Encapsulated antenna structure and method of making same

Abstract

The application provides a packaged antenna structure and a manufacturing method thereof. The packaged antenna structure comprises a substrate, a first surface and a second surface of the substrate, a stacked dielectric structure on the first surface of the substrate, the stacked dielectric structure comprising a plurality of stacked dielectric layers, wherein the dielectric constants of the plurality of dielectric layers present a step change, and a patch antenna comprising an antenna main line on the stacked dielectric structure. The packaged antenna structure can improve the bandwidth of the packaged antenna structure.

Description

Technical Field

[0001] This invention relates to the field of microstrip patch packaged antenna technology, and in particular to a packaged antenna structure and its manufacturing method. Background Technology

[0002] In the field of millimeter-wave communication, microstrip patch-packaged antennas, due to their compatibility with artificial intelligence technology (AIP), have become a core component for realizing device miniaturization and high-frequency integration.

[0003] However, existing microstrip patch-packaged antennas have bandwidth limitations, meaning that the bandwidth of packaged antennas cannot be further increased. Therefore, how to provide a technical solution to improve the bandwidth of packaged antennas has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The technical problem solved by this invention is to improve antenna bandwidth by providing a packaged antenna structure and its manufacturing method.

[0005] To address the aforementioned problems, embodiments of the present invention provide a packaged antenna structure, comprising: a substrate, including a first surface and a second surface of the substrate facing each other; a stacked dielectric structure located on the first surface of the substrate, the stacked dielectric structure comprising a plurality of stacked dielectric layers, wherein the dielectric constant of the plurality of dielectric layers exhibits a stepped change; and a patch antenna, comprising: an antenna mainline located on the stacked dielectric structure.

[0006] Optionally, the dielectric constants of the plurality of dielectric layers decrease as they move upward along a direction perpendicular to the first surface of the substrate; the material of each dielectric layer includes one or more of the following: bismaleimide triazine resin, polyimide, polytetrafluoroethylene, epoxy resin, and glass fiber powder filler. The materials of each dielectric layer are different.

[0007] Optionally, the patch antenna further includes: an antenna connection line passing through the stacked dielectric structure and the substrate; an antenna signal line located on the second surface of the substrate; the antenna signal line being coupled to the antenna connection line, and the antenna connection line being coupled to the antenna main line.

[0008] Optionally, the shape of the antenna main line includes one or more of the following: square, circular, elliptical, triangular, and polygonal.

[0009] Optionally, the packaged antenna structure further includes: a reference ground line located on the first surface of the substrate, and the stacked dielectric structure covering the reference ground line.

[0010] Optionally, the antenna connection line also extends through the reference ground main line and is isolated from the reference ground main line.

[0011] Optionally, the packaged antenna structure further includes: an internal ground connection line penetrating the substrate; a ground signal line located on the second surface of the substrate; and a driving circuit connected to the ground signal line, wherein the ground signal line is connected to the internal ground connection line, and the internal ground connection line is connected to the main ground line.

[0012] Optionally, the packaged antenna structure further includes a protective layer located on the second side of the substrate and covering the reference ground signal line and the antenna signal line.

[0013] Optionally, the encapsulated antenna structure further includes: a contact point; a conductive post penetrating the protective layer, wherein one end of the conductive post is coupled to the reference ground signal line, and the other end of the conductive post is coupled to the contact point.

[0014] To address the aforementioned problems, embodiments of the present invention provide a method for fabricating an encapsulated antenna structure, comprising: providing a carrier board; forming a stacked dielectric structure on the carrier board, the stacked dielectric structure comprising a plurality of dielectric layers stacked sequentially, wherein the dielectric constant of the plurality of dielectric layers exhibits a step-like variation; and forming a patch antenna, the patch antenna comprising: an antenna mainline located on the stacked dielectric structure.

[0015] Optionally, the step of forming the patch antenna includes: forming an antenna material layer on the carrier plate; The antenna material layer is patterned to form antenna signal lines and reference ground signal lines located on the carrier plate.

[0016] Optionally, the step of forming the patch antenna further includes: forming a substrate covering the carrier plate, the substrate including: a first substrate surface and a second substrate surface opposite to each other, wherein the second substrate surface covers the antenna signal line and the reference ground signal line; forming a first through hole and a second through hole through the substrate.

[0017] Optionally, the material of the substrate includes polyimide.

[0018] Optionally, the process of forming a substrate covering the carrier plate includes a coating process.

[0019] Optionally, the step of forming the patch antenna further includes: forming a reference ground main line located on the substrate; forming an internal reference ground connection line that fills the first through-hole, the internal reference ground connection line being coupled to the reference ground main line; and forming an antenna first sub-connection line that fills the second through-hole.

[0020] Optionally, the step of forming the patch antenna further includes: forming a stacked dielectric structure covering a first surface of the substrate, the stacked dielectric structure including a plurality of stacked dielectric layers; patterning the stacked dielectric structure to form a third via through the stacked dielectric structure, the third via exposing the first sub-connection line of the antenna.

[0021] Optional processes for forming the various dielectric layers include: coating processes.

[0022] Optionally, the step of forming the patch antenna further includes: A second sub-connecting line is formed to fill the third through hole. The first sub-connecting line and the second sub-connecting line constitute the antenna connecting line.

[0023] Optionally, the step of forming the patch antenna further includes: forming an antenna main line on the stacked dielectric structure, wherein the antenna main line is connected to the antenna connecting line.

[0024] Optionally, the manufacturing method further includes: Remove the carrier board to expose the antenna signal line, the reference ground signal line, and the first sub-antenna connection line.

[0025] Optionally, the process for removing the carrier plate includes one or more of etching, peeling, or grinding.

[0026] Optionally, the manufacturing method further includes: forming a conductive pillar, one end of which is coupled to the reference ground signal line; attaching a driving circuit to the second surface of the substrate and coupling it to the reference ground signal line.

[0027] Optionally, one end of the conductive post may be coupled to the reference ground signal line by means of conductive adhesive or soldering.

[0028] Optionally, the material of the conductive pillar includes one or more of copper, gold, silver, aluminum, and molybdenum.

[0029] Optionally, the manufacturing method further includes: forming a protective layer covering the second side of the substrate; removing a portion of the protective layer to expose the other end of the conductive post.

[0030] Optionally, the process of removing a portion of the protective layer includes etching or polishing processes.

[0031] Optionally, the manufacturing method further includes: forming a contact point and coupling it to the other end of the conductive post.

[0032] Optionally, the material of the contact point includes one or more of tin, bismuth, indium, and aluminum.

[0033] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages: The packaged antenna structure of this invention includes: a substrate, including a first surface and a second surface of the substrate facing each other; a stacked dielectric structure located on the first surface of the substrate; the stacked dielectric structure including multiple stacked dielectric layers; and a patch antenna, including: an antenna main line located on the stacked dielectric structure. Compared with existing solutions that cause abrupt changes in electromagnetic wave propagation by setting a single dielectric layer, this application sets the dielectric constant of multiple dielectric layers in the stacked dielectric structure to exhibit a stepped change, so that electromagnetic waves are smoothly propagated into the air. Different dielectric layers are adapted to the propagation characteristics of different frequency waves. By optimizing energy matching through the impedance gradient of each dielectric layer, the antenna maintains good impedance matching with each dielectric layer over a wider frequency range, thereby broadening the radiation bandwidth and improving the bandwidth of the packaged antenna. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0035] Figure 1 This is a top view of the packaged antenna structure according to an embodiment of this application; Figures 2 to 11 This is a schematic diagram of each step in the method for forming the packaged antenna structure according to an embodiment of this application; Figure 12 This is a simulation diagram showing the bandwidth improvement of the packaged antenna structure according to an embodiment of this application. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] Existing packaged antenna structures have limitations in further increasing the bandwidth of packaged antennas. The reasons for this are analyzed below.

[0038] Existing packaged antenna structures employ a single dielectric layer structure. The electromagnetic waves from the packaged antenna are transmitted directly into the air through this single dielectric layer. This causes abrupt changes in the transmission of the electromagnetic waves, which limits the bandwidth of the packaged antenna. Furthermore, due to the extremely short wavelength of millimeter waves (typically less than 10 mm), it is difficult to achieve good dielectric impedance matching between the dielectric constant and thickness parameters of the single dielectric layer over a wide frequency range. As a result, the antenna's relatively low operating bandwidth generally fails to meet the wideband requirements of scenarios such as millimeter wave communication and autonomous driving radar.

[0039] In summary, existing packaged antenna structures have the problem of not being able to further improve the bandwidth of the packaged antenna. To solve this technical problem, embodiments of the present invention provide a packaged antenna structure, including: a substrate, including a first surface and a second surface of the substrate facing each other; a stacked dielectric structure located on the first surface of the substrate, the stacked dielectric structure including multiple stacked dielectric layers, wherein the dielectric constant of the multiple dielectric layers exhibits a stepped change; and a patch antenna, including: an antenna mainline located on the stacked dielectric structure.

[0040] The packaged antenna structure of this application uses a stepped dielectric constant of multiple dielectric layers in the stacked dielectric structure to allow electromagnetic waves to be smoothly transmitted into the air. Different dielectric layers are adapted to the propagation characteristics of different frequency waves. By optimizing energy matching through the impedance gradient of each dielectric layer, the antenna can maintain good impedance matching with each dielectric layer over a wider frequency range, thereby broadening the radiation bandwidth and improving the bandwidth of the packaged antenna.

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0042] refer to Figure 1 and Figure 11 This is a schematic diagram of the packaged antenna structure according to an embodiment of this application, wherein... Figure 1 This is a top view of the encapsulated antenna structure according to an embodiment of this application. Figure 11 for Figure 1 A structural schematic diagram of a cross-section along the direction of the dashed line AA1.

[0043] It should be noted that, Figure 1 The dashed line K in the diagram indicates that the main antenna line 202 is not displayed.

[0044] refer to Figure 11 The packaged antenna structure includes: a substrate 200.

[0045] The substrate 200 is used to provide a supporting base for forming the packaged antenna.

[0046] The material of the substrate 200 includes polyimide, which has the following beneficial effects: First, excellent thermal stability.

[0047] Polyimide has high thermal stability, which enables it to maintain its physical and chemical properties at high temperatures. This is crucial for the high-temperature processing of packaged antenna structures.

[0048] Second, it has good mechanical properties.

[0049] Polyimide has high strength, low coefficient of thermal expansion and good abrasion resistance, which enables the packaged antenna structure to withstand mechanical stress during manufacturing and operation.

[0050] Third, electrical insulation performance and radiation resistance.

[0051] Polyimide has a low dielectric constant and low leakage rate, making it an excellent electrical insulating material that can effectively reduce the interference of external signals on the packaged antenna structure.

[0052] Fourth, chemical stability.

[0053] Polyimide is highly resistant to most chemicals and is not easily corroded, thus protecting the encapsulated antenna structure from chemical corrosion in the environment.

[0054] Fifth, processing performance.

[0055] Polyimide can be formed into thin films, and the processing is relatively simple, which helps to improve production efficiency.

[0056] In this embodiment, the substrate 200 includes: a first surface M1 of the substrate 200 and a second surface M2 of the substrate 200.

[0057] Continue to refer to Figure 11 The packaged antenna structure includes: a stacked dielectric structure 201 located on the first surface M1 of the substrate 200.

[0058] The stacked dielectric structure 201 is used to improve the bandwidth of the packaged antenna.

[0059] The stacked dielectric structure 201 includes multiple stacked dielectric layers. For the sake of brevity and clarity in the accompanying drawings, in this embodiment, the number of the multiple dielectric layers is equal to 3, but this does not limit the scope of this application.

[0060] In this embodiment, the stacked dielectric structure includes: a dielectric layer 201a, a dielectric layer 201b stacked on the dielectric layer 201a, and a dielectric layer 201c stacked on the dielectric layer 201b.

[0061] The materials of each dielectric layer include one or more of the following: bismaleimide triazine resin (BT resin), polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber filler (Ajinomoto Build-up Film, ABF). Specifically, the material of dielectric layer 201a includes one or more of the following: bismaleimide triazine resin (BT resin), polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber filler (Ajinomoto Build-up Film, ABF). The material of dielectric layer 201b includes bismaleimide triazine resin (BT resin). The dielectric layer 201c is made of one or more of the following: bismaleimide triazine (resin, BT resin), polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber filler (Ajinomoto Build-up Film, ABF).

[0062] The materials of each dielectric layer are different. In this embodiment, the material of dielectric layer 201a is epoxy resin, the material of dielectric layer 201b is BT resin, and the material of dielectric layer 201c is polytetrafluoroethylene.

[0063] The dielectric constants of the multiple dielectric layers exhibit a step-like variation, with the dielectric constants decreasing in a stepwise manner. In this embodiment, along the direction F1 perpendicular to the first surface M1 of the substrate 200 upwards, the dielectric constants of the multiple dielectric layers exhibit a decreasing variation. That is, along the direction F1 perpendicular to the first surface M1 of the substrate 200 upwards, the dielectric constant of dielectric layer 201a is greater than that of dielectric layer 201b, and the dielectric constant of dielectric layer 201b is greater than that of dielectric layer 201c, which can improve the bandwidth of the packaged antenna.

[0064] In this embodiment, along the direction F1 perpendicular to the first surface M1 of the substrate 200 upwards, the dielectric constant of the dielectric layer 201a is 4.5, the dielectric constant of the dielectric layer 201b is 3.2, and the dielectric constant of the dielectric layer 201c is 2.1.

[0065] Continue to refer to Figure 11 The encapsulated antenna structure includes: a patch antenna.

[0066] The patch antenna is used to transmit signals, such as electromagnetic wave signals, to the outside world, or to receive signals, such as electromagnetic wave signals, from the outside world.

[0067] The patch antenna includes an antenna main line 202 located on the stacked dielectric structure 201.

[0068] In this embodiment, the antenna main line 202 is in contact with the dielectric layer 201c in the stacked dielectric structure 201 and is located on the surface of the dielectric layer 201c.

[0069] The material of the antenna main wire 202 includes one or more of copper, gold, silver, aluminum, and molybdenum. In this embodiment, the material of the antenna main wire 202 is copper, because copper is used to encapsulate antennas and has the following advantages: First, copper has a very high conductivity, which can effectively transmit current and reduce energy loss.

[0070] Secondly, copper has low resistivity, which generates less heat when transmitting the same current, thus improving the efficiency and reliability of the system.

[0071] Third, copper is not prone to electromigration, and its conductivity will not decrease significantly during long-term high-current transmission.

[0072] Fourth, copper exhibits good stability in electromagnetic fields and is not easily affected by electromagnetic interference.

[0073] Fifth, copper has good ductility and plasticity, making it easy to stretch, bend and shape, and easy to manufacture various shapes and sizes.

[0074] Sixth, copper has good corrosion resistance in most environments, especially in oxygen-containing environments, where a dense copper oxide protective film will form on the copper surface to prevent further corrosion.

[0075] Seventh, copper is easy to recycle and reuse, which meets the requirements of environmental protection and resource recycling.

[0076] Eighth, copper is inexpensive and therefore more cost-effective.

[0077] Viewed from above, the antenna main line 202 has a shape that includes one or more of the following: square, circular, elliptical, triangular, and polygonal. In this embodiment, the antenna main line 202 is square (e.g., ...). Figure 1 As shown), that is, the square antenna main line 202, which is located on the stacked dielectric structure 201 and is in contact with the dielectric layer 201c in the stacked dielectric structure 201.

[0078] The antenna main line 202 includes a feed line 555 (e.g., Figure 1 As shown), it is used to electrically connect the antenna main line 202 and the antenna connecting line 203 (e.g. Figure 8 (As shown).

[0079] Continue to refer to Figure 11 The packaged antenna structure includes a driving circuit 205.

[0080] The driving circuit 205 is used to provide a grounding signal for the reference ground main line 206, and also to provide the signal required for the antenna main line 202 to transmit electromagnetic waves, and to perform signal processing on the received signals after the antenna main line 202 receives external signals.

[0081] In this embodiment, the driving circuit 205 is a chip, which includes: a semiconductor transistor (not shown), a ground terminal 214, an antenna terminal 215, a power supply terminal 216, a signal source terminal 217, and internal interconnects (not shown). The semiconductor transistor includes at least the following functions: First, signal amplification.

[0082] Radar systems need to amplify the received weak signals to a sufficient intensity for subsequent processing and analysis. Semiconductor transistors, especially field-effect transistors, offer high gain and low noise figures.

[0083] Second, signal processing.

[0084] Semiconductor transistors are used to perform functions such as signal mixing, amplification, filtering, and modulation. In radar systems, these processing steps are crucial for signal detection, tracking, and target identification.

[0085] Third, the on / off function.

[0086] Semiconductor transistors are used as switches to control different parts of a radar system, such as turning the radar antenna on and off, and transmitting signals.

[0087] The internal connection line includes at least the following functions: First, it is used for connections between various semiconductor transistors.

[0088] Second, it is used to transmit external signals to the chip to control whether the semiconductor transistors are working.

[0089] The driving circuit 205 is connected to the reference ground signal line 208. In this embodiment, the ground terminal 214 is connected to the reference ground signal line 208 through the first tin metal layer 222. The reference ground signal line 208 is connected to the internal reference ground connection line 207. The internal reference ground connection line 207 is connected to the main reference ground line 206, which grounds the main reference ground line 206.

[0090] The antenna terminal 215 is electrically connected to the antenna signal line 204 through the first tin metal layer 222, and the driving circuit 205 controls whether the antenna main line 202 is working through the antenna terminal 215.

[0091] The power terminal 216 is connected to the power line 212 through the first tin metal layer 222. The power supply (not shown) provides a stable operating voltage and current to the drive circuit 205 through the power line 212 and the power terminal 216 to ensure that the radar antenna can work normally.

[0092] The signal source terminal 217 is connected to the signal source line 213 through the first tin metal layer 222. The signal source (not shown) provides the driving circuit 205 with the signal required for radar operation through the signal source line 213 and the signal source terminal 217. The signal source generates signals with different frequencies, amplitudes and waveforms, such as sine waves, square waves, and triangular waves.

[0093] Continue to refer to Figure 11 The encapsulated antenna structure includes: an antenna connection line 203.

[0094] The antenna connection line 203 is used to connect the antenna main line 202 and the antenna signal line 204.

[0095] The antenna connection line 203 passes through the stacked dielectric structure 201 and the substrate 200. In this embodiment, the antenna connection line 203 passes through both the stacked dielectric structure 201 and the substrate 200.

[0096] The shape of the antenna connection line 203 along the cross-sectional view parallel to the first surface M1 of the substrate 200 includes one or more of the following: square, circular, elliptical, triangular and polygonal. In this embodiment, the shape of the antenna connection line 203 along the cross-sectional view parallel to the first surface M1 of the substrate 200 is square.

[0097] The material of the antenna connection line 203 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the antenna connection line 203 is copper.

[0098] In this embodiment, the antenna connection line 203 is electrically connected to the antenna main line 202, and the antenna connection line 203 is perpendicular to the surface of the stacked dielectric structure 201 and the substrate 200.

[0099] In this embodiment, the antenna connection line 203 includes a first sub-connection line 203a and a second sub-connection line 203b. The first sub-connection line 203a penetrates the substrate 200, and the second sub-connection line 203b penetrates the stacked dielectric structure 201. The first sub-connection line 203a and the second sub-connection line 203b are electrically connected to form the antenna connection line 203.

[0100] The material of the first sub-connector 203a includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the first sub-connector 203a is copper. The material of the second sub-connector 203b includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the second sub-connector 203b is copper.

[0101] Continue to refer to Figure 11 The packaged antenna structure includes: an antenna signal line 204 located on the second surface M2 of the substrate 200.

[0102] The antenna signal line 204 is used to transmit the signal generated by the driving circuit 205 to the antenna main line 202 through the antenna connection line 203, or to transmit the signal received by the antenna main line 202 to the driving circuit 205 through the antenna connection line 203.

[0103] The shape of the antenna signal line 204 in a cross-sectional view along the direction perpendicular to the first surface M1 of the substrate 200 includes one or more of the following: square, circular, elliptical, triangular and polygonal. In this embodiment, the shape of the antenna signal line 204 in a cross-sectional view along the direction perpendicular to the first surface M1 of the substrate 200 is square.

[0104] The material of the antenna signal line 204 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the antenna signal line 204 is copper.

[0105] The antenna signal line 204 is coupled to the antenna connection line 203, and the antenna connection line 203 is coupled to the antenna main line 202. In this embodiment, one end of the antenna signal line 204 is connected to the antenna terminal 215 of the driving circuit 205, and the other end of the antenna signal line 204 is electrically connected to one end of the antenna connection line 203. The other end of the antenna connection line 203 is electrically connected to the antenna main line 202. That is, the other end of the antenna signal line 204 is connected to the first sub-connection line 203a, the first sub-connection line 203a is connected to the second sub-connection line 203b, and the second sub-connection line 203b is connected to the antenna main line 202.

[0106] Continue to refer to Figure 11 The encapsulated antenna structure includes: a reference ground main line 206 located on the first surface M1 of the substrate 200.

[0107] The reference ground main line 206 has the following beneficial effects: First, during thunderstorms, the encapsulated antenna is susceptible to lightning strikes. Reference ground line 206 can conduct lightning into the ground, thereby protecting the encapsulated antenna and related electronic equipment from lightning damage and reducing the risk of equipment damage.

[0108] Second, the encapsulated antenna will generate some interference when receiving and transmitting signals, such as electromagnetic interference. Reference ground line 206 can help guide this interference to the ground and reduce interference to the encapsulated antenna.

[0109] Third, by using the reference ground main line 206, common-mode noise in the encapsulated antenna system can be reduced, thereby improving signal reception quality and transmission efficiency.

[0110] Viewed from above, the reference land main line 206 has a shape that includes one or more of the following: square, circle, ellipse, triangle and polygon. In this embodiment, the reference land main line 206 is square.

[0111] The material of the reference ground main line 206 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the reference ground main line 206 is copper.

[0112] The stacked dielectric structure 201 covers the reference ground main line 206. In this embodiment, the reference ground main line 206 covers the first surface M1 of the substrate 200, the stacked dielectric structure 201 covers the reference ground main line 206, and the dielectric layer 201a is in contact with the reference ground main line 206.

[0113] In this embodiment, the projection of the antenna main line 202 onto the first surface M1 of the substrate 200 is located within the projection of the reference ground main line 206 onto the first surface M1 of the substrate 200, thereby improving the anti-interference capability of the packaged antenna.

[0114] Continue to refer to Figure 11 The encapsulated antenna structure includes: an internal ground connection line 207 that penetrates the substrate 200.

[0115] The internal connection line 207 of the reference ground is used to connect the reference ground main line 206 and the reference ground signal line 208.

[0116] In this embodiment, the internal connection line 207 of the reference ground penetrates the substrate 200.

[0117] The internal connection line 207 of the reference ground, along the shape of the cross-sectional view parallel to the first surface M1 of the substrate 200, includes one or more of the following: square, circle, ellipse, triangle and polygon. In this embodiment, the internal connection line 207 of the reference ground, along the shape of the cross-sectional view parallel to the first surface M1 of the substrate 200, is square.

[0118] The material of the internal connection line 207 of the reference ground includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the internal connection line 207 of the reference ground is copper.

[0119] In this embodiment, the internal ground connection line 207 is electrically connected to the main ground line 206, and the internal ground connection line 207 is perpendicular to the surface of the stacked dielectric structure 201 and the substrate 200.

[0120] Continue to refer to Figure 11 The packaged antenna structure includes a reference ground signal line 208 located on the second surface M2 of the substrate 200.

[0121] The reference ground signal line 208 is used to transmit the grounding signal of the driving circuit 205 to the reference ground main line 206 through the reference ground signal line 208.

[0122] The reference ground signal line 208, along the shape of a cross-sectional view perpendicular to the first surface M1 of the substrate 200, includes one or more of the following: square, circular, elliptical, triangular, and polygonal. In this embodiment, the reference ground signal line 208, along the shape of a cross-sectional view perpendicular to the first surface M1 of the substrate 200, is square.

[0123] The material of the reference ground signal line 208 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the reference ground signal line 208 is copper.

[0124] The driving circuit 205 is connected to the reference ground signal line 208, which is connected to the internal reference ground connection line 207, which is connected to the main reference ground line 206. The reference ground signal line 208 is coupled to the internal reference ground connection line 207, which is coupled to the main reference ground line 206. In this embodiment, one end of the reference ground signal line 208 is connected to the ground terminal 214 of the driving circuit 205, and the other end of the reference ground signal line 208 is electrically connected to one end of the internal reference ground connection line 207, which is electrically connected to the main reference ground line 206.

[0125] Continue to refer to Figure 11 The antenna connection line 203 also passes through the reference ground main line 206 and is isolated from the reference ground main line 206.

[0126] In this embodiment, the antenna main line 202 is isolated from the reference ground main line 206, the reference ground internal connection line 207, and the reference ground signal line 208; the antenna connection line 203 is isolated from the reference ground main line 206, the reference ground internal connection line 207, the reference ground signal line 208, and the power line 212; and the antenna signal line 204 is isolated from the reference ground main line 206, the reference ground internal connection line 207, the reference ground signal line 208, and the signal source line 213.

[0127] The antenna connection line 203 also passes through the reference ground main line 206, and at the point of penetration, there is a certain distance between the antenna connection line 203 and the reference ground main line 206 to isolate the antenna connection line 203 from the reference ground main line 206.

[0128] Continue to refer to Figure 11 The encapsulated antenna structure includes a protective layer 209.

[0129] The protective layer 209 is used to help encapsulate the entire package for moisture protection, mechanical impact protection, insulation, and support.

[0130] The material of the protective layer 209 is generally composed of epoxy resin (bisphenol F / o-cresol type), curing agent (phenolic / amine), silica powder (60-90%), release agent, flame retardant and coupling agent, etc. The material of the protective layer 209 is also called epoxy molding compound (EMC), which is used to help the overall encapsulation of the package to prevent moisture, mechanical impact, insulation and support.

[0131] The protective layer 209 is located on the second surface M2 of the substrate 200 and covers the reference ground signal line 208 and the antenna signal line 204. In this embodiment, the protective layer 209 covers the second surface M2 of the substrate 200 and the surfaces of the reference ground signal line 208 and the antenna signal line 204. The protective layer 209 also covers the driving circuit 205, the power supply line 212, and the signal source line 213.

[0132] Continue to refer to Figure 11 The encapsulated antenna structure includes: contact points.

[0133] The contact point is used to connect to an external power source and signal source, provide voltage and signal for the operation of the drive circuit 205, and ground the reference ground main line 206, further reducing the probability of interference from other electronic devices to the packaged antenna and improving the bandwidth of the packaged antenna.

[0134] The material of the contact point includes one or more of tin, bismuth, indium and aluminum. In this embodiment, the material of the contact point is tin.

[0135] The shape of the contact point includes one or more of the following: a square prism, a sphere, and an ellipsoid. In this embodiment, the shape of the contact point is spherical.

[0136] It should be noted that the contact point can also be called a solder ball.

[0137] In this embodiment, there are four contact points: contact point 210a, contact point 210b, contact point 210c, and contact point 210d. Contact points 210a and 210b are coupled to the reference ground signal line 208, contact point 210c is coupled to the power line 212, and contact point 210d is coupled to the signal source line 213.

[0138] Continue to refer to Figure 11 The encapsulated antenna structure includes: conductive pillars.

[0139] The conductive post is used to connect the contact point to the reference ground signal line 208, and also to transmit power supply voltage and signals.

[0140] The material of the conductive pillar includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the conductive pillar is copper.

[0141] In this embodiment, there are four conductive pillars, namely conductive pillar 211a, conductive pillar 211b, conductive pillar 211c, and conductive pillar 211d.

[0142] The conductive post penetrates the protective layer 209, and one end of the conductive post is coupled to the reference ground signal line 208, while the other end of the conductive post is coupled to the contact point. In this embodiment, conductive posts 211a to 211d all penetrate the protective layer 209, and one end of conductive posts 211a and 211b is coupled to the reference ground signal line 208 through a second tin metal layer 223. The other end of conductive post 211a is electrically connected to the contact point 210a, and the other end of conductive post 211b is electrically connected to the contact point 210b. One end of conductive post 211c is coupled to the power line 212 through the second tin metal layer 223, and one end of conductive post 211d is coupled to the signal source line 213 through the second tin metal layer 223. The other end of conductive post 211d is coupled to the contact point 210d.

[0143] Continue to refer to Figure 11 The encapsulated antenna structure includes a power line 212 and a signal source line 213.

[0144] The power line 212 is used to transmit external power to the drive circuit 205, providing the drive circuit 205 with a stable operating voltage and current.

[0145] The signal source line 213 is used to transmit external signals to the driving circuit 205 and provide working signals to the driving circuit 205, such as signals of different frequencies, amplitudes and waveforms, such as sine waves, square waves, triangle waves, etc.

[0146] In this embodiment, one end of the power line 212 is electrically connected to the power terminal 216 of the drive circuit 205, and the other end of the power line 212 is electrically connected to the contact point 210c through the conductive post; one end of the signal source line 213 is electrically connected to the signal source terminal 217 of the drive circuit 205, and the other end of the signal source line 213 is electrically connected to the contact point 210d through the conductive post.

[0147] refer to Figure 12The above is a simulation diagram of the bandwidth improvement of the packaged antenna structure in the embodiment of this application. The solid line S1 represents the bandwidth diagram corresponding to the packaged antenna structure in the embodiment of this application, and the dashed line S2 represents the bandwidth diagram corresponding to the existing packaged antenna structure. The horizontal axis represents the frequency in gigahertz (GHz), and the vertical axis represents the decibel (dB). The simulation parameters of the packaged antenna structure in the embodiment of this application include: the number of dielectric layers is 3, namely dielectric layer 201a, dielectric layer 201b stacked on dielectric layer 201a, and dielectric layer 201c stacked on dielectric layer 201b.

[0148] The dielectric layer 201a is made of epoxy resin, the dielectric layer 201b is made of BT resin, and the dielectric layer 201c is made of polytetrafluoroethylene.

[0149] The dielectric layer 201a has a thickness of 60 micrometers, the dielectric layer 201b has a thickness of 48 micrometers, and the dielectric layer 201c has a thickness of 19 micrometers.

[0150] Along the direction F1 perpendicular to the first surface M1 of the substrate 200 upwards, the dielectric constant of the dielectric layer 201a is 4.5, the dielectric constant of the dielectric layer 201b is 3.2, and the dielectric constant of the dielectric layer 201c is 2.1.

[0151] Simulation parameters for existing packaged antenna structures include: Single-layer dielectric layer; The dielectric constant of the single-layer dielectric layer is 4.5, and the thickness of the single-layer dielectric layer is 19 micrometers.

[0152] like Figure 12 As shown, line L corresponds to -10dB. At -10dB, the frequency difference between arrows J1 and J2 is 1.608GHz, which is the bandwidth of the packaged antenna structure in this embodiment at -10dB. At -10dB, the frequency difference between arrows J3 and J4 is 1.41GHz, which is the bandwidth of the existing packaged antenna structure at -10dB. The bandwidth of the packaged antenna structure in this application embodiment is increased by a certain percentage compared to existing packaged antenna structures. (1.608-1.41) / 1.41≈14%.

[0153] To address the aforementioned technical problem, embodiments of the present invention provide a method for fabricating an encapsulated antenna structure, comprising: providing a carrier board; forming a stacked dielectric structure on the carrier board, the stacked dielectric structure comprising a plurality of dielectric layers stacked sequentially; and forming a patch antenna, the patch antenna comprising: an antenna mainline located on the stacked dielectric structure.

[0154] The method for fabricating the packaged antenna structure according to the embodiments of this application sets the dielectric constant of multiple dielectric layers in the stacked dielectric structure to exhibit a stepped change, so that electromagnetic waves are smoothly transmitted into the air. Different dielectric layers are adapted to the propagation characteristics of waves of different frequencies. By optimizing energy matching through the impedance gradient of each dielectric layer, the antenna maintains good impedance matching with each dielectric layer over a wider frequency range, thereby broadening the radiation bandwidth and improving the bandwidth of the packaged antenna.

[0155] refer to Figures 2 to 11 This is a schematic diagram of each step in the method for forming the packaged antenna structure according to an embodiment of this application.

[0156] refer to Figure 2 Provide a 300 carrier board.

[0157] The carrier plate 300 is used to provide a supporting foundation for forming the packaged antenna structure.

[0158] The carrier plate 300 is made of one or more of the following materials: polyimide, acrylic, glass, phenolic resin and ceramic. In this embodiment, the carrier plate 300 is made of glass.

[0159] The carrier plate 300 includes a fourth surface M4 opposite to the third surface M3 of the carrier plate 300.

[0160] refer to Figure 3 Antenna signal lines 204 are formed on the carrier plate 300.

[0161] The material of the antenna main line 202 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the antenna main line 202 is copper.

[0162] In this embodiment, the reference ground signal line 208, power line 212, and signal source line 213 are formed simultaneously during the step of forming the antenna signal line 204; in other embodiments, the reference ground signal line 208, power line 212, and signal source line 213 are formed separately using independent steps.

[0163] The method for forming antenna signal lines 204 on the carrier plate 300 includes: exposure, development and etching processes, and electroplating processes.

[0164] In some embodiments, the step of forming antenna signal lines 204 on the carrier plate 300 using an electroplating process includes: Photoresist is applied to the third surface M3 of the carrier plate 300, and the photoresist is insulating.

[0165] The photoresist is patterned, and the antenna signal line 204 pattern on the photomask is transferred to the third surface M3 of the carrier plate 300. At the same time, the reference ground signal line 208 pattern, the power line 212 pattern, and the signal source line 213 pattern are transferred to the third surface M3 of the carrier plate 300. That is, the reference ground signal line 208, power line 212, and signal source line 213 patterns are formed simultaneously using the same photomask.

[0166] A substrate 300 with patterned photoresist is placed in an electroplating bath containing a copper ion solution, so that copper ions are formed in the areas on the substrate 300 without photoresist, that is, at the locations of the antenna signal line 204, the reference ground signal line 208, the power line 212, and the signal source line 213.

[0167] The photoresist on the carrier 300 is removed by a stripping process, so that the antenna signal line 204, reference ground signal line 208, power line 212 and signal source line 213 can be formed simultaneously on the third surface M3 of the carrier 300.

[0168] In other embodiments, an exposure, development, and etching process is used to form the antenna signal line 204, reference ground signal line 208, power line 212, and signal source line 213 located on the third surface M3 of the carrier plate 300.

[0169] The step of forming antenna signal lines 204 on the carrier 300 using an exposure, development, and etching process includes: An antenna material layer (not shown) is formed on the third surface M3 of the carrier plate 300.

[0170] Forming a photoresist covering the initial signal lines of the antenna; The photoresist is patterned, and the antenna signal line 204 pattern on the photomask is transferred to the third surface M3 of the carrier plate 300. At the same time, the reference ground signal line 208 pattern, the power line 212 pattern, and the signal source line 213 pattern are transferred to the third surface M3 of the carrier plate 300. That is, the reference ground signal line 208, power line 212, and signal source line 213 patterns are formed simultaneously using the same photomask. The antenna material layer is patterned by using an exposure, development, and etching process to form the antenna signal line 204 on the third surface M3 of the carrier board 300. During the formation of the antenna signal line 204, the reference ground signal line 208, the power line 212, and the signal source line 213 are formed simultaneously.

[0171] In this embodiment, an exposure, development, and etching process is used to form the antenna signal line 204, reference ground signal line 208, power line 212, and signal source line 213 located on the third surface M3 of the carrier plate 300.

[0172] For other information regarding the antenna signal line 204, reference ground signal line 208, power supply line 212, and signal source line 213, please refer to the corresponding description in the aforementioned embodiment of the packaged antenna structure, which will not be repeated here.

[0173] refer to Figure 4 This forms a substrate 200 covering the carrier plate 300.

[0174] The substrate 200 is used to provide a supporting foundation for forming the packaged antenna structure.

[0175] The material of the substrate 200 includes polyimide.

[0176] The process of forming a substrate 200 covering the carrier plate 300 includes a coating process, wherein the coating process includes one or more of brush coating, roller coating, spray coating, dip coating and spin coating.

[0177] The brush coating refers to applying the material of the substrate onto the substrate using a brush. The roll coating: using a roller to coat the substrate with the material; The spraying process involves using a spray gun to apply the material from the substrate onto the substrate. The dip coating involves immersing the carrier plate in the material of the substrate to coat the carrier plate with the material of the substrate.

[0178] The spin coating process involves rotating the carrier plate while dripping the substrate material onto the carrier plate, thereby coating the substrate material onto the carrier plate.

[0179] In this embodiment, the process of forming the substrate 200 covering the carrier plate 300 is a spin coating process, that is, the carrier plate 300 is fixed on a stage (not shown), the nozzle of the spin coating equipment is located at the center of the carrier plate 300, and while rotating the stage, liquid substrate 200 material is sprayed onto the third surface M3 of the carrier plate 300.

[0180] In this embodiment, the step of forming the substrate 200 covering the carrier plate 300 includes: A layer of polyimide of uniform thickness is coated on the third surface M3 of the carrier plate 300 by spin coating process; The polyimide is subjected to heat curing to form a substrate 200 located on the third surface M3 of the carrier plate 300.

[0181] In this embodiment, the substrate 200 includes a first surface M1 and a second surface M2 of the substrate 200 facing each other. The substrate 200 is formed on the third surface M3 of the carrier plate 300, and the second surface M2 of the substrate 200 is in contact with the third surface M3 of the substrate 200.

[0182] In this embodiment, the second surface M2 of the substrate 200 covers the antenna signal line 204, the reference ground signal line 208, the power line 212, and the signal source line 213. That is, the second surface M2 of the substrate 200 is in contact with the antenna signal line 204, the reference ground signal line 208, the power line 212, and the signal source line 213.

[0183] For other information regarding the substrate 200, please refer to the corresponding description in the packaged antenna structure of the foregoing embodiments, which will not be repeated here.

[0184] Continue to refer to Figure 4 A first through hole 218 and a second through hole 219 are formed through the substrate 200.

[0185] In this embodiment, the step of forming the first through hole 218 and the second through hole 219 penetrating the substrate 200 includes: Photoresist is coated on the first surface M1 of the substrate 200; The photoresist is patterned, and the pattern corresponding to the first through hole 218 and the second through hole 219 on the photomask is transferred to the first surface M1 of the substrate 200.

[0186] The substrate 200 is subjected to processes such as exposure, development, and etching to form a first through hole 218 and a second through hole 219 penetrating the substrate 200. The bottom of the first through hole 218 and the bottom of the second through hole 219 expose the third surface M3 of the carrier plate 300.

[0187] refer to Figure 5 A reference ground main line 206 is formed on the substrate 200.

[0188] The material of the reference ground main line 206 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the reference ground main line 206 is copper.

[0189] The step of forming the reference ground main line 206 located on the substrate 200 includes: On the second surface M2 of the substrate 200, a reference ground mainline material layer (not shown) is formed covering the second surface M2 of the substrate 200 by physical vapor deposition process. The reference ground mainline material layer also fills the first via 218 and the second via 219. The reference ground main line material layer is processed by exposure, development and etching processes to form the reference ground main line 206 located on the substrate 200, the reference ground internal connection line 207 filling the first via 218, and the antenna first sub-connection line 203a filling the second via 219.

[0190] In this embodiment, the internal connection line 207 of the reference ground is coupled to the main line of the reference ground 206, and the signal line of the reference ground 208 is coupled to the internal connection line of the reference ground 207.

[0191] It should be noted that the first sub-connection line 203a is isolated from the reference ground main line 206, the reference ground internal connection line 207, the reference ground signal line 208, the power line 212, and the signal source line 213.

[0192] It should be noted that the reference ground main line 206, the first sub-connecting line 203a, and the reference ground internal connecting line 207 can be formed using independent process steps.

[0193] In some embodiments, an electroplating process can be used to form a reference ground main line 206 on the substrate 200, a reference ground internal connection line 207 filling the first through-hole 218, and an antenna first sub-connection line 203a filling the second through-hole 219. Those skilled in the art can deduce the steps of using an electroplating process to form a reference ground main line 206 on the substrate 200, a reference ground internal connection line 207 filling the first through-hole 218, and an antenna first sub-connection line 203a filling the second through-hole 219 based on the foregoing embodiments.

[0194] For other information regarding the reference ground main line 206, the reference ground internal connection line 207, and the reference ground signal line 208, please refer to the corresponding descriptions in the aforementioned embodiment of the encapsulated antenna structure, which will not be repeated here.

[0195] refer to Figure 6 A stacked dielectric structure 201 is formed on the carrier board 300. The stacked dielectric structure 201 includes a plurality of dielectric layers stacked sequentially, wherein the dielectric constant of the plurality of dielectric layers exhibits a step-like change, which can improve the bandwidth of the packaged antenna structure.

[0196] The stacked dielectric structure 201 includes multiple stacked dielectric layers. For the sake of brevity and clarity in the accompanying drawings, in this embodiment, the number of the multiple dielectric layers is equal to 3, but this does not limit the scope of this application.

[0197] In this embodiment, the stacked dielectric structure includes: a dielectric layer 201a, a dielectric layer 201b stacked on the dielectric layer 201a, and a dielectric layer 201c stacked on the dielectric layer 201b.

[0198] The material of the dielectric layer 201a includes one or more of the following: bismaleimide triazine resin (BT resin), polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber filler (Ajinomoto Build-up Film, ABF). The material of the dielectric layer 201b includes one or more of the following: bismaleimide triazine resin (BT resin), polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber filler (Ajinomoto Build-up Film, ABF). The material of the dielectric layer 201c includes bismaleimide triazine resin (BT resin). Triazine, resin, BT resin, polyimide (PI), polytetrafluoroethylene (PTFE), epoxy resin, and glass fiber powder filler (Ajinomoto Build-up Film, ABF) are among one or more of these.

[0199] The materials of each dielectric layer are different. In this embodiment, the material of dielectric layer 201a is epoxy resin, the material of dielectric layer 201b is BT resin, and the material of dielectric layer 201c is polytetrafluoroethylene.

[0200] The process for forming each dielectric layer includes a coating process, wherein the coating process includes one or more of brush coating, roller coating, spray coating, dip coating and spin coating.

[0201] The brush coating refers to applying the material of each dielectric layer onto the substrate using a brush. Roll coating: using a roller to coat the material of each dielectric layer onto the substrate; The spraying process involves using a spray gun to apply the material of each dielectric layer onto the substrate. The dip coating involves immersing the substrate in the material of each dielectric layer so that the material of each dielectric layer is coated onto the substrate.

[0202] The spin coating process involves rotating the substrate while simultaneously dripping the material of each dielectric layer onto the substrate, thereby coating the substrate with the material of each dielectric layer.

[0203] In this embodiment, the process for forming the dielectric layer 201a is a spin coating process, the process for forming the dielectric layer 201b is a spin coating process, and the process for forming the dielectric layer 201c is a spin coating process.

[0204] A stacked dielectric structure 201 is formed on the carrier plate 300, that is, a stacked dielectric structure 201 covering the first surface M1 of the substrate 200 is formed. The stacked dielectric structure 201 includes a plurality of dielectric layers stacked sequentially. In this embodiment, the stacked dielectric structure 201 is formed on the carrier plate 300, and the stacked dielectric structure 201 includes three dielectric layers stacked sequentially. The steps for forming the stacked dielectric structure 201 include: The epoxy resin is mixed with a curing agent; The substrate 200 is cleaned and dried; The epoxy resin mixed with curing agent is uniformly coated on the first surface M1 of the substrate 200 by spin coating process. The substrate 200 is heated to cure the epoxy resin, forming a dielectric layer 201a covering the first surface M1 of the substrate 200; The substrate 200 is cleaned and dried; The BT resin is uniformly coated on the surface of the dielectric layer 201a by spin coating process. The substrate 200 is heated to cure the BT resin, forming a dielectric layer 201b covering the dielectric layer 201a; The substrate 200 is cleaned and dried; Polytetrafluoroethylene powder is mixed with a solvent (such as dimethyl sulfoxide) to prepare a polytetrafluoroethylene dispersion; The polytetrafluoroethylene dispersion is uniformly coated onto the surface of the medium layer 201b using a spin coating process. The substrate coated with polytetrafluoroethylene dispersion was placed in a drying oven to remove the solvent; After removing the solvent, the substrate 200 is heat-treated to solidify the PTFE dispersion and form a dielectric layer 201c covering the dielectric layer 201b. It should be noted that the spin coating process for forming the dielectric layer 201a, the dielectric layer 201b and the dielectric layer 201c can be referred to the spin coating process for forming the substrate 200 covering the carrier plate 300 described above.

[0205] It should be noted that the dielectric constant of the dielectric layer 201a is greater than that of the dielectric layer 201b, and the dielectric constant of the dielectric layer 201b is greater than that of the dielectric layer 201c, which can improve the bandwidth of the packaged antenna.

[0206] In this embodiment, the dielectric layer 201a covers the reference ground mainline 206.

[0207] For further information regarding the stacked dielectric structure 201, please refer to the corresponding description in the encapsulated antenna structure of the foregoing embodiments, which will not be repeated here.

[0208] refer to Figure 7 This forms a third through-hole 220 that penetrates the stacked medium structure 201.

[0209] In this embodiment, the step of forming the third through-hole 220 through the stacked dielectric structure 201 includes: Photoresist is applied to the first surface M1 of the substrate 200, that is, the photoresist covers the surface of the dielectric layer 201c of the stacked dielectric structure 201.

[0210] The photoresist is patterned, and the pattern corresponding to the third via 220 on the photomask is transferred to the first surface M1 of the substrate 200.

[0211] The stacked dielectric structure 201 on the substrate 200 is patterned by exposure, development and etching processes to form a third through hole 220 through the stacked dielectric structure 201, and the bottom of the third through hole 220 exposes the first sub-connection line 203a.

[0212] refer to Figure 8 A patch antenna is formed, the patch antenna including: an antenna main line 202, located on the stacked dielectric structure 201.

[0213] The material of the antenna main line 202 includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the antenna main line 202 is copper.

[0214] The process for forming the antenna main line 202 includes: exposure, development, and etching processes, and electroplating processes. In this embodiment, the exposure, development, and etching process is used.

[0215] In this embodiment, the step of forming the antenna main line 202 includes: An antenna mainline material layer (not shown) is formed on the carrier plate 300 by physical vapor deposition or chemical vapor deposition process. That is, the antenna mainline material layer covers the stacked dielectric structure 201 and the antenna mainline material layer also fills the third through hole 220. The antenna main line material layer is patterned using an exposure, development, and etching process to form an antenna main line 202 located on the stacked dielectric structure 201, and a second sub-connection line 203b filling the third via 220. The second sub-connection line 203b is connected to the first sub-connection line 203a. The first sub-connection line 203a and the second sub-connection line 203b constitute the antenna connection line 203. The antenna main line 202 is connected to the antenna connection line 203.

[0216] For other relevant information regarding the antenna main line 202 and the antenna connecting line 203, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.

[0217] refer to Figure 9 Remove the carrier board 300 to expose the antenna signal line 204, the reference ground signal line 208, and the first sub-antenna connection line 203.

[0218] The process of removing the carrier plate 300 includes one or more of etching, peeling, or grinding. In this embodiment, the process of removing the carrier plate 300 is a grinding process.

[0219] In this embodiment, the carrier plate 300 is removed by chemical mechanical polishing process, exposing the antenna signal line 204, the reference ground signal line 208 and the first sub-antenna connection line 203, as well as the power line 212 and the signal source line 213.

[0220] The step of removing the carrier plate 300 includes: Adjust and set the grinding parameters, such as grinding time, grinding pressure, and the rotation speed of the grinding wheel on the grinding machine. The grinding machine table (not shown) is moved so that the grinding wheel on the grinding machine table is directly opposite the fourth surface M4 of the carrier plate 300; in this embodiment, the grinding machine table is below and the carrier plate 300 is above; in some embodiments, the grinding machine table is above and the carrier plate 300 is below. The grinding machine is moved toward the fourth surface M4 of the carrier plate 300, and the grinding wheel is ground on the fourth surface M4 of the carrier plate 300 according to the adjusted pressure and speed to remove the carrier plate 300.

[0221] refer to Figure 10 The driving circuit 205 is attached to the second surface M2 of the substrate 200 and coupled to the reference ground signal line 208.

[0222] In this embodiment, the driving circuit 205 is a chip, which includes: a semiconductor transistor (not shown), a ground terminal 214, an antenna terminal 215, a power supply terminal 216, a signal source terminal 217, and internal connection lines (not shown).

[0223] In this embodiment, the step of attaching the driving circuit 205 to the second surface M2 of the substrate 200 includes: The first surface M1 of the substrate is on top, and the second surface M2 of the substrate is on the bottom; On the second surface M2 of the substrate 200, a layer of solder paste (not shown) is applied to the exposed surfaces of the antenna signal line 204, reference ground signal line 208, power line 212 and signal source line 213 through a stencil (template) (not shown). The solder paste includes a first solder paste (not shown) and a second solder paste (not shown). The first solder paste is used for attaching the drive circuit 205, and the second solder paste is used for attaching the conductive pillars.

[0224] Continue to refer to Figure 10 Remove the stencil, and the first solder paste remains on the surface for coupling the antenna signal line 204, reference ground signal line 208, power line 212, and signal source line 213 with the drive circuit 205; the second solder paste remains on the surface for coupling the reference ground signal line 208, power line 212, and signal source line 213 with the conductive posts. Using a component mounting device, the driving circuit 205 is attached to the second surface M2 of the substrate 200 and coupled to the reference ground signal line 208.

[0225] The first solder paste is cured by a high-temperature reflow apparatus to form a first tin metal layer 222, thereby electrically connecting the driving circuit 205 to the reference ground signal line 208. That is, the ground terminal 214 of the driving circuit 205 is electrically connected to the reference ground signal line 208 through the first tin metal layer 222. In addition, the antenna terminal 215 of the driving circuit 205 is electrically connected to the antenna signal line 204 through the first tin metal layer 222, the power terminal 216 of the driving circuit 205 is electrically connected to the power line 212 through the first tin metal layer 222, and the signal source terminal 217 of the driving circuit 205 is electrically connected to the signal source line 213 through the first tin metal layer 222.

[0226] For other relevant information about the drive circuit 205, please refer to the corresponding description in the foregoing embodiments, which will not be repeated here.

[0227] In some embodiments, in the step of attaching the driving circuit 205 to the second surface M2 of the substrate 200, the first surface M1 of the substrate 200 is on the bottom and the second surface M2 of the substrate is on the top.

[0228] Continue to refer to Figure 10 A conductive pillar is formed, and one end of the conductive pillar is coupled to the reference ground signal line 208.

[0229] The material of the conductive pillar includes one or more of copper, gold, silver, aluminum and molybdenum. In this embodiment, the material of the conductive pillar is copper.

[0230] The shape of the conductive pillar includes one or more of the following: circular pillar, square pillar and elliptical pillar. In this embodiment, the conductive pillar is circular.

[0231] The conductive pillar is an independent copper cylindrical body.

[0232] In this embodiment, there are four conductive pillars, namely conductive pillar 211a, conductive pillar 211b, conductive pillar 211c, and conductive pillar 211d. One end of conductive pillar 211a and conductive pillar 211b is coupled to the reference ground signal line 208, conductive pillar 211c is coupled to the power line 212, and conductive pillar 211d is coupled to the signal source line 213.

[0233] The formation of the conductive pillar involves coupling one end of the conductive pillar to the reference ground signal line 208 on the second surface M2 of the substrate 200.

[0234] The step of forming a conductive post, one end of which is coupled to the reference ground signal line 208, includes: In the step of attaching the driving circuit 205, the conductive pillars are simultaneously attached to the second surface M2 of the substrate 200 using a component mounting device, so that one end of the conductive pillar is coupled to the reference ground signal line 208 through the second solder paste. In this embodiment, one end of the conductive pillars 211a and 211b is coupled to the reference ground signal line 208 through the second solder paste. In the step of coupling one end of the conductive pillars 211a and 211b to the reference ground signal line 208 through the second solder paste, one end of the conductive pillar 211c is also coupled to the power line 212 through the second solder paste, and one end of the conductive pillar 211d is coupled to the signal source line 213.

[0235] That is, in the same step, one end of the conductive post 211a and conductive post 211b is coupled to the reference ground signal line 208 by the second solder paste, one end of the conductive post 211c is coupled to the power line 212, and one end of the conductive post 211d is coupled to the signal source line 213.

[0236] The second solder paste is cured by a high-temperature reflow apparatus to form a second tin metal layer 223, so that one end of the conductive post is electrically connected to the reference ground signal line 208 through the second tin metal layer 223. In this embodiment, one end of the conductive post 211a and conductive post 211b is electrically connected to the reference ground signal line 208 through the second tin metal layer 223, one end of the conductive post 211c is electrically connected to the power line 212 through the second tin metal layer 223, and one end of the conductive post 211d is electrically connected to the signal source line 213 through the second tin metal layer 223.

[0237] In this embodiment, the first solder paste and the second solder paste are cured in the same step using a high-temperature reflow device, thereby forming a first tin metal layer 222 and a second tin metal layer 223.

[0238] It should be noted that after the first solder paste and the second solder paste are formed by the stencil, and before the first solder paste and the second solder paste are cured by the high-temperature reflow device, in the same process step, the driving circuit 205 and the conductive pillar are simultaneously attached to the second surface M2 of the substrate 200. In some embodiments, the driving circuit 205 can be attached to the second surface M2 of the substrate 200 first, and then the conductive pillar can be attached to the second surface M2 of the substrate 200. In other embodiments, the conductive pillar can be attached to the second surface M2 of the substrate 200 first, and then the driving circuit 205 can be attached to the second surface M2 of the substrate 200.

[0239] For other relevant information about the conductive pillars, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.

[0240] refer to Figure 11 A protective layer 209 is formed covering the second surface M2 of the substrate 200.

[0241] The protective layer 209 is used to help encapsulate the entire package for moisture protection, mechanical impact protection, insulation, and support.

[0242] The material of the protective layer 209 is generally composed of epoxy resin (bisphenol F / o-cresol type), curing agent (phenolic / amine), silica powder (60-90%), release agent, flame retardant and coupling agent, etc. The material of the protective layer 209 is also called epoxy molding compound (EMC), which is used to help the overall encapsulation of the package to prevent moisture, mechanical impact, insulation and support.

[0243] The step of forming a protective layer 209 covering the second surface M2 of the substrate 200 includes: The substrate 200 is flipped using a manual or automatic flipping machine so that the first side M1 of the substrate is on the bottom and the second side M2 ​​of the substrate is on the top.

[0244] It should be noted that, for ease of understanding the antenna packaging structure of this application, Figure 12 The design is based on the first surface M1 of the substrate being on top and the second surface M2 of the substrate being on the bottom, but this does not limit the scope of this application.

[0245] Using a molding machine (molding process), a molding compound (EMC) is applied to the second surface M2 of the substrate through a high-temperature melting process.

[0246] The molding compound (EMC) is cooled to cure and form a protective layer 209.

[0247] In this embodiment, the protective layer 209 covers the reference ground signal line 208, the antenna signal line 204, the driving circuit 205, the conductive pillars 211a, 211b, 211c, and 211d, the power line 212, and the signal source line 213.

[0248] Continue to refer to Figure 11 Remove a portion of the protective layer 209 to expose the other end of the conductive post.

[0249] The process of removing a portion of the protective layer 209 includes etching or polishing processes. In this embodiment, a portion of the protective layer 209 is removed by polishing processes, such as mechanical polishing.

[0250] The step of removing a portion of the protective layer 209 to expose the other end of the conductive post includes: Adjust and set the grinding parameters, such as grinding time, grinding pressure, and the rotation speed of the grinding wheel on the grinding machine. The grinding machine is moved so that the grinding wheel on the grinding machine is directly opposite the second surface M2 of the substrate 200. In this embodiment, the grinding machine is below and the substrate 200 is above. In some embodiments, the grinding machine is above and the substrate 200 is below. The grinding machine is moved closer to the substrate 200, and the grinding wheel is ground on the second surface M2 of the substrate 200 according to the adjusted pressure and speed to remove a part of the protective layer 209, that is, to thin the protective layer 209 and expose the other end of the conductive pillar, that is, to expose the other end of the conductive pillar 211a, conductive pillar 211b, conductive pillar 211c and conductive pillar 211d.

[0251] For other relevant information about the protective layer 209, please refer to the corresponding description in the foregoing embodiments, which will not be repeated here.

[0252] Continue to refer to Figure 11 This forms a contact point, which is coupled to the other end of the conductive post.

[0253] The contact point is used to connect to an external power source and signal source, provide voltage for the operation of the drive circuit 205, and ground the reference ground main line 206, further reducing the probability of interference from other electronic devices to the packaged antenna and increasing the bandwidth of the packaged antenna.

[0254] The material of the contact point includes one or more of tin, bismuth, indium and aluminum. In this embodiment, the material of the contact point is tin.

[0255] In this embodiment, there are four contact points: contact point 210a, contact point 210b, contact point 210c, and contact point 210d.

[0256] It should be noted that the contact point can also be called a solder ball.

[0257] The steps to form a contact point include: The substrate 200 is flipped using a manual or automatic flipping machine so that the first side M1 of the substrate is on the bottom and the second side M2 ​​of the substrate is on the top.

[0258] Apply flux (not shown) to the exposed ends of conductive posts 211a, 211b, 211c and 211d.

[0259] Contact points (solder balls) are attached to the other end faces of conductive pillars 211a, 211b, 211c, and 211d. In this embodiment, contact point 210a is attached to the other end face of conductive pillar 211a, contact point 210ba is attached to the other end face of conductive pillar 211b, contact point 210c is attached to the other end face of conductive pillar 211c, and contact point 210d is attached to the other end face of conductive pillar 211d.

[0260] The substrate 200 is subjected to a high-temperature reflow process to form conductive connections between contact points and conductive pillars. In this embodiment, the high-temperature reflow process forms contact point 210a to be electrically connected to the other end of conductive pillar 211a, contact point 210b to be electrically connected to the other end of conductive pillar 211b, contact point 210c to be electrically connected to the other end of conductive pillar 211c, and contact point 210d to be electrically connected to the other end of conductive pillar 211d.

[0261] It should be noted that contact points 210a and 210b are coupled to the reference ground signal line 208, contact point 210c is coupled to the power line 212, and contact point 210d is coupled to the signal source line 213. That is, contact point 210a is electrically connected to the other end of conductive post 211a and then coupled to the reference ground signal line 208; contact point 210c is electrically connected to the other end of conductive post 211c and then coupled to the power line 212; and contact point 210d is electrically connected to the other end of conductive post 211d and then coupled to the signal source line 213.

[0262] For other relevant information about the contact points, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.

[0263] In the embodiments of this application, "multiple" refers to two or more.

[0264] The descriptions of "first," "second," "third," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0265] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A packaged antenna structure, characterized in that, include: The substrate includes a first surface and a second surface of the substrate facing each other. A stacked dielectric structure is located on the first surface of the substrate. The stacked dielectric structure includes multiple stacked dielectric layers, wherein the dielectric constant of the multiple dielectric layers exhibits a step-like change; along the direction perpendicular to the first surface of the substrate upwards, the dielectric constant of the multiple dielectric layers exhibits a decreasing change, and the materials of each dielectric layer are different. A reference ground line is located on the first surface of the substrate, and the stacked dielectric structure covers the reference ground line, wherein the dielectric layer in the stacked dielectric structure closest to the substrate is in contact with the reference ground line; Patch antenna, including: The antenna main line is located on the stacked dielectric structure, which is located between the antenna main line and the reference ground main line. The projection of the antenna main line on the first surface of the substrate is located within the projection of the reference ground main line on the first surface of the substrate.

2. The packaged antenna structure as described in claim 1, characterized in that, Along the direction perpendicular to the first surface of the substrate, the dielectric constant of the plurality of dielectric layers decreases in that direction. The materials of each dielectric layer include one or more of the following: bismaleimide triazine resin, polyimide, polytetrafluoroethylene, epoxy resin, and glass fiber powder filler; The materials of each dielectric layer are different.

3. The packaged antenna structure as described in claim 1, characterized in that, The patch antenna further includes: Antenna connection lines penetrate the stacked dielectric structure and the substrate; The antenna signal line is located on the second surface of the substrate; The antenna signal line is coupled to the antenna connection line, and the antenna connection line is coupled to the antenna main line.

4. The packaged antenna structure as described in claim 1, characterized in that, The shape of the antenna main line includes one or more of the following: square, circular, elliptical, triangular, and polygonal.

5. The packaged antenna structure as described in claim 1, characterized in that, The antenna connection line also runs through the main reference ground line and is isolated from the main reference ground line.

6. The packaged antenna structure as described in claim 1, characterized in that, Also includes: An internal ground connection line extends through the substrate; A reference ground signal line is located on the second surface of the substrate; A driving circuit is connected to the reference ground signal line, which is connected to the internal connection line of the reference ground, and the internal connection line of the reference ground is connected to the main line of the reference ground.

7. The packaged antenna structure as described in claim 6, characterized in that, Also includes: A protective layer is located on the second side of the substrate and covers the reference ground signal line and the antenna signal line.

8. The packaged antenna structure as described in claim 7, characterized in that, Also includes: Contact point; A conductive post penetrates the protective layer, with one end of the conductive post coupled to the reference ground signal line and the other end of the conductive post coupled to the contact point.

9. A method for fabricating a packaged antenna structure, characterized in that, include: Provide carrier board; A stacked dielectric structure is formed on the carrier plate, the stacked dielectric structure comprising a plurality of dielectric layers stacked sequentially, wherein the dielectric constant of the plurality of dielectric layers exhibits a step-like change; A patch antenna is formed, the patch antenna comprising: an antenna main line located on the stacked dielectric structure; The step of forming the patch antenna further includes: forming a substrate covering the carrier plate; forming a reference ground main line on the substrate; wherein the dielectric constants of the plurality of dielectric layers decrease in a direction perpendicular to the first surface of the substrate, and the materials of each dielectric layer are different; the dielectric layer closest to the substrate in the stacked dielectric structure is in contact with the reference ground main line; the stacked dielectric structure is located between the antenna main line and the reference ground main line, and the projection of the antenna main line on the first surface of the substrate is located within the projection of the reference ground main line on the first surface of the substrate.

10. The manufacturing method as described in claim 9, characterized in that, The steps for forming the patch antenna include: An antenna material layer is formed on the carrier plate; The antenna material layer is patterned to form antenna signal lines and reference ground signal lines located on the carrier plate.

11. The manufacturing method as described in claim 10, characterized in that, The substrate includes: a first substrate surface and a second substrate surface facing each other, wherein the second substrate surface covers an antenna signal line and a reference ground signal line; The step of forming the patch antenna further includes: forming a first through hole and a second through hole through the substrate.

12. The manufacturing method as described in claim 11, characterized in that, The substrate material includes polyimide.

13. The manufacturing method as described in claim 11, characterized in that, The process of forming a substrate covering the carrier plate includes: a coating process.

14. The manufacturing method as described in claim 11, characterized in that, The step of forming the patch antenna further includes: An internal ground connection line is formed to fill the first through hole, and the internal ground connection line is coupled to the main ground line; Form the first sub-connection line of the antenna that fills the second through hole.

15. The manufacturing method as described in claim 11, characterized in that, The step of forming the patch antenna further includes: A stacked dielectric structure is formed covering a first surface of the substrate, the stacked dielectric structure comprising a plurality of stacked dielectric layers; The stacked dielectric structure is graphically represented to form a third via that penetrates the stacked dielectric structure, the third via exposing the first sub-connection line of the antenna.

16. The manufacturing method as described in claim 15, characterized in that, The processes for forming the various dielectric layers include: coating processes.

17. The manufacturing method as described in claim 15, characterized in that, The step of forming the patch antenna further includes: A second sub-connecting line is formed to fill the third through hole. The first sub-connecting line and the second sub-connecting line constitute the antenna connecting line.

18. The manufacturing method as described in claim 17, characterized in that, The step of forming the patch antenna further includes: An antenna main line is formed on the stacked dielectric structure, and the antenna main line is connected to the antenna connecting line.

19. The manufacturing method as described in claim 15, characterized in that, Also includes: Remove the carrier board to expose the antenna signal line, the reference ground signal line, and the first sub-antenna connection line.

20. The manufacturing method as described in claim 19, characterized in that, The process for removing the carrier plate includes one or more of etching, peeling, or grinding.

21. The manufacturing method as described in claim 11, characterized in that, Also includes: A conductive pillar is formed, one end of which is coupled to the reference ground signal line; The driving circuit is attached to the second side of the substrate and coupled to the reference ground signal line.

22. The manufacturing method as described in claim 21, characterized in that, The method by which one end of the conductive post is coupled to the reference ground signal line includes: conductive adhesive or soldering.

23. The manufacturing method as described in claim 21, characterized in that, The material of the conductive pillar includes one or more of copper, gold, silver, aluminum, and molybdenum.

24. The manufacturing method as described in claim 21, characterized in that, Also includes: A protective layer is formed covering the second side of the substrate; Remove a portion of the protective layer to expose the other end of the conductive post.

25. The manufacturing method as described in claim 24, characterized in that, The process of removing a portion of the protective layer includes etching or polishing processes.

26. The manufacturing method as described in claim 24, characterized in that, Also includes: A contact point is formed and coupled to the other end of the conductive post.

27. The manufacturing method as described in claim 26, characterized in that, The material of the contact point includes one or more of tin, bismuth, indium, and aluminum.

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