Sensor packaging structure

Abstract

The invention discloses a sensor packaging structure, which comprises a substrate, a sensing chip, a plurality of first metal wires, a plurality of second metal wires, an annular supporting layer and a light-transmitting sheet, wherein the sensing chip is arranged on the substrate; the first metal wires and the second metal wires are connected with the substrate and the sensing chip; the annular supporting layer is formed on the sensing chip; the substrate and the sensing chip are electrically coupled with each other through the plurality of first metal wires, and each edge of the top surface of the sensing chip is provided with at least one adjacent second metal wire. The highest end point, relative to the substrate, of each second metal wire is higher than the highest end point of any first metal wire, and the light-transmitting piece is arranged on the annular supporting layer and abuts against the highest end points of the multiple second metal wires, so that the multiple first metal wires do not make contact with the light-transmitting piece. Therefore, the light-transmitting sheet is effectively prevented from pressing any one of the first metal wires, and the signal transmission efficiency between the substrate and the sensing chip is ensured.

Description

Technical Field

[0001] This invention relates to a packaging structure, and more particularly to a sensor packaging structure. Background Technology

[0002] Existing sensor packaging structures use a support layer to support a light-transmitting sheet. However, the light-transmitting sheet may be too heavy or tilted, and may frequently press against at least one metal line used for signal transmission between the substrate and the sensor chip. Consequently, the at least one metal line pressed by the light-transmitting sheet may deform, affecting its signal transmission performance.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The present invention provides a sensor packaging structure that can effectively improve the defects that may occur in existing sensor packaging structures.

[0005] This invention discloses a sensor packaging structure, comprising: a substrate having an upper surface and a lower surface located on opposite sides; wherein the upper surface has a chip fixing region, and the substrate includes a plurality of first bonding pads and a plurality of second bonding pads located outside the chip fixing region; a sensing chip disposed on the chip fixing region of the substrate, and a top surface of the sensing chip including a sensing region and a carrying region surrounding the sensing region; wherein the sensing chip includes: a plurality of first bonding pads located in the carrying region, and the plurality of first bonding pads are arranged along a plurality of edges of the top surface; and a plurality of second bonding pads located in the carrying region, and each edge of the top surface is provided with at least one adjacent second bonding pad; wherein the plurality of second bonding pads do not have signal transmission function; and a plurality of first gold... The system comprises: a plurality of first metal wires, one end of which is connected to a plurality of first bonding pads, and the other end of which is connected to a plurality of first connecting pads, so that the substrate and the sensing chip are electrically coupled to each other; a plurality of second metal wires, one end of which is connected to a plurality of second bonding pads, and the other end of which is connected to a plurality of second connecting pads; wherein each second metal wire has a highest point relative to the substrate, which is higher than the highest point of any first metal wire; an annular support layer is formed in the carrier area of ​​the sensing chip; and a light-transmitting sheet is disposed on the annular support layer and abuts against the highest point of the plurality of second metal wires, so that the plurality of first metal wires do not touch the light-transmitting sheet; wherein the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together form a closed space, and the sensing area is located within the closed space.

[0006] Optionally, each second metal line undergoes a deformation of up to 8 micrometers at its highest point.

[0007] Optionally, the plurality of second bonding pads and the plurality of second connecting pads are all ground pads, and the substrate and the sensing chip are grounded together through the plurality of second metal lines.

[0008] Optionally, the plurality of second bonding pads and the plurality of second connecting pads do not have any electrical function, and the plurality of second metal wires are only used to support the light-transmitting sheet.

[0009] Optionally, at each edge of the top surface of the sensing chip, a plurality of corresponding first connection pads and at least one corresponding second connection pad are arranged in a row.

[0010] Optionally, the highest point of each first metal line is a first distance from the top surface of the sensing chip, and the highest point of each second metal line is a second distance from the top surface of the sensing chip, which is at least 10 micrometers greater than the first distance.

[0011] Optionally, the highest point of each first metal line is a first distance away from the top surface of the sensing chip, and the highest point of each second metal line is a second distance away from the top surface of the sensing chip, which is 120% to 250% of the first distance.

[0012] Optionally, each second metal wire may be made of a material different from that of any first metal wire, and the structural strength of each second metal wire may be greater than that of any first metal wire.

[0013] Optionally, each second metal wire has a forward bonding structure that differs from the bonding structure of any of the first metal wires.

[0014] Optionally, the sensor package structure further includes a package body formed on the upper surface of the substrate; wherein at least a portion of each first metal line, at least a portion of each second metal line, the sensor chip, the annular support layer, and the light-transmitting sheet are embedded within the package body, and the outer surface of the light-transmitting sheet is at least partially exposed outside the package body.

[0015] Optionally, each first connecting pad and its connected first metal wire are partially embedded within an annular support layer, while the remaining portion of each first metal wire is embedded within a package; each second connecting pad and its connected second metal wire are partially embedded within an annular support layer, while the remaining portion of each second metal wire is embedded within a package.

[0016] Optionally, the plurality of first connecting pads and the plurality of second connecting pads are located outside the annular support layer and embedded within the package, and the plurality of first metal wires and the plurality of second metal wires are completely embedded within the package.

[0017] This invention also discloses a sensor packaging structure, comprising: a substrate having an upper surface and a lower surface located on opposite sides; wherein the upper surface has a chip fixing region, and the substrate includes a plurality of first bonding pads and a plurality of second bonding pads located outside the chip fixing region; a sensing chip disposed on the chip fixing region of the substrate, and a top surface of the sensing chip including a sensing region and a carrying region surrounding the sensing region; wherein the sensing chip includes: a plurality of first bonding pads located in the carrying region, and the plurality of first bonding pads are arranged along a plurality of edges of the top surface; and a plurality of second bonding pads located in the carrying region, and each of the plurality of corners of the top surface has an adjacent second bonding pad; wherein the plurality of second bonding pads do not have signal transmission function; and a plurality of first gold... The system comprises: a plurality of first metal wires, one end of which is connected to a plurality of first bonding pads, and the other end of which is connected to a plurality of first connecting pads, so that the substrate and the sensing chip are electrically coupled to each other; a plurality of second metal wires, one end of which is connected to a plurality of second bonding pads, and the other end of which is connected to a plurality of second connecting pads; wherein each second metal wire has a highest point relative to the substrate, which is higher than the highest point of any first metal wire; an annular support layer is formed in the carrier area of ​​the sensing chip; and a light-transmitting sheet is disposed on the annular support layer and abuts against the highest point of the plurality of second metal wires, so that the plurality of first metal wires do not touch the light-transmitting sheet; wherein the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together form a closed space, and the sensing area is located within the closed space.

[0018] Optionally, each edge of the top surface of the sensing chip is configured with at least one adjacent second connection pad.

[0019] Optionally, a plurality of first connecting pads and a plurality of second connecting pads are arranged together in a rectangular ring.

[0020] In summary, the sensor packaging structure disclosed in the embodiments of the present invention can, through the structural configuration of multiple second metal lines, enable multiple second metal lines without signal transmission function to work together with the annular support layer to support the light-transmitting sheet, thereby effectively preventing the light-transmitting sheet from pressing on any of the first metal lines, and thus ensuring the signal transmission performance between the substrate and the sensing chip.

[0021] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of the present invention.

[0023] Figure 2 for Figure 1 The sensor packaging structure is shown in a three-dimensional diagram after omitting the annular support layer, the light-transmitting sheet, and the package body.

[0024] Figure 3 for Figure 2 A top-down view.

[0025] Figure 4 for Figure 1 A schematic cross-sectional view along section line IV-IV.

[0026] Figure 5 for Figure 4 A magnified diagram of region V.

[0027] Figure 6 for Figure 2 Another top-view diagram of its appearance.

[0028] Figure 7 for Figure 4 Another cross-sectional view of the same state.

[0029] Figure 8 This is a cross-sectional view of the sensor packaging structure of Embodiment 1 of the present invention when the light-transmitting sheet is placed.

[0030] Figure 9 for Figure 5 Another cross-sectional view of the same state.

[0031] Figure 10 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 2 of the present invention.

[0032] Figure 11 for Figure 10 A cross-sectional view along section line XI-XI.

[0033] Figure 12 This is a top view of the sensor packaging structure of Embodiment 2 of the present invention, omitting the annular support layer, the light-transmitting sheet, and the package body.

[0034] Figure 13 for Figure 12 Another top-view diagram of its appearance. Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0036] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or features, these components or features should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one feature from another. Furthermore, the term "or" as used in this document should, as appropriate, include any combination of one or more related listed items.

[0037] [Example 1]

[0038] Please see Figures 1 to 9 As shown, this is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a sensor packaging structure 100, which includes a substrate 1, a sensing chip 2 disposed on the substrate 1, a plurality of first metal lines 3 and a plurality of second metal lines 4 connecting the sensing chip 2 and the substrate 1, an annular support layer 5 disposed on the sensing chip 2, a light-transmitting sheet 6 disposed on the annular support layer 5 and the plurality of second metal lines 4, and a package body 7 formed on the substrate 1.

[0039] It should be noted that although the sensor packaging structure 100 is described in this embodiment as including the above-described components, the sensor packaging structure 100 can also be adjusted and varied according to design requirements. For example, in other embodiments of the present invention not shown, the package body 7 of the sensor packaging structure 100 can be omitted or replaced with other components according to actual needs. The construction and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

[0040] like Figures 2 to 5As shown, the substrate 1 in this embodiment is square or rectangular, but the present invention is not limited thereto. The substrate 1 has an upper surface 11 and a lower surface 12 located on opposite sides. A chip fixing region 113 is provided at approximately the center of the upper surface 11, and the substrate 1 includes a plurality of first bonding pads 111 and a plurality of second bonding pads 112 located outside the chip fixing region 113. In this embodiment, the plurality of first bonding pads 111 and the plurality of second bonding pads 112 are generally arranged in a ring, but the present invention is not limited thereto.

[0041] Furthermore, in this embodiment, the substrate 1 may also have a plurality of solder balls 8 on the lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) by the plurality of solder balls 8, so that the sensor package structure 100 can be electrically coupled to the electronic component.

[0042] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square). The sensing chip 2 is described below as an image sensing chip, but the invention is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 113 of the substrate 1 by die-attach adhesive; that is, the sensing chip 2 is located inside the plurality of first bonding pads 111 and the plurality of second bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 surrounding the sensing area 211 (in a ring shape).

[0043] More specifically, the sensing chip 2 includes a plurality of first connecting pads 213 and a plurality of second connecting pads 214 located in the bearing region 212 (that is, the plurality of first connecting pads 213 and the plurality of second connecting pads 214 are located outside the sensing region 211), and the number of the plurality of second connecting pads 214 may be less than the number of the plurality of first connecting pads 213. In this embodiment, the number and position of the plurality of first connecting pads 213 of the sensing chip 2 correspond to the number and position of the plurality of first bonding pads 111 of the substrate 1, and the number and position of the plurality of second connecting pads 214 of the sensing chip 2 correspond to the number and position of the plurality of second bonding pads 112 of the substrate 1.

[0044] Furthermore, a plurality of first connecting pads 213 are arranged along a plurality of edges 21a of the top surface 21, and each edge 21a of the top surface 21 is provided with at least one adjacent second connecting pad 214. In this embodiment, at each edge 21a of the top surface 21 of the sensing chip 2, the corresponding plurality of first connecting pads 213 and the corresponding at least one second connecting pad 214 may optionally be arranged in a row. That is, the plurality of first connecting pads 213 and the plurality of second connecting pads 214 may optionally be arranged in a rectangular ring; and the number of corresponding at least one second connecting pad 214 at each edge 21a of the top surface 21 of the sensing chip 2 can be adjusted and varied according to actual needs (e.g.: Figure 2 and Figure 3 One shown, or Figure 6 (as shown in the examples), but the present invention is not limited thereto.

[0045] like Figures 2 to 5 As shown, one end of each of the multiple first metal wires 3 is connected to a plurality of first bonding pads 111, and the other end of each of the multiple first metal wires 3 is connected to a plurality of first connecting pads 213, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other. Furthermore, in this embodiment, the sensing function or signal transmission of the sensing chip 2 is achieved by the multiple first metal wires 3 in combination with the multiple first bonding pads 111 and the multiple first connecting pads 213. That is to say, the multiple first metal wires 3 are not suitable for being compressed or deformed.

[0046] One end of each of the multiple second metal wires 4 is connected to a multiple of the second bonding pads 112, and the other end of each of the multiple second metal wires 4 is connected to a multiple of the second connecting pads 214, but the multiple second connecting pads 214 do not have signal transmission function. That is to say, the multiple second metal wires 4 can withstand pressure or deformation.

[0047] Furthermore, the plurality of second bonding pads 112 and the plurality of second connecting pads 214 are all grounding pads, and the substrate 1 and the sensing chip 2 are connected to a common ground via the plurality of second metal lines 4, and the plurality of second metal lines 4 can be used to support the light-transmitting sheet 6. Alternatively, the plurality of second bonding pads 112 and the plurality of second connecting pads 214 do not have any electrical function, and the plurality of second metal lines 4 are only used to support the light-transmitting sheet 6.

[0048] Furthermore, each of the second metal lines 4 has a highest point 41 relative to the substrate 1, which is higher than the highest point 31 of any one of the first metal lines 3, and the highest points 41 of the multiple second metal lines 4 are substantially located on the same plane (e.g., the height difference between the highest points 41 of any two second metal lines 4 is no more than 5 micrometers).

[0049] It should be noted that, to facilitate the implementation of the above-described architecture of multiple first metal wires 3 and multiple second metal wires 4, each second metal wire 4 can adopt a normal bond construction, which differs from the bonding construction of any of the first metal wires 3; for example, a reverse bond construction and an ultra-low bonding construction, but the present invention is not limited thereto. Furthermore, the material of each second metal wire 4 can differ from the material of any of the first metal wires 3, and the structural strength of each second metal wire 4 is greater than the structural strength of any of the first metal wires 3.

[0050] Furthermore, the highest endpoint 31 of each of the first metal lines 3 is separated from the top surface 21 of the sensing chip 2 by a first distance D1, and the highest endpoint 41 of each of the second metal lines 4 is separated from the top surface 21 of the sensing chip 2 by a second distance D2. The second distance D2 may be at least 10 micrometers greater than the first distance D1; or, the second distance D2 may be 120% to 250% of the first distance D1. In this embodiment, the first distance D1 is described as 65 micrometers (μm) to 85 micrometers, and the second distance D2 is 140 micrometers to 160 micrometers, but the present invention is not limited thereto.

[0051] The annular support layer 5 is formed on the carrier region 212 of the sensing chip 2 and surrounds the outside of the sensing region 211. In this embodiment, each first connecting pad 213 and a portion of its connected first metal wire 3 are embedded within the annular support layer 5, and each second connecting pad 214 and a portion of its connected second metal wire 4 are also embedded within the annular support layer 5. The remaining portions of each first metal wire 3 and each second metal wire 4 are embedded within the package 7, but the invention is not limited thereto. For example, such as Figure 7 As shown, the plurality of first connecting pads 213 and the plurality of second connecting pads 214 may all be located outside the annular support layer 5 and embedded within the encapsulation body 7, and the plurality of first metal wires 3 and the plurality of second metal wires 4 are completely embedded within the encapsulation body 7.

[0052] like Figures 2 to 4As shown, the light-transmitting sheet 6 in this embodiment is illustrated as a flat glass plate, but the present invention is not limited thereto. The light-transmitting sheet 6 has an outer surface 61, an inner surface 62 located opposite to the outer surface 61, and an annular side surface 63 located between the outer surface 61 and the inner surface 62. The light-transmitting sheet 6 (e.g., the inner surface 62) is disposed on the annular support layer 5 and abuts against the highest endpoint 41 of the plurality of second metal lines 4, so that the plurality of first metal lines 3 do not touch the light-transmitting sheet 6.

[0053] Therefore, in this embodiment, the sensor packaging structure 100 can be configured with multiple second metal lines 4 so that multiple second metal lines 4 without signal transmission function can work together with the annular support layer 5 to support the light-transmitting sheet 6, thereby effectively preventing the light-transmitting sheet 6 from pressing against any of the first metal lines 3, and thus ensuring the signal transmission performance between the substrate 1 and the sensing chip 2.

[0054] It should be noted that, as Figure 8 As shown, in this embodiment, the light-transmitting sheet 6 can be placed on the highest point 31 of the annular support layer 5 and the multiple second metal lines 4 by free fall (e.g., by using a capturing device to release the light-transmitting sheet 6 at a predetermined distance above the annular support layer 5), and each second metal line 4 undergoes a deformation of less than 8 micrometers (μm) at the highest point 41 (e.g., Figure 5 The second metal wire 4 shown has almost no deformation, or Figure 9 The second metal line 4 shown has undergone slight deformation.

[0055] From another perspective, such as Figure 4 As shown, the light-transmitting sheet 6, the annular support layer 5, and the top surface 21 of the sensing chip 2 together form a closed space E, and the sensing area 211 is located within the closed space E. Furthermore, the package 7 is formed on the upper surface 11 of the substrate 1, such that at least a portion of each of the first metal lines 3, at least a portion of each of the second metal lines 4, the sensing chip 2, the annular support layer 5, and the light-transmitting sheet 6 are embedded within the package 7, and the outer surface 61 of the light-transmitting sheet 6 is at least partially exposed outside the package 7.

[0056] [Example 2]

[0057] Please see Figures 10 to 13As shown, this is Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiment 1 described above are as follows (e.g., the configuration of the plurality of second bonding pads 112, the plurality of second connecting pads 214, and the plurality of second metal wires 4):

[0058] As in this embodiment Figures 10 to 12 As shown, the sensing chip 2 may have an adjacent second connecting pad 214 at each of the multiple corners 21b of the top surface 21, so that the multiple second metal lines 4 can correspondingly support the four corners of the light-transmitting sheet 6, thereby effectively preventing the light-transmitting sheet 6 from tilting. Or, as Figure 13 As shown, in addition to each of the multiple corners 21b of the top surface 21 having an adjacent second connection pad 214, each edge 21a of the top surface 21 may also be further provided with at least one adjacent second connection pad 214, thereby effectively improving the support strength of the light-transmitting sheet 6 by the multiple second metal lines 4.

[0059] [Technical Effects of the Embodiments of the Invention]

[0060] In summary, the sensor packaging structure disclosed in the embodiments of the present invention can, through the structural configuration of multiple second metal lines, enable multiple second metal lines without signal transmission function to work together with the annular support layer to support the light-transmitting sheet, thereby effectively preventing the light-transmitting sheet from pressing on any of the first metal lines, and thus ensuring the signal transmission performance between the substrate and the sensing chip.

[0061] The above-disclosed content is only an optional and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A sensor packaging structure, characterized in that, The sensor packaging structure includes: a substrate having an upper surface and a lower surface located on opposite sides; wherein the upper surface has a chip fixing area, and the substrate includes a plurality of first bonding pads and a plurality of second bonding pads located outside the chip fixing area; A sensing chip is disposed on the chip fixing area of ​​the substrate, and one top surface of the sensing chip includes a sensing area and a carrying area surrounding the sensing area; wherein, the sensing chip includes: A plurality of first connecting pads are located in the bearing area, and the plurality of first connecting pads are arranged along a plurality of edges of the top surface; and A plurality of second connecting pads are located in the bearing area, and at least one second connecting pad is disposed adjacent to each edge of the top surface; wherein the plurality of second connecting pads do not have signal transmission function; Multiple first metal lines, one end of which is connected to multiple first bonding pads respectively, and the other end of the multiple first metal lines is connected to multiple first connection pads, so that the substrate and the sensing chip are electrically coupled to each other. Multiple second metal lines, one end of which is connected to multiple second bonding pads, and the other end of which is connected to multiple second connecting pads; wherein each second metal line has a highest point relative to the substrate, and the highest point is higher than the highest point of any first metal line; A ring-shaped support layer is formed in the carrier region of the sensing chip; and A light-transmitting sheet is disposed on the annular support layer and abuts against the highest endpoints of the plurality of second metal lines, so that the plurality of first metal lines do not touch the light-transmitting sheet; wherein, the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together form a closed space, and the sensing area is located within the closed space.

2. The sensor packaging structure according to claim 1, characterized in that, Each of the second metal wires undergoes a deformation of up to 8 micrometers at its highest endpoint.

3. The sensor packaging structure according to claim 1, characterized in that, The plurality of second bonding pads and the plurality of second connecting pads are all ground pads, and the substrate and the sensing chip are connected to a common ground through the plurality of second metal lines.

4. The sensor packaging structure according to claim 1, characterized in that, The plurality of second bonding pads and the plurality of second connecting pads do not have any electrical function, and the plurality of second metal wires are only used to support the light-transmitting sheet.

5. The sensor packaging structure according to claim 1, characterized in that, At each edge of the top surface of the sensing chip, a plurality of corresponding first connection pads and at least one corresponding second connection pad are arranged in a row.

6. The sensor packaging structure according to claim 1, characterized in that, The highest point of each of the first metal lines is at a first distance from the top surface of the sensing chip, and the highest point of each of the second metal lines is at a second distance from the top surface of the sensing chip, the second distance being at least 10 micrometers greater than the first distance.

7. The sensor packaging structure according to claim 1, characterized in that, The highest point of each of the first metal lines is a first distance from the top surface of the sensing chip, and the highest point of each of the second metal lines is a second distance from the top surface of the sensing chip, wherein the second distance is 120% to 250% of the first distance.

8. The sensor packaging structure according to claim 1, characterized in that, The material of each second metal wire is different from that of any first metal wire, and the structural strength of each second metal wire is greater than that of any first metal wire.

9. The sensor packaging structure according to claim 1, characterized in that, Each of the second metal wires has a forward bonding structure, which is different from the bonding structure of any of the first metal wires.

10. The sensor packaging structure according to claim 1, characterized in that, The sensor packaging structure further includes a package body formed on the upper surface of the substrate; wherein at least a portion of each of the first metal lines, at least a portion of each of the second metal lines, the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the package body, and the outer surface of the light-transmitting sheet is at least partially exposed outside the package body.

11. The sensor packaging structure according to claim 10, characterized in that, Each of the first connecting pads and the first metal wires connected thereto are partially embedded within the annular support layer, while the remaining portion of each of the first metal wires is embedded within the package; each of the second connecting pads and the second metal wires connected thereto are partially embedded within the annular support layer, while the remaining portion of each of the second metal wires is embedded within the package.

12. The sensor packaging structure according to claim 10, characterized in that, Multiple first connecting pads and multiple second connecting pads are located outside the annular support layer and embedded within the package, and multiple first metal wires and multiple second metal wires are completely embedded within the package.

13. A sensor packaging structure, characterized in that, The sensor packaging structure includes: a substrate having an upper surface and a lower surface located on opposite sides; wherein the upper surface has a chip fixing area, and the substrate includes a plurality of first bonding pads and a plurality of second bonding pads located outside the chip fixing area; A sensing chip is disposed on the chip fixing area of ​​the substrate, and one top surface of the sensing chip includes a sensing area and a carrying area surrounding the sensing area; wherein, the sensing chip includes: A plurality of first connecting pads are located in the bearing area, and the plurality of first connecting pads are arranged along a plurality of edges of the top surface; and Multiple second connecting pads are located in the bearing area, and each of the multiple corners of the top surface is provided with an adjacent second connecting pad; wherein, the multiple second connecting pads do not have signal transmission function; Multiple first metal lines, one end of which is connected to multiple first bonding pads respectively, and the other end of the multiple first metal lines is connected to multiple first connection pads, so that the substrate and the sensing chip are electrically coupled to each other. Multiple second metal lines, one end of which is connected to multiple second bonding pads, and the other end of which is connected to multiple second connecting pads; wherein each second metal line has a highest point relative to the substrate, and the highest point is higher than the highest point of any first metal line; A ring-shaped support layer is formed in the carrier region of the sensing chip; and A light-transmitting sheet is disposed on the annular support layer and abuts against the highest endpoints of the plurality of second metal lines, so that the plurality of first metal lines do not touch the light-transmitting sheet; wherein, the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together form a closed space, and the sensing area is located within the closed space.

14. The sensor packaging structure according to claim 13, characterized in that, Each edge of the top surface of the sensing chip is configured with at least one adjacent second connection pad.

15. The sensor packaging structure according to claim 13, characterized in that, The plurality of first connecting pads and the plurality of second connecting pads are arranged together in a rectangular ring.

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