A centering mechanism, bonding device and centering method

Abstract

This invention relates to a centering mechanism, bonding equipment, and centering method, comprising: a lifting member capable of moving along the height direction under external force; a centering assembly including a supporting member and a positioning member, the supporting member being horizontally movable relative to the lifting member to move the positioning member closer to or away from the lifting member, so that the positioning member has an initial position and a centering position; and a telescopic member capable of connecting to the supporting member and always applying an elastic force to the supporting member to ensure that the supporting member is always in contact with the lifting member; when the supporting member abuts against the first contact surface of the lifting member, adjacent supporting members move away from each other, so that the telescopic member is stretched and the positioning member is in the initial position; when the lifting member moves along the height direction, such that when the supporting member abuts against the second contact surface of the lifting member, the supporting members move closer to each other under the action of the telescopic member, and the positioning member is in the centering position. Through the above method, the overall structure of the bonding equipment can be simple and reliable, achieving high-precision centering without a complex drive mechanism.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically relating to a centering mechanism, bonding equipment, and centering method. Background Technology

[0002] In semiconductor manufacturing, wafer bonding is a crucial process that combines two or more wafers together physically or chemically. It is a wafer-level packaging technology commonly used in the manufacture of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics, and optoelectronics, ensuring mechanically stable and hermetically sealed packaging. Before bonding, the two wafers must be precisely aligned to ensure their centers coincide; otherwise, device performance and bonding quality will be affected.

[0003] In existing technologies, during the alignment of wafers and carriers of the same size within the process chamber of a bonding equipment, a vacuum suction robot is typically used to transfer the wafer above the carrier, and after calibration, the wafer is placed on the carrier surface. This alignment method largely relies on vision systems and / or precision mechanical adjustments, resulting in complex structures, high costs, and stringent requirements for the operating environment. Furthermore, traditional mechanical positioning mechanisms often employ single-point or two-point clamping, which can easily cause uneven force on the wafer, leading to warping or misalignment, making it difficult to meet the demands of high-precision bonding. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is how to solve the problem of semiconductor device alignment structure being too complex and alignment accuracy being insufficient.

[0005] To solve the above-mentioned technical problems, the present invention provides a centering mechanism, comprising: a lifting member configured to move along the height direction under external force; a centering assembly, comprising at least three sets, wherein the at least three sets of centering assemblies are distributed along a preset direction; the preset direction is a direction distributed around the lifting member as the center; each centering assembly includes a supporting member and a positioning member connected to the supporting member, the supporting member being horizontally movable relative to the lifting member to drive the positioning member closer to or away from the lifting member, so that the positioning member has an initial position and a centering position; and a telescopic mechanism. The member is configured to connect at least three of the abutment members and to always apply an elastic force to the abutment members so that the abutment members are always in contact with the lifting member; wherein, when the abutment members abut with the first contact surface of the lifting member, adjacent two abutment members move away from each other so that the telescopic member is stretched and the positioning member is located in the initial position; the lifting member moves along the height direction so that when the abutment members abut with the second contact surface of the lifting member, the abutment members move closer to each other under the action of the telescopic member and the positioning member is located in the centering position.

[0006] In one embodiment, the lifting member has a first abutting portion and a guide portion connected to the first abutting portion;

[0007] Along the height direction, the guide portion is inclined toward the centerline of the lifting member;

[0008] Wherein, the outer peripheral surface of the first abutting part serves as the first contact surface, and the outer peripheral surface of the guide part serves as the second contact surface.

[0009] In one embodiment, each of the abutting members includes a body and a second abutting portion, the second abutting portion having a first end and a second end disposed opposite to each other, the first end being connected to the body, and the second end being disposed away from the body and abutting against the lifting member.

[0010] In one embodiment, the length of the first end gradually decreases from the length of the second end to the length of the second end, or the area of ​​the first orthographic projection of the first end onto the lifting member is greater than the area of ​​the second orthographic projection of the second end onto the lifting member.

[0011] In one embodiment, when the positioning element is in the initial position, the size of the first space enclosed between at least three positioning elements is larger than the size of the target object, and the target object can be placed in the first space;

[0012] When the positioning element is located in the centering position, the size of the second space enclosed between at least three positioning elements is the same as or close to the size of the target object, so as to clamp the target object, and the center of the target object overlaps with the center of the lifting element.

[0013] In one embodiment, the target object has a docking notch;

[0014] When the positioning element is in the initial position, the docking notch of the target object is oriented toward one of the positioning elements;

[0015] When the positioning element moves from the initial position to the centering position, the docking notch engages with one of the positioning elements.

[0016] In one embodiment, the centering component further includes a connector and a slider, the connector connecting the abutment and the positioning member respectively, and the slider being mounted on the connector and configured to slide with the target disc.

[0017] The present invention also provides a bonding apparatus, comprising:

[0018] Bonded cavity;

[0019] The target disk is installed in the bonding cavity and is configured to hold the target object.

[0020] A centering mechanism is connected to the target disk body and is movable relative to the target disk body;

[0021] The centering mechanism is as described above, and the center of the centering mechanism corresponds to the center of the target disk.

[0022] In one embodiment, the target disk has at least three through holes, and the positioning element of each centering component is disposed through the corresponding through hole;

[0023] The through hole has a first end and a second end, the first end being located close to the center of the target disk body, and the second end being located away from the center of the target disk body;

[0024] When the positioning element is located at the first end, it is in the initial position;

[0025] When the positioning element is located at the second end, it is in the centering position.

[0026] The present invention also provides a centering method, employing the bonding apparatus described above, comprising the following steps:

[0027] The supporting member abuts against the first contact surface of the lifting member, and the positioning member is located in the initial position;

[0028] Place the target object on the target disk;

[0029] The lifting member moves along the height direction so that the supporting member abuts against the second contact surface of the lifting member. The supporting members move closer to each other under the action of the telescopic member, driving the positioning member to move from the initial position to the centering position.

[0030] The target object moves under the pushing action of at least three of the positioning elements until the center of the target object corresponds to the center of the lifting element.

[0031] The technical solution provided by this invention has the following advantages: By providing a lifting component and at least three sets of centering components, the lifting component can move along the height direction under external force, and the at least three sets of centering components are distributed along a preset direction; the preset direction is the direction centered on the lifting component; wherein, each centering component includes a supporting component and a positioning component connected to the supporting component, the supporting component can move horizontally relative to the lifting component to drive the positioning component closer to or away from the lifting component, so that the positioning component has an initial position and a centering position; a telescopic component is also provided, which can connect at least three supporting components and always applies an elastic force to the supporting components so that the supporting components always abut against the lifting component; wherein, the supporting component… When the first contact surface of the lifting component comes into contact with the support component, the two adjacent support components move away from each other, so that the telescopic component is stretched and the positioning component is in the initial position. When the lifting component moves along the height direction, so that when the support component comes into contact with the second contact surface of the lifting component, the support components move closer to each other under the action of the telescopic component, and the positioning component is in the centering position. It can be seen that by the cooperation of the lifting component and at least three centering components, and by using the elastic restoring force of the telescopic component to realize the synchronous radial movement of the positioning component, at least three positioning components can center at least two target objects, so as to carry out the next bonding action. The overall structure is simple and reliable, and high-precision centering can be achieved without complex drive mechanisms. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the centering mechanism provided in Embodiment 1 of the present invention cooperating with one of the target disks;

[0034] Figure 2 for Figure 1 Partial structural diagram;

[0035] Figure 3 This is a schematic diagram of the centering mechanism provided in Embodiment 1 of the present invention cooperating with another target disk.

[0036] Figure 4 for Figure 3 Partial structural diagram;

[0037] Figure 5 This is another structural schematic diagram of the centering mechanism and the target disk body provided in Embodiment 1 of the present invention;

[0038] Figure 6This is a schematic diagram of the centering mechanism provided in Embodiment 1 of the present invention;

[0039] Figure 7 This is another structural schematic diagram of the centering mechanism provided in Embodiment 1 of the present invention;

[0040] Figure 8 This is a schematic diagram showing the cooperation between the lifting member and the supporting member provided in Embodiment 1 of the present invention.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100 - Target disk body; 101 - Through hole;

[0043] 200 - Semiconductor devices; 201 - Docking notch;

[0044] 300-Centering mechanism; 1-Lifting component; 11-First abutting part; 12-Guide part; 2-Centering component; 21-Holding component; 211-Main body; 212-Second abutting part; 213-Avoiding part; 22-Positioning component; 23-Connecting component; 24-Sliding component; 3-Telescopic component. Detailed Implementation

[0045] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0046] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0047] In this invention, unless otherwise stated, directional terms such as "upper," "lower," "top," and "bottom" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction of the component itself; similarly, for ease of understanding and description, "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention. Example

[0048] Please see Figures 1 to 8This preferred embodiment of the bonding apparatus is used in the manufacturing of semiconductor devices 200, and is capable of bonding at least two different semiconductor devices 200 together by physical or chemical methods. The semiconductor device 200 can be a wafer, sapphire, chip, etc., and is not specifically limited here, depending on the actual situation. Furthermore, in this embodiment, the size of the semiconductor device 200 is not specifically limited. In the following description, a wafer is used as a specific embodiment for the semiconductor device 200.

[0049] The bonding equipment includes a bonding cavity, a target disk 100 mounted within the bonding cavity, and a centering mechanism 300 connected to the target disk 100. The centering mechanism 300 is movable relative to the target disk 100. The target disk 100 is an adsorption disk made of high-strength ceramic material and is fixed to the bottom center of the bonding cavity by support columns. The bonding cavity is generally a stainless steel vacuum cavity, equipped with a vacuuming mechanism and a heating mechanism. The vacuuming mechanism creates a vacuum within the bonding cavity, while the heating mechanism is connected to the target disk 100. The target disk 100 is responsible for flatly adsorbing the semiconductor device 200, preventing displacement. The heating mechanism transfers heat to the semiconductor device 200 on the target disk 100 through thermal conduction, causing thermal softening of the semiconductor device 200 material and reducing its hardness and elastic modulus. Therefore, during the bonding process of semiconductor devices 200, the surfaces of the two semiconductor devices 200 can make more sufficient contact, reducing gaps and defects at the interface, and creating a good physical basis for subsequent bonding reactions.

[0050] Furthermore, when both semiconductor devices 200 are made of silicon, the energy provided by the heating mechanism allows the atoms at the interface of the semiconductor devices 200 to gain sufficient kinetic energy to overcome the obstacles of the surface oxide layer or adsorption layer, undergo atomic-level diffusion, form covalent bonds, significantly improve the bonding strength, and thus ensure bonding efficiency.

[0051] In the bonding process described above, one semiconductor device 200 needs to be placed on the target disk 100 first, and then the second semiconductor device 200 is placed on top of it. Therefore, the accuracy of the alignment of the two semiconductor devices 200 on the target disk 100 is also an important reference indicator for bonding quality.

[0052] In existing technologies, a vacuum suction robot is typically used to transport two semiconductor devices 200 to above a target disk 100, calibrate them, and then place them on the surface of the target disk 100. This calibration is generally performed using a vision system or sensor detection, which is inefficient and prone to accuracy issues. For example, the first semiconductor device 200 may shift during its descent, but the vacuum suction robot may not detect this shift. Consequently, the second semiconductor device 200 may remain in its original position without adjustment, potentially shifting in the opposite direction during its final descent. This results in a misalignment and low overlap between the two semiconductor devices, ultimately affecting the final bonding quality.

[0053] To ensure the final bonding quality, the centering mechanism 300 in this embodiment includes a lifting member 1 and a centering assembly 2, wherein the lifting member 1 is configured to be able to move along the height direction under external force ( Figure 5 As indicated by arrow a, the bonding device further includes a drive assembly connected to the lifting member 1 to drive the lifting member 1 to move along the height direction. The drive assembly may include a stepper motor and a lead screw connecting the stepper motor and the lifting member 1. The stepper motor drives the lead screw to rotate, thereby moving the lifting member 1. In other embodiments, the drive assembly may also include an electric cylinder, a pneumatic cylinder, etc., without specific limitations, as long as it achieves the effect of driving the lifting member 1 to move along the height direction.

[0054] The lifting member 1 is generally cylindrical and has a first contact surface and a second contact surface. Specifically, the lifting member 1 has a first abutting portion 11 and a guide portion 12 connected to the first abutting portion 11. Along the height direction, the guide portion 12 is inclined towards the center line of the lifting member 1. That is, the first abutting portion 11 is cylindrical and the guide portion 12 is conical.

[0055] In this embodiment, two guide portions 12 are provided, which are respectively disposed on both sides of the first abutment portion 11, and both guide portions 12 are inclined towards the center line of the lifting member 1. The outer peripheral surface of the first abutment portion 11 serves as the first contact surface, and the outer peripheral surface of the guide portion 12 serves as the second contact surface.

[0056] In other embodiments, the number of guide portions 12 may also be one, that is, a guide portion 12 is provided on one side of the first abutment portion 11. This is not specifically limited here and depends on the actual situation.

[0057] The centering component 2 is provided in at least three sets, and the at least three sets of centering components 2 are distributed along a preset direction. In this embodiment, the preset direction is the direction in which the lifting component 1 is distributed with the lifting component 1 as the center. In order to further ensure the final bonding effect, in this embodiment, the center of the lifting component 1 coincides with the center of the target disk 100. That is, the preset direction is actually the direction in which the target disk 100 is distributed with the center as the center.

[0058] Each centering component 2 includes a supporting member 21 and a positioning member 22 connected to the supporting member 21. The supporting member 21 can move horizontally relative to the lifting member 1 to move the positioning member 22 closer to or further away from the lifting member 1. The target disk body 100 has at least three through holes 101, and the positioning member 22 of each centering component 2 is disposed through its corresponding through hole 101. In this embodiment, there are three centering components 2, and correspondingly, there are also three through holes 101 on the target disk body 100. In other embodiments, the number of centering components 2 may be four, five, six, etc., and correspondingly, the number of through holes 101 may also be four, five, six, etc., without specific limitation, depending on the actual situation. Furthermore, in this embodiment, the positioning member 22 is cylindrical.

[0059] As the three sets of centering components 2 are known to be distributed with the lifting component 1 as the center, the three through holes 101 are not collinear, thus the center position of the space formed by the three positioning components 22 can be determined. When the semiconductor device 200 is placed above the target disk 100 and falls, even if the falling process causes shaking due to airflow, resulting in displacement between the final position of the semiconductor device 200 on the target disk 100 and the preset position, the centering component, driven by the supporting component 21, can also drive the semiconductor device 200 to move, so that the center of the semiconductor device 200 finally coincides with the center of the target disk 100. Repeating the above process, the final centers of both semiconductor devices 200 coincide with the center of the target disk 100, that is, the two circles are concentric, thereby ensuring the overlap of the two semiconductor devices 200 and improving the bonding quality.

[0060] The centering mechanism 300 also includes a telescopic member 3, which is configured to connect at least three abutment members 21 and always apply an elastic force to the abutment members 21 so that the abutment members 21 are always in contact with the lifting member 1. When the lifting member 1 moves along the height direction, the abutment members 21 will contact the first contact surface and the second contact surface of the lifting member 1 respectively, thereby changing the distance between the abutment members 21, which in turn drives the positioning member 22 to move horizontally relative to the lifting member 1, so that the positioning member 22 has an initial position and a centering position. In this embodiment, the telescopic member 3 is a ring spring.

[0061] When the positioning member 22 is in the initial position, the size of the first space enclosed between at least three positioning members 22 is larger than the size of the target object, allowing the target object to be placed within the first space. When the positioning member 22 is in the centering position, the size of the second space enclosed between at least three positioning members 22 is the same as or close to the size of the target object, thus clamping the target object, and the center of the target object overlaps with the center of the lifting member 1. In this embodiment, the target object is the aforementioned semiconductor device 200. The lifting member 1 is driven to move up and down along the height direction by the driving component, thereby causing the abutment member 21 of the centering component 2 to contact the first contact surface and the second contact surface of the lifting member 1, respectively. This changes the distance between two adjacent abutment members 21, causing the positioning member 22 to move closer to or away from the lifting member 1, thereby adjusting the position of the semiconductor device 200 so that the final center of the semiconductor device 200 is aligned with the center of the target disk 100, thus achieving the centering effect.

[0062] Specifically: when the abutment 21 abuts against the first contact surface of the lifting member 1, the two adjacent abutment 21 move away from each other so that the telescopic member 3 is stretched and the positioning member 22 is in the initial position; when the lifting member 1 moves along the height direction, so that when the abutment 21 abuts against the second contact surface of the lifting member 1, the abutment 21 moves closer to each other under the action of the telescopic member 3 and the positioning member 22 is in the centering position.

[0063] As described above, the positioning element 22 is disposed through the through hole 101. The through hole 101 can be a straight groove, with one end closer to the center of the target disk 100 being the first end and the other end further from the center being the second end. When the positioning element 22 is located at the first end, it corresponds to the initial position of the centering mechanism 300; when the positioning element 22 is located at the second end, it corresponds to the centering position of the centering mechanism 300. The through hole 101 provides both a movement channel for the positioning element 22 and serves a limiting function.

[0064] Each abutment 21 includes a body 211 and a second abutment portion 212. The second abutment portion 212 has a first end and a second end disposed opposite to each other. The first end is connected to the body 211, and the second end is disposed away from the body 211 and abuts against the lifting member 1. The length of the first end gradually decreases from the length of the second end to the length of the second end, or the area of ​​the first orthographic projection of the first end on the lifting member 1 is greater than the area of ​​the second orthographic projection of the second end on the lifting member 1. With the above arrangement, the contact area between the second abutment portion 212 and the first abutment portion 11 is smaller, thereby reducing the friction between the second abutment portion 212 and the first abutment portion 11.

[0065] As can be seen from the foregoing, the guide portion 12 is inclined toward the center line of the lifting member 1, that is, the diameter of the guide portion 12 is smaller than the diameter of the first abutting portion. Therefore, in order to prevent interference between the body 211 and the first abutting portion 11 during the process of the second abutting portion 212 abutting with the guide portion 12, in this embodiment, a clearance portion 213 is formed between the second abutting portion 212 and the body 211. The clearance portion 213 is stepped.

[0066] Please combine Figure 1 and Figure 2 In one embodiment, at least two target objects each have a mating notch 201. One positioning member 22 mates with the mating notch 201 of the at least two target objects, and as described above, the positioning member 22 is cylindrical. In this case, the positioning member 22 that mates with the mating notch 201 is closer to the target object than the other two positioning members 22. That is, when the positioning member 22 is in the initial position, the mating notch 201 of the target object is oriented towards one of the positioning members 22 for initial positioning. At this time, the distance between the one positioning member 22 and the edge of the target object is L1, and the distance between the other two positioning members 22 and the target object is L2, where L1 is less than L2. When the positioning member 22 moves from the initial position to the centering position, the mating notch 201 is tangent to one of the positioning members 22, and the other two positioning members 22 abut against the edge of the target object, thereby achieving angular alignment (the directions of the mating notches 201 coincide) while completing center alignment, further ensuring the centering effect. Similarly, the target object is the aforementioned semiconductor device 200.

[0067] Please combine Figure 3 and Figure 4 In another embodiment, when at least one or more target objects do not have the docking notch 201, the distances between the three positioning members 22 and the edges of the target objects are equal. That is, when the positioning member 22 is in the initial position, the target object is located between the three positioning members 22; when the positioning member 22 moves from the initial position to the centering position, the three positioning members 22 cooperate with each other to push the center of the target object to coincide with the center of the target disk 100, thereby completing concentric positioning.

[0068] The centering component 2 also includes a connector 23 and a slider 24. The connector 23 connects to the abutment 21 and the positioning member 22, respectively. The slider 24 is mounted on the connector 23 and configured to slide with the target disk 100. The slider 24 ensures the stability of the movement of the abutment 21 and the positioning member 22. The slider 24 is a slide rail, and correspondingly, the target disk 100 can be provided with a groove that slides in conjunction with the slide rail.

[0069] The centering mechanism 300 in this embodiment operates as follows: Initially, the first abutting part 11 (first contact surface) of the lifting member 1 contacts the second abutting parts 212 of the three abutting members 21. The positioning member 22 is located at the second end (initial position) of the through hole 101, at which time the diameter of the circular space formed by the three positioning members 22 is larger than the size of the semiconductor device 200.

[0070] One of the semiconductor devices 200 is placed above the target disk 100 and falls. The semiconductor device 200 that eventually falls onto the target disk 100 may be off-center. Subsequently, the drive assembly drives the lifting member 1 to rise or fall. During the rising or falling process, the second abutment portion 212 of the abutment member 21 gradually disengages from the first abutment portion 11 and instead contacts the inclined surface (second contact surface) of the conical guide portion 12. As the diameter of the guide portion 12 gradually decreases, the elastic restoring force of the telescopic member 3 is released, pushing the three abutment members 21 to slide down the inclined surface synchronously, that is, to move radially toward the center. Through the connecting rod, the three positioning members 22 are driven to slide from the second end to the inner end within the through hole 101.

[0071] Finally, under the action of spring force, it is gently pushed towards the center of the target disk 100, so that the three positioning members 22 cooperate with each other to contact the edge of the semiconductor device 200 until the center of the semiconductor device 200 is completely aligned with the center of the target disk 100, thus completing the centering. After that, the above action is repeated to center another semiconductor device 200 with the semiconductor device 200 already placed on the target disk 100, and then the transfer, alignment and final bonding process of the upper wafer can be performed.

[0072] The present invention also provides a centering method, employing the bonding apparatus described above, comprising the following steps:

[0073] The holding member 21 abuts against the first contact surface of the lifting member 1, and the positioning member 22 is in the initial position;

[0074] Place the target object (semiconductor device 200) on the target disk 100;

[0075] The lifting member 1 moves along the height direction so that the supporting member 21 abuts against the second contact surface of the lifting member 1. The supporting members 21 move closer to each other under the action of the telescopic member 3, which drives the positioning member 22 to move from the initial position to the centering position.

[0076] The target object (semiconductor device 200) moves under the pushing action of at least three positioning members 22 until the center of the target object corresponds to the center of the lifting member 1.

[0077] In summary: By providing a lifting member 1 and at least three sets of centering components 2, the lifting member 1 can move along the height direction under external force, and the at least three sets of centering components 2 are distributed along a preset direction; the preset direction is the direction distributed with the lifting member 1 as the center; wherein, each centering component 2 includes a supporting member 21 and a positioning member 22 connected to the supporting member 21, the supporting member 21 can move horizontally relative to the lifting member 1 to drive the positioning member 22 closer to or away from the lifting member 1, so that the positioning member 22 has an initial position and a centering position; a telescopic member 3 is also provided, the telescopic member 3 can connect at least three supporting members 21, and always applies an elastic force to the supporting members 21 so that the supporting members 21 are always in contact with the lifting member 1; wherein, the supporting member 21 and the lifting member 1 are connected by a telescopic member 21. When the first contact surface of the lowering member 1 abuts, the two adjacent supporting members 21 move away from each other, so that the telescopic member 3 is stretched and the positioning member 22 is in the initial position; when the lifting member 1 moves along the height direction, when the supporting member 21 abuts with the second contact surface of the lifting member 1, the supporting members 21 move closer to each other under the action of the telescopic member 3, and the positioning member 22 is in the centering position; it can be seen that through the cooperation of the lifting member 1 and at least three centering components 2, and by utilizing the elastic restoring force of the telescopic member 3 to achieve synchronous radial movement of the positioning member 22, at least three positioning members 22 can center at least two target objects, thereby performing the next bonding action. The overall structure is simple and reliable, and high-precision centering can be achieved without a complex drive mechanism.

[0078] Obviously, the embodiments described above are merely some, not all, embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art can make other variations or modifications without creative effort, and all such variations or modifications should fall within the scope of protection of the present invention.

Claims

1. A centering mechanism, characterized in that, include: The lifting component is configured to move along the height direction under the drive of an external force. The centering component is provided in at least three sets, and the at least three sets of centering components are distributed along a preset direction; the preset direction is the direction in which they are distributed with the lifting member as the center; each centering component includes a supporting member and a positioning member connected to the supporting member, the supporting member can move horizontally relative to the lifting member to drive the positioning member to move closer to or away from the lifting member, so that the positioning member has an initial position and a centering position. The telescopic member is configured to connect at least three of the abutments and to always apply an elastic force to the abutments so that the abutments are always in contact with the lifting member; When the abutting member abuts against the first contact surface of the lifting member, two adjacent abutting members move away from each other, so that the telescopic member is stretched and the positioning member is located in the initial position; when the lifting member moves along the height direction, so that when the abutting member abuts against the second contact surface of the lifting member, the abutting members move closer to each other under the action of the telescopic member and the positioning member is located in the centering position.

2. The centering mechanism according to claim 1, characterized in that, The lifting component has a first abutting part and a guide part connected to the first abutting part; Along the height direction, the guide portion is inclined toward the centerline of the lifting member; Wherein, the outer peripheral surface of the first abutting part serves as the first contact surface, and the outer peripheral surface of the guide part serves as the second contact surface.

3. The centering mechanism according to claim 1, characterized in that, Each of the abutting members includes a body and a second abutting portion. The second abutting portion has a first end and a second end disposed opposite to each other. The first end is connected to the body, and the second end is disposed away from the body and abuts against the lifting member.

4. The centering mechanism according to claim 3, characterized in that, The length of the first end gradually decreases from the length of the second end to the length of the second end, or the area of ​​the first orthographic projection of the first end onto the lifting member is greater than the area of ​​the second orthographic projection of the second end onto the lifting member.

5. The centering mechanism according to claim 1, characterized in that, When the positioning element is in the initial position, the size of the first space enclosed between at least three positioning elements is larger than the size of the target object, and the target object can be placed in the first space; When the positioning element is located in the centering position, the size of the second space enclosed between at least three positioning elements is the same as or close to the size of the target object, so as to clamp the target object, and the center of the target object overlaps with the center of the lifting element.

6. The centering mechanism according to claim 5, characterized in that, The target object has a docking notch; When the positioning element is in the initial position, the docking notch of the target object is oriented toward one of the positioning elements; When the positioning element moves from the initial position to the centering position, the docking notch engages with one of the positioning elements.

7. The centering mechanism according to claim 1, characterized in that, The centering component further includes a connector and a slider. The connector connects the abutment and the positioning member respectively, and the slider is mounted on the connector and configured to slide with the target disc.

8. A bonding apparatus, characterized in that, include: Bonded cavity; The target disk is installed in the bonding cavity and is configured to hold the target object. A centering mechanism is connected to the target disk body and is movable relative to the target disk body; The centering mechanism is the centering mechanism as described in any one of claims 1 to 7, and the center of the centering mechanism corresponds to the center of the target disk.

9. The bonding apparatus as described in claim 8, characterized in that, The target disk has at least three through holes, and the positioning element of each centering component is disposed through the corresponding through hole; The through hole has a first end and a second end, the first end being located close to the center of the target disk body, and the second end being located away from the center of the target disk body; When the positioning element is located at the first end, it is in the initial position; When the positioning element is located at the second end, it is in the centering position.

10. A centering method, characterized in that, The bonding apparatus as described in claim 8 or 9 includes the following steps: The supporting member abuts against the first contact surface of the lifting member, and the positioning member is located in the initial position; Place the target object on the target disk; The lifting member moves along the height direction so that the supporting member abuts against the second contact surface of the lifting member. The supporting members move closer to each other under the action of the telescopic member, driving the positioning member to move from the initial position to the centering position. The target object moves under the pushing action of at least three of the positioning elements until the center of the target object corresponds to the center of the lifting element.

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