Acid quenching agent, preparation method of acid quenching agent, negative photoresist composition and application of negative photoresist composition

CN121609677APending Publication Date: 2026-03-06LUAN XINYIHUA SEMICONDUCTOR MATERIALS CO LTD
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Patent Information

Application Number
CN202511799328.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-02
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

In existing technologies, during the photoresist lift-off process, the photoacid in the photoresist composition undergoes a dark reaction with the acid quencher, affecting the photoresist profile and photosensitivity. This presents a solution to the specific problems that existing technologies have failed to effectively address. The solution addresses the specific problems that existing technologies have failed to effectively address. The solution addresses the specific problems that existing technologies have failed to effectively address. The solution addresses the specific problems that existing technologies have failed to effectively address. The solution addresses the specific problems that existing technologies have failed to effectively address. The solution addresses the specific problems that existing technologies have failed to effectively address, employing new technical measures or methods. The steps are described in a fluent and natural language.

Method used

An acid quencher and its preparation method are provided, comprising: mixing concentrated sulfuric acid and concentrated nitric acid to obtain a mixed acid; adding benzotriazole to the mixed acid to carry out a first reaction to obtain a first reaction solution; quenching the first reaction solution in ice water to obtain 5,7-dinitrobenzotriazole; mixing 5,7-dinitrobenzotriazole, anhydrous zinc chloride and phosphorus oxychloride, and reacting under reflux to obtain a second reaction solution; quenching the second reaction solution in ice water to obtain 2-chloro-5,7-dinitrobenzotriazole; suspending sodium hydride in dry tetrahydrofuran under nitrogen protection, cooling and then adding liquid ammonia dropwise to obtain a third reaction solution; adding the tetrahydrofuran solution of 2-chloro-5,7-dinitrobenzotriazole to the third reaction solution to carry out a second reaction to obtain tris(5,7-dinitrobenzotriazole-2-yl)amine.

Benefits of technology

It achieves the suppression of acid diffusion, improves the chemical stability and solubility of photoresist, reduces pattern defects, expands the exposure energy window and depth of focus window, enhances the resist removal performance and pattern difference control of negative photoresist compositions, solves the problem of dark reaction between acid quencher and photoacid in photoresist lift-off process, and improves the photosensitivity and stability of photoresist.

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Abstract

The invention provides an acid quenching agent, a preparation method of the acid quenching agent, a negative photoresist composition and application of the negative photoresist composition, and relates to the technical field of photoresist. The acid quenching agent tri (5, 7-dinitrobenzotriazole-2-yl) amine provided by the invention has a three-dimensional propeller structure, three benzotriazole rings are spirally arranged by taking central nitrogen as an axis, stereo steric hindrance is provided for inhibiting acid diffusion, and a conjugated structure formed by the benzotriazole rings and nitryl has efficient light absorption capacity. According to the negative photoresist composition provided by the invention, the acid quenching agent tri (5, 7-dinitrobenzotriazole-2-yl) amine is adopted, benzoic acid and a derivative thereof are added, and the acid quenching agent and benzoic acid salifying can enable the formula of the negative photoresist composition to have better chemical stability; according to the proportion of the formula, good photoresist removing performance can be considered, and a wide exposure energy window and a wide focal depth window are achieved while the pattern difference of the photoresist on different substrates is reduced.
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