An adaptive product map probe testing device

Abstract

The application discloses a kind of self-adapting product layout probe testing device, it is related to probe testing field, including base, workbench and piece table, the top of workbench is located piece table and is symmetrically provided with probe handling assembly, wherein probe handling assembly itself can be adjusted multidirectionally, probe edge three-dimensional seat is connected at the output end of probe handling assembly, and probe body is carried on probe edge three-dimensional seat, visual movement component is provided on the workbench, visual detection module body is connected on the visual movement component, piece table moving component is provided on the top of workbench.The application can meet the test demand of different size line loop in product layout by adjusting probe through single edge double probe, and probe itself meets the test of different product layout by the cooperation of X-axis probe linear motor, Y-axis probe linear motor and Z-axis precision fine adjustment table, improves the overall compatibility.

Description

Technical Field

[0001] This invention relates to the field of probe testing, specifically to a probe testing device that adapts to product layout. Background Technology

[0002] In the semiconductor manufacturing process, after the wafer completes the front-end processes (such as photolithography, etching, and thin film deposition), it needs to undergo electrical parameter testing before dicing and packaging to screen out chips that function properly or meet performance specifications. This process is usually completed using a probe station and probe cards in conjunction with a testing machine. The probes on the probe station are precisely aligned with and contact the pads or bumps on the chip on the wafer to establish a temporary electrical connection. The testing machine then applies an excitation signal and measures the response.

[0003] Currently, traditional probe cards are dedicated hardware designed for specific models and layouts. Once the product layout changes (such as adding test points), even if the change is minor, it often requires redesigning, manufacturing, and verifying new probe cards, which is costly and time-consuming, seriously affecting the overall usability. Furthermore, due to the diversity of product layouts, traditional designs can only meet the needs of a few product layouts, resulting in a complicated overall compatibility structure that is difficult to meet the design requirements of multiple product layout sizes and product replacement needs. Therefore, staff need to repeatedly replace different probes corresponding to each product, which not only affects the overall testing time but also increases the workload of the staff.

[0004] In summary, the above structure cannot meet the electrical testing requirements of different product layouts during actual testing, which not only affects the overall testing time but also increases the workload of staff. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a probe testing device that adapts to product layouts, so as to solve the technical problem that the above-mentioned structure cannot meet the electrical testing requirements of different product layouts in actual testing, which not only affects the overall testing time, but also increases the workload of the staff.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a probe testing device for adaptive product layout, comprising a base, a worktable, and a substrate support, wherein the worktable is located on top of the base, and the substrate support is adjustable on the worktable. Probe transport assemblies are symmetrically arranged on the top of the worktable and on the substrate support, wherein the probe transport assemblies themselves can be adjusted in multiple directions, and a three-dimensional probe holder is connected to the output end of the probe transport assemblies, and the probe body is supported on the three-dimensional probe holder. A vision movement component is provided at one end of the workbench located on the substrate support. A vision inspection module body is connected to the vision movement component. A substrate support movement component is provided at the top of the workbench located on the substrate support. A clamping mechanism is provided at the top of the substrate support.

[0007] By adopting the above technical solution, each probe handling component is equipped with dual probes. The single-sided dual probes can be adjusted to meet the testing requirements of different sized line loops in the product layout. Furthermore, the probes themselves, through the cooperation of the X-axis probe linear motor, the Y-axis probe linear motor, and the Z-axis precision fine-tuning stage, can meet the testing of different product layouts, improving their overall compatibility. In addition, the vision movement component will move the probe to the top according to the test point and move the detection accordingly based on the position of the test point, effectively reducing the overall testing time and also reducing the workload of the staff.

[0008] The present invention is further configured such that the probe handling assembly includes an X-axis probe linear motor, a Y-axis probe linear motor and a Z-axis precision fine-tuning stage, and two sets of X-axis probe linear motors are symmetrically arranged on the top of the worktable, with a Y-axis probe linear motor slidably arranged on each of the X-axis probe linear motors, and the Z-axis precision fine-tuning stage is located on the Y-axis probe linear motor.

[0009] Preferably, the X-axis probe linear motor can drive the probe body to slide along the X-axis, and the Y-axis probe linear motor can be used to ensure the horizontal position adjustment of the probe body. At the same time, the Z-axis precision micro-adjustment stage can meet the needs of fine adjustment of the probe body in the front-back, left-right, and up-down directions.

[0010] The present invention is further configured such that the visual movement component includes an X-axis visual module linear motor, a Y-axis visual module linear motor, and a visual inspection module body. The X-axis visual module linear motor is disposed on the top of the worktable, wherein the Y-axis visual module linear motor is slidably disposed on the X-axis visual module linear motor, and the visual inspection module body is slidably disposed at the output end of the Y-axis visual module linear motor.

[0011] Preferably, before the inspection begins, the plate carrier is moved to a designated position. Then, with the cooperation of the linear motors of the X-axis vision module and the Y-axis vision module, the vision inspection module body scans and inspects the product. The vision inspection module body first determines the position of the product. Since the product's orientation needs to be aligned with the preset orientation before inspection, it is easy to accurately capture the position of the lines on the product, thus ensuring the high efficiency of product orientation recognition.

[0012] The present invention is further configured such that the plate-bearing stage moving assembly includes an X-bearing plate-bearing stage linear motor and a Y-bearing plate-bearing stage linear motor, the top of the worktable is provided with the X-bearing plate-bearing stage linear motor, wherein the Y-bearing plate-bearing stage linear motor is slidably arranged on the X-bearing plate-bearing stage linear motor, and the plate-bearing stage is mounted on the Y-bearing plate-bearing stage linear motor.

[0013] Preferably, in the initial state, both the probe handling component and the vision movement component are in a zero state. At this time, the X-bearing stage linear motor and the Y-bearing stage linear motor move the wafer support to the loading position of the worktable. By placing the chip to be tested on the wafer support, and then with the cooperation of the X-bearing stage linear motor and the Y-bearing stage linear motor, it is moved to the designated position on the worktable.

[0014] The present invention is further configured such that a sliding groove is provided on the X bearing plate stage linear motor, wherein an array of toothed blocks are installed in the sliding groove, and a support platform is provided on the top of the bearing plate stage, and clamping plates that cooperate with the toothed blocks are slidably provided on both sides of the support platform.

[0015] Preferably, during the sliding process of the X-bearing stage linear motor, the toothed blocks drive the clamping plates on both sides of the support stage to slide, thereby clamping the chip body. After the subsequent testing is completed and the stage is reset, the clamping plates release the chip body from the clamping process. This process does not require manual clamping, saving a lot of manpower and resources.

[0016] The present invention is further configured such that a transmission gear meshing with a toothed block is rotatably provided at the bottom of the support platform, and a fixed gear is connected to the top of the transmission gear inside the support platform. The two sides of the fixed gear are meshing and slidingly provided with toothed rods, and one end of the toothed rods passes through the support platform and is connected to the clamping plate.

[0017] Preferably, during the sliding process of the wafer support stage, the toothed block in its groove will drive the transmission gear to rotate. During this process, the transmission gear will drive the fixed gear at the top output end to rotate. Through meshing with the rack, when the transmission gear rotates, the fixed gear will drive the rack to slide horizontally to both sides, thereby enabling the clamping plate to complete the clamping work of the chip body.

[0018] The present invention is further configured such that the inner wall of the clamping plate is provided with a buffer airbag, the top of the support platform is provided with a support airbag, and a corrugated pipe is connected between the buffer airbag and the support airbag.

[0019] Preferably, the buffer airbag prevents the clamping plate from causing wear to the outer wall of the chip body during the clamping process. When the buffer airbag is compressed, the gas inside can be introduced into the support airbag through the corrugated tube. At this time, the support airbag is in an inflated state, which lifts the chip body and effectively avoids the back of the detection area from contacting the top of the substrate. The goal is to prevent physical damage, ensure test accuracy, and improve compatibility.

[0020] The invention is further configured such that the top of the supporting airbag is higher than the horizontal plane of the supporting platform.

[0021] Preferably, when the subsequent support airbag is in an inflated state, the bottom of the chip body will contact the support airbag, ensuring that the bottom of the chip body is completely detached from the support platform, effectively preventing the support platform from causing a certain degree of wear to the bottom of the chip body during subsequent testing.

[0022] The present invention is further configured such that both ends of the bellows are sealed to the buffer airbag and the support airbag respectively.

[0023] Preferably, the sealed design ensures that no leakage occurs during the ventilation process of the bellows, further improving the stability of gas flow within the device.

[0024] The present invention is further configured such that a control system is provided on one side of the worktable, and the control system is electrically connected to the probe handling assembly, the vision moving assembly and the substrate moving assembly respectively.

[0025] Preferably, the control system facilitates the orderly driving of the probe transport component, vision movement component, and slide stage movement component, further improving the overall stability of the device during the testing process.

[0026] In summary, the present invention has the following main beneficial effects: 1. This invention provides probe handling components on both sides of the substrate stage, with each component equipped with dual probes. The dual probes on one side allow for adjustment to meet the testing requirements of different sized line loops in the product layout. Furthermore, the probes themselves, through the cooperation of X-axis and Y-axis linear motors and a Z-axis precision fine-tuning stage, can meet the testing requirements of different product layouts, improving overall compatibility. The vision movement component moves the probe to the top according to the test point and moves accordingly to detect the test point, effectively reducing the overall testing time and the workload of the staff. 2. This invention features a sliding groove on the X-bearing stage. During the movement of the stage, the toothed block in the sliding groove drives the transmission gear to rotate. Through the meshing of the fixed gear and the rack, the clamping plates on both sides slide, thus clamping the chip body. After subsequent testing and reset, the transmission gear reverses, releasing the clamping plates from the chip body. This process eliminates the need for manual clamping, saving significant manpower and resources, and improving the overall testing efficiency of the chip body. 3. This invention provides a buffer airbag on the inner wall of the clamping plate. The buffer airbag prevents the clamping plate from abrading the outer wall of the chip body during clamping. When the buffer airbag is compressed, the gas inside can be introduced into the support airbag through the corrugated pipe. At this time, the support airbag is inflated and lifts the chip body, effectively avoiding contact between the back of the detection area and the top of the substrate. The goal is to prevent physical damage, ensure testing accuracy, and improve compatibility. Attached Figure Description

[0027] Figure 1 This is a front perspective view of the present invention; Figure 2 This is a rear perspective view of the present invention; Figure 3 This is a schematic diagram of the workbench structure of the present invention; Figure 4 This is a schematic diagram of the probe handling assembly structure of the present invention; Figure 5 For the present invention Figure 4 Enlarged view of A in the middle; Figure 6 This is a schematic diagram of the visual motion component structure of the present invention; Figure 7 This is a schematic diagram of the moving assembly of the receiving stage of the present invention; Figure 8 This is a schematic diagram of the support platform structure of the present invention; Figure 9 This is a partial structural diagram of the second embodiment of the present invention; Figure 10 For the present invention Figure 9 Enlarged view of B in the middle; Figure 11 This is a schematic diagram of the transmission gear structure of the present invention; Figure 12 This is a schematic diagram of the gear rack structure of the present invention; Figure 13 For the present invention Figure 12 Enlarged view of C; Figure 14 This is a schematic diagram of the internal structure of the support airbag of the present invention.

[0028] Explanation of reference numerals in the attached figures: 1. Base; 2. Worktable; 3. Probe handling assembly; 301. X-axis probe linear motor; 302. Y-axis probe linear motor; 303. Z-axis precision fine-tuning stage; 304. Edge probe 3D base; 305. Probe body; 4. Vision movement assembly; 401. X-axis vision module linear motor; 402. Y-axis vision module linear motor; 403. Vision inspection module body; 5. Sheet support stage movement assembly; 501. X-axis bearing sheet stage linear motor; 502. Y-axis bearing sheet stage linear motor; 6. Sheet support stage; 7. Bottom support block; 8. Clamping block; 9. Chip body; 10. Buffer airbag; 11. Support platform; 12. Support airbag; 13. Clamping plate; 14. Slide groove; 15. Tooth block; 16. Transmission gear; 17. Bellows; 18. Tooth rack; 19. Fixed gear; 20. Support plate; 21. Elastic telescopic cylinder. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] The embodiments of the present invention will now be described.

[0031] Example 1: Please refer to Figures 1-8 The probe testing device for adaptive product layout shown includes a base 1, a worktable 2, a probe handling assembly 3, a vision movement assembly 4, a clamping mechanism, and a drive mechanism. In the initial state, the probe body 305 on the probe handling assembly 3 and the vision detection module body 403 on the vision movement assembly 4 are in a reset state. At this time, the support stage 6 is moved to a designated position on the top of the worktable 2 by the cooperation of the X-bearing stage linear motor 501 and the Y-bearing stage linear motor 502. Then, the chip body 9 is placed on the top of the support stage 6. The support stage 6 is provided with a bottom support block 7 and a clamping block 8. Both the bottom support block 7 and the clamping block 8 are made of epoxy resin material. The bottom support block 7 is used to support the product and prevent the back of the product's testing area from contacting the top of the support stage 6. The clamping block 8 is used to limit the chip body 9 to prevent it from shifting position during the test, which further improves the overall test stability. During testing, the X-axis vision module linear motor 401 and the Y-axis vision module linear motor 402 work together to move the vision inspection module body 403 to the top of the chip body 9. The vision inspection module body 403 scans and inspects the product by moving back and forth and left and right in cooperation with the X-axis vision module linear motor 401 and the Y-axis vision module linear motor 402. The vision inspection module body 403 determines the position of the product and divides the lines of electrical components to be tested in the layout into left and right parts. Since there are two sets of probe transport components 3 located on the top of the worktable 2, the layout of the left part of the product is tested by the left probe transport component 3, and the layout of the right part of the product is tested by the right probe transport component 3. The vision moving component 4 transports the vision inspection module body 403 to the position directly above the probe body 305 detection waiting position. Subsequently, with the cooperation of the Z-axis precision fine-tuning stage 303 and the three-dimensional probe holder 304, the probe body 305 is finely adjusted and brought into contact with the top of the chip body 9 to achieve resistance testing of the product lines. The wafer stage moving component 5 moves the product to the next line with the electrical parameter to be tested, and repeats the above workflow to achieve resistance testing of the product lines. The testing is carried out in the order of front to back and left to right. At this time, the resistance data of the lines on the left side of the product layout can be tested. The resistance data of the lines on the right side of the layout is tested in the same way to obtain the resistance test data of the entire product layout lines. This process effectively reduces the overall testing time and also reduces the workload of the staff.

[0032] For details regarding the above embodiments, please refer to [link / reference]. Figure 2 The workbench 2 is equipped with a control system on one side. The control system is electrically connected to the probe transport component 3, the vision movement component 4 and the slide stage movement component 5. The control system facilitates the orderly driving of the probe transport component 3, the vision movement component 4 and the slide stage movement component 5, which further improves the stability of the overall testing process of the device.

[0033] For details regarding the above embodiments, please refer to [link / reference]. Figure 4The probe handling assembly 3 includes an X-axis probe linear motor 301, a Y-axis probe linear motor 302, and a Z-axis precision fine-tuning stage 303. Two sets of X-axis probe linear motors 301 are symmetrically arranged on the top of the worktable 2. The Y-axis probe linear motors 302 are slidably mounted on each X-axis probe linear motor 301. The Z-axis precision fine-tuning stage 303 is located on the Y-axis probe linear motors 302. The X-axis probe linear motors 301 can drive the probe body 305 to slide along the X-axis, and work with the Y-axis probe linear motors 302 to ensure the horizontal position adjustment of the probe body 305. At the same time, the Z-axis precision fine-tuning stage 303 can meet the requirements for fine adjustment of the probe body 305 in the front-back, left-right, and up-down directions.

[0034] Example 2: Please refer to Figures 9-14 The probe testing device for adaptive product layout shown has an overall structure similar to that of Embodiment 1. The X-bearing stage linear motor 501 has a groove 14, in which an array of toothed blocks 15 are installed. A support platform 11 is provided on the top of the support platform 6, and clamping plates 13 that slidably engage with the toothed blocks 15 are slidably arranged on both sides of the support platform 11. A transmission gear 16 that meshes with the toothed blocks 15 is rotatably arranged on the bottom of the support platform 6. A fixed gear 19 is connected to the top of the transmission gear 16 within the support platform 11. Tooth bars 18 are slidably meshed on both sides of the fixed gear 19, and one end of the tooth bars 18 extends through the support platform 11 and... The clamping plate 13 is connected to the chip support stage 6. During the sliding process, the toothed block 15 in the slide groove 14 will drive the transmission gear 16 to rotate. During this process, the transmission gear 16 will drive the fixed gear 19 at the top output end to rotate. Through meshing with the rack 18, when the transmission gear 16 rotates, the fixed gear 19 will drive the rack 18 to slide horizontally to both sides. This allows the clamping plate 13 to complete the clamping work of the chip body 9. After the subsequent test is completed and the device is reset, the clamping plate 13 will release the clamping work of the chip body 9. In this process, no manual clamping is required, saving a lot of manpower and resources. Furthermore, a buffer airbag 10 is provided on the inner wall of the clamping plate 13, and a support airbag 12 is provided on the top of the support platform 11. A corrugated pipe 17 connects the buffer airbag 10 and the support airbag 12. Under the action of the buffer airbag 10, the clamping plate 13 can prevent wear on the outer wall of the chip body 9 during the clamping process. When the buffer airbag 10 is squeezed, the gas inside it can be introduced into the support airbag 12 under the action of the corrugated pipe 17. At this time, the support airbag 12 is in an inflated state, which lifts the chip body 9, effectively avoiding contact between the back of the detection area and the top of the substrate 6. The goal is to prevent physical damage, ensure test accuracy, and improve compatibility.

[0035] For details regarding the above embodiments, please refer to [link / reference].Figure 11 The top of the support airbag 12 is higher than the horizontal plane of the support platform 11. When the support airbag 12 is in the inflated state, the bottom of the chip body 9 will contact the support airbag 12, ensuring that the bottom of the chip body 9 is completely separated from the support platform 11. This effectively prevents the support platform 11 from causing a certain degree of wear to the bottom of the chip body 9 during subsequent testing. Furthermore, the two ends of the bellows 17 are sealed with the buffer airbag 10 and the support airbag 12 respectively. The sealed design ensures that no leakage will occur during the ventilation process of the bellows 17, further improving the stability of gas flow in the device.

[0036] For details regarding the above embodiments, please refer to [link / reference]. Figure 14 The support plate 20 is vertically slidably disposed on the inner side of the support airbag 12. The bottom of the support plate 20 is connected to an elastic telescopic cylinder 21. The elastic telescopic cylinder 21 is connected to a bellows 17 on one side. When the clamping plate 13 squeezes the outer wall of the chip body 9, some of the gas in the buffer airbag 10 will be discharged into the elastic telescopic cylinder 21 through the bellows 17. Under the action of the elastic telescopic cylinder 21, the support plate 20 on the inner wall of the support airbag 12 is pushed upward. In this process, in conjunction with the support airbag 12, the chip body 9 will not tilt during the lifting process, which improves the accuracy of subsequent probe testing. In addition, there are two sets of bellows 17. One set is connected to the elastic telescopic cylinder 21, and the other set directly discharges the gas into the support airbag 12, ensuring that the support airbag 12 can be inflated.

[0037] In practical operation, the present invention is used as follows: the wafer carrier moving component 5 moves the entire wafer carrier to the top side of the workbench 2, and then the operator places the chip body 9 on the wafer carrier 6. The top of the wafer carrier 6 is provided with a bottom support block 7 and a clamping block 8. The bottom support block 7 prevents the bottom of the chip body 9 from contacting the top of the wafer carrier 6. Then, the clamping block 8 limits and clamps the chip body 9. During the inspection, the vision moving component 4 scans and inspects the product while moving back and forth and left and right. The vision inspection module body 403 first determines the position of the product. Since the product needs to be aligned with the preset direction before inspection, it is convenient to accurately capture the position of the lines on the product. Because the workbench 2 is equipped with two sets of probe transport components 3, the probe transport components 3 adjust the probes by setting a single-sided double probe body 305 to meet the testing requirements of different sized line circuits in the product layout. By contacting the probe body 305 with the chip body 9 to be tested, the resistance of the product lines is tested. After the test is completed, the probe body 305 is raised to the probe detection waiting position by the Z-axis precision micro-adjustment stage 303. The wafer carrier moving component 5 moves the product to the next line with the electrical parameter to be tested. The above workflow is repeated to achieve resistance testing of the product lines. The testing is carried out in the order from front to back and from left to right. At this time, the resistance data of the lines on the left side of the product layout can be tested. The resistance data of the lines on the right side of the layout is tested in the same way, so as to obtain the resistance test data of the entire product layout lines. This process effectively reduces the overall testing time and also reduces the workload of the staff.

[0038] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A probe testing device for adaptive product layout, comprising a base (1), a worktable (2), and a substrate support (6), wherein the worktable (2) is located on top of the base (1), and the substrate support (6) is adjustablely positioned on the worktable (2), characterized in that: The top of the workbench (2) is symmetrically provided with a probe transport assembly (3) on the support platform (6). The probe transport assembly (3) can be adjusted in multiple directions. A probe three-dimensional seat (304) is connected to the output end of the probe transport assembly (3), and the probe body (305) is carried on the probe three-dimensional seat (304). A visual moving component (4) is provided on one end of the workbench (2) located on the substrate (6). A visual inspection module body (403) is connected to the visual moving component (4). A substrate moving component (5) is provided on the top of the workbench (2) located on the substrate (6). A clamping mechanism is provided on the top of the substrate (6). The moving assembly (5) of the bearing stage includes an X-bearing stage linear motor (501) and a Y-bearing stage linear motor (502). The X-bearing stage linear motor (501) is provided on the top of the worktable (2). The Y-bearing stage linear motor (502) is slidably arranged on the X-bearing stage linear motor (501), and a bearing stage (6) is installed on the Y-bearing stage linear motor (502). The X-bearing stage linear motor (501) has a sliding groove (14), in which an array of toothed blocks (15) are installed. The top of the plate support (6) is provided with a support platform (11), and the two sides of the support platform (11) are slidably provided with clamping plates (13) that cooperate with the toothed block (15). The bottom of the plate support (6) is rotatably provided with a transmission gear (16) that meshes with the toothed block (15). The top of the transmission gear (16) is located inside the support platform (11) and connected to a fixed gear (19). The two sides of the fixed gear (19) are slidably provided with toothed rods (18), and one end of the toothed rod (18) passes through the support platform (11) and connects with the clamping plate (13). In the initial state, both the probe handling component (3) and the vision moving component (4) are in the zero state. The X-bearing stage linear motor (501) and the Y-bearing stage linear motor (502) move the wafer support (6) to the loading position of the worktable (2). By placing the chip body to be tested on the wafer support (6), with the cooperation of the X-bearing stage linear motor (501) and the Y-bearing stage linear motor (502), it is moved to the designated position of the worktable (2). During the sliding process of the X-bearing stage linear motor (501), the clamping plates (13) on both sides of the support platform (11) are driven to slide by the action of the tooth block (15) to complete the clamping work of the chip body.

2. The probe testing device for adaptive product layout according to claim 1, characterized in that: The probe handling assembly (3) includes an X-axis probe linear motor (301), a Y-axis probe linear motor (302), and a Z-axis precision fine-tuning stage (303). Two sets of X-axis probe linear motors (301) are symmetrically arranged on the top of the worktable (2). A Y-axis probe linear motor (302) is slidably arranged on each of the X-axis probe linear motors (301). The Z-axis precision fine-tuning stage (303) is located on the Y-axis probe linear motor (302).

3. The probe testing device for adaptive product layout according to claim 1, characterized in that: The visual motion component (4) includes an X-axis visual module linear motor (401), a Y-axis visual module linear motor (402), and a visual inspection module body (403). The X-axis visual module linear motor (401) is provided on the top of the worktable (2), and the Y-axis visual module linear motor (402) is slidably provided on the X-axis visual module linear motor (401). The visual inspection module body (403) is slidably provided at the output end of the Y-axis visual module linear motor (402).

4. The probe testing device for adaptive product layout according to claim 1, characterized in that: The inner wall of the clamping plate (13) is provided with a buffer airbag (10), and the top of the support platform (11) is provided with a support airbag (12). A corrugated pipe (17) connects the buffer airbag (10) and the support airbag (12).

5. The probe testing device for adaptive product layout according to claim 4, characterized in that: The top of the support airbag (12) is higher than the horizontal plane of the support platform (11).

6. The probe testing device for adaptive product layout according to claim 4, characterized in that: The two ends of the corrugated pipe (17) are respectively sealed between the buffer airbag (10) and the support airbag (12).

7. The probe testing device for adaptive product layout according to claim 6, characterized in that: A support plate (20) is slidably disposed on the inner side of the support airbag (12) in the vertical direction. An elastic telescopic cylinder (21) is connected to the bottom of the support plate (20), and the elastic telescopic cylinder (21) is connected to a corrugated pipe (17) on one side.

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