Manufacturing method of copper-block-embedded multilayer printed circuit board

Abstract

The invention discloses a manufacturing method of a copper block-embedded multilayer printed circuit board, which comprises the following steps of: slotting a core board by adopting a numerical control machine tool, setting the routing distance to be 2000mm, and adopting a one-by-one stacking mode; performing PP windowing, and performing numerical control groove milling to enable the groove holes in the PP to be consistent with the groove holes in the core plate; the copper block is subjected to browning treatment, and the copper block is baked for 0.5 h at the temperature of 123 DEG C after browning; laminating and copper block embedding are carried out on a laminating and laminating table, accurate positioning is carried out by adopting electromagnetic hot melting and eight rivets during laminating, and core plate slotting and PP windowing positions are ensured to coincide; performing press fit; sequentially carrying out plasma treatment and chemical degumming treatment on the laminated plate; mechanical drilling is conducted, specifically, holes with the hole diameter ranging from 0.15 mm to 0.4 mm are drilled in a segmented mode; hole metallization and outer layer pattern manufacturing are carried out, and the backlight level gt after copper deposition is controlled; at the 9.5 level, the hole copper thickness is 25-30 [mu] m after full-plate electroplating; depth-controlled drilling and secondary hole plugging are carried out, the depth of a stub is controlled to be 50-200 microns, vacuum resin hole plugging is carried out, and the depression / protrusion is controlled; 8 [mu] m. According to the manufacturing method of the copper-block-embedded multilayer printed circuit board, by controlling the technological process and technological parameters, the reliability problems of alignment, pressing, interconnection and the like under a multilayer stacked structure are systematically solved.