Water-cooled heat-dissipation power supply structure and manufacturing method thereof

Abstract

The application belongs to the technical field of power supply, and discloses a water-cooled heat dissipation type power supply structure and a manufacturing method thereof, which comprises: heat dissipation side wall members arranged on two sides, wherein the inner walls of the heat dissipation side wall members are each provided with a plurality of power devices; a main circuit board fixedly arranged between the heat dissipation side wall members on the left and right sides, wherein the main circuit board is provided with power supply components, the heat dissipation side wall members and the main circuit board are positioned by welding positioning jigs, so that the pin arrays of the power devices of the heat dissipation side wall members on the two sides and the pad arrays of the main circuit board are synchronously aligned in three-dimensional space and then welded and fixed; and a bottom plate located at the bottom of the main circuit board and fixedly connected to the heat dissipation side wall members on the two sides, wherein the bottom plate is used for contacting a water-cooled radiator, and the heat dissipation side wall members provide mounting positions for the water-cooled radiator. The application solves the problem of low heat dissipation performance caused by the fact that the power devices cannot be individually cooled in the prior art.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a water-cooled power supply structure and its manufacturing method. Background Technology

[0002] In power supply structures, the electronic components typically generate heat during operation, necessitating timely heat dissipation to prevent impact on power supply performance. In existing technologies, the electronic components within the power supply, especially power devices (MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), IGBTs (Insulated-Gate Bipolar Transistors), and / or rectifiers, are usually directly soldered onto the circuit board. During operation, these power devices become the primary source of heat generation in the power supply.

[0003] Existing power supply structures often provide overall heat dissipation for the power supply casing, but lack individual heat dissipation structures for individual power devices, resulting in poor heat dissipation performance.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a water-cooled power supply structure and its manufacturing method, so as to solve the problem of poor heat dissipation performance caused by the inability to dissipate heat from power devices individually in the prior art.

[0006] The technical solution of this application is as follows: On the one hand, this application proposes a water-cooled heat dissipation power supply structure, including: heat dissipation sidewalls arranged opposite to each other on the left and right sides, and multiple power devices are arranged on the inner walls of the heat dissipation sidewalls on both sides. The main circuit board is fixedly disposed between the heat dissipation sidewalls on the left and right sides. Power components are disposed on the main circuit board. The heat dissipation sidewalls and the main circuit board are positioned by a welding positioning fixture so that the pin arrays of the power devices on the heat dissipation sidewalls on both sides are synchronously aligned with the pad arrays on both sides of the main circuit board in three-dimensional space before being welded and fixed. The power devices and power components form a power circuit on the main circuit board. The base plate is located at the bottom of the main circuit board and is fixedly connected to the heat dissipation sidewalls on both sides. The base plate is used to contact the water-cooled radiator, and the heat dissipation sidewalls provide mounting positions for the water-cooled radiator.

[0007] Optionally, an insulating thermally conductive pad is provided between the power device and the inner wall of the heat dissipation sidewall.

[0008] Optionally, the power device is fixedly connected to the heat dissipation sidewall component by fasteners; An insulating sleeve is provided between the fastener and the power device.

[0009] Optionally, the number of power devices connected to the heat dissipation sidewalls on the left and right sides may differ.

[0010] Optionally, mounting through holes are provided on the heat dissipation sidewalls on both sides, and the mounting through holes are used to pass through the connectors to connect the water-cooled radiator.

[0011] On the other hand, this application also proposes a method for manufacturing a water-cooled power supply structure, applicable to the water-cooled power supply structure described above, wherein the manufacturing method includes the following steps: Various power devices are pre-mounted on the heat dissipation sidewalls on the left and right sides respectively; A welding positioning fixture is provided, which includes a plate positioning cavity and positioning grooves on the left and right sides; Place the main circuit board in the board positioning cavity and insert the power supply components on the main circuit board; The pre-installed heat dissipation sidewall components are placed in the positioning grooves on the left and right sides respectively, so that the pin array of the power device is inserted into the pad array of the main circuit board. After fixing the heat dissipation sidewall component, perform overall welding to obtain a welded semi-finished product; The welded semi-finished products are assembled with the base plate to form a U-shaped main body.

[0012] Optionally, in the step of providing a welding positioning fixture, which includes a plate positioning cavity and positioning grooves on the left and right sides, the welding positioning fixture includes: The welding base has a plate positioning cavity on it, and positioning grooves are provided on the left and right sides of the plate positioning cavity. Support boss, the support boss is set on the welding base and is located outside the positioning grooves on the left and right sides; Locking cover, which is detachably connected to the support protrusions on the left and right sides, presses down the heat dissipation side wall component.

[0013] Optionally, the welding base is also provided with multiple elastic clips, which are distributed at the outer edge of the board positioning cavity. The elastic clips enter the board positioning cavity by rotation and press down on the main circuit board. The support boss is also equipped with a lifting rod locking post, which is used to lock both ends of the locking cover.

[0014] Optionally, the step of pre-mounting various power devices onto the heat dissipation sidewalls on the left and right sides specifically includes: A limiting fixture is provided to align the heat dissipation sidewall component, multiple power devices, and insulating thermally conductive pads. The aligned power devices are fixedly connected to the heat dissipation sidewall using fasteners, which are equipped with insulating sleeves.

[0015] Optionally, in the step of providing a limiting fixture to align the heat dissipation sidewall component, multiple power devices, and insulating thermally conductive pads, the limiting fixture includes: The limiting base plate has a side wall component positioning cavity, which is used to accommodate and limit the heat dissipation side wall component. The limiting base plate is also provided with positioning posts. The first template has an insulating sheet positioning hole. The first template is used to fit onto the positioning post so that the insulating sheet positioning hole covers a predetermined position on the inner wall of the heat dissipation side wall component. The insulating heat-conducting pad is placed inside the insulating sheet positioning hole. The second template has component positioning holes. The second template is used to fit onto the positioning post so that the component positioning holes cover the insulating thermally conductive pad, and the power device is placed inside the component positioning holes.

[0016] The beneficial effects of the water-cooled power supply structure and its manufacturing method provided in this application are at least as follows: First, power devices are connected to the heat dissipation sidewalls on both sides. Then, a welding positioning fixture is used to accurately weld the pre-assembled power devices on the heat dissipation sidewalls to the main circuit board below, forming a power circuit. Finally, it is fixed to the base plate, forming a U-shaped main structure. In this way, the main power devices can dissipate heat through the heat dissipation sidewalls, achieving heat dissipation not only through the water-cooled radiator below the base plate but also through another heat dissipation path utilizing the outer wall of the heat dissipation sidewalls. Furthermore, the heat conduction and dissipation process of the heat dissipation sidewalls targets the main power devices, thereby greatly improving the power supply's heat dissipation performance. Moreover, the heat dissipation sidewalls and the main circuit board are positioned using the welding positioning fixture, achieving accurate alignment, optimizing the assembly process, and facilitating automated mass production. By attaching the power devices to the inner wall of the heat sink sidewall, the components within the U-shaped main structure of the power supply are more dispersed. This not only facilitates airflow to remove heat but also reduces the main circuit board area, increasing power density. It also provides convenience for vertically mounting various functional expansion boards, allowing the product to flexibly adapt to different needs. Furthermore, the pre-mounting of the heat sink sidewall and power devices enables modular pre-assembly. Combined with an integrated fixture design, critical processes such as alignment and welding, which rely on individual skills, are transformed into standardized operations guaranteed by tooling. This reduces reliance on highly skilled assembly workers and improves production yield and product consistency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the water-cooled power supply structure according to an embodiment of this application; Figure 2 This is an exploded view of the water-cooled power supply structure according to an embodiment of this application; Figure 3This is a schematic diagram of the structural principle of the pre-installation process of the sidewall integrated heat dissipation module according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the welded semi-finished product after overall welding in the embodiments of this application; Figure 5 This is a flowchart illustrating the steps of a method for manufacturing a water-cooled power supply structure according to an embodiment of this application. Figure 6 This is a flowchart of the pre-installation process of the sidewall integrated heat dissipation module in the embodiments of this application; Figure 7 This is a schematic diagram illustrating the structural principle of the limiting fixture limiting the heat dissipation sidewall component during the pre-assembly process of the sidewall integrated heat dissipation module according to an embodiment of this application. Figure 8 This is a schematic diagram illustrating the structural principle of the limiting fixture limiting the insulating thermally conductive pad during the pre-assembly process of the sidewall integrated heat dissipation module according to an embodiment of this application. Figure 9 This is a schematic diagram illustrating the structural principle of the limiting fixture for limiting power devices during the pre-assembly process of the sidewall integrated heat dissipation module according to an embodiment of this application. Figure 10 This is a schematic diagram of the structural principle of the sidewall integrated heat dissipation module obtained by fixing the power device after limiting its position during the pre-assembly process of the sidewall integrated heat dissipation module according to an embodiment of this application. Figure 11 This is an exploded view of the welding positioning fixture according to an embodiment of this application in use; Figure 12 This is a schematic diagram illustrating the structural principle of the welding positioning fixture in this application for limiting the main circuit board and connecting power components; Figure 13 This is a schematic diagram illustrating the structural principle of the welding positioning fixture in this application for limiting and fixing the integrated heat dissipation module on the side wall.

[0018] The following are the labels in the diagram: 100, base plate; 200, heat dissipation sidewall component; 210, power device; 211, insulating thermal pad; 220, fastener; 221, insulating sleeve; 230, mounting through hole; 300, main circuit board; 310, power supply component; 400, top cover; 500, limiting fixture; 510, limiting base plate; 511, sidewall component positioning cavity; 512, first clearance groove; 513, positioning post; 520, first template; 521, insulating sheet positioning hole; 530, second template; 531, component positioning hole; 600, welding positioning fixture; 610, welding base; 611, plate positioning cavity; 612, positioning groove; 613, guide positioning post; 614, elastic buckle; 620, support boss; 621, lifting rod locking post; 630, locking cover; 631, opening groove. Detailed Implementation

[0019] This application provides a water-cooled power supply structure and its manufacturing method. To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0020] It should be noted that in annotations, leader lines with arrows represent non-solid areas such as holes and slots, or non-specific solid features such as higher-level features, or specific directions. Leader lines without arrows represent solid features or specific lower-level features.

[0021] When a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality of" means two or more, unless otherwise explicitly defined.

[0022] like Figure 1 , Figure 2 As shown, this embodiment proposes a water-cooled power supply structure, mainly including: a base plate 100, side plates (heat dissipation sidewalls 200) arranged opposite each other on the left and right sides, and a main circuit board 300. The base plate 100 is usually a square plate. For ease of structural description, when the square base plate 100 is laid flat, the direction of the long side is the front-back direction, the direction of the short side is the left-right direction, and the direction of the thickness is the up-down direction. This embodiment uses this as the standard for structural description. The base plate 100, the side plates on the left and right sides, and the main circuit board 300 are the basic structure of the power supply. The solution of this application mainly changes the position of the power supply circuit components and optimizes the manufacturing method of the power supply structure after the component position is changed.

[0023] like Figure 3As shown, the side panel in this embodiment uses a heat dissipation sidewall component 200. The heat dissipation sidewall component 200 can be a high-efficiency heat dissipation plate, such as an aluminum plate or other alloy plate. It not only serves as a support and protection for the power supply's outer casing but also has efficient heat conduction, thus facilitating heat dissipation. Multiple power devices 210 are disposed on the inner walls of both sides of the heat dissipation sidewall component 200. The power devices 210 are the main heat-generating components in the power supply circuit. The power devices 210 can be pre-fixed to the inner side of the heat dissipation sidewall component 200 to form a sidewall integrated heat dissipation module (which can be pre-assembled into a standardized module). This sidewall integrated heat dissipation module can conduct heat to the power devices 210 through the heat dissipation sidewall component 200, achieving the heat dissipation function. Figure 2 , Figure 4 As shown, the main circuit board 300 is fixedly disposed between the heat dissipation sidewall components 200 on the left and right sides. Power components 310 are disposed on the main circuit board 300. The heat dissipation sidewall components 200 (sidewall integrated heat dissipation modules) with each power device 210 pre-installed and the main circuit board 300 are positioned by a welding positioning fixture 600 (the detailed structure of the welding positioning fixture 600 is described below) so that the pin array of the power devices 210 on the heat dissipation sidewall components 200 on both sides is synchronously aligned with the pad array on both sides of the main circuit board 300 in three-dimensional space and then welded and fixed. The power devices 210 and power components 310 form a complete power circuit on the main circuit board 300, thereby forming a welded semi-finished product with the main circuit board 300 in the middle and the sidewall integrated heat dissipation modules on the left and right sides. The welded semi-finished product is then placed on the base plate 100, so that the base plate 100 is located at the bottom of the main circuit board 300. The heat dissipation side wall components 200 on both sides are fixed on the base plate 100. The base plate 100 is also used to contact the water-cooled radiator, and the heat dissipation side wall components 200 also provide mounting positions for the water-cooled radiator, which facilitates the installation of the water-cooled radiator.

[0024] The water-cooled power supply structure in this embodiment has the following advantages: First, by integrating the high-heat-generating power devices 210 onto the left and right heat dissipation sidewalls 200, a highly integrated sidewall heat dissipation module is formed. Then, the left and right sidewall heat dissipation modules are simultaneously soldered and fixed to the main circuit board 300. This achieves a multi-functional integrated design for the heat dissipation sidewalls 200, enabling them not only to provide housing protection and device mounting, but also to act as the main heat dissipation unit for the power devices 210. Additionally, it provides mounting positions for water-cooled radiators, thereby improving the installation interface for connecting water-cooling plates. This structure eliminates the need to design independent mounting brackets for water-cooled radiators and avoids the need for additional mounting holes on the base plate 100, optimizing the entire power supply structure.

[0025] Secondly, optimizing the assembly process creates conditions for automated production. Based on the aforementioned integrated design (heat dissipation sidewall component 200 pre-installed with power devices 210), the power devices 210 (core heat-generating components) can be pre-assembled onto the heat dissipation sidewall component 200 to form an integrated sidewall heat dissipation module. This integrated sidewall heat dissipation module is quickly positioned to the main circuit board 300 using a dedicated welding positioning fixture 600 and then welded in one go. This transforms the complex operation of simultaneous alignment on both sides into a standardized process ensured by the welding positioning fixture 600, providing a technological foundation for achieving high-precision and high-consistency automated production.

[0026] Third, the structure of pre-fixing the power devices 210 to the inner side of the heat dissipation sidewall 200 improves space utilization, enhances layout scalability, and facilitates high power density. Placing the main heat-generating components (power devices 210) on the left and right heat dissipation sidewalls 200 frees up significant central three-dimensional space within the power supply structure. This layout helps reduce the area of ​​the main circuit board 300 to increase power density, while also providing space and convenience for vertically mounting various functional expansion boards, allowing the product to flexibly adapt to different needs.

[0027] Fourth, this power supply structure allows for better standardization of production and reduces reliance on highly skilled workers. Through the process design of "integrated heat dissipation modules on the side walls" and "integrated positioning welding using a 600 welding positioning fixture," critical processes such as alignment and welding, which depend on individual skills, are transformed into standardized operations guaranteed by tooling. This reduces reliance on highly skilled assembly workers and helps improve production first-pass yield and product consistency.

[0028] like Figure 2 , Figure 3 , Figure 4 As shown, in some embodiments, an insulating thermally conductive pad 211 is provided between the power device 210 and the inner wall of the heat dissipation sidewall 200. The insulating thermally conductive pad 211 can be a ceramic sheet, and the insulating thermally conductive pad 211 can be positioned and installed onto the inner wall of the heat dissipation sidewall 200 by a limiting fixture 500. The specific structure of the limiting fixture 500 is described in detail below. By using the insulating thermally conductive pad 211, the power device 210 is prevented from directly contacting the metal heat dissipation sidewall 200, which meets safety requirements.

[0029] like Figure 2 , Figure 3 , Figure 4As shown, in some embodiments, the power device 210 is fixedly connected to the heat dissipation sidewall component 200 by fasteners 220, and an insulating sleeve 221 is provided between the fasteners 220 and the power device 210. The fasteners 220 can be screws, and the insulating sleeve 221 can be insulating beads used on the screws to ensure electrical safety. The limiting fixture 500 can ensure that the power device 210 is precisely aligned with the screw holes on the ceramic plate and the heat dissipation sidewall component 200. The power device 210 is placed on the positioned ceramic plate, and the power device 210 is locked to the inner wall of the heat dissipation sidewall component 200 using screws with insulating beads, thus completing the pre-assembly of the sidewall integrated heat dissipation module.

[0030] In some embodiments, the number of power devices 210 connected to the heat dissipation sidewalls 200 on both the left and right sides is the same. In this way, without considering the distribution of power components 310 on the main circuit board 300, the heat dissipation of the power devices 210 on both sides can be evenly distributed, which is beneficial to heat dissipation.

[0031] like Figure 4 , Figure 11As shown, however, the distribution of power components 310 on the main circuit board 300 is usually uneven, with different numbers of power devices 210 connected to the heat dissipation sidewalls 200 on the left and right sides. This allows for better heat dissipation by considering the distribution of power components 310 on the main circuit board 300. In the specific structure of this embodiment, power components are provided at both the front and rear ends of the first side edge (e.g., the left side edge) of the main circuit board 300. The power components at the front end can be structures such as electrolytic capacitors, and the power components at the rear end can be structures such as connectors. This way, the space at both the front and rear ends of the first side edge of the main circuit board 300 is blocked by the power components. There are no power components at either end of the second side edge (e.g., the right side edge) of the main circuit board 300. This ensures that the space at either end of the second side edge of the main circuit board 300 remains unobstructed. Therefore, the number of power devices 210 connected to the heat dissipation sidewall 200 fixed to the outside of the first side edge of the main circuit board 300 is 6; and the number of power devices 210 connected to the heat dissipation sidewall 200 fixed to the outside of the second side edge of the main circuit board 300 is 10. Since the number of power devices 210 at the first side edge is less than that at the second side edge, and the power components at the front and rear ends of the first side edge of the main circuit board 300 partially obstruct the channel space formed by the front and rear ends of the first side edge, the airflow is not as smooth as that in the channel space formed by the front and rear ends of the second side edge. Therefore, considering that a more balanced heat dissipation on both sides would be more conducive to a more uniform heat dissipation path design for the water-cooled radiator, the number of power devices 210 at the first side edge is less than that at the second side edge. This results in more power devices 210 on the heat dissipation sidewall 200 of the second side edge, which is more conducive to heat dissipation, and relatively fewer power devices 210 on the heat dissipation sidewall 200 of the first side edge, which is less conducive to heat dissipation, thereby making the heat generation on both sides more uniform.

[0032] like Figure 3 , Figure 4As shown, in some embodiments, mounting through holes 230 are provided through the heat dissipation sidewalls 200 on both the left and right sides. These mounting through holes 230 are used to pass through connectors to connect to the water-cooled radiator. The mounting through holes 230 on the heat dissipation sidewalls 200 are vertically arranged, and multiple mounting through holes 230 are distributed along the front-back direction on the heat dissipation sidewalls 200. In use, the connector can be a heat-conducting screw that facilitates heat transfer. The entire heat-conducting screw passes through the water-cooled radiator and the mounting through hole 230, and is then fixed by a nut. At least part of the outer wall of the heat-conducting screw contacts the inner wall of the mounting through hole 230. This not only allows for the mounting of the water-cooled radiator but also forms another heat dissipation path. While the heat dissipation sidewalls 200 contact the outside air for natural heat dissipation, the bottom of the heat dissipation sidewalls 200 contacts the water-cooled radiator for water-cooled heat dissipation, improving heat dissipation efficiency. Furthermore, the heat-conducting screw can contact the water-cooled radiator for heat conduction, further improving heat dissipation efficiency.

[0033] like Figure 5 As shown, in some embodiments, a method for manufacturing a water-cooled power supply structure is also proposed, applied to the water-cooled power supply structure described above, wherein the manufacturing method includes the following steps: Step S100: Pre-install various power devices on the heat dissipation sidewalls on the left and right sides respectively.

[0034] Pre-assembly of the heat dissipation sidewall components and power devices enables modular assembly. Pre-assembling the heat dissipation sidewall components and power devices on both the left and right sides facilitates subsequent direct assembly, improving assembly efficiency and yield.

[0035] like Figure 5 , Figure 6 As shown, step S100 further includes steps S110 and S120. For example: Step S110: Provide a limiting fixture to align the heat dissipation sidewall component, multiple power devices, and insulating thermal pads.

[0036] like Figure 9 As shown, the limiting fixture 500 specifically includes: a limiting base plate 510, a first template 520, and a second template 530. (As shown...) Figure 7 , Figure 8 , Figure 9As shown, a sidewall positioning cavity 511 is provided on the upper surface of the limiting base plate 510. The left and right sides of the sidewall positioning cavity are respectively provided with first clearance grooves 512. The sidewall positioning cavity 511 is used to accommodate and limit the heat dissipation sidewall component 200. The first clearance grooves 512 can be used to easily insert fingers to remove the heat dissipation sidewall component 200 from the sidewall positioning cavity. When the heat dissipation sidewall component 200 is placed into the first clearance groove 512, the four inner walls of the sidewall positioning cavity abut against the front and back and the top and bottom sides of the heat dissipation sidewall component 200 to achieve limitation, so that the position of the heat dissipation sidewall component 200 on the limiting base plate 510 is fixed. Furthermore, the limiting base plate 510 is also provided with positioning posts 513, which can be set at the four corners of the upper surface of the limiting base plate 510. The first template 520 and the second template 530 are both provided with positioning holes that cooperate with the positioning posts 513. In this way, when the first template 520 or the second template 530 is fitted onto the positioning post 513 through the positioning hole, the first template 520 or the second template 530 can be positioned and matched with the limiting base plate 510. An insulating sheet positioning hole 521 is opened on the first template 520. After the first template 520 is fitted onto the positioning post 513, the insulating sheet positioning hole 521 covers the predetermined position of the inner wall of the heat dissipation side wall component 200. Then, the insulating heat-conducting pad 211 is placed in the insulating sheet positioning hole 521 and attached to the predetermined position on the inner wall of the heat dissipation side wall component 200 below. A component positioning hole 531 is provided on the second template 530. After the second template 530 is fitted onto the positioning post 513, the component positioning hole 531 covers the insulating thermally conductive pad 211. Then, the power device 210 is placed in the component positioning hole 531, so that the power device 210 covers the insulating thermally conductive pad 211 and is positioned at a predetermined position on the inner wall of the heat dissipation side wall component 200.

[0037] Step S120: The aligned power device is fixedly connected to the heat dissipation side wall component using fasteners, wherein the fasteners are provided with insulating sleeves.

[0038] like Figure 9 , Figure 10 As shown, in the specific process, when the screw with the insulating particles is screwed on, the power device 210, positioned by the second template 530, is locked onto the inner wall of the heat dissipation sidewall component 200, completing the pre-installation of the integrated heat dissipation module on the sidewall. Combined with the limiting fixture 500, accurate installation of the power device 210 is achieved. Key processes such as screwing and alignment, which rely on individual skills, are transformed into standardized operations guaranteed by the limiting fixture 500. This reduces reliance on highly skilled assembly workers and helps improve production yield and product consistency.

[0039] Step S200: Provide a welding positioning fixture, which includes a plate positioning cavity and positioning grooves on the left and right sides.

[0040] like Figure 11As shown, in the specific process, the main circuit board and the heat dissipation side wall are accurately positioned by the welding positioning fixture 600 before welding, which simplifies the process and ensures the consistency of the product.

[0041] Step S300: Place the main circuit board in the board positioning cavity and insert power supply components on the main circuit board.

[0042] Step S400: Place the pre-installed heat dissipation sidewall components into the positioning grooves on the left and right sides respectively, so that the pin array of the power device is inserted into the pad array of the main circuit board.

[0043] Step S500: After fixing the heat dissipation sidewall component, perform overall welding to obtain a welded semi-finished product.

[0044] like Figure 4 , Figure 11 As shown, the pin arrays of the power devices 210 on the left and right heat dissipation sidewalls 200 must be strictly synchronized with the pad arrays on both sides of the main circuit board 300 in three-dimensional space (X, Y, Z directions). This requires that the positions of the power devices 210 on the integrated heat dissipation modules on both sides of the sidewalls cannot be offset from the inner wall of the heat dissipation sidewall 200, and the spatial position of the heat dissipation strip module must achieve high-precision matching and alignment with the pad layout of the main circuit board 300. Furthermore, during the soldering process, it is necessary to maintain the rigidity and stress control of the heat dissipation strip module and the main circuit board 300 to ensure that they do not deform during the soldering process. The main structure composed of the heat dissipation sidewalls 200 and numerous power devices 210 has a certain weight and size. During positioning and soldering, it is necessary to maintain its overall rigidity and precisely control the clamping force to prevent deformation of the main circuit board 300 or displacement of the aligned components.

[0045] like Figure 11 , Figure 12As shown, to solve the above difficulties, this embodiment uses a dedicated welding positioning fixture 600 for installation and positioning. The welding positioning fixture 600 of this embodiment includes: a welding base 610, a supporting boss 620, and a locking cover 630. A plate positioning cavity 611 is formed in the middle of the upper surface of the welding base 610. Positioning grooves 612 are provided on the left and right sides of the plate positioning cavity 611. The positioning grooves 612 are connected to the plate positioning cavity 611, and the bottom of the positioning grooves 612 is recessed into the bottom surface of the plate positioning cavity 611. The lower bottom surface of the plate positioning cavity 611 and the lower bottom surface of the positioning grooves 612 serve as mechanical reference surfaces, providing initial positioning in the vertical direction. The front, rear, left, and right sides of the board positioning cavity 611 limit the main circuit board 300 placed therein in the front, rear, left, and right directions; the front, rear, left, and right sides of the positioning groove 612 initially limit the side wall integrated heat dissipation module (heat dissipation side wall component 200) placed therein in the front, rear, left, and right directions, thereby limiting the relative position of the side wall integrated heat dissipation module placed on the welding base 610 and the main circuit board 300, so that the pin array of the power device 210 and the pad array on both sides of the main circuit board 300 are strictly synchronized in three-dimensional space (X, Y, Z directions).

[0046] like Figure 12 , Figure 13 As shown, furthermore, guide positioning posts 613 are provided on the front and rear sides of the positioning groove 612. For example, the guide positioning posts 613 are vertically arranged on the front and rear sides of the bottom surface of the positioning groove 612 corresponding to the corresponding positions of the heat dissipation sidewall component 200. Correspondingly, positioning holes are opened on the bottom surface of the heat dissipation sidewall component or the mounting through holes of the integrated heat dissipation module are used for docking and positioning. The guide positioning posts are used to guide the heat dissipation sidewall component 200 to be accurately positioned, ensuring that the pins of the power device 210 are initially aligned with the pad array (the pad array can be an arrangement of solder holes) of the main circuit board 300.

[0047] To maintain rigidity and control stress on the integrated heat dissipation module and main circuit board 300 on the sidewall, a support boss 620 is provided on the welding base 610 and located outside the positioning grooves 612 on both sides. A locking cover 630 is detachably connected to the support bosses 620 on both sides, pressing down on the heat dissipation sidewall component 200. By pressing the locking cover 630 against the top of the heat dissipation strip modules on both sides in the left-right direction, uniform pressure is applied to the heat dissipation sidewall component 200, securing it firmly in the welding base 610. This initially ensures the stability of the pin-to-solder hole connection during the welding process.

[0048] like Figure 11 , Figure 12As shown, furthermore, multiple elastic clips 614 are provided on the welding base 610. These elastic clips 614 are distributed at the outer edge of the board positioning cavity 611. The elastic clips 614 rotate to enter the board positioning cavity 611 and press down on the main circuit board 300. The multiple elastic clips 614 are a combination of springs and pressure tables, and the pressure tables can also rotate. The multiple elastic clips 614 form a flexible clamping mechanism. The elastic clips 614 are evenly distributed around the periphery of the main circuit board 300, providing the necessary fixing force while preventing board warping or stress concentration due to rigid clamping. This effectively ensures the positional stability of the main circuit board 300 during the welding process.

[0049] like Figure 11 , Figure 13 As shown, the support boss 620 is further provided with a lifting rod locking post 621, which is used to lock both ends of the locking cover 630. The lifting rod locking post 621 includes a rotating part and a locking button, which is rotatably connected to the top of the support boss 620 through the rotating part. Correspondingly, opening slots 631 are provided at both ends of the locking cover 630. When the locking button is rotated to the left or right position, the opening slot 631 passes through the locking button and presses against the top of the heat dissipation sidewall 200. Then, the locking button is turned to the front or back position, so that the locking button presses horizontally on the opening slot 631 to achieve locking. This facilitates the quick installation of the locking cover 630. After the heat dissipation sidewall 200 is placed, uniform pressure is applied from above to fasten it in the welding positioning fixture 600, preventing angular displacement or loosening during subsequent handling or welding.

[0050] like Figure 12 , Figure 13 As shown, the detailed process of the above steps is as follows: Step 1: Secure the main circuit board. Insert the main circuit board into the soldering base, and rotate the elastic clips around the outer edge of the board positioning cavity to press down and clamp the main circuit board located in the board positioning cavity.

[0051] Step 2: Pre-insert power components onto the main circuit board. Insert all other components (power components) that need to be mounted onto the main circuit board, except for the power devices on the heat sink sidewall.

[0052] Step 3: Positioning and assembling the heat dissipation sidewall component. Place the pre-installed power device heat dissipation sidewall component into the positioning grooves on both sides along the guide positioning posts. Ensure that all pins of the power device are simultaneously inserted into the corresponding solder holes on the main circuit board. Then, cover with the locking cover and tighten the four lifting rod locking posts.

[0053] Step 4: Overall Soldering and Disassembly. The complete soldering fixture, including the main circuit board and heat dissipation sidewall components, is fed into the wave soldering oven to complete all pin soldering in one operation (including pin soldering of power devices and power supply components). After soldering, the components are removed from the oven and disassembled sequentially to obtain the soldered semi-finished product (e.g., ...). Figure 4 As shown, this is a complete welded semi-finished product.

[0054] Step S600: Assemble the welded semi-finished product with the base plate to form a U-shaped main body.

[0055] Step S700: Install the top cover onto the U-shaped main body to form the finished power supply. Figure 1 , Figure 2 As shown, the top cover 400 can be installed on the top of the heat dissipation sidewall components on both the left and right sides to complete the encapsulation.

[0056] In summary, this welding positioning fixture systematically solves the problems of synchronous alignment on both sides and component stress control through a continuous operation of "base positioning → elastic buckle to lightly secure the main circuit board → positioning groove and guide positioning post to guide the heat dissipation sidewall component to precise positioning → locking cover to press and lock". It transforms complex precision alignment into a reliable mechanical positioning operation. Arranging power devices on both sides leaves three-dimensional space above the main circuit board. This space can be used to reduce the motherboard area or vertically install expansion function boards, helping to improve the overall power density. Furthermore, it makes the power supply structure more integrated; the heat dissipation sidewall component combines heat dissipation, power device installation, and overall system fixation support, eliminating the need for a separate mounting bracket and optimizing the overall structure.

[0057] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A water-cooled power supply structure, characterized in that, include: The heat dissipation sidewalls are arranged opposite each other on the left and right sides, and multiple power devices are arranged on the inner walls of the heat dissipation sidewalls on both sides. The main circuit board is fixedly disposed between the heat dissipation sidewalls on the left and right sides. Power components are disposed on the main circuit board. The heat dissipation sidewalls and the main circuit board are positioned by a welding positioning fixture so that the pin arrays of the power devices on the heat dissipation sidewalls on both sides are synchronously aligned with the pad arrays on both sides of the main circuit board in three-dimensional space before being welded and fixed. The power devices and the power components form a power circuit on the main circuit board. A base plate is located at the bottom of the main circuit board and is fixedly connected to the heat dissipation sidewalls on both sides. The base plate is used to contact the water-cooled radiator, and the heat dissipation sidewalls provide mounting positions for the water-cooled radiator. First, a limiting fixture is provided, and various power devices are pre-mounted onto the heat dissipation sidewalls on the left and right sides through the limiting fixture; The main circuit board is then positioned by the plate positioning cavity of the welding positioning fixture, and the pre-installed heat dissipation sidewall component is positioned by the positioning grooves on the left and right sides of the welding positioning fixture, so that the pin array of the power device is inserted into the pad array of the main circuit board. The welding positioning fixture is provided with support bosses on the left and right sides, and locking covers are detachably provided on the support bosses on the left and right sides. The locking covers apply uniform pressure to the heat dissipation sidewall component by pressing down on it, and fasten it in the welding base, thereby ensuring the stability of the pin and solder hole connection during the welding process. After the heat dissipation sidewall component is fixed, it is welded as a whole to obtain a welded semi-finished product. The complete welding positioning fixture with the main circuit board and the heat dissipation sidewall component is sent into the wave soldering oven to complete the welding of all pins at one time. After the welding is completed, it is taken out of the oven and disassembled in sequence to obtain the welded semi-finished product. The welded semi-finished products are then assembled with the base plate to form a U-shaped main body; The number of power devices connected to the heat dissipation sidewalls on the left and right sides is different. Power components are provided at both the front and rear ends of the first side edge of the main circuit board. The space at both the front and rear ends of the first side edge of the main circuit board is blocked by the power components. There are no power components at either end of the second side edge of the main circuit board. The space at both ends of the second side edge of the main circuit board remains unobstructed and unobstructed. Therefore, the number of power devices connected to the heat dissipation sidewall fixed to the outside of the first side edge of the main circuit board is less than the number of power devices connected to the heat dissipation sidewall fixed to the outside of the second side edge of the main circuit board. Since there are fewer power devices at the first side edge than at the second side edge, and the power components at both ends of the first side edge of the main circuit board partially obstruct the channel space formed by the front and rear ends of the first side edge, the airflow is not as smooth as in the channel space formed by the front and rear ends of the second side edge, thus making the heat dissipation on both sides more even. Therefore, having fewer power devices at the first side edge than at the second side edge, and having more power devices on the heat dissipation sidewall of the second side edge which is more conducive to heat dissipation than on the heat dissipation sidewall of the first side edge which is less conducive to heat dissipation, can make the heat generation on both sides more uniform. The heat dissipation sidewalls on both sides are provided with mounting through holes for connecting the water-cooled radiator with connectors. Multiple mounting through holes are distributed along the front-to-back direction on the heat dissipation sidewalls. The connector is a heat-conducting screw that facilitates heat transfer. The entire heat-conducting screw passes through the water-cooled radiator and the mounting through holes and is fixed with a nut. At least part of the outer wall of the heat-conducting screw contacts the inner wall of the mounting through holes, thus not only mounting the water-cooled radiator but also forming another heat dissipation path. While the heat dissipation sidewalls naturally dissipate heat through contact with the outside air, the bottom of the heat dissipation sidewalls contacts the water-cooled radiator for water-cooled heat dissipation. Additionally, the heat-conducting screw contacts the water-cooled radiator for heat conduction.

2. The water-cooled power supply structure according to claim 1, characterized in that, An insulating thermally conductive pad is provided between the power device and the inner wall of the heat dissipation sidewall.

3. The water-cooled power supply structure according to claim 2, characterized in that, The power device is fixedly connected to the heat dissipation sidewall component by fasteners; An insulating sleeve is provided between the fastener and the power device.

4. A method for manufacturing a water-cooled power supply structure, applied to the water-cooled power supply structure as described in any one of claims 1-3, characterized in that, The manufacturing method includes the following steps: Various power devices are pre-mounted on the heat dissipation sidewalls on the left and right sides respectively; A welding positioning fixture is provided, the welding positioning fixture including a plate positioning cavity and positioning grooves on the left and right sides; The main circuit board is placed in the board positioning cavity, and power supply components are plugged into the main circuit board. The pre-installed heat dissipation sidewall components are placed in the positioning grooves on the left and right sides respectively, so that the pin array of the power device is inserted into the pad array of the main circuit board. After fixing the heat dissipation sidewall component, perform overall welding to obtain a welded semi-finished product; The welded semi-finished products are assembled with the base plate to form a U-shaped main body.

5. The manufacturing method of the water-cooled heat dissipation power supply structure according to claim 4, characterized in that, In the step of providing a welding positioning fixture, the welding positioning fixture including a plate positioning cavity and positioning grooves on the left and right sides, the welding positioning fixture includes: A welding base, wherein the plate positioning cavity is formed on the welding base, and the positioning grooves are provided on the left and right sides of the plate positioning cavity; A support boss is provided on the welding base and located outside the positioning grooves on the left and right sides; A locking cover is detachably connected to the support protrusions on the left and right sides, pressing down on the heat dissipation sidewall.

6. The manufacturing method of the water-cooled heat dissipation power supply structure according to claim 5, characterized in that, The welding base is also provided with multiple elastic buckles, which are distributed at the outer edge of the plate positioning cavity. The elastic buckles enter the plate positioning cavity by rotation and press down on the main circuit board. The support boss is also provided with a lifting rod locking post, which is used to lock both ends of the locking cover.

7. The manufacturing method of the water-cooled heat dissipation power supply structure according to claim 4, characterized in that, The specific steps of pre-mounting various power devices onto the heat dissipation sidewalls on the left and right sides include: A limiting fixture is provided to align the heat dissipation sidewall component, multiple power devices, and insulating thermally conductive pad. The aligned power device is fixedly connected to the heat dissipation sidewall component by fasteners, wherein the fasteners are provided with insulating sleeves.

8. The manufacturing method of the water-cooled heat dissipation power supply structure according to claim 7, characterized in that, In the step of providing a limiting fixture to align the heat dissipation sidewall component, multiple power devices, and insulating thermally conductive pads, the limiting fixture includes: A limiting base plate is provided with a side wall component positioning cavity, which is used to accommodate and limit the heat dissipation side wall component. A positioning post is also provided on the limiting base plate. The first template has an insulating sheet positioning hole. The first template is used to fit onto the positioning post so that the insulating sheet positioning hole covers a predetermined position on the inner wall of the heat dissipation side wall component. The insulating thermally conductive pad is placed inside the insulating sheet positioning hole. The second template has a component positioning hole. The second template is used to fit onto the positioning post so that the component positioning hole covers the insulating thermally conductive pad, and the power device is placed inside the component positioning hole.

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