Anti-oxidation heating device and test sorting machine
By designing the temperature chamber assembly and the air blowing plate, uniform heating and oxidation prevention of the chip are achieved, solving the problems of uneven heating and oxidation in traditional heating devices, and improving test consistency and yield.
Patent Information
- Application Number
- CN202511733781.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-03-06
Smart Images

Figure CN121620166A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor chip sorting technology, and in particular to a heating device and a testing and sorting machine for achieving oxidation prevention. Background Technology
[0002] In the high-temperature testing station of the test sorting machine, the traditional solution generally uses heating rods to locally heat the track or chip, and completes the test in an open or semi-open environment. However, this method results in a concentrated heat source from the heating rods, leading to large temperature differences on the track, uneven heating of the chip, and poor test consistency. Moreover, oxygen cannot be effectively isolated in the high-temperature environment, making the chip surface extremely prone to oxidation and reducing the yield rate. Summary of the Invention
[0003] This application provides a heating device and a test sorting machine for achieving anti-oxidation. Through the enclosed space of the temperature chamber assembly, the air blowing plate and multiple air holes, the heated anti-oxidation gas is directly introduced into the bearing channel. While exhausting the air, heat is evenly transferred to the main body of the track, thereby simultaneously achieving isothermal heating of the chip and an anti-oxidation environment.
[0004] In a first aspect, embodiments of this application provide a heating device for achieving oxidation prevention. The heating device includes a temperature chamber assembly, a track assembly, and a gas heating assembly. The temperature chamber assembly is enclosed by a chamber wall to form a closed space. The chamber wall includes a top chamber wall located at the top of the temperature chamber assembly, and the top chamber wall has a track opening. The track assembly is disposed in the closed space along a first preset direction, with one end exposed outside the temperature chamber assembly through the track opening, for loading and unloading materials. The track assembly includes a track body and two air blowing plates. The interior of the track body is provided with a carrying channel for carrying a plurality of chips. The track body includes two side walls parallel to the first preset direction, and the two air blowing plates are respectively installed on different side walls. The two side walls are spaced apart and have a plurality of air holes communicating with the carrying channel. The gas heating assembly is used to continuously supply heated anti-oxidation gas to the two air blowing plates. The anti-oxidation gas flows into the carrying channel through the plurality of air holes to discharge the air in the carrying channel from the closed space through the track opening and conduct heat to the track body to uniformly heat the plurality of chips.
[0005] Secondly, embodiments of this application provide a test sorting machine, which includes a sorting machine body and the aforementioned anti-oxidation heating device disposed on the sorting machine body.
[0006] The aforementioned anti-oxidation heating device and testing sorting machine, through the enclosed space provided by the temperature chamber and the air blowing plates and multiple air holes on both sides of the track assembly, allow the heated anti-oxidation gas to enter the bearing channel evenly through the airflow channel of the bottom rail. While exhausting the air, heat is conducted to the main body of the track, achieving isothermal heating of the chip. By utilizing the exhaust vents, heat insulation pads, temperature chamber door, and parallel multi-track assembly, a low-oxygen environment is simultaneously ensured, heat loss is reduced, and parallel testing is carried out, thereby improving test consistency, yield, and production capacity. Attached Figure Description
[0007] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0008] Figure 1 This is a schematic diagram of the heating device for preventing oxidation provided in an embodiment of this application.
[0009] Figure 2 This is a structural block diagram of a heating device for preventing oxidation, provided in an embodiment of this application.
[0010] Figure 3 An exploded view of the track assembly provided in an embodiment of this application.
[0011] Figure 4 This is a schematic diagram of the cover plate provided in an embodiment of this application.
[0012] Figure 5 This is a schematic diagram of the first structure of the bottom rail provided in an embodiment of this application.
[0013] Figure 6 for Figure 5 The middle circle shows an enlarged view of part A.
[0014] Figure 7 A perspective view of the bottom rail provided in an embodiment of this application.
[0015] Figure 8 This is a schematic diagram of a first partial structure of the air blowing plate provided in an embodiment of this application.
[0016] Figure 9 This is a schematic diagram of a second partial structure of the air blowing plate provided in an embodiment of this application.
[0017] Figure 10 This is a partial cross-sectional view of the air blowing plate provided in an embodiment of this application.
[0018] Figure 11This is a schematic diagram of the second structure of the bottom rail provided in an embodiment of this application.
[0019] Figure 12 This is a structural block diagram of the test sorting machine provided in an embodiment of this application.
[0020] Component designations
[0021]
[0022]
[0023] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0025] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar planned objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data are interchangeable where appropriate; in other words, the described embodiments are implemented according to a sequence other than that illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, may also include other content; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0026] It should be noted that the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0027] Please refer to Figure 12This is a structural block diagram of the test sorting machine provided in the embodiments of this application. This application provides a test sorting machine 1000. The test sorting machine 1000 can be a translational test sorting machine 1000, a gravity test sorting machine 1000, etc., used to test chips (such as semiconductor chips) and sort chips with different test results. The test sorting machine 1000 needs to perform high-temperature electrical tests on the chips; that is, it needs to ensure that each chip is kept under the same temperature environment to eliminate external interference conditions such as oxidation, to ensure smooth testing. In this application, the test sorting machine 1000 includes a sorting machine body 200 and a heating device 100 for oxidation prevention. The heating device 100 is disposed in the sorting machine body 200. The following will specifically describe how the heating device 100 for oxidation prevention achieves rapid oxygen removal and uniform heating to provide a uniform temperature environment while preventing chip oxidation.
[0028] Please refer to Figure 1 and Figure 2 This application also provides a heating device 100 for achieving oxidation prevention. The heating device 100 includes a temperature chamber assembly 1, a track assembly 2, and a gas heating assembly 3. The track assembly 2 is located inside the temperature chamber assembly 1. The gas heating assembly 3 is located outside the temperature chamber assembly 1 and is used to provide preheated anti-oxidation gas, and achieves rapid oxygen removal and uniform heating through the cooperation of the temperature chamber assembly 1 and the track assembly 2.
[0029] Specifically, the incubator assembly 1 is enclosed by multiple walls to form a closed space, providing an initial closed environment and reducing contact between outside air and the interior of the incubator assembly 1. More specifically, the walls can be made of insulating materials, such as alumina alloy or stainless steel with insulation cotton. The walls include a top wall 10a located at the top of the incubator assembly 1, and a front wall 10b and a rear wall 10c arranged opposite each other. The top wall 10a has a track opening 11. The track opening 11 is the only channel for the chip to enter and exit the incubator assembly 1, providing an initial closed environment for the chip. The front wall 10b has an incubator door 12. The incubator door 12 can be a hinged incubator door, an electronic incubator door, etc. The incubator door 12 can be operably locked or unlocked to keep the closed space closed or open. When the closed space is closed, it maintains the initial closed environment and reduces the entry of outside air into the interior of the incubator assembly 1. When the enclosed space is open, staff can inspect the current status of the incubator assembly 1 and / or the track assembly 2 to independently determine if there are any potential faults. This application establishes an initial enclosed environment before heating by having only the track opening 11 exposed in the incubator assembly 1 and the incubator door 12 operable to lock or unlock the incubator assembly 1, thus laying the foundation for subsequent rapid oxygen reduction and temperature equalization.
[0030] The track assembly 2 is arranged in the enclosed space along the first preset direction X, with one end exposed to the temperature chamber assembly 1 via the track opening 11. The exposed end of the track assembly 2 can directly connect to the feeding mechanism (such as a conveyor belt, sorting head, etc.) provided on the sorting machine body 200, without the need for an additional transfer platform. In other words, the exposed end of the track assembly 2 is used for loading and unloading materials. In this application, there are at least two track assemblies 2, and the first preset direction X can be along the length of the track assembly 2. At least two track assemblies 2 are arranged side-by-side in the enclosed space at a preset interval along the second preset direction Y. The second preset direction Y can be along the length of the top chamber wall 10a. The first preset direction X and the second preset direction Y are perpendicular to each other. The preset interval can be set according to the scale of the feeding mechanism. It is understood that the number and position of the track openings 11 provided on the top chamber wall 10a can be customized according to the arrangement of each track assembly 2. For example, the number of track openings 11 is equal to the number of track assemblies 2, and they are arranged side-by-side on the top chamber wall 10a at a preset interval along the second preset direction Y. The working principle and structural dimensions of a single track component 2 in this application are completely consistent with those of multiple single track components 2. Therefore, testing efficiency can be improved by adding track components 2. The following example uses two track components 2, and the two track components 2 are the same track component 2.
[0031] Please refer to Figure 3 This is an exploded view of the track assembly provided in the embodiments of this application. Each track assembly 2 includes a track body 21 and two air-blowing plates 22. The track body 21 is generally in the shape of a flat square tube. The interior of the track body 21 has a through-type support channel. The support channel is used to support several chips. Specifically, the track body 21 includes two side walls, a bottom rail 211, and a cover plate 212. The length direction of the bottom rail 211 is parallel to a first preset direction X, and the two side walls are arranged parallel to the first preset direction X and are located on both sides of the bottom rail 211 along a second preset direction Y, forming a U-shaped structure together with the bottom rail 211. The cover plate 212 is fastened to the top of the side wall and covers the bottom rail 211, and can be fixedly connected to the side wall to close the U-shaped structure into a complete support channel. More specifically, the cover plate 212 is arranged facing the front box wall 10b, which facilitates observation and maintenance through locking and unlocking the temperature box door 12. Figure 11 As shown, the bottom rail 211 is positioned facing the rear chamber wall 10c. A heat insulation pad 2114 is provided on the side of the bottom rail 211 facing the rear chamber wall 10c to create a gap between the rail assembly 2 and the chamber assembly 1, thereby preventing heat leakage to the chamber assembly 1. Two air-blowing plates 22 are respectively installed on different side walls through fittings adapted to side-by-side fixing holes 220, and are respectively connected to the load-bearing channel. The fixing holes 220 include, but are not limited to, through holes and threaded holes. Correspondingly, the fixings include, but are not limited to, screws and bolts.
[0032] Furthermore, such as Figure 4As shown, the cover plate 212 has multiple vent holes 2121 spaced apart along a first preset direction X. These vent holes 2121 are arranged side-by-side along the first preset direction X to allow air to flow with the anti-oxidation gas and exit from the enclosed space through the track opening 11. The shape and number of the vent holes 2121 in this application can be customized according to the exhaust requirements, and each vent hole 2121 can be the same or different.
[0033] Gas heating components 3 are connected to two air blowing plates 22 respectively, and are used to continuously supply heated anti-oxidation gas to the two air blowing plates 22. The anti-oxidation gas can be nitrogen or an inert gas, so as to form an air curtain in the bearing channel to quickly expel air and prevent oxygen backflow. In this application, the anti-oxidation gas flows into the bearing channel through multiple air holes to expel the air in the bearing channel from the enclosed space through the track opening 11, and to uniformly heat several chips by conducting heat to the track body 21, so as to achieve the dual effect of isothermal heating and anti-oxidation. The following will further explain how to achieve anti-oxidation of chips while providing the same temperature environment by describing the structural features of the track body 21 and the air blowing plates 22.
[0034] like Figures 5-7 As shown, both sidewalls are spaced apart by multiple air holes that connect to the carrying channel. That is, multiple air holes are located on the bottom rail 211. These multiple air holes include multiple first air holes 2111 and multiple second air holes 2112. The multiple first air holes 2111 face the air blowing plate 22 and are spaced apart on each sidewall at a first interval, used to receive anti-oxidation gas from the air blowing plate 22. The multiple second air holes 2112 are arranged in a second-interval array on the side of the bottom rail 211 facing the cover plate 212, used to evenly introduce the anti-oxidation gas into the carrying channel. The first interval is greater than the second interval. The bottom rail 211 is provided with an airflow channel 2113 connecting the first air holes 2111 and the second air holes 2112, so that the anti-oxidation gas flows into the carrying channel through the airflow channel 2113 and evenly distributes heat to the bottom rail 211, thereby evenly distributing heat to several chips through the bottom rail 211. In this application, the multiple second vents 2112 arranged in a second-spacing array can be arranged in two rows at equal intervals along a first preset direction X on the side of the bottom rail 211 facing the cover plate 212. The airflow channel 2113 can be designed with a constant cross-section to ensure uniform distribution of the anti-oxidation gas within the airflow channel 2113. The two sidewalls are opened with first vents 2111 at a larger first spacing to form a wide inlet area, which reduces the pressure of the anti-oxidation gas and distributes it evenly. Subsequently, the anti-oxidation gas enters the airflow channel 2113, and the second vents 2112 are densely arranged with a smaller second spacing on the side facing the cover plate 212 to form a dense outlet area, so as to convert the concentrated jet into a low-speed laminar flow, so that the heat is spread evenly along the bottom rail 211, and the chips are heated synchronously, avoiding local overshoot, thereby simultaneously obtaining temperature balance and continuous low oxygen protection.
[0035] like Figures 8-10 As shown, each air-blowing plate 22 is provided with multiple first air-blowing holes 221 and multiple second air-blowing holes 222. The multiple first air-blowing holes 221 are spaced apart at a third interval on the side of the air-blowing plate 22 facing away from the bottom rail 211, and the multiple second air-blowing holes 222 are spaced apart at a first interval on the side of the air-blowing plate 22 facing the bottom rail 211, corresponding one-to-one with the first air holes 2111 on the corresponding sidewall. The third interval is greater than the first interval. The air-blowing plate 22 is provided with an air-blowing channel 223 connecting the first air-blowing holes 221 and the second air-blowing holes 222. In this application, the first air-blowing holes 221 on the side of the air-blowing plate 22 facing away from the bottom rail 211 are arranged with a larger third interval, allowing the high-speed airflow from the gas heating assembly 3 to be depressurized and buffered firstly; subsequently, the second air-blowing holes 222 on the side of the air-blowing plate 22 facing the bottom rail 211 are densely arranged with a smaller first interval, corresponding one-to-one with the first air holes 2111 on the sidewall, achieving multi-point synchronous outflow. The air blowing channel 223 has a uniform cross-section design, which ensures uniform flow rate and avoids additional pressure loss. Therefore, the anti-oxidation gas achieves pressure and flow uniformity within the air blowing plate 22, entering the bottom rail 211 in a low-speed laminar flow state. The working process of the heating device 100 will be described in general below.
[0036] First, after checking that the temperature chamber assembly 1 and the track assembly 2 are operating normally, the staff locks the temperature chamber door 12 and starts the gas heating assembly 3 to heat the anti-oxidation gas to the process temperature. At this time, the heat insulation pad 2114 blocks heat leakage to the temperature chamber assembly 1, and an initial heat preservation environment is formed inside the temperature chamber. Then, the feeding mechanism pushes the chip into the carrying channel along the first preset direction X. Next, the heated anti-oxidation gas flows sequentially through the air blowing plate 22, the first air hole 2111 on the side wall, and the airflow channel 2113 of the bottom rail 211. After pressure reduction and diversion in the wide inlet area, it turns into a low-speed laminar flow through the second air hole 2112 in the dense outlet area. The gas flows into the carrying channel, forming a diagonal airflow at the exhaust port 2121. Air within the carrying channel, along with the anti-oxidation gas, is continuously discharged through the track opening 11, rapidly establishing a low-oxygen environment within the enclosed space. Subsequently, the anti-oxidation gas exchanges heat thoroughly with the bottom track 211, which conducts heat to each chip, causing them to heat up synchronously and maintain a uniform temperature for subsequent high-temperature electrical testing. Finally, the gas supply is stopped and the chamber door 12 is unlocked. The track assembly 2 extracts or directly pushes out the chips, which are then unloaded by the sorting machine body 200's unloading mechanism, completing the one-time heating process for anti-oxidation. This application achieves a dual improvement in both production capacity and consistency through the parallel operation of multiple track assemblies 2.
[0037] It is understood that this embodiment uses a dual-track main body as an example. In practice, the number of track bodies can be expanded to three-track main bodies, four-track main bodies, etc., depending on the width of the sorting machine main body 200. Only by increasing the number of track openings 11 and maintaining the preset spacing, multiple parallel test channels can be formed within a single sorting machine 1000, thereby improving the test capacity.
[0038] In some feasible embodiments, the temperature chamber assembly 1 is also equipped with an oxygen analyzer and a temperature feedback interface. The oxygen analyzer is used to monitor the oxygen concentration in the enclosed space in real time. When the oxygen concentration is higher than a set threshold, the flow rate can be automatically adjusted by the gas heating assembly 3 to extend the purging time. Similarly, the track body 21 is embedded with several thermocouples to feed back the measured temperature to the gas heating assembly 3 through the temperature feedback interface to achieve temperature control.
[0039] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.
[0040] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between devices or units through some interfaces, and may be electrical, mechanical, or other forms.
[0041] The unit described as a separate component may or may not be physically separate. The component shown as a unit may or may not be a physical unit; that is, it may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0042] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist independently, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.
[0043] In the above embodiments, the enclosed space provided by the temperature chamber, together with the air blowing plates and multiple air holes on both sides of the track assembly, allows the heated anti-oxidation gas to enter the bearing channel evenly through the airflow channel of the bottom rail. While exhausting the air, heat is conducted to the track body, achieving isothermal heating of the chip. By utilizing the exhaust vents, heat insulation pads, temperature chamber door, and parallel multi-track assembly, a low-oxygen environment is simultaneously ensured, heat loss is reduced, and parallel testing is carried out, thereby improving test consistency, yield, and production capacity.
[0044] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
[0045] The above-listed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.
Claims
1. A heating device that realizes oxidation prevention, characterized by, The heating device comprises: a temperature box assembly, which is formed by a box wall to form a closed space, the box wall comprises a top box wall located at the top of the temperature box assembly, and the top box wall is provided with a track opening; a track assembly, which is arranged in a first preset direction in the closed space and has one end exposed to the temperature box assembly through the track opening for feeding and discharging; the track assembly comprises a track main body and two blowing plates; the inside of the track main body is provided with a bearing channel for bearing a plurality of chips; the track main body comprises two side walls parallel to the first preset direction, and the two blowing plates are respectively mounted on different side walls; the two side walls are both provided with a plurality of air holes spaced apart and communicating with the bearing channel; and a gas heating assembly, which is used for continuously providing heated antioxidant gas to the two blowing plates, the antioxidant gas flows into the bearing channel through the plurality of air holes to discharge the air in the bearing channel from the closed space through the track opening, and conducts heat to the track main body to uniformly heat the plurality of chips.
2. The heating device of claim 1, wherein The track main body further comprises a bottom rail and a cover plate, and the cover plate is covered above the bottom rail to jointly form the bearing channel with the two side walls. The two side walls are located on the bottom rail.
3. The heating device of claim 2, wherein, The cover plate is provided with a plurality of exhaust holes spaced apart in the first preset direction, and the plurality of exhaust holes are used for discharging the air from the closed space through the track opening along with the flow of the antioxidant gas.
4. The heating device of claim 2, wherein The plurality of air holes are arranged on the bottom rail and comprise a plurality of first air holes and a plurality of second air holes, the plurality of first air holes are arranged at a first interval on each side wall, the plurality of second air holes are arranged on one side of the bottom rail facing the cover plate at a second interval, and the first interval is greater than the second interval; the bottom rail is provided with an air flow channel communicating the first air holes and the second air holes, so that the antioxidant gas flows into the bearing channel through the air flow channel and uniformly distributes the heat to the bottom rail.
5. The heating device of claim 4, wherein Each blowing plate is provided with a plurality of first blowing holes and a plurality of second blowing holes, the plurality of first blowing holes are arranged at a third interval on one side of the blowing plate away from the bottom rail, the plurality of second blowing holes are arranged at the first interval on one side of the blowing plate facing the bottom rail and correspond to the first air holes of the corresponding side wall one by one, and the third interval is greater than the first interval; the blowing plate is provided with a blowing channel communicating the first blowing holes and the second blowing holes.
6. The heating device of claim 2, wherein The box wall further comprises a front box wall and a rear box wall arranged oppositely, and the front box wall is provided with a temperature box door which is operable to lock or unlock the temperature box assembly to make the closed space in a closed state or an open state.
7. The heating device of claim 6, wherein The cover plate faces the front box wall, and one side of the bottom rail facing the rear box wall is provided with a heat insulation pad to make the track assembly and the temperature box assembly have a gap.
8. The heating device of claim 1, wherein, The antioxidant gas is nitrogen or inert gas.
9. A test handler characterized by, The test handler comprises: a handler main body; and the oxidation-preventing heating device as claimed in any one of claims 1-8 arranged on the handler main body.
10. The test handler of claim 9 wherein, The track assemblies are at least two, and the at least two track assemblies are arranged side by side along a second preset direction at a preset interval in the closed space, and the first preset direction and the second preset direction are perpendicular to each other.