Structural member, light-emitting substrate, backlight module and display device

Abstract

A structure. The structure includes two main body parts, a connecting part and two first binding parts. The two main body parts each extend along a first direction and have a first interval along a second direction. Each of the main body parts includes a plurality of first electronic elements arranged at intervals along the first direction. The connecting part extends along the second direction, and two ends of the connecting part are connected to ends of the two main body parts on the same side, respectively. The two binding parts are connected to ends of the two main body parts away from the connecting part, respectively, and the first binding parts are configured to be connected to a connector.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a structural component, a light-emitting substrate, a backlight module, and a display device. Background Technology

[0002] With the development of LED technology, backlight modules using Mini-LEDs and Micro-LEDs have been widely adopted. Mini-LEDs are approximately 100μm to 300μm in size, while Micro-LEDs are less than 100μm. Due to their small size, high brightness, and high contrast, Mini-LEDs and Micro-LEDs, when used in backlight modules, allow for multiple dimming zones and fine-tuning of each zone, enabling the display of High Dynamic Range (HDR) images, thus attracting increasing attention. Summary of the Invention

[0003] On one hand, a structural component is provided. The structural component includes two main body portions, a connecting portion, and two first binding portions. The two main body portions extend along a first direction and are spaced apart along a second direction. Each main body portion includes a plurality of first electronic components spaced apart along the first direction. The connecting portion extends along the second direction, and its two ends are respectively connected to the ends of the two main body portions located on the same side. The two binding portions are respectively connected to the ends of the two main body portions away from the connecting portion, and the first binding portions are configured to connect to a connector.

[0004] In some embodiments, the spacing between two adjacent first electronic components along the second direction is D. y The dimension of the main body along the second direction is D2. Wherein, D... y And D2 satisfies: D y =3D² + 3M; the value of M ranges from 0 to 2 mm.

[0005] In some embodiments, the spacing between two adjacent first electronic components along the second direction is D. y The dimension of the main body along the second direction is D2. Wherein, D... y And D2 satisfies: D y =2D² + 2M; the value of M ranges from 0 to 2 mm.

[0006] In some embodiments, the structural component is an aluminum-based structural component.

[0007] On the other hand, a light-emitting substrate is provided. The light-emitting substrate includes a back plate and at least one structural component group disposed on the back plate. The structural component group includes a plurality of first structural components, a plurality of first connectors, a plurality of second structural components, and a plurality of second connectors. The plurality of first structural components include the structural components described in any of the above embodiments. The plurality of first structural components are spaced apart on the back plate along a second direction, and each first structural component has a first opening. Each first binding portion of each first structural component is connected to a first connector. The plurality of second structural components include the structural components described in any of the above embodiments. The plurality of second structural components are spaced apart on the back plate along the second direction, and each second structural component has a second opening, the direction of which is opposite to the direction of the first opening. Each first binding portion of the second structural component is connected to a second connector. Two first connectors that are respectively connected to two adjacent first structural components and have the smallest distance along the second direction are respectively connected to two second connectors connected to the same second structural component. Two second connectors that are respectively connected to two adjacent second structural components and have the smallest distance along the second direction are respectively connected to two first connectors connected to the same first structural component.

[0008] In some embodiments, the number of the first structural members is one more than the number of the second structural members. The structural member group further includes two third structural members and an outgoing connector. The two third structural members are respectively located on both sides of the plurality of second structural members along the second direction, and both third structural members extend along the first direction. Each third structural member has a second binding portion at its end near the first structural member and a third binding portion at its end away from the first structural member. The second binding portion is connected to the second connector, and is also connected via the second connector to the second connector located on the outermost side of the plurality of first structural members in the second direction. The outgoing connector is connected to the third binding portion.

[0009] In some embodiments, the number of the second structural members is one more than the number of the first structural members. The structural member group further includes two third structural members and an outgoing connector. The two third structural members are respectively located on both sides of the plurality of first structural members along the second direction, and each third structural member extends along the first direction. Each third structural member has a second binding portion at its end near the second structural member and a third binding portion at its end away from the second structural member. The second binding portion is connected to the first connector and, through the first connector, to the second connector located on the outermost side of the plurality of second structural members in the second direction. The outgoing connector is connected to the third binding portion.

[0010] In some embodiments, the third structural member includes a plurality of second electronic elements spaced apart along the first direction. The spacing between two adjacent second electronic elements is equal to the spacing between two adjacent first electronic elements in the first structural member and the second structural member.

[0011] In some embodiments, the third structural member is an aluminum-based structural member, and the outgoing connector and the second electronic component are disposed on the surface of the third structural member away from the back plate.

[0012] In some embodiments, the third structural member is an epoxy board structural member, the second electronic component is disposed on the surface of the third structural member away from the back plate, and the outgoing connector is disposed on the surface of the third structural member close to the back plate. The back plate includes a plurality of clearance holes, and each outgoing connector is disposed within one of the clearance holes.

[0013] In some embodiments, the light-emitting substrate further includes a driving circuit board and a circuit board. The driving circuit board is disposed on the surface of the back plate away from the third structural member. One end of the circuit board is connected to the driving circuit board, and the other end is connected to the outgoing connector.

[0014] In some embodiments, the light-emitting substrate includes a plurality of structural member groups arranged along the second direction. A plurality of third structural members, each belonging to a different structural member group, are spaced apart along the second direction.

[0015] In some embodiments, the first electronic component and the second electronic component of the first and second structural components are both light-emitting elements. The angle between the maximum emission angle of the light-emitting element and the normal direction of the light-emitting element is α. The thickness of the first connector is T1, and the distance between the first connector and the light-emitting element closest to the first connector in the first direction is L1, where T1 ≤ L1 × tan(90° - α). The thickness of the second connector is T2, and the distance between the second connector and the light-emitting element closest to the second connector in the first direction is L2, where T2 ≤ L2 × tan(90° - α).

[0016] In another aspect, a backlight module is provided. The backlight module includes a driving circuit board and a light-emitting substrate as described in any of the above embodiments. The first electronic component of the first structural member and the second electronic component of the second structural member of the light-emitting substrate, as well as the second electronic component of the third structural member, all include light-emitting elements. The driving circuit board is connected to the light-emitting substrate and is configured to transmit control signals to the light-emitting substrate.

[0017] In another aspect, a display device is provided. The display device includes the aforementioned backlight module and display panel. The display panel is disposed on the light-emitting side of the backlight module. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0019] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0020] Figure 2 This is a structural diagram of a display panel according to some embodiments;

[0021] Figure 3A This is a structural diagram of a wiring substrate according to some embodiments;

[0022] Figure 3B This is another structural diagram of a wiring substrate according to some embodiments;

[0023] Figure 4 for Figure 3A A magnified view of a portion of region A in the middle;

[0024] Figure 5 This is yet another structural diagram of a wiring substrate according to some embodiments;

[0025] Figure 6 This is a structural diagram of a structural component according to some embodiments;

[0026] Figure 7 This is a structural diagram of a light-emitting substrate according to some embodiments;

[0027] Figure 8 This is a structural diagram of a third structural member according to some embodiments;

[0028] Figure 9 This is a connection structure diagram of the outgoing connector and the third structural member according to some embodiments;

[0029] Figure 10 This is a diagram illustrating another connection structure between the outgoing connector and the third structural member according to some embodiments;

[0030] Figure 11 This is another structural diagram of a light-emitting substrate according to some embodiments;

[0031] Figure 12 This is a structural diagram of the back side of a light-emitting substrate according to some embodiments;

[0032] Figure 13 for Figure 7 or Figure 11 A cross-sectional view along section line AA. Detailed Implementation

[0033] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0034] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0035] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0036] In describing some embodiments, the terms "coupled" and "connected" and their derivative expressions may be used. The term "connected" should be interpreted broadly; for example, "connected" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0037] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0038] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0039] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0040] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0041] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0042] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0043] It should be understood that when a layer or component is referred to as being on another layer or substrate, it can mean that the layer or component is directly on another layer or substrate, or that there is an intermediate layer between the layer or component and another layer or substrate.

[0044] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0045] Some embodiments of this disclosure provide a display device, which can be any device that displays either moving (e.g., video) or fixed (e.g., still image) text or images.

[0046] For example, the display device may be a mobile phone, wireless device, personal digital assistant (PDA), wearable device, augmented reality (AR) device, virtual reality (VR) device, handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, television monitor, flat panel display, computer monitor, automotive display (e.g., odometer display), cockpit controller and / or display, display of camera view (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, packaging and aesthetic structure (e.g., display of an image of a piece of jewelry), etc.

[0047] In some embodiments, the display device described above may be a liquid crystal display (LCD). See also... Figure 1 When the display device 1000 is a liquid crystal display device, the display device 1000 may include a backlight module 100 and a display panel 200. Of course, the embodiments disclosed herein are not limited to this; the display device 1000 may also include other structures or devices, such as... Figure 1 As shown, the display device 1000 may further include a bezel 300 and a glass cover plate disposed on the display side of the display panel 200. Figure 1 (not shown in the text), etc., as long as the same technical concept as this application is applied, they will not be listed one by one here.

[0048] The display panel 200 has a display side and a non-display side. The display side refers to the side of the display panel 200 used for displaying images. Figure 1 The non-display side refers to the side opposite to the display side of the display panel 200. The backlight module 100 is located on the non-display side of the display panel 200. Figure 2 (Lower side of the display panel 200), the backlight module 100 is used to provide a backlight for the display panel 200.

[0049] See Figure 2 When the display device 1000 is a liquid crystal display device, the display panel 200 can be a liquid crystal display panel. In this case, the display panel 200 may include an array substrate 210, a cell substrate 220, and a liquid crystal layer 230 disposed between the array substrate 210 and the cell substrate 220.

[0050] A thin-film transistor 212 (TFT) and a pixel electrode 213 are disposed on the array substrate 210 on the first substrate 211. The TFT includes an active layer, a source, a drain, a gate, and a gate insulating layer. The source and drain are respectively in contact with the active layer, and the pixel electrode 213 is electrically connected to the drain of the TFT 212.

[0051] like Figure 2 As shown, the array substrate 210 also includes a common electrode 214 disposed on the first substrate 211. The pixel electrode 213 and the common electrode 214 can be disposed on different layers; in this case, as shown... Figure 2 As shown, a first insulating layer 215 is disposed between the pixel electrode 213 and the common electrode 214. When the common electrode 214 is disposed between the film layer containing the thin-film transistor 212 and the pixel electrode 213, as... Figure 2 As shown, a second insulating layer 216 is also provided between the common electrode 214 and the thin-film transistor 212.

[0052] Pixel electrode 213 and common electrode 214 may also be disposed on the same layer (not shown in the figure). In this case, both pixel electrode 213 and common electrode 214 are comb-like structures including multiple strip-shaped sub-electrodes. In other embodiments, common electrode 214 may also be disposed in the cell substrate 220.

[0053] like Figure 2As shown, the cell substrate 220 may include a color filter layer 222 disposed on the second substrate 221. In this case, the cell substrate 220 may also be referred to as a color filter substrate (CF). When the backlight module 100 is used to emit white light, the color filter layer 222 includes at least red photoresist units, green photoresist units, and blue photoresist units, each of which is directly opposite a sub-pixel of the display panel 200. The cell substrate 220 also includes a black matrix pattern 223 disposed on the second substrate 221, which separates the red, green, and blue photoresist units.

[0054] Continue reading Figure 2 The display panel 200 may further include a first polarizer 240 disposed on the side of the cell substrate 220 away from the liquid crystal layer 230, and a second polarizer 250 disposed on the side of the array substrate 210 away from the liquid crystal layer 230. In addition, the display panel 200 may include other films or structures, which will not be listed in detail in the embodiments disclosed herein.

[0055] When the display device is working, the backlight module 100 emits light towards the display panel 200. An electric field can be formed between the pixel electrodes and the common electrode of the display panel. The liquid crystal molecules in the liquid crystal layer 230 are deflected under the action of the electric field, thereby adjusting the brightness (grayscale adjustment) of the light emitted by the backlight module 100. The light passing through the liquid crystal layer 230 is further directed towards the cell substrate 220, colored by the color filter layer 222, and then emitted to achieve image display.

[0056] like Figure 1 As shown, the backlight module 100 may include a light-emitting substrate 110 and an optical film 120 disposed on the side of the light-emitting substrate 110 near the display panel 200. The light-emitting substrate 110 may directly emit white light, or it may emit light of other colors. The light of other colors is converted by the optical film 120 and then directed to the display panel 200. For example, the light-emitting substrate 110 may emit blue light, and the optical film 120 may include a quantum dot film. The quantum dot film converts the blue light emitted by the light-emitting substrate into white light before it is directed to the display panel. The optical film 120 may include a diffuser plate and / or an optical brightness enhancement film, which are not specifically limited in the embodiments of this disclosure. The diffuser plate has scattering and diffusion effects, which can further mix the white light; the optical brightness enhancement film can improve the light extraction efficiency of the backlight module 100. In addition, the backlight module 100 may also include other film layers or structures, which are not listed in the embodiments of this disclosure.

[0057] like Figure 1As shown, the light-emitting substrate 110 includes a back plate 111 and a light source disposed on the back plate 111. The light source includes multiple light-emitting elements 112 (such as Mini-LED chips or Micro-LED chips) arranged in an array. A light-mixing interval H exists between the light-emitting substrate 110 and the optical film 120. The light-emitting elements 112 can be considered equivalent to point light sources. The light emitted by adjacent light-emitting elements 112 undergoes preliminary light mixing within the light-mixing interval H before being incident on the optical film 120. After further homogenization by the optical film 120, the light is incident on the display panel 200. It can be understood that the light ultimately incident on the display panel can be considered equivalent to light emitted from a surface light source.

[0058] In some embodiments, in display products with a large light mixing interval H (e.g., greater than 20 mm), the spacing between adjacent light-emitting elements 112 on the light-emitting substrate 110 is large, and the light-emitting substrate can be formed using a light strip. The light-emitting substrate can be divided into multiple dimming zones, and the brightness of the light-emitting elements in each dimming zone can be finely adjusted. With the number of light-emitting elements in each dimming zone remaining constant, the larger the spacing between the light-emitting elements on the light strip, the larger the area of ​​the dimming zone.

[0059] In related technologies, a light strip may include a U-shaped circuit board, on which multiple light-emitting elements and a first connector are provided. When multiple U-shaped circuit boards are arranged to form a light-emitting substrate, a transition circuit board is also required. The transition circuit board has multiple second connectors, arranged in two columns along a direction perpendicular to the extension direction of the transition circuit board. Each column includes multiple second connectors arranged along the extension direction of the transition circuit board. Along a direction perpendicular to the extension direction of the transition circuit board, U-shaped circuit boards are provided on both sides of the transition circuit board, and the first connectors on the U-shaped circuit boards on both sides are connected to the second connectors on the transition circuit board. The transition circuit board can be connected to an external circuit (such as a driver circuit board) via a flexible printed circuit (FPC). Along a direction perpendicular to the extension direction of the transition circuit board, two pairs of interconnected first and second connectors are included between two adjacent U-shaped circuit boards, resulting in a large spacing between the light-emitting elements on both sides of the transition circuit board, which is not conducive to reducing the area of ​​the dimming zones of the light-emitting substrate.

[0060] To address the aforementioned technical problems, embodiments of this disclosure provide a wiring substrate 2000. It can be used to fabricate structural components. See also... Figure 3A and Figure 4 The wiring substrate 2000 includes a substrate 2100, which includes a first region 30 and a second region 40. Wherein, Figure 3A In order to clearly show the boundaries and positions of the first area 30 and the second area 40, different types of fill patterns are used for the two.

[0061] The substrate 2100 can be made of any of the following materials: glass, quartz, sapphire, ceramic, etc.; or a semiconductor material, such as any of the following: single-crystal semiconductor substrates or polycrystalline semiconductors based on silicon or silicon carbide, compound semiconductors such as silicon-germanium, SOI (Silicon on Insulator); or an organic resin material including epoxy resin, triazine, silicone resin, or polyimide. The substrate 2100 can also be an epoxy board (FR4) type printed circuit board (PCB), or a flexible PCB that is easily deformable; or a ceramic material including silicon nitride (AlN) or Al2O3, or a metal or metal compound, or any of the following: metal core printed circuit board (MCPCB) or metal copper clad laminate (MCCL).

[0062] The first region 30 includes two first main regions 31, a first connecting region 32, and two first binding regions 33. Both first main regions 31 extend along a first direction X and have a second interval D5 along a second direction Y; wherein the second interval D5 refers to the distance between the two first main regions 31 in the second direction Y. The ends of the first connecting region 32 are respectively located on the same side as the ends of the two first main regions 31 (e.g., ...). Figure 3A The left end of the first connection area 32 is connected to the two first bonding areas 33 respectively. Each first bonding area 33 is configured to connect to a first connector. The first region 30 forms a U-shaped structure and has a third opening 34, which refers to the area between the two first main regions 31. The orientation of the third opening 34 is away from the first connection area 32. Figure 3A The direction from left to right. The first direction X and the second direction Y intersect each other; for example, the first direction X and the second direction Y are perpendicular to each other.

[0063] The second region 40 includes two second main regions 41, a second connecting region 42, and two second binding regions 43. Both second main regions 41 extend along a first direction X and have a third interval D6 along a second direction Y; wherein the third interval D6 refers to the distance between the two second main regions 41 in the second direction Y. The ends of the second connecting region 42 are respectively located on the same side as the ends of the two second main regions 41 (e.g., ...). Figure 3AThe two second bonding areas 43 are respectively connected to the ends of the two second main branches 41 that are away from the second connecting area 42. Each second bonding area 43 is configured to connect to a second connector. The second region 40 forms a U-shaped structure and has a fourth opening 44, which refers to the area between the two second main branches 41. The orientation of the fourth opening 44 is away from the second connecting area 42, i.e. Figure 3A The direction from right to left.

[0064] like Figure 3A As shown, the orientation of the fourth opening 44 ( Figure 3A Along the first direction X from right to left), and the orientation of the third opening 34 ( Figure 3A The first main region 31 is positioned opposite to the second main region 42 along the first direction X (from left to right) so that it can extend into the fourth opening 44 and the second main region 42 can extend into the third opening 34. For example, two first main regions 31 belonging to two adjacent first regions 30 and having the smallest distance along the second direction Y are located in the fourth opening 44 of the same second region 40; two second main regions 41 belonging to two adjacent second regions 40 and having the smallest distance along the second direction Y are located in the third opening 34 of the same first region 30. Based on this, it is beneficial to increase the space utilization of the substrate 2100. A wiring substrate 2000 can be cut to form multiple structural components, and any one of the first regions 30 and any one of the second regions 40 is used to form an independent structural component (such as a structural component that can be used as a light source). Each first region 30 and each second region 40 is a U-shaped structure.

[0065] In some embodiments, see Figure 3A The dimension D3 of the first main section 31 along the first direction X is equal to the dimension D4 of the second main section 41 along the first direction X. And / or, see [reference needed]. Figure 4 The dimension of the first main region 31 along the second direction Y is equal to the dimension of the second main region 41 along the second direction Y, and the dimensions of both the first main region 31 and the second main region 41 along the second direction Y are D2. This allows for the formation of a first main region 31 and a second main region 41 of identical size and shape. The first main region 31 and the second main region 41 are used to house a first electronic component 50, which may be, for example, a light-emitting element, a sensor, or other arrayed components. The identical size and shape of the first main region 31 and the second main region 41 improves the uniformity of the arrangement of the first electronic component 50 on the first main region 31 and the second main region 41.

[0066] It is understandable that, when the first electronic component 50 is a light-emitting element, the structural component formed by cutting the wiring substrate 2000 is a light-emitting structural component. In terms of the type of light-emitting element, it can be an LED with a quantum well junction, an LED with a columnar structure, an LED with a double heterojunction, etc. The light-emitting element can also include a packaging structure on the light-emitting side of the LED. The packaging structure can be made of transparent material, and its surface can be curved or hemispherical. In terms of the size of the light-emitting element, it can be a structure miniaturized to the scale of hundreds of micrometers. For example, the light-emitting area of ​​the LED in the light-emitting element can be 1 mm². 2 Alternatively, the light-emitting area of ​​an LED can be 10000μm. 2 Alternatively, the light-emitting area of ​​an LED can be 3000μm. 2 Below, the light-emitting area of ​​an LED can be 700μm. 2 The following is a summary of the embodiments disclosed herein. Of course, the embodiments disclosed herein are not limited to these, and other light-emitting elements may also be used, as long as the same technical concept as this application is applied.

[0067] In some embodiments, such as Figure 3A As shown, the second interval D5 is equal to the third interval D6. In this way, a first region 30 and a second region 40 with the same size and shape can be formed, so that the structural components formed by the first region 30 and the second region 40 can have the same shape, thereby improving the consistency and versatility of the structural components.

[0068] For example, the dimension of the first connection area 32 of the first region 30 along the first direction X is equal to the dimension of the second connection area 42 of the second region 40 along the first direction X. Furthermore, since the second interval D5 is equal to the third interval D6, the dimension of the first connection area 32 of the first region 30 along the second direction Y is equal to the dimension of the second connection area 42 of the second region 40 along the second direction Y. Thus, the first trunk area 31 of the first region 30 can be completely located within the fourth opening 44 of the second region 40, and the second trunk area 42 of the second region 40 can be completely located within the third opening 34 of the first region 30. This improves the space utilization within the third opening 34 and the fourth opening 44, thereby increasing the space utilization of the wiring substrate 2000 and reducing the manufacturing cost of the wiring substrate 2000.

[0069] In some embodiments, such as Figure 3A and Figure 4As shown, the second interval D5 is greater than twice the dimension D2 of the second main region 41 along the second direction, and less than or equal to 2.5 times the dimension D2 of the second main region 41 along the second direction Y. That is, 2D2 < D5 ≤ 2.5D2. At this time, the two second main regions 41 of the second region 40 are respectively located in the fourth openings 44 of two adjacent first regions 30, and only two second main regions 41 are set in each fourth opening 44.

[0070] The third interval D6 is greater than twice the dimension D2 of the first main region 31 along the second direction Y, and less than or equal to 2.5 times the dimension D2 of the first main region 31 in the second direction, i.e., 2D2 < D6 ≤ 2.5D2. At this time, the two first main regions 31 of the first region 30 are respectively located in the fourth opening 44 of two adjacent second regions 40, and two first main regions 31 of two adjacent first regions 30 are provided in one fourth opening 44. That is to say, two first main regions 31 can be set in each fourth opening 44.

[0071] The condition 2D2<D5≤2.5D2 and 2D2<D6≤2.5D2 not only allows two adjacent second main areas 41 belonging to two second regions 40 to be placed in the same third opening 34, but also allows two adjacent first main areas 31 belonging to two first regions 30 to be placed in the same fourth opening 44. It also facilitates setting an interval between the first main area 31 and the second main area 41 so that the first region 30 and the second region 40 can be separated from each other at the interval between the first main area 31 and the second main area 41.

[0072] like Figure 3A As shown, the substrate 2100 includes a plurality of first regions 30 arranged sequentially along the second direction Y, and a plurality of second regions 40 arranged sequentially along the second direction Y. Two first backbone regions 31, belonging to two adjacent first regions 30 and having the smallest distance along the second direction Y, are located within a fourth opening 44 of the same second region 40. Two second backbone regions 41, belonging to two adjacent second regions 40 and having the smallest distance along the second direction Y, are located within a third opening 34 of the same first region 30. This allows the second backbone regions 41 to be positioned using the third opening 34 and the first backbone regions to be positioned using the fourth opening 44, which improves the space utilization of the wiring substrate 2000.

[0073] like Figure 3AAs shown, when two first main regions 31 belonging to two adjacent first regions 30 and having the smallest distance along the second direction Y are located within the fourth opening 44 of the same second region 40; and when two second main regions 41 belonging to two adjacent second regions 40 and having the smallest distance along the second direction Y are located within the third opening 34 of the same first region 30, in order to maximize the use of the space of the substrate 2100, a third region 70 can be provided between the first region 30 and the second region 40 closest to the edge along the second direction Y, and the third region is located between the first main region 31 and the second main region 41 closest to the edge along the second direction Y. The third region 70 is connected to the first region 30 and to the second region 40 by a connecting structure 62. A through hole 61 is provided between two adjacent connecting structures 62 to reduce the connection area between the third region 70 and the first region 30 and between the third region 70 and the second region 40, so as to facilitate the subsequent separation of the third region 70 from the first region 30 and the second region 40.

[0074] For example, the two outermost regions of the substrate 2100 along the second direction Y can be either a first region 30 or a second region 40. For instance, as... Figure 3A As shown, the upper and lower sides of the substrate 2100 along the second direction Y are both the first region 30, or, as... Figure 3B As shown, the upper side of the substrate 2100 along the second direction Y is the first region 30, and the lower side is the second region 40. Of course, both sides of the substrate 2100 along the second direction Y can also be the second region 40 (not shown in the figure); or the upper side is the second region 40, and the lower side is the first region 30 (not shown in the figure).

[0075] Continue reading Figure 3A and Figure 4Each adjacent first region 30 and second region 40, adjacent first region 30 and third region 70, adjacent first region 30 and first region 30, adjacent second region 40 and second region 40, and adjacent second region 40 and third region 70 includes multiple through holes 61. A connecting structure 62 is included between two adjacent through holes 61. The connecting structure 62 is used to connect and fix adjacent first regions 30 and second region 40, adjacent first regions 30 and third region 70, adjacent first regions 30 and first region 30, adjacent second regions 40 and second region 40, and adjacent second region 40 and third region 70. The connecting structure 62 connects the first region 30, second region 40, and third region 70 to form a whole, which is beneficial for setting wiring layers on the first region 30 and second region 40 of the substrate 2100 during the wiring substrate fabrication process. The connecting structures 62 penetrate the substrate 2100 through the through holes 61, which helps to reduce the contact area between the first region 30, the second region 40 and the third region 70, and facilitates the separation of the first region 30 and the second region 40 in the subsequent fabrication process to form independent structural components.

[0076] In some embodiments, such as Figure 3A and Figure 4 As shown, each first main section 31 of the first region 30 and each second main section 41 of the second region 40 are provided with a plurality of first electronic components 50 at intervals along a first direction X. Exemplarily, the first electronic components 50 are disposed at the midpoint of the first main section 31 along a second direction Y and the midpoint of the second main section 41 along the second direction Y. The width of the connecting structure 62 along the direction perpendicular to the boundary of the first region 30 or the second region 40 connected to the connecting structure 62 is M.

[0077] For example, along the extending direction of the edge of the first region 30 or the second region 40, the length of the through hole 61 is greater than the length of the connecting structure 62. Along the direction perpendicular to the edge of the first region 30 or the second region 40 where the connecting structure 62 is located, the width of the connecting structure 62 is M, which can be 1mm to 2mm. For instance, within the interval between the first main region 31 and the second main region 32 along the second direction Y, the width M of the connecting structure 62 along the second direction Y ranges from 0 to 2mm; within the interval between the first main region 31 and the second main region 32 along the first direction X, the width M of the connecting structure 62 along the first direction X ranges from 0 to 2mm. For example, the width M of the connecting structure 62 is 1mm, 1.5mm, or 2mm, etc.

[0078] Wherein, the line connecting the geometric centers of multiple first electronic components 50 located in any first main region 31 or second main region 41 coincides with the midline of the first main region 31 or second main region 41 along the first direction X. And Dy D2 and M satisfy D2 = (D y -3M) / 3, or in other words, D y =3D² + 3M. For example... Figure 4 As shown, the distance between two adjacent first electronic components 50 on two first trunk areas 31 belonging to the same first region 30 along the second direction Y is equal to the sum of the dimensions of one first trunk area 31 along the second direction Y (2×(1 / 2×D2)), the dimensions of the two second trunk areas 41 along the second direction Y (2×D2), and the dimensions of the three connecting structures 62 along the second direction Y (3M).

[0079] The spacing between two adjacent first electronic components 50 along the first direction X on two first main regions 31 belonging to the same first region 30 is also D. x Alternatively, the interval between two adjacent first electronic components 50 along the first direction X on two second main regions 41 belonging to the same second region 40 is also D. x Furthermore, the distribution density of the first electronic component 50 in the first direction X and the second direction Y can be made the same, i.e., D x＝ D y Of course, the distribution density of the first electronic component 50 in the first direction X and the second direction Y may also be different, and this disclosure does not limit this.

[0080] like Figure 3A and Figure 4 As shown, each first main trunk area 31 of the first region 30 and each second main trunk area 41 of the second region 40 are provided with multiple driving elements 51. The driving elements 51 are configured to control at least one first electronic element 50 in the same region (e.g., the same first main trunk area 31 or the same second main trunk area 42). For example, when the first electronic element 50 is a light-emitting element (e.g., a Mini-LED chip), the driving element 51 can be a micro-integrated circuit chip. One driving element 51 can control multiple light-emitting elements. These multiple light-emitting elements can be connected in series, in parallel, or in a combination of series and parallel, or each of the multiple light-emitting elements can be independent. No specific limitation is made here.

[0081] In some embodiments, such as Figure 4 As shown, each first backbone area 31 of the first region 30 and each second backbone area 41 of the second region 40 are provided with a plurality of fixing holes 52. The fixing holes 52 are used to fix the structural components formed by the wiring substrate 2000 to other components, such as fixing the structural components to the backplane. The wiring substrate also includes encapsulating adhesive (not shown in the figure), and each encapsulating adhesive covers a first electronic component 50 to protect the first electronic component 50.

[0082] In other embodiments, see Figure 5 The second interval D5 is greater than the dimension D2 of the second main area 41 along the second direction Y, and less than or equal to 1.5 times the dimension D2 of the second main area 41 along the second direction Y, i.e., D2 < D5 ≤ 1.5D2. At this time, one second main area 41 of the second region 40 is located within the third opening 34 of a first region 30, and the other second main area 41 is located between two adjacent first regions 30. That is to say, only one second main area 41 is set in each third opening 34.

[0083] The third interval D6 is greater than the dimension D2 of the first main section 31 along the second direction Y, and less than or equal to 1.5 times the dimension D2 of the first main section 31 in the second direction, i.e., D2 < D6 ≤ 1.5D2. At this time, one first main section 31 of the first region 30 is located within the fourth opening 44 of a second region 40, and the other first main section 31 is located between two adjacent second regions 40. That is to say, only one first main section 31 is set in each fourth opening 44.

[0084] The condition D2<D5≤1.5D2 and D2<D6≤1.5D2 not only allows a second main area 41 to be set in the third opening 34 and a first main area 31 to be set in the fourth opening 44, but also facilitates setting an interval between the first main area 31 and the second main area 41, which is beneficial for subsequently separating the first region 30 and the second region 40 from the interval between the first main area 31 and the second main area 41.

[0085] In other embodiments, see Figure 5 The line connecting the geometric centers of multiple first electronic components 50 located in any first main region 31 or second main region 41 coincides with the midline of the first main region 31 or second main region 41 along the first direction X, and D y D2 and M satisfy D2 = (D y -2M) / 2, or in other words, D y = 2D² + 2M. For example... Figure 5 As shown, the distance between two adjacent first electronic components 50 along the second direction Y on two first main regions 31 belonging to the same first region 30 is also D. y It is equal to the sum of the dimensions of a first main section 31 along the second direction Y (1 / 2×D2), the dimensions of a second main section 41 along the second direction Y D2, and the dimensions of the two connecting structures 62 along the second direction Y (2M).

[0086] The dimensions of the first main region 31 and the second main region 41 along the second direction Y are both D2. Thus, the spacing between two adjacent first electronic components 50 along the second direction Y on the two first main regions 31 belonging to the same first region 30 is also D. y Alternatively, the interval between two adjacent first electronic components 50 along the second direction Y on two second main regions 41 belonging to the same second region 40 is also D. y This ensures that the distribution density of the first electronic component 50 is the same in the first direction X and the second direction Y.

[0087] For example, see Figure 5 The adjacent first region 30 and second region 40 include multiple through holes 61, and adjacent through holes 61 include a connecting structure 62. The connecting structure 62 is used to connect and fix adjacent first regions 30 and second regions 40. The connecting structure 62 connects the first region 30 and second region 40 into a whole, which is beneficial for wiring on the first region 30 and second region 40 of the substrate 2100 during the wiring substrate fabrication process. The connecting structures 62 penetrate the substrate 2100 through the through holes 61, which helps to reduce the contact area between the first region 30 and second region 40, and facilitates the separation of the first region 30 and second region 40 in subsequent fabrication processes to form independent structural components. The multiple through holes 61 and the multiple connecting structures 62 together constitute a fourth region 60, which separates two adjacent first regions 30 and / or second regions 40, so that any first region 30 and any second region 40 can be divided from the fourth region 60 to form independent structural components.

[0088] Embodiments of this disclosure also provide a structural component 3000. See also... Figure 6 The structural component 3000 can be formed by cutting the wiring substrate described in any of the above embodiments, wherein any first region 30 and any second region 40 on the wiring substrate independently form a structural component.

[0089] The structural component 3000 may include two main body portions 310, a connecting portion 320, and two first binding portions 330. Both main body portions 310 extend along a first direction X and have a first interval D7 along a second direction Y. Each main body portion 310 includes a plurality of first electronic components 50 spaced apart along the first direction X. The connecting portion 320 extends along the second direction Y, and its two ends are respectively located on the same side as the two main body portions 310 (e.g., ...). Figure 6 The two first binding portions 330 are respectively connected to the ends of the two main body portions 310 away from the connecting portion 320. Figure 6The left end of the component is connected, and the first binding part 330 is configured to connect with the connector. That is, the structural component 3000 is a U-shaped structural component. Compared with a straight structural component, when the U-shaped structural component is assembled to form a light-emitting substrate, the use of connectors can be reduced, thereby reducing the manufacturing cost of the light-emitting substrate.

[0090] like Figure 6 As shown, the main body 310 also includes a plurality of driving elements 51 and fixing holes 52. The driving elements 51 are used to drive at least one first electronic element 50 in the same area (e.g., the same main body 310). The fixing holes 52 are used to fix the structural member 3000 to other components, such as fixing the structural member 3000 to the back plate.

[0091] The binding portion 330 of the U-shaped structural component is located at the end of the main body 310 away from the connecting portion 320. When multiple structural components are assembled to form a light-emitting substrate, the multiple structural components can be arranged in an S-shape and connected sequentially by connectors (e.g., Figure 7 As shown, by reducing the spacing between interconnected structural components and the minimum spacing between adjacent first electronic components, the dimming area of ​​the light-emitting substrate can be reduced while keeping the number of first electronic components included in the dimming zone unchanged, thereby improving the dimming accuracy of the light-emitting substrate.

[0092] For example, when the above-described structural member is formed in a first region of the wiring substrate, each first trunk region of the first region forms a main body, a first connection region forms a connection portion, and each first bonding region forms a bonding portion. When the above-described structural member is formed in a second region of the wiring substrate, each second trunk region of the second region forms a main body, a second connection region forms a connection portion, and each second bonding region forms a bonding portion. Since the first region and the second region are the same in size and shape, the structural members formed in the first region and the second region have the same structure.

[0093] In some embodiments, the spacing between two adjacent first electronic elements 50 along the second direction Y is D. y The main body 310 has a dimension D2 along the second direction Y. Wherein, D... y And D2 satisfies: D y =3D2+3M; M ranges from 0 to 2mm. The structural component can be formed by the wiring substrate described in the above embodiment, and the arrangement density of the first and second regions on the wiring substrate can be increased, the space utilization of the wiring substrate can be improved, and the manufacturing cost of the structural component 3000 can be reduced.

[0094] The structural component 3000 can be an aluminum-based structural component. The aluminum-based structural component includes a wiring layer (copper layer) for designing the circuit structure. The circuit structure is electrically connected to the first electronic component 50 and other electronic components (such as the driving element 52) ​​on the structural component 3000, thereby transmitting electrical signals to the first electronic component 50 and other electronic components. Using an aluminum-based structural component helps reduce the manufacturing cost of the structural component 3000.

[0095] See Figure 7 The present disclosure also provides a light-emitting substrate 110. The light-emitting substrate 110 includes a back plate 111 and at least one structural component group 500 disposed on the back plate 111. The structural component group 500 includes a plurality of first structural components 510, a plurality of first connectors 520, a plurality of second structural components 530, and a second connector 540.

[0096] It is understood that the multiple first structural members 510 and the multiple second structural members 530 can all be the structural members described in the above embodiments, that is, the first structural members 510 and the second structural members 530 have the same structure. Figure 7 In this configuration, the first structural component 510 and the second structural component 530 employ different filling patterns, used only to distinguish their arrangement positions. When the structural component 3000 is used to assemble and form the light-emitting substrate 110, the first electronic components 50 included in both the first structural component 510 and the second structural component 530 are both light-emitting elements. The structure and type of the light-emitting elements are described above and will not be repeated here.

[0097] Multiple first structural members 510 are spaced apart on the back plate 111 along the second direction Y. Each first structural member 510 has a first opening 511, and the orientation of the first opening 511 is as follows: Figure 7 From left to right. Each first structural member 510 has a first binding part (not shown) and a first connector 520.

[0098] Multiple second structural members 530 are spaced apart on the back plate 111 along a second direction Y, and multiple first structural members 510 and multiple second structural members 530 are arranged side by side along a first direction X. Each second structural member 530 has a second opening 521, the orientation of which is... Figure 7 From right to left in the middle. Each second structural member 530 has a first binding part 330 and a second connector 540 connected.

[0099] The orientation of the first opening 511 is opposite to that of the second opening 521, so that the first binding portion 330 of the first structural member 510 and the first binding portion 330 of the second structural member 530 are arranged opposite to each other, and the first connector 520 connected to the first structural member 510 and the second connector 540 connected to the second structural member 530 are mutually plugged in. The first structural member 510 and the second structural member 530 are connected by the first connector 520 and the second connector 540, which helps to reduce the assembly difficulty between the first structural member 510 and the second structural member 530 and improve the assembly efficiency. Moreover, only one pair of interconnected first connectors 520 and second connector 540 is needed to connect the first structural member 510 and the second structural member 530. Compared with the prior art, one less pair of interconnected first connectors 520 and second connector 540 can be used between the first structural member 510 and the second structural member 530, which helps to reduce the spacing between the two first electronic components 50 that belong to the first structural member 510 and the second structural member 530 and are closest in distance along the first direction X. Furthermore, based on calculations of connector dimensions of the same size in related technologies, the spacing between the two electronic components 50 can be reduced from 52mm to 34.4mm, which can accommodate light-emitting substrates with smaller light-emitting element spacing. In other embodiments, the spacing between the two electronic components 50 that are closest in distance along the first direction X, belonging to the first structural component 510 and the second structural component 530 respectively, can be reduced by shrinking the size of the first connector 520 and the second connector 540. In this way, the spacing between two adjacent first electronic components 50 can be further reduced without changing other conditions, thus achieving a light-emitting substrate with a smaller element spacing size. Moreover, the first structural component 510 and the second structural component 530 can still be fabricated using aluminum-based structural components, reducing the fabrication cost of the light-emitting substrate.

[0100] It is understandable that, in order to ensure that the distribution density of light-emitting elements on the light-emitting substrate is the same and the luminous intensity of different regions is equal or approximately equal, the aforementioned spacing between the two first electronic elements 50 that belong to the first structural member 510 and the second structural member 530 and are closest in distance along the first direction X, and the spacing D between two adjacent first electronic elements 50 along the first direction X on the first structural member 510 or the second structural member 530, are considered. x Equal; the spacing D between two adjacent first electronic components 50 along the second direction Y on the first structural component 510 or the second structural component 530. yAlong the first direction Y, the intervals between two adjacent first structural members 510 and the two closest first electronic components 50 along the second direction Y, the intervals between two adjacent second structural members 530 and the two closest first electronic components 50 along the second direction Y, and the intervals between adjacent second structural members 530 and third structural members 550 and the closest first electronic components 50 and second electronic components 553 along the second direction Y are equal.

[0101] In some embodiments, the first connector 520 and the second connector 540 may be board-to-board (BTB) connectors. The first connector 520 and the second connector 540, which are connected, have the same number of connection terminals and are mated and fixed by plugging together. Exemplarily, one of the first connector 520 and the second connector 540 is a male connector, and the other is a female connector.

[0102] like Figure 7 As shown, two first connectors 520, which are respectively connected to two adjacent first structural members 510 and have the smallest distance along the second direction Y, are respectively connected to two second connectors 540 that are connected to the same second structural member 530. For example, Figure 7 In the middle, along the top-to-bottom direction, among the four first connectors 520 connected to the first first structural member 510 and the second first structural member 510, the two middle first connectors 520 are respectively connected to the two second connectors 540 connected to the first second structural member 530.

[0103] Two second connectors 540, each connected to two adjacent second structural members 530 and having the smallest distance along the second direction Y, are respectively connected to two first connectors 520 connected to the same first structural member 510. For example, in... Figure 7In the middle, along the top-to-bottom direction, among the four second connectors 540 connected to the first second structural member 530 and the second second structural member 530, the two middle second connectors 540 are respectively connected to the two first connectors 520 connected to the second first structural member 510. In this way, the first structural member 510 and the second structural member 530 with a connection relationship can be connected through only one first connector 520 and one second connector 540, without the need for an adapter circuit board. This helps to reduce the distance between the first structural member 510 and the second structural member 530 along the first direction X, thereby reducing the interval between the two first electronic components belonging to the first structural member 510 and the second structural member 530 that are closest along the first direction, and further reducing the interval between the first electronic components. With the number of first electronic components included in the dimming zone remaining unchanged, the area of ​​the dimming zone can be reduced, and the dimming accuracy of the light-emitting substrate 110 can be improved.

[0104] In some embodiments, such as Figure 7 As shown, the number of first structural components 510 is one more than the number of second structural components 530. The structural component group 500 also includes two third structural components 550 and an outgoing connector 560.

[0105] See Figure 7 and Figure 8 Two third structural members 550 are respectively located on both sides of the plurality of second structural members 530 along the second direction Y, and both third structural members 550 extend along the first direction X. A second binding portion 551 is provided at the end of the third structural member 550 near the first structural member 510, and a third binding portion 552 is provided at the end away from the first structural member 510. The second binding portion 551 is connected to the second connector 540, and is also connected to the first connector 520, which is connected to the plurality of first structural members 510 and located on the outermost side of the second direction Y, through the second connector 540. The outgoing connector 560 is connected to the third binding portion 552. Based on this, the plurality of first structural members 510, the plurality of second structural members 530, and the two third structural members 550 together can form a regularly shaped (e.g., rectangular) light-emitting substrate.

[0106] In other embodiments, such as Figure 11 As shown, the number of second structural components 530 is one more than the number of first structural components 510. The structural component group also includes two third structural components 550 and a cable connector 560.

[0107] See Figure 8 and Figure 11Two third structural members 550 are respectively located on both sides of the plurality of first structural members 510 along the second direction Y, and both third structural members 550 extend along the first direction X. A second bonding portion 551 is provided at the end of the third structural member 550 near the second structural member 530, and a third bonding portion 552 is provided at the end away from the second structural member 530. The second bonding portion 551 is connected to the first connector 520, and is also connected through the first connector 520 to a second connector 540 located on the outermost side of the second direction Y, which is connected to the plurality of second structural members 530. A lead connector 560 is connected to the third bonding portion 552. Based on this, the plurality of first structural members 510, the plurality of second structural members 530, and the two third structural members 550 together can form a regularly shaped (rectangular) light-emitting substrate. It can be understood that the lead connector can be a surface mount connector, and the surface mount connector is soldered to the third bonding portion 552.

[0108] In some embodiments, such as Figure 8 As shown, the third structural component 550 includes a plurality of second electronic elements 553 spaced apart along the first direction X. The spacing between two adjacent second electronic elements 553 is equal to the spacing between two adjacent first electronic elements 50 in the first structural component 510 and the second structural component 530. That is, the distribution density of the second electronic elements 553 is the same as the distribution density of the first electronic elements 50. When the third structural component 550 is used in conjunction with the first structural component 510 and the second structural component 530 to form a light-emitting substrate, it helps to ensure the uniformity of light emission from the light-emitting substrate. The second electronic elements 553 can be light-emitting elements; for example, the second electronic elements 553 and the first electronic elements 50 can be the same type of light-emitting element.

[0109] For example, the dimension of the third structural member 550 along the second direction Y can be the same as the dimension of the main body portion of the structural member 3000 along the second direction Y, that is, the dimension of the third structural member 550 along the second direction Y is D2. Of course, in some other embodiments, the dimension of the third structural member 550 along the second direction Y can also be different from the dimension of the main body portion along the second direction Y. For example, the dimension of the third structural member 550 along the second direction Y is larger than the dimension of the main body portion along the second direction Y, or the dimension of the third structural member 550 along the second direction Y is smaller than the dimension of the main body portion along the second direction Y.

[0110] like Figure 8 As shown, similar to the first structural member 510 and the second structural member 530, the third structural member 550 may further include a plurality of driving elements 51 and mounting holes 52. The driving elements 51 are used to drive at least one second electronic component 553 on the third structural member 550, and the mounting holes 52 are used to mount the third structural member 550 onto a back panel.

[0111] In some embodiments, the third structural member 550 is an aluminum-based structural member, which helps to reduce the cost of the third structural member 550. The aluminum-based structural member includes a wiring layer; based on this, see [reference needed]. Figure 9 The outgoing connector 560 and the second electronic component 553 are disposed on the surface of the third structural member 550 away from the back plate 111.

[0112] In other embodiments, the third structural member 550 is an epoxy board (FR4) structural member, which may include two wiring layers located on opposite sides of the substrate layer, and the two wiring layers can be electrically connected through vias. See also Figure 10 The second electronic component 553 is disposed on the surface of the third structural member 550 away from the back plate 111, and the outgoing connector 560 is disposed on the surface of the third structural member 550 close to the back plate 111. In this way, the outgoing connector 560 can be disposed on the backlight side (away from the second electronic component 553) of the third structural member 550, which can prevent the outgoing connector 560 from blocking the light emitted by the second electronic component 553.

[0113] For example, when the spacing between the second electronic components 553 is small (e.g., 30mm to 50mm), the third structural component 550 can be an epoxy board structure, which can effectively prevent the outgoing connector 560 from blocking the light emitted by the second electronic components 553. When the spacing between the first electronic components 50 is large (e.g., >50mm), the third structural component 550 can be an aluminum-based structure. In this way, the manufacturing cost of the third structural component 550 can be reduced without the outgoing connector 560 blocking the light emitted by the second electronic components 553.

[0114] In some embodiments, at least one of the first structural member 510 and the second structural member 530 is an aluminum-based structural member. For example, both the first structural member 510 and the second structural member 530 are aluminum-based structural members. Compared to using epoxy board-based structural members, the fact that both the first structural member 510 and the second structural member 530 are aluminum-based structural members can reduce the manufacturing cost of the light-emitting substrate.

[0115] See Figure 12 The back panel 111 includes a plurality of clearance holes 101, and each outgoing connector 560 is disposed in a clearance hole 101, which can prevent the outgoing connector 560 from interfering with the back panel 111, and can lead the outgoing connector 560 to the side of the back panel away from the structural component assembly 500.

[0116] Continue reading Figure 12The light-emitting substrate 110 also includes a driving circuit board 570 and a circuit board 580. The driving circuit board 570 is disposed on the surface of the back plate 111 away from the third structural member 550 (structural member group 500). One end of the circuit board 580 is connected to the driving circuit board 570, and the other end is connected to the outgoing connector 560. Exemplarily, the driving circuit board 570 can be a flexible printed circuit (FPC) or a printed circuit board (PCB), and the circuit board 580 can be a flexible flat cable (FFC). The driving circuit board 570 transmits control signals to the structural member group 500 through the circuit board 580 to control the structural member group 500 to emit light.

[0117] In some embodiments, the light-emitting substrate 110 includes a plurality of structural component groups 500 arranged along the second direction Y. Figure 7 The example shown uses a light-emitting substrate 110 comprising two structural component groups 500. It can be understood that the light-emitting substrate 110 may also include one (e.g., Figure 11 As shown, there are any number of structural component groups 500, such as three, five, etc., which will not be listed here. Multiple third structural components 550 belonging to different structural component groups 500 are arranged at intervals along the second direction Y. In this way, the outgoing connectors 560 connected to all structural component groups 500 are arranged in the second direction Y, which helps to reduce the difficulty of setting up the circuit board 580 and the outgoing connectors 560.

[0118] In some embodiments, see Figure 13 The first electronic element 50 and the second electronic element 553 of the first structural component 510 and the second structural component 530 are all light-emitting elements 112. The angle between the maximum emission angle of the light-emitting element and the normal direction N of the light-emitting element is α. The luminous intensity corresponding to the light emitted from the light-emitting element 112 along the normal direction N of its emission surface S is defined as 1, and the luminous intensity of the light emitted along the maximum emission angle in that direction is half the luminous intensity of the light emitted along the normal direction N.

[0119] The thickness of the first connector 520 is T1, and the minimum distance between the first connector 520 and the light-emitting element 112 closest to the first connector 520 is L1. The light-emitting element 112 closest to the first connector 520 is the light-emitting element 112 on the first structural member 510 that is closest to the first bonding portion 330. The minimum distance between the first connector 520 and the light-emitting element 112 refers to the minimum distance between the outlines of the orthographic projections of the first connector 520 and the light-emitting element 112 on the surface of the first structural member 510 away from the back plate 111. Wherein, T1≤L1×tan(90°-α), thus, the obstruction of the light emitted by the first connector 520 to the light-emitting element 112 can be greatly reduced, and the risk of shadows being generated on the light-emitting substrate can be reduced.

[0120] The thickness of the second connector 540 is T2, and the minimum distance between the second connector 540 and the light-emitting element 112 closest to the second connector 540 is L2, where T2≤L2×tan(90°-α). In this way, the obstruction of the light emitted by the second connector 540 to the light-emitting element 112 can be minimized, and the risk of shadows on the light-emitting substrate can be reduced.

[0121] Some embodiments of this disclosure also provide a method for assembling a light-emitting substrate, which will be described below. Figure 7 Taking the light-emitting substrate shown as an example, the assembly method of the light-emitting substrate is described exemplarily. First, a first structural component and a first connector are connected to form a first component. A second structural component and a second connector are connected to form a second component. A third structural component, a second connector, and an outgoing connector are connected to form a third component. Then, the third component is mounted on a backplate through fixing holes. A first connector of one of the first components is inserted into a second connector of the third structural component, and the first component is mounted and fixed on the backplate. Then, a second connector of the second component is inserted into another first connector of the aforementioned first component, and the second component is mounted and fixed on the backplate, and so on. Finally, another third structural component is taken, and its second connector is inserted into the first connector of the last first component, and the third component is mounted and fixed on the backplate, completing the assembly of one structural component group. Following the above steps, another structural component group is installed.

[0122] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A structural component, characterized in that, include: The system comprises two main body portions, each extending along a first direction and having a first interval along a second direction. Each main body portion includes a plurality of first electronic components spaced apart along the first direction. The interval between two adjacent first electronic components along the second direction is D. y The dimension of the main body portion along the second direction is D2; Among them, D y And D2 satisfies: D y =3D² + 3M, or, D y =2D² + 2M; M ranges from 0 to 2 mm; wherein the first direction and the second direction intersect each other; A connecting portion extends along the second direction, and both ends of the connecting portion are respectively connected to the ends of the two main body portions located on the same side; Two first binding portions, respectively connected to the ends of the two main body portions away from the connecting portions, are configured to connect with the connector.

2. The structural component according to claim 1, characterized in that, The structural component is an aluminum-based structural component.

3. A light-emitting substrate, characterized in that, Includes a back plate and at least one structural component assembly disposed on the back plate, the structural component assembly comprising: A plurality of first structural members, each of the first structural members comprising the structural member as described in claim 1 or 2, the plurality of first structural members being spaced apart on the back plate along a second direction, each first structural member having a first opening; A plurality of first connectors, wherein each first binding portion of the first structural member is connected to a first connector; A plurality of second structural members, each second structural member including the structural member as described in claim 1 or 2, the plurality of second structural members being spaced apart on the back plate along the second direction, each second structural member having a second opening, the orientation of the first opening being opposite to the orientation of the second opening; Multiple second connectors, wherein each first binding portion of the second structural member is connected to a second connector; Specifically, the two first connectors that are respectively connected to two adjacent first structural members and have the smallest distance along the second direction are respectively connected to two second connectors that are connected to the same second structural member; the two second connectors that are respectively connected to two adjacent second structural members and have the smallest distance along the second direction are respectively connected to two first connectors that are connected to the same first structural member.

4. The light-emitting substrate according to claim 3, characterized in that, The number of the first structural component is one more than the number of the second structural component; the structural component group also includes: Two third structural members are respectively located on both sides of the plurality of second structural members along the second direction, and both third structural members extend along the first direction. The third structural members are provided with a second binding part at the end closer to the first structural member and a third binding part at the end farther away from the first structural member. The second binding part is connected to the second connector and is connected through the second connector and the first connector located on the outermost side of the plurality of first structural members in the second direction. The outgoing connector is connected to the third bonding part.

5. The light-emitting substrate according to claim 3, characterized in that, The number of the second structural component is one more than the number of the first structural component; the structural component group also includes: Two third structural members are respectively located on both sides of the plurality of first structural members along the second direction, and both third structural members extend along the first direction. The third structural members are provided with a second binding part at the end closer to the second structural members and a third binding part at the end farther away from the second structural members. The second binding part is connected to the first connector and is connected to the second connector located on the outermost side along the second direction through the first connector and the plurality of second structural members. The outgoing connector is connected to the third bonding part.

6. The light-emitting substrate according to claim 4 or 5, characterized in that, The third structural component includes a plurality of second electronic components spaced apart along the first direction, wherein the spacing between two adjacent second electronic components is equal to the spacing between two adjacent first electronic components in the first structural component and the second structural component.

7. The light-emitting substrate according to claim 6, characterized in that, The third structural component is an aluminum-based structural component, and the outgoing connector and the second electronic component are disposed on the surface of the third structural component away from the back plate.

8. The light-emitting substrate according to claim 6, characterized in that, The third structural component is an epoxy board structural component, the second electronic component is disposed on the surface of the third structural component away from the back plate, and the outgoing connector is disposed on the surface of the third structural component close to the back plate; The backplate includes multiple clearance holes, and each of the outgoing connectors is disposed within one of the clearance holes.

9. The light-emitting substrate according to claim 8, characterized in that, The light-emitting substrate also includes: A drive circuit board is disposed on the surface of the back plate away from the third structural member; The circuit board has one end connected to the drive circuit board and the other end connected to the outgoing connector.

10. The light-emitting substrate according to claim 4 or 5, characterized in that, The light-emitting substrate includes multiple structural component groups arranged along the second direction; multiple third structural components belonging to different structural component groups are arranged at intervals along the second direction.

11. The light-emitting substrate according to claim 5, characterized in that, The first electronic component and the second electronic component of the first structural component and the second structural component are both light-emitting elements; the angle between the maximum light emission angle of the light-emitting element and the normal direction of the light-emitting element is α; The thickness of the first connector is T1, and the distance between the first connector and the light-emitting element closest to the first connector in the first direction is L1, where T1≤L1×tan(90°-α). The thickness of the second connector is T2, and the distance between the second connector and the light-emitting element closest to the second connector in the first direction is L2, where T2≤L2×tan(90°-α).

12. A backlight module, characterized in that, include: The light-emitting substrate as described in any one of claims 3 to 11; wherein the first electronic element of the first structural member and the second structural member, and the second electronic element of the third structural member, all include light-emitting elements.

13. A display device, characterized in that, include: The backlight module as described in claim 12; The display panel is located on the light-emitting side of the backlight module.

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