A semiconductor package inspection apparatus and method

By designing a semiconductor packaging inspection device, the problem of misjudgment caused by irregular material strip movement is solved by utilizing the synergistic effect of vision modules and mechanical components. This enables stable identification and protection of semiconductors, cutting them into appropriate lengths for easy subsequent transportation.

CN121633107BActive Publication Date: 2026-11-06LONGXIN MICRO (XIAN) ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202511950471.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-12-23
Publication Date
2026-11-06
Estimated Expiration
2045-12-23

AI Technical Summary

Technical Problem

During semiconductor strip inspection, the irregular movement of the strip causes the image captured by the camera to be blurry, increasing the probability of false detection.

Method used

A semiconductor packaging inspection device was designed, comprising an inspection mechanism, a sealing mechanism, and a cutting mechanism. Through components such as a vision module, a backlight base, a motor-driven linkage, and rollers, it achieves stable identification, protection, and cutting of semiconductors.

Benefits of technology

It improves the accuracy of semiconductor testing, avoids image blurring caused by irregular ribbon movement, protects semiconductors from contamination, and cuts the ribbon into appropriate lengths for easy subsequent transportation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging detection device and a detection method, which comprise a bottom plate, a detection mechanism arranged on the top of the bottom plate, a sealing mechanism arranged on the right side of the detection mechanism and a cutting mechanism arranged on the right side of the sealing mechanism. The detection mechanism is specifically started, that is, a visual module, a backlight base and a motor A are started, the motor A drives a connecting rod A to rotate, the connecting rod A drives a connecting rod B to rotate, the connecting rod A drives a sliding plate to slide, the sliding plate drives a J-shaped hook to move, the J-shaped hook is inserted into a circular hole of a supporting plate when moving, the supporting plate is uniformly moved by the J-shaped hook, the identification of the visual module can be kept stable, the image captured by the visual module is prevented from being blurred due to irregular movement of the supporting plate, each grid of the supporting plate can be fully identified, and the probability of detection error is reduced.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a semiconductor packaging testing device and testing method. Background Technology

[0002] Semiconductors are special materials with electrical conductivity between that of conductors and insulators. They are mainly composed of elements such as silicon and germanium. Semiconductors are widely used in electronic devices, such as diodes, transistors, and integrated circuits. Semiconductors can control the flow of current to achieve functions such as switching, amplification, and signal processing. Semiconductors exhibit limited conductivity at room temperature, and their conductivity can be adjusted by doping with other elements (such as phosphorus or boron). When semiconductors are placed in a strip for inspection, the moving strip is prone to irregular movement, which can cause the image captured by the camera to become blurry. This means that not every segment of the strip can be fully identified, thus increasing the probability of false detection. To address this, we propose a semiconductor packaging inspection device and method. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor packaging inspection device to solve the problems mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a semiconductor packaging inspection device, comprising a base plate, an inspection mechanism disposed on top of the base plate, a sealing mechanism disposed to the right of the inspection mechanism, and a cutting mechanism disposed to the right of the sealing mechanism. The inspection mechanism includes an outer box, inside which a vision module is disposed. A square box A is disposed on the right side of the outer box, inside which a feeding assembly is disposed. The left side of the square box A is fixed to the right side of the outer box, and a transparent rectangular plate is disposed on the front of the square box A.

[0005] Furthermore, the vision module is located at the center inside the outer box, the feeding group includes a connecting rod A, the front of the vision module is provided with a beveled mirror, the top of the vision module and the beveled mirror are respectively fixed to the top inner wall of the outer box, a backlight base is provided directly below the beveled mirror, a support plate is placed on the top of the backlight base, the support plate extends from left to right, the connecting rod A is rotatably connected to the inner wall of the back of the square box A, the right side of the back of the connecting rod A extends backward and penetrates the square box A, the angle of the beveled surface on the back of the beveled mirror is forty-five degrees, and a backlight source is provided on the top of the backlight base.

[0006] Furthermore, a motor A is fixed to the back of the square box A, and the output end of the motor A is fixed to the outer wall of the back of the connecting rod A. A sliding groove is provided at the bottom of the connecting rod A, and a sliding plate is slidably connected inside the sliding groove. A connecting rod B is rotatably connected to the left side of the outer wall of the front of the sliding plate. The top left side of the connecting rod A is rotatably connected to the top left side of the connecting rod B. A J-shaped hook is rotatably connected to the center of the outer wall of the front of the sliding plate. The J-shaped hook extends into the round hole of the support plate. A stop bar is provided on the left side of the J-shaped hook. The stop bar contacts the J-shaped hook, and the back of the stop bar is fixed to the outer wall of the front of the sliding plate.

[0007] Furthermore, the sealing mechanism includes a square box B, with a top cover on the top of the square box B. The square box B is rotatably connected to the top cover. A support block is fixed at the center of the bottom of the inner wall of the square box B. Rollers A are respectively provided on the left and right sides of the top of the support block. The front and back sides of the two rollers A penetrate the square box B and extend outward. Motors B are respectively provided on the back sides of the two rollers A. The output ends of the front sides of the two motors B are respectively fixed to the back sides of the two rollers A.

[0008] Furthermore, rollers B are respectively provided on the top of the two rollers A, and collars are respectively fitted on the front and back of the two rollers B. The four collars are respectively fixed to the front and back of the inner wall of the square box B. The four collars are rotatably connected to the two rollers B. The top of the four collars is rotatably connected to the baffles. The four collars are respectively threaded to the four baffles with bolts. A rectangular ring is provided at the top center of the support block.

[0009] Furthermore, a ring-shaped cutter is fixed at the bottom center of the rectangular ring, and several eccentric wheels are arranged inside the rectangular ring. A rotating shaft is arranged at the upper part of the rectangular ring, and the rotating shaft passes through several eccentric wheels. Several eccentric wheels are fixed on the outer wall of the rotating shaft. The front and back of the rotating shaft pass through the square box B and extend outward. A motor C is arranged on the back of the rotating shaft, and the output end of the front of the motor C is fixed to the back of the rotating shaft.

[0010] Furthermore, two square-round plates are respectively provided on the front and back of the rectangular ring. The four square-round plates are arranged in pairs and the connected components are the same. The front of the two square-round plates located on the front is fixed to the inner wall of the square box B. A round rod is slidably connected to the center of the two square-round plates. The two round rods are fixed to the top and bottom of the rectangular ring respectively, close to each other. Springs are respectively sleeved on the outside of the two round rods. The springs sleeved on the outside of the round rods flexibly constrain the square-round plates.

[0011] Furthermore, the cutting mechanism includes a square box C, with an irregular groove on the left outer wall of the square box C, a square box D fixed to the bottom of the square box C, a storage box on the inner wall of the square box D, a square hole at the center of the bottom inner wall of the square box C, the storage box being slidably connected to the inner wall of the square box D, and the interiors of the square box C and the square box D being connected together through the square hole.

[0012] Furthermore, a knife gate is provided at the top of the square hole of the square box C. The front and back sides of the knife gate are slidably connected to the front and back sides of the inner wall of the square box C, respectively. A bidirectional lead screw is provided at the top of the knife gate. The front and back sides of the bidirectional lead screw pass through the square box C and extend outward. A motor D is provided on the back side of the bidirectional lead screw. The output end of the front side of the motor D is fixed to the back side of the bidirectional lead screw.

[0013] Furthermore, rectangular sliders are respectively fitted on the front and back of the bidirectional lead screw, and the two rectangular sliders are respectively threaded to the bidirectional lead screw. Rotating rods are rotatably connected to the front and back of the two storage boxes, and the bottoms of the four rotating rods are respectively rotatably connected to the top of the guillotine. The two rectangular sliders are horizontally mirrored front and back with the square box C as the center.

[0014] The present invention has the following beneficial effects: (1) The present invention sets up a detection mechanism, specifically by activating the vision module, the backlight base and the motor A. The motor A drives the connecting rod A to rotate, which in turn drives the connecting rod B to rotate, causing the connecting rod A to pull the slide plate to slide, which in turn causes the slide plate to move the J-shaped hook. When the J-shaped hook moves, it will insert into the round hole of the tray. In this way, the tray can be moved at a constant speed by the J-shaped hook, so that the recognition of the vision module can remain stable and avoid the image captured by the vision module from becoming blurry due to the irregular movement of the tray. This ensures that each grid of the tray can be fully recognized, thereby reducing the probability of detection misjudgment.

[0015] (2) The present invention sets up a sealing mechanism, specifically by starting roller A, motor B and motor C, so that roller A heats the soft film and pulls the soft film wrapped around the outside of roller B by rotating roller A. The heated soft film will move to the top of the semiconductor strip. Then motor C will drive the rotating shaft to rotate, so that the rotating shaft drives the rectangular ring to move vertically through the eccentric wheel. In this way, the rectangular ring can slide along the round rod and drive the ring cutter to move vertically to cut the soft film and attach it to the strip, thereby protecting the semiconductor and preventing the semiconductor from being contaminated and damaged.

[0016] (3) The present invention sets up a cutting mechanism, specifically starting the motor D, which drives the bidirectional lead screw to rotate at its output end. The bidirectional lead screw will drive the two rectangular sliders to move closer to each other. When the rectangular sliders move, they will drive the rotating rods connected to the left and right sides to rotate, so that the rotating rods push the rectangular slider gate downwards, and the gate moves downwards along the box C. In this way, the semiconductor strip can be cut by the vertical movement of the gate, and the strip is cut into a suitable length. The size of the cut strip is small, which is convenient for subsequent semiconductor transportation.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the base plate structure of the present invention; Figure 3 This is a schematic diagram of the visual module structure of the present invention; Figure 4 This is a schematic diagram of the chute structure of the present invention; Figure 5 This is a schematic diagram of the support block structure of the present invention; Figure 6 This is a schematic diagram of the rectangular ring structure of the present invention; Figure 7 This is a schematic diagram of the storage box structure of the present invention; Figure 8 This is a schematic diagram of the bidirectional lead screw structure of the present invention.

[0020] The attached diagram lists the components represented by each number as follows: In the diagram: 11. Base plate; 12. Detection mechanism; 121. Outer box; 1221. Vision module; 1222. Angled mirror; 1231. Backlight base; 1232. Support plate; 124. Square box A; 1251. Slide groove; 1252. Slide plate; 1261. Link A; 1262. Link B; 127. J-hook; 128. Stop bar; 129. Motor A; 13. Sealing mechanism; 131. Square box B; 132. Top cover; 133. Support block; 1341. 1342. Roller B; 1343. Collar; 1351. Rectangular Ring; 1352. Circular Cutter; 1361. Eccentric Wheel; 1362. Rotating Shaft; 137. Square and Round Plate; 1381. Motor B; 1382. Motor C; 139. Round Rod; 14. Cutting Mechanism; 141. Square Box C; 142. Square Box D; 143. Storage Box; 144. Bidirectional Lead Screw; 145. Knife Gate; 146. Rectangular Slider; 147. Rotating Rod; 148. Motor D. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-8 As shown, the present invention is a semiconductor packaging inspection device, including a base plate 11, an inspection mechanism 12, the inspection mechanism 12 being disposed on the top of the base plate 11, a sealing mechanism 13 being disposed on the right side of the inspection mechanism 12, and a cutting mechanism 14 being disposed on the right side of the sealing mechanism 13. The inspection mechanism 12 includes an outer box 121, a vision module 1221 being disposed inside the outer box 121, a square box A124 being disposed on the right side of the outer box 121, a feeding assembly being disposed inside the square box A124, the left side of the square box A124 being fixed to the right side of the outer box 121, and a transparent rectangular plate being disposed on the front side of the square box A124.

[0023] When the vision module 1221, backlight base 1231, and motor A129 are activated, motor A129 drives linkage A1261 to rotate, which in turn drives linkage B1262 to rotate. This causes linkage A1261 to pull slide plate 1252, which in turn moves J-hook 127. As J-hook 127 moves, it inserts into the circular hole of tray 1232. This allows tray 1232 to move at a constant speed via J-hook 127, ensuring stable recognition by the vision module 1221. This prevents blurring of the image captured by the vision module 1221 due to irregular movement of tray 1232, ensuring that each segment of tray 1232 is fully recognized, thereby reducing the probability of false detection.

[0024] The vision module 1221 is located at the center inside the outer box 121. The feeding group includes a connecting rod A1261. A beveled mirror 1222 is provided on the front of the vision module 1221. The tops of the vision module 1221 and the beveled mirror 1222 are respectively fixed to the top inner wall of the outer box 121. A backlight base 1231 is provided directly below the beveled mirror 1222. A support plate 1232 is placed on the top of the backlight base 1231. The support plate 1232 extends from the left to the right. The connecting rod A1261 is rotatably connected to the inner wall of the back of the square box A124. The right side of the back of the connecting rod A1261 extends backward and penetrates the square box A124. The angle of the beveled surface on the back of the beveled mirror 1222 is forty-five degrees. A backlight source is provided on the top of the backlight base 1231.

[0025] A motor A129 is fixed to the back of the square box A124. The output end of the motor A129 is fixed to the outer wall of the back of the connecting rod A1261. A groove 1251 is provided at the bottom of the connecting rod A1261. A slide plate 1252 is slidably connected inside the groove 1251. A connecting rod B1262 is rotatably connected to the left side of the outer wall of the front of the slide plate 1252. The top left side of the connecting rod A1261 is rotatably connected to the top left side of the connecting rod B1262. A J-shaped hook 127 is rotatably connected to the center of the outer wall of the front of the slide plate 1252. The J-shaped hook 127 extends into the round hole of the support plate 1232. A stop bar 128 is provided on the left side of the J-shaped hook 127. The stop bar 128 contacts the J-shaped hook 127. The back of the stop bar 128 is fixed to the outer wall of the front of the slide plate 1252.

[0026] The sealing mechanism 13 includes a square box B131, with a top cover 132 on the top of the square box B131. The square box B131 is rotatably connected to the top cover 132. A support block 133 is fixed at the center of the bottom of the inner wall of the square box B131. Rollers A1341 are respectively arranged on the left and right sides of the top of the support block 133. The front and back sides of the two rollers A1341 pass through the square box B131 and extend outward. Motors B1381 are respectively arranged on the back sides of the two rollers A1341. The output ends of the front sides of the two motors B1381 are respectively fixed to the back sides of the two rollers A1341.

[0027] The roller A1341, motor B1381, and motor C1382 are started. Roller A1341 heats the soft film and pulls the soft film wrapped around the outside of roller B1342 by rotating. The heated soft film moves to the top of the semiconductor strip. Then, motor C1382 drives the rotating shaft 1362 to rotate. The rotating shaft 1362 drives the rectangular ring 1351 to move vertically through the eccentric wheel 1361. This allows the rectangular ring 1351 to slide along 1377 through the round rod 139 and drive the annular cutter 1352 to move vertically, cutting the soft film and attaching it to the strip to protect the semiconductor and prevent it from being contaminated and damaged.

[0028] Rollers B1342 are respectively installed on the top of the two rollers A1341. The front and back of the two rollers B1342 are respectively fitted with collars 1343. The four collars 1343 are respectively fixed to the front and back of the inner wall of the square box B131. The four collars 1343 are rotatably connected to the two rollers B1342. The top of the four collars 1343 is rotatably connected to the baffle. The four collars 1343 are respectively threaded to the four baffles with bolts. A rectangular ring 1351 is provided at the top center of the support block 133.

[0029] A ring cutter 1352 is fixed at the bottom center of a rectangular ring 1351. Several eccentric wheels 1361 are arranged inside the rectangular ring 1351. A rotating shaft 1362 is arranged at the upper part of the rectangular ring 1351. The rotating shaft 1362 passes through the several eccentric wheels 1361. The several eccentric wheels 1361 are fixed on the outer wall of the rotating shaft 1362. The front and back of the rotating shaft 1362 pass through the square box B131 and extend outward. A motor C1382 is arranged on the back of the rotating shaft 1362. The output end of the front of the motor C1382 is fixed to the back of the rotating shaft 1362.

[0030] Two square-round plates 137 are respectively provided on the front and back of the rectangular ring 1351. The four square-round plates 137 are arranged in pairs and the connected parts are the same. The front of the two square-round plates 137 located on the front is fixed to the inner wall of the square box B131. A round rod 139 is slidably connected to the center of the two square-round plates 137 respectively. The two round rods 139 are fixed to the top and bottom of the rectangular ring 1351 respectively, close to each other. Springs are respectively sleeved on the outside of the two round rods 139. The springs sleeved on the outside of the round rods 139 flexibly constrain the square-round plates 137.

[0031] The cutting mechanism 14 includes a square box C141. A shaped groove is provided on the left outer wall of the square box C141. A square box D142 is fixed to the bottom of the square box C141. A storage box 143 is provided on the inner wall of the square box D142. A square hole is provided at the center of the bottom inner wall of the square box C141. The storage box 143 is slidably connected to the inner wall of the square box D142. The interiors of the square box C141 and the square box D142 are connected together through the square hole.

[0032] Start motor D148, causing its output to drive bidirectional lead screw 144 to rotate. The bidirectional lead screw 144 will drive two rectangular sliders 146 to move closer to each other. When the rectangular sliders 146 move, they will drive the rotating rods 147 connected to the left and right sides to rotate, causing the rotating rods 147 to push the rectangular slider gate 145 downward, so that the gate 145 moves downward along the box C141. In this way, the semiconductor strip can be cut into appropriate lengths by the vertical movement of the gate 145. The cut strips are smaller in size, which facilitates the subsequent semiconductor transportation.

[0033] A knife gate 145 is provided on the top of the square hole of the square box C141. The front and back of the knife gate 145 are slidably connected to the front and back of the inner wall of the square box C141, respectively. A bidirectional lead screw 144 is provided on the top of the knife gate 145. The front and back of the bidirectional lead screw 144 pass through the square box C141 and extend outward. A motor D148 is provided on the back of the bidirectional lead screw 144. The output end of the front of the motor D148 is fixed to the back of the bidirectional lead screw 144.

[0034] A rectangular slider 146 is fitted on the front and back of the bidirectional lead screw 144, and the two rectangular sliders 146 are threadedly connected to the bidirectional lead screw 144. The front and back of the two storage boxes 143 are rotatably connected to the rotating rods 147, and the bottom of the four rotating rods 147 are rotatably connected to the top of the gate 145. The two rectangular sliders 146 are horizontally mirrored with respect to the square box C141 as the center.

[0035] In use, the semiconductor is placed in the tray 1232, and then the motor A129 is started, causing the motor A129 to drive the connecting rod A1261 to rotate. The connecting rod A1261 then pulls the slide plate 1252 to slide. The slide plate 1252 slides along the inner wall of the groove 1251, causing the J-shaped hook 127, which is rotatably connected to the front, to shift. When the slide plate 1252 moves to the right, the J-shaped hook 127 inserts into the tray 1232. Inside the circular hole, the stop bar 128 is pressed against the J-shaped hook 127 to restrict its rotation direction. Then, the J-shaped hook 127 pushes the support plate 1232 to the right, causing the support plate 1232 to move the semiconductor to the right. The semiconductor is moved to the bottom of the 45-degree mirror 1222, and then the backlight base 1231 is activated. The backlight base 1231 provides a backlight source for the bottom of the support plate 1232. Then, the vision module 1221 is activated. The orientation of the vision module 1221 can be adjusted.

[0036] When the area where the vision module 1221 is placed is small, the camera can be placed horizontally; when the area where the vision module 1221 is placed is large, the camera can be placed vertically. The vision module 1221 camera is a two-megapixel camera. Then, the vision module 1221 emits a light source containing red and blue light to identify the tray 1232. First, it detects the number of empty spaces in front of the tray 1232. The empty space data is continuous. When the number of empty spaces is less than the configured number, an alarm will be triggered. After the number of empty spaces is met, the product will be detected. Then, the vision module 1221 detects the semiconductors in the tray 1232. When there are empty spaces in the tray 1232, an alarm will be triggered. After the semiconductors in the tray 1232 are detected, they will enter the interior of the square box B131. Then, a plastic soft film is placed on the two rollers A1341 and the two rollers B1342.

[0037] The right-side roller B1342 is a waste material take-up reel. Then, the two rollers A1341 are started to heat the plastic media. Then, the motor B1381 is started to drive the rollers A1341 to rotate. The rotation of the rollers A1341 then moves the plastic media. Then, the motor C1382 is started to drive the rotating shaft 1362 to rotate. When the rotating shaft 1362 rotates, it drives the eccentric wheel 1361 to rotate eccentrically. The eccentric displacement of the eccentric wheel 1361 drives the rectangular ring 1351 to move up and down. The rectangular ring 1351 drives the round rod 139 to move, and the round rod 139 slides along the square and round plate 137. The square and round plate 137 stretches the spring, and the spring will return to its original position by rebounding.

[0038] When the rectangular ring 1351 moves, it drives the annular cutter 1352 installed at the bottom to move downward, applying the soft film onto the tray 1232. Then, the tray 1232 moves to the right from the support block 133 and into the square box C141. Then, the motor D148 is started, which drives the bidirectional lead screw 144 to rotate, causing the bidirectional lead screw 144 to drive the two rectangular sliders 146 to move closer to each other. Then, the rotating rod 147 connected to the front rotates and pushes the gate 145 downward. The gate 145 slides downward along the inner wall of the square box C141. Then, by moving the gate 145 downward, the tray 1232 is cut. The cut tray 1232 falls from the square box C141 into the square box D142. It should be noted that the vision module 1221 in this application is a PSI vision module. The control of the vision module 1221, backlight base 1231, motor A129, roller A1341, motor B1381, motor C1382, and motor D148 in this application can all be achieved by using a program set in the control panel and inputting relevant parameters as needed for automated control. The setting of this control method can be realized by existing technologies, such as PLC.

[0039] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor packaging inspection device, comprising a base plate (11), characterized in that, Also includes: The detection mechanism (12) is located on top of the base plate (11); A sealing mechanism (13) is provided on the right side of the detection mechanism (12); A cutting mechanism (14) is provided on the right side of the sealing mechanism (13); The detection mechanism (12) includes an outer box (121), a vision module (1221) is provided inside the outer box (121), a square box A (124) is provided on the right side of the outer box (121), and a feeding group is provided inside the square box A (124). The left side of the square box A (124) is fixed to the right side of the outer box (121), and a transparent rectangular plate is provided on the front of the square box A (124). The back of the square box A (124) is fixed with a motor A (129). The output end of the motor A (129) is fixed on the back outer wall of the connecting rod A (1261). The bottom of the connecting rod A (1261) is provided with a sliding groove (1251). The sliding groove (1251) is slidably connected to a sliding plate (1252). The left side of the front outer wall of the sliding plate (1252) is rotatably connected to a connecting rod B (1262). The top left side of the connecting rod A (1261) is rotatably connected to the top left side of the connecting rod B (1262). The center of the front outer wall of the sliding plate (1252) is rotatably connected to a J-shaped hook (127). The J-shaped hook (127) extends into the round hole of the support plate (1232). A stop bar (128) is provided on the left side of the J-shaped hook (127). Among them, the stop bar (128) contacts the J-shaped hook (127), and the back of the stop bar (128) is fixed to the outer wall of the front of the slide plate (1252); A ring cutter (1352) is fixed at the bottom center of a rectangular ring (1351). Several eccentric wheels (1361) are arranged inside the rectangular ring (1351). A rotating shaft (1362) is arranged at the upper part of the rectangular ring (1351). The rotating shaft (1362) passes through several eccentric wheels (1361). Several eccentric wheels (1361) are fixed on the outer wall of the rotating shaft (1362). The front and back of the rotating shaft (1362) pass through the square box B (131) and extend outward. Among them, a motor C (1382) is provided on the back of the rotating shaft (1362), and the output end of the front of the motor C (1382) is fixed on the back of the rotating shaft (1362); The rectangular ring (1351) has two square round plates (137) on its front and back sides respectively. The four square round plates (137) are arranged in pairs and the connected parts are the same. The front of the two square round plates (137) on the front side is fixed to the inner wall of the square box B (131). The center of the two square round plates (137) is slidably connected to round rods (139). The two round rods (139) are fixed to the top and bottom of the rectangular ring (1351) respectively, close to each other. Springs are respectively sleeved on the outer side of the two round rods (139). Among them, the spring sleeved on the outside of the round rod (139) provides flexible constraint to the square and round plate (137).

2. The semiconductor packaging inspection device according to claim 1, characterized in that: The visual module (1221) is located at the center inside the outer box (121). The feeding group includes a connecting rod A (1261). A beveled mirror (1222) is provided on the front of the visual module (1221). The tops of the visual module (1221) and the beveled mirror (1222) are respectively fixed on the top inner wall of the outer box (121). A backlight base (1231) is provided directly below the beveled mirror (1222). A tray (1232) is placed on the top of the backlight base (1231). The tray (1232) extends from the left to the right. The connecting rod A (1261) is rotatably connected to the inner wall of the back of the square box A (124). The right side of the back of the connecting rod A (1261) extends backward and penetrates the square box A (124). Among them, the angle of the back slope of the inclined mirror (1222) is forty-five degrees, and the backlight base (1231) is provided with a backlight source on the top.

3. The semiconductor packaging inspection device according to claim 2, characterized in that: The sealing mechanism (13) includes a square box B (131), a top cover (132) is provided on the top of the square box B (131), the square box B (131) is rotatably connected to the top cover (132), a support block (133) is fixed at the center of the bottom of the inner wall of the square box B (131), rollers A (1341) are respectively provided on the left and right sides of the top of the support block (133), the front and back of the two rollers A (1341) respectively penetrate the square box B (131) and extend outward, and motors B (1381) are respectively provided on the back of the two rollers A (1341). Among them, the output ends of the two motors B (1381) on the front are respectively fixed to the back of the two rollers A (1341).

4. The semiconductor packaging inspection device according to claim 3, characterized in that: Rollers B (1342) are respectively provided on the top of the two rollers A (1341). The front and back of the two rollers B (1342) are respectively fitted with collars (1343). The four collars (1343) are respectively fixed to the front and back of the inner wall of the square box B (131). The four collars (1343) are rotatably connected to the two rollers B (1342). The top of the four collars (1343) is rotatably connected with baffles. Among them, the four collars (1343) are connected to the four baffles by bolts and threads respectively, and a rectangular ring (1351) is provided at the top center of the support block (133).

5. A semiconductor packaging inspection device according to claim 4, characterized in that: The cutting mechanism (14) includes a square box C (141), the outer left side wall of the square box C (141) is provided with an irregular groove, the bottom of the square box C (141) is fixed with a square box D (142), the inner wall of the square box D (142) is provided with a storage box (143), and the center of the bottom inner wall of the square box C (141) is provided with a square hole. The storage box (143) is slidably connected to the inner wall of the square box D (142), and the interior of the square box C (141) is connected to the interior of the square box D (142) through a square hole.

6. The semiconductor packaging inspection device according to claim 5, characterized in that: A knife gate (145) is provided on the top of the square hole of the square box C (141). The front and back sides of the knife gate (145) are slidably connected to the front and back sides of the inner wall of the square box C (141), respectively. A bidirectional screw rod (144) is provided on the top of the knife gate (145). The front and back sides of the bidirectional screw rod (144) pass through the square box C (141) and extend outward. A motor D (148) is provided on the back side of the bidirectional screw rod (144). Among them, the output end of the motor D (148) is fixed on the back of the bidirectional lead screw (144).

7. A semiconductor packaging inspection device according to claim 6, characterized in that: The front and back sides of the bidirectional lead screw (144) are respectively fitted with rectangular sliders (146), and the two rectangular sliders (146) are respectively threaded to the bidirectional lead screw (144). The front and back sides of the two storage boxes (143) are respectively rotatably connected with rotating rods (147), and the bottom of the four rotating rods (147) are respectively rotatably connected to the top of the guillotine (145). Among them, the two rectangular sliders (146) are set horizontally mirrored front and back with the square box C (141) as the center.

8. A semiconductor packaging inspection method, employing the semiconductor packaging inspection apparatus as described in claim 7, characterized in that: Includes the following steps: Step 1: Place the semiconductor into the tray (1232), then start the motor A (129), causing the motor A (129) to drive the connecting rod A (1261) to rotate. Then, the connecting rod A (1261) will rotate, causing the connecting rod A (1261) to pull the slide plate (1252) to slide. The slide plate (1252) will slide along the inner wall of the groove (1251) and drive the J-shaped hook (127) connected to the front to move. When the slide plate (1252) moves to the right, the J-shaped hook (127) will insert into the tray (1232). 2) Inside the round hole, and let the stop bar (128) press against the J-shaped hook (127) to restrict its rotation direction. Then the J-shaped hook (127) will push the tray (1232) to the right, so that the tray (1232) will drive the semiconductor to move to the right, move the semiconductor to the bottom of the 45-degree mirror (1222), and then start the backlight base (1231). The backlight base (1231) will provide a backlight source for the bottom of the tray (1232). Then start the vision module (1221). The setting direction of the vision module (1221) can be adjusted. Step 2: When the area where the vision module (1221) is placed is small, the camera can be placed horizontally. When the area where the vision module (1221) is placed is large, the camera can be placed vertically. The camera of the vision module (1221) is a two-megapixel camera. Then the vision module (1221) will emit a light source containing red and blue light to identify the tray (1232). First, it will detect the number of empty spaces in front of the tray (1232). The empty material data is continuous. When the number of empty spaces is less than the configured number, an alarm will be triggered. After the number of empty spaces is met, the product will be detected. Then, the semiconductor in the tray (1232) will be detected through the vision module (1221). When there is empty material in the tray (1232), an alarm will be triggered. After the semiconductor in the tray (1232) is detected, it will enter the interior of the square box B (131). Then, the plastic soft film will be placed on the two rollers A (1341) and the two rollers B (1342). Step 3: The right-side roller B (1342) is a waste material take-up wheel. Then, start the two rollers A (1341) to heat the plastic media. Then, start the motor B (1381) to drive the roller A (1341) to rotate. Then, the rotation of the roller A (1341) will drive the plastic media to move. Then, start the motor C (1382) to drive the rotating shaft (1362) to rotate. When the rotating shaft (1362) rotates, it will drive the eccentric wheel (1361) to rotate eccentrically. The eccentric displacement of the eccentric wheel (1361) will drive the rectangular ring (1351) to move up and down. The rectangular ring (1351) will drive the round rod (139) to move. The round rod (139) will slide along the square plate (137) and stretch the spring. The spring will push back and reset the rectangular ring (1351). Step 4: When the rectangular ring (1351) moves, it will drive the ring cutter (1352) installed at the bottom to move downward, and apply the soft film to the tray (1232). Then the tray (1232) will move to the right from the tray (133) and be placed in the square box C (141). Then the motor D (148) will be started. The motor D (148) will drive the double-acting screw (144) to rotate, so that the double-acting screw (144) will drive the two rectangular sliders (146) to move closer to each other. Then the rotating rod (147) connected to the front will push the gate (145) downward. The gate (145) will slide down along the inner wall of the square box C (141). Then the tray (1232) will be cut by moving the gate (145) downward. The cut tray (1232) will fall from the square box C (141) into the square box D (142).

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