Liquid cooling heat dissipation module and heat dissipation system

Abstract

The present disclosure relates to the technical field of heat dissipation devices, and provides a cold heat dissipation module and a heat dissipation system. The cold heat dissipation module comprises a liquid inlet member, a liquid return member, a liquid cooling plate and an adjusting member. The liquid inlet member is provided with a liquid inlet portion. The liquid return member is arranged in a spaced manner with the liquid inlet member, and the liquid return member is provided with a liquid return portion corresponding to the liquid inlet portion. The liquid inlet end of the liquid cooling plate is in conductive connection with the liquid inlet portion, and the liquid return end is in conductive connection with the liquid return portion. The adjusting member is in transmission connection with the liquid cooling plate. The liquid cooling plate comprises a first plate body and a second plate body in movable butt joint. The first plate body and the second plate body cooperatively enclose an internal liquid cooling channel of the liquid cooling plate. The adjusting member can drive the second plate body to relatively move towards or away from the first plate body, so as to adjust the cross-sectional area of the internal liquid cooling channel. The heat dissipation system comprises the cold heat dissipation module, and both of them can individually improve the liquid cooling cooling efficiency of one or several liquid cooling plates, and can efficiently and quickly realize the beneficial effect of strengthening heat dissipation and cooling of individual abnormally high-temperature devices.

Description

Technical Field

[0001] This patent relates to the field of heat dissipation device technology, and in particular to a liquid cooling heat dissipation module and heat dissipation system. Background Technology

[0002] Liquid cooling modules in servers or computers typically consist of a liquid cooling plate, a coolant distributor, and liquid cooling piping. Different liquid cooling modules are designed for different heat-generating components of the server or computer, such as CPU liquid cooling, memory liquid cooling, graphics card liquid cooling, and combinations thereof. When the server or computer operates at high power, heat from the CPU, memory, and other heat-generating components is conducted to the liquid cooling plate. The coolant circulation path within the liquid cooling plate then transfers the heat to the cooling units, achieving liquid cooling of the computer.

[0003] In existing liquid cooling modules, when one or more of the multiple heat-generating units experience abnormally high temperatures during liquid cooling circulation, the module intensifies cooling by increasing the overall heat dissipation power (e.g., increasing the overall flow rate of the coolant within the module). However, this approach increases the overall power consumption of the liquid cooling module, and most of the coolant does not effectively contribute to cooling the abnormally high-temperature components. This is a significant challenge in the practical application of existing liquid cooling modules. Summary of the Invention

[0004] This disclosure provides a liquid cooling module and a cooling system to address the problem in related technologies where memory liquid cooling plates are unable to efficiently and quickly cool down some abnormally high-temperature components.

[0005] The liquid cooling heat dissipation module provided in this embodiment includes a liquid inlet component, a liquid return component, a liquid cooling plate, and an adjustment component;

[0006] The liquid inlet component has a liquid inlet section;

[0007] The return liquid component and the inlet liquid component are spaced apart, and the return liquid component has a return liquid section corresponding to the inlet liquid section;

[0008] The liquid inlet end of the liquid cooling plate is electrically connected to the liquid inlet section, and the liquid return end is electrically connected to the liquid return section;

[0009] The adjusting component is connected to the liquid cooling plate via a transmission mechanism.

[0010] The liquid cooling plate includes a first plate and a second plate that are movably connected.

[0011] The first plate and the second plate cooperate to form the internal liquid cooling channel of the liquid cooling plate;

[0012] The adjusting member can drive the second plate to move relative to or away from the first plate to adjust the cross-sectional area of ​​the internal liquid cooling channel.

[0013] In one embodiment, the first plate and the second plate are respectively provided with mating edges on their facing surfaces, and the mating edges are respectively provided with protruding insert edges and fitting grooves.

[0014] The raised insert edge is movably and sealingly inserted into the mounting groove;

[0015] When the adjusting member drives the second plate to move relative to or away from the first plate, the protruding insertion edge can correspondingly increase or decrease its actual insertion length in the mounting groove.

[0016] In one possible embodiment, the liquid inlet includes a mounting port and a liquid inlet.

[0017] The liquid inlet end of the first plate is fixedly snapped into the mounting port by a snap-fit ​​head;

[0018] The liquid inlet end of the second plate is movably inserted into the liquid inlet, and the internal liquid cooling channel is connected to the liquid inlet.

[0019] In one embodiment, the liquid inlet is further provided with a sealing flange that protrudes toward the center in its inner wall;

[0020] The liquid inlet end of the liquid cooling plate is inserted into the liquid inlet and abuts against the sealing flange;

[0021] When the adjusting member drives the second plate to move relative to or away from the first plate, the liquid inlet end of the second plate can reciprocate along the sealing edge.

[0022] In one possible embodiment, the mounting opening includes a mounting slot formed along its own long axis.

[0023] The mounting head includes a mounting insert edge that corresponds to the mounting slot and a sealing edge that is perpendicularly connected to the mounting insert edge and is used to seal and cover the mounting slot.

[0024] In one embodiment, the liquid inlet end of the second plate is further provided with a liquid inlet channel;

[0025] One end of the liquid inlet channel is connected to the liquid inlet, and the other end is connected to the internal liquid cooling channel. The cross-sectional area of ​​the liquid inlet channel is smaller than that of the internal liquid cooling channel.

[0026] In one embodiment, the liquid cooling plate further includes a thermally conductive adhesive pad;

[0027] The thermally conductive pads are respectively attached to the side panels of the first plate and the second plate that are opposite to each other.

[0028] In one embodiment, the adjusting member includes a shape memory metal spring disposed in the liquid cooling plate;

[0029] One end of the memory metal spring is connected to the first plate, and the other end is connected to the second plate;

[0030] When the temperature in the liquid cooling plate is lower than the deformation temperature, the memory metal spring is in an elastic contraction state so that the first plate and the second plate remain close to each other;

[0031] When the temperature in the liquid cooling plate is higher than the deformation temperature, the memory metal spring is in an elastically extended state, so that the first plate and the second plate keep away from each other.

[0032] In one possible embodiment, the adjusting member includes a drive motor and a transmission assembly that is driveably connected to the drive motor;

[0033] The transmission assembly includes a first transmission component connected to the first plate and a second transmission component connected to the second plate;

[0034] Furthermore, the drive motor can drive and change the relative position of the first transmission member and the second transmission member, so as to make the second plate move relative to or away from the first plate.

[0035] In addition, this disclosure also provides a liquid cooling heat dissipation system, which includes a liquid supply device and the above-mentioned liquid cooling heat dissipation module;

[0036] The liquid supply device includes an inlet pipe and a return pipe, wherein the inlet pipe is connected to the inlet component and the return pipe is connected to the return component.

[0037] The technical solution provided in this disclosure has the following advantages compared with related technologies:

[0038] The liquid cooling module provided in this embodiment can adjust the relative position of the second plate and the first plate in the corresponding liquid cooling plate through its own adjustment components. This increases or decreases the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate, and enables the function of individually increasing or decreasing the flow rate of the coolant in the liquid cooling plate. When the liquid cooling module is performing liquid cooling, one or more of the liquid cooling plates can individually increase or decrease their own liquid cooling efficiency. This allows for the individual enhanced heat conduction and cooling of one or more heat-generating devices with abnormally high temperatures. Without increasing the overall power consumption of the liquid cooling module, it can efficiently and quickly achieve the function of enhanced heat dissipation and cooling of individual abnormally high-temperature devices.

[0039] In addition, the heat dissipation system provided in this embodiment includes the liquid cooling heat dissipation module described above, which can also achieve the beneficial effects of the liquid cooling heat dissipation module described above, and will not be described in detail here.

[0040] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0041] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0042] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0043] Figure 1 A three-dimensional structural diagram of the liquid cooling heat dissipation module provided in an embodiment of this disclosure is shown;

[0044] Figure 2 An exploded view of a portion of the liquid cooling heat dissipation module provided in an embodiment of this disclosure is shown;

[0045] Figure 3 A perspective sectional view of the liquid cooling heat dissipation module provided in an embodiment of this disclosure is shown;

[0046] Figure 4 An exploded view of the liquid cooling heat dissipation module provided in an embodiment of this disclosure is shown from another perspective;

[0047] Figure 5 A schematic diagram of a heat dissipation system provided in an embodiment of this disclosure is shown.

[0048] Explanation of the labels in the diagram: 1. Liquid inlet; 11. Liquid inlet section; 111. Mounting port; 112. Liquid inlet; 112a. Sealing flange;

[0049] 2. Liquid return component; 21. Liquid return section;

[0050] 3. Liquid cooling plate; 31. First plate; 311. Protruding insertion edge; 312. Mounting head; 312a. Mounting insertion edge; 312b. Sealing edge; 32. Second plate; 321. Embedding groove; 322. Liquid inlet channel; 33. Thermally conductive pad;

[0051] 4. Adjusting components; 5. Liquid inlet pipe; 6. Liquid return pipe. Detailed Implementation

[0052] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0053] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0054] Combination Figure 1 and Figure 5 As shown, this embodiment of the present disclosure provides a liquid cooling heat dissipation module, which includes a liquid inlet 1, a liquid return 2, a liquid cooling plate 3, and an adjusting component 4; the liquid inlet 1 has a liquid inlet portion 11; the liquid return 2 is spaced apart from the liquid inlet 1, and the liquid return 2 has a liquid return portion 21 corresponding to the liquid inlet portion 11; the liquid inlet end of the liquid cooling plate 3 is electrically connected to the liquid inlet portion 11, and the liquid return end is electrically connected to the liquid return portion 21; the adjusting component 4 is drivenly connected to the liquid cooling plate 3; wherein, the liquid cooling plate 3 includes a first plate 31 and a second plate 32 that are movably connected; the first plate 31 and the second plate 32 cooperate with each other to form an internal liquid cooling channel of the liquid cooling plate 3; the adjusting component 4 can drive the second plate 32 to move relative to or away from the first plate 31 to adjust the cross-sectional area of ​​the internal liquid cooling channel.

[0055] The liquid cooling module provided in this disclosure can be, but is not limited to, liquid cooling devices for CPU liquid cooling, memory liquid cooling, graphics card liquid cooling, or combinations thereof in servers or computers. Specifically, the liquid cooling of memory devices in servers will be used as an example to illustrate the usage process.

[0056] In practical use, the liquid cooling module first connects the inlet and outlet ends of the liquid cooling plate 3 to the inlet section 11 of the inlet component 1 and the outlet section 21 of the outlet component 2, respectively, so that the coolant in the inlet component 1 can enter the internal liquid cooling channel of the liquid cooling plate 3 and be collected back through the outlet component 2. Then, the second plate 32 can be moved towards the first plate 31 to the closest critical position by adjusting the adjusting component 4. At this time, the cross-sectional area of ​​the internal liquid cooling channel formed by the first plate 31 and the second plate 32 is minimized. Finally, the two sides of the outside of the liquid cooling plate 3 are thermally connected to the memory device, so that the heat in the memory device can be transferred to the coolant inside the liquid cooling plate 3, thereby realizing the function of liquid cooling of the memory device.

[0057] In addition, when one or more memory devices experience abnormally high temperatures, the liquid cooling plate 3 connected to it can be adjusted via the adjusting component 4, and the second plate 32 can be moved away from the first plate 31 to increase the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3. This allows the flow rate of the coolant in the liquid cooling plate 3 to be increased individually, thereby improving the liquid cooling efficiency of the liquid cooling plate 3. This enables the individual enhanced heat conduction and cooling of one or more memory devices with abnormally high temperatures, without increasing the overall power consumption of the liquid cooling module. It can also efficiently and quickly enhance the heat dissipation and cooling of individual abnormally high-temperature devices.

[0058] In addition, it is worth noting that the adjustment component 4 can adjust the actual relative position of the first plate 31 and the second plate 32 in the liquid cooling plate 3 by manual adjustment, passive temperature adjustment based on the actual temperature, or active temperature monitoring and adjustment based on the actual temperature.

[0059] Furthermore, multiple liquid cooling plates 3 can be arranged in parallel intervals, and multiple liquid inlet parts 11 and multiple liquid return parts 21 can be arranged one-to-one in the liquid inlet part 1 and the liquid return part 2 respectively. Multiple liquid cooling plates 3 can be arranged in parallel between the liquid inlet part 1 and the liquid return part 2 by one-to-one installation.

[0060] In one embodiment, the first plate 31 and the second plate 32 are respectively provided with mating edges on their facing surfaces, and the mating edges are respectively provided with a protruding insertion edge 311 and an inserting groove 321; the protruding insertion edge 311 is movably and sealingly inserted into the inserting groove 321; wherein, when the adjusting member 4 drives the second plate 32 to move relative to or away from the first plate 31, the protruding insertion edge 311 can correspondingly increase or decrease its actual insertion length in the inserting groove 321.

[0061] Specifically, in combination Figure 2 and Figure 3In further detail, a protruding insert edge 311 is provided in the mating edge of the first plate 31 facing the second plate 32, and an embedding groove 321 is provided in the mating edge of the second plate 32 facing the first plate 31. The protruding insert edge 311 can be inserted into the embedding groove 321 by means of a movable seal. In this way, when the adjusting member 4 drives the second plate 32 to move relative to or away from the first plate 31, the protruding insert edge 311 can increase or decrease its actual insertion length in the embedding groove 321 accordingly, thereby realizing the function of reducing or increasing the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3.

[0062] Furthermore, in order to ensure the sealing of the movable connection between the protruding insert edge 311 and the mounting groove 321, elastic sealing elements can be provided in the outer edge wall of the protruding insert edge 311 or the inner groove wall of the mounting groove 321 to ensure that the two can be reliably sealed when the protruding insert edge 311 is inserted into the mounting groove 321, thereby preventing the coolant in the liquid cooling plate 3 from leaking from here.

[0063] The specific connection arrangement of the first plate 31 and the second plate 32 described above has the advantages of simple structure, enabling the first plate 31 to move relatively flexibly toward or away from the second plate 32, and ensuring a reliable sealed connection between the two.

[0064] In one embodiment, the liquid inlet 11 includes a mounting port 111 and a liquid inlet 112; the liquid inlet end of the first plate 31 is fixedly mounted to the mounting port 111 by the mounting head 312; the liquid inlet end of the second plate 32 is movably inserted into the liquid inlet 112, and the internal liquid cooling channel is correspondingly connected to the liquid inlet 112.

[0065] Specifically, in combination Figure 2 and Figure 3 In further detail, the liquid inlet 11 is configured to include a mounting port 111 and a liquid inlet 112. At this time, the liquid inlet end of the first plate 31 is fixedly snapped into the mounting port 111 by the mounting head 312, and the liquid inlet end of the second plate 32 is movably inserted into the liquid inlet 112.

[0066] When the first plate 31 and the second plate 32 are movably connected, the first plate 31 is fixedly connected and installed in the liquid inlet 11, while the second plate 32 can be installed in the liquid inlet 11 in a corresponding limited position with the first plate 31. At the same time, the second plate 32 can also be moved and adjusted. In this way, the adjusting member 4 can drive the second plate 32 to move toward or closer to the first plate 31 to change the size of the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3.

[0067] The specific arrangement of the liquid inlet section 11 described above has the advantages of simple structure, ensuring the liquid inlet end of the liquid cooling plate 3 can be connected and connected, and also ensuring the movement and adjustment of the second plate 32.

[0068] In one embodiment, the liquid inlet 112 is further provided with a sealing flange 112a protruding towards the center in its inner wall; the liquid inlet end of the liquid cooling plate 3 is inserted into the liquid inlet 112 and seals against the sealing flange 112a; wherein, when the adjusting member 4 drives the second plate 32 to move relative to or away from the first plate 31, the liquid inlet end of the second plate 32 can reciprocate along the sealing flange 112a.

[0069] Specifically, in combination Figure 2 and Figure 4 In further detail, a sealing flange 112a protruding towards the center is provided in the inner wall of the liquid inlet 112. The sealing flange 112a can be, but is not limited to, a plate-shaped flange, an annular flange, etc. In this way, the sealing flange 112a can form a three-stage stepped diameter of the liquid inlet 112 along the liquid inlet direction: "large-small-large".

[0070] Furthermore, the liquid inlet end of the second plate 32 can be sealed and abutted against the sealing edge 112a. When the adjusting member 4 drives the second plate 32 to move relative to or away from the first plate 31, the liquid inlet end of the second plate 32 can also move back and forth along the sealing edge 112a, fully ensuring the sealing docking function and movement adjustment function of the second plate 32 at the liquid inlet 112.

[0071] In one embodiment, the mounting opening 111 includes a mounting slot opened along its own long axis; the mounting head 312 includes a mounting insertion edge 312a that is inserted into the mounting slot, and a sealing edge 312b that is perpendicularly connected to the mounting insertion edge 312a and is used to seal and cover the mounting slot.

[0072] Specifically, in combination Figure 2 and Figure 3 In further detail, a mounting slot is provided in the mounting opening 111 along its long axis, and a mounting insertion edge 312a is correspondingly provided in the mounting head 312 to be inserted into the mounting slot, and a sealing edge 312b is perpendicularly connected to the mounting insertion edge 312a and used to seal and cover the mounting slot. In this way, when the mounting head 312 is mounted in the mounting opening 111, the mounting insertion edge 312a can be inserted into the mounting slot in the mounting opening 111 along its long axis, and at the same time, the sealing edge 312b covers and seals the port of the mounting slot, thereby ensuring the firmness and sealing of the mounting opening 111 and the mounting head 312 when they are mounted.

[0073] In one embodiment, the liquid inlet end of the second plate 32 is further provided with a liquid inlet channel 322; one end of the liquid inlet channel 322 is connected to the liquid inlet 112 and the other end is connected to the internal liquid cooling channel, and the cross-sectional area of ​​the liquid inlet channel 322 is smaller than the cross-sectional area of ​​the internal liquid cooling channel.

[0074] Specifically, in combination Figure 2 and Figure 3 In further detail, a liquid inlet channel 322 is provided at the liquid inlet end of the second plate 32. One end of the liquid inlet channel 322 is connected to the liquid inlet 112 and the other end is connected to the internal liquid cooling channel. Since the cross-sectional area of ​​the liquid inlet channel 322 is smaller than that of the internal liquid cooling channel, the liquid inlet channel 322 and the liquid outlet end face of the liquid inlet 112 can be sealed and connected. This makes the perimeter of the joint between the second plate 32 and the liquid inlet 112 smaller, which makes it easier for the second plate 32 and the sealing flange 112a in the liquid inlet 112 to be fully sealed and connected.

[0075] Moreover, when the coolant flows from the inlet channel 322 into the internal liquid cooling channel with a larger cross-sectional area, the flow rate of the coolant will decrease, thereby enabling the coolant to perform more thorough heat exchange and absorption in the internal liquid cooling channel of the liquid cooling plate 3.

[0076] In one embodiment, the liquid cooling plate 3 further includes a thermally conductive adhesive pad 33; the thermally conductive adhesive pad 33 is respectively attached to the side surfaces of the first plate 31 and the second plate 32 that are facing away from each other.

[0077] Specifically, in combination Figure 2 In further detail, the thermally conductive pads 33 are respectively attached to the back-to-back side panels of the first plate 31 and the second plate 32. In this way, the liquid cooling plate 3 can be connected to the memory device without gaps, with a large area and a firm thermal conductivity through the two back-to-back large-area plates and the thermally conductive pads 33. This allows the heat in the memory device to be more efficiently transferred to the coolant in the liquid cooling plate 3 through the thermally conductive pads 33.

[0078] In one embodiment, the adjusting member 4 includes a shape memory metal spring disposed in the liquid cooling plate 3; one end of the shape memory metal spring is connected to the first plate 31 and the other end is connected to the second plate 32; wherein, when the temperature in the liquid cooling plate 3 is lower than the deformation temperature, the shape memory metal spring is in an elastically contracted state, so that the first plate 31 and the second plate 32 remain close to each other; when the temperature in the liquid cooling plate 3 is higher than the deformation temperature, the shape memory metal spring is in an elastically extended state, so that the first plate 31 and the second plate 32 remain far apart from each other.

[0079] Specifically, in combination Figure 3 and Figure 4To elaborate further, the adjusting component 4 is specifically configured as a shape memory metal spring located within the liquid cooling plate 3, with one end connected to the first plate 31 and the other end connected to the second plate 32. When the temperature in the liquid cooling plate 3 is below the deformation temperature (i.e., the deformation memory temperature of the shape memory metal), the shape memory metal spring is in an elastically contracted state. At this time, the elastic tension of the shape memory metal spring pulls towards the first plate 31 and the second plate 32, causing them to maintain a tendency to move closer together. At this point, the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3 is minimized. Conversely, when the temperature in the liquid cooling plate 3 is above the deformation temperature (i.e., the deformation memory temperature of the shape memory metal), the shape memory metal spring is in an elastically extended state. At this time, the elastic thrust of the shape memory metal spring pulls away from the first plate 31 and the second plate 32, causing them to maintain a tendency to move away from each other. At this point, the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3 gradually reaches its maximum.

[0080] Therefore, when an individual memory device generates abnormal heat, the abnormal heat will cause the temperature of the coolant in the corresponding liquid cooling plate 3 to rise. This will automatically cause the memory metal spring to switch from an elastic contraction state to an elastic extension state, so that the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3 gradually reaches its maximum, thereby adaptively increasing the flow rate of the coolant in the liquid cooling plate 3 and automatically improving the liquid cooling efficiency of the liquid cooling plate 3.

[0081] The aforementioned adjustment component 4 has a simple structure and can automatically match and adjust the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3 through the temperature deformation of the memory metal spring, thereby achieving the beneficial effect of adaptively adjusting the liquid cooling efficiency of the liquid cooling plate 3.

[0082] In one embodiment, the adjusting member 4 includes a drive motor and a transmission assembly that is driven to drive the drive motor; wherein the transmission assembly includes a first transmission member connected to the first plate 31 and a second transmission member connected to the second plate 32; and the drive motor is capable of driving and changing the relative position of the first transmission member and the second transmission member, so as to cause the second plate 32 to move relative to or away from the first plate 31.

[0083] Specifically, the transmission assembly can be configured as a "gear and rack assembly" or a "lead screw and nut assembly", and the moving part in the transmission assembly (e.g., the rack in the gear and rack assembly or the nut in the lead screw and nut assembly) is connected to the second plate 32 as a second transmission member, and another assembly is connected to the first plate 31 as a first transmission member. In this way, when the drive motor drives the gear or the lead screw to reciprocate, the rack or nut can reciprocate accordingly, thereby realizing the function of driving the second plate 32 to move relative to or away from the first plate 31.

[0084] Furthermore, the drive motor can also be used in conjunction with a temperature detection controller. The temperature detector detects the real-time temperature of each memory device. When one or more actual temperatures are higher than a preset threshold temperature, the temperature detection controller can send an electrical signal to control the corresponding drive motor to start driving. This causes the second plate 32 to move relative to or away from the first plate 31, increasing the cross-sectional area of ​​the internal liquid cooling channel in the liquid cooling plate 3, thereby increasing the flow rate and liquid cooling efficiency of the coolant in the liquid cooling plate 3.

[0085] The specific configuration of the aforementioned regulating component 4 enables active detection and control via a temperature detection controller and a drive motor, thereby achieving the beneficial effect of efficiently adjusting the liquid cooling efficiency of the liquid cooling plate 3.

[0086] In addition, this disclosure also provides a liquid cooling heat dissipation system, which includes a liquid supply device and the above-mentioned liquid cooling heat dissipation module; wherein, the liquid supply device includes an inlet pipe 5 and a return pipe 6, and the inlet pipe 5 is correspondingly and electrically connected to the inlet component 1, and the return pipe 6 is correspondingly and electrically connected to the return component 2.

[0087] Specifically, in combination Figure 5 In further detail, this liquid cooling system can be applied to liquid cooling of CPU, memory, graphics card, or combinations thereof in computers. Since the liquid cooling system includes a liquid supply device and the aforementioned liquid cooling module, it can achieve all the beneficial effects of the aforementioned liquid cooling module, which will not be elaborated further here.

[0088] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0089] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A liquid-cooled heat dissipation module, characterized in that, include: Liquid inlet (1), wherein a liquid inlet section (11) is provided in the liquid inlet (1); The return liquid component (2) is spaced apart from the inlet liquid component (1), and the return liquid component (2) has a return liquid part (21) corresponding to the inlet liquid part (11). The liquid cooling plate (3) has its liquid inlet end connected to the liquid inlet section (11) and its liquid return end connected to the liquid return section (21). Adjustment component (4) is connected to the liquid cooling plate (3) in a transmission manner; The liquid cooling plate (3) includes a first plate (31) and a second plate (32) that are movably connected. The first plate (31) and the second plate (32) cooperate to form the internal liquid cooling channel of the liquid cooling plate (3); The adjusting member (4) can drive the second plate (32) to move relative to or away from the first plate (31) to adjust the cross-sectional area of ​​the internal liquid cooling channel.

2. The liquid-cooled heat dissipation module according to claim 1, characterized in that, The first plate (31) and the second plate (32) are respectively provided with mating edges on their respective facing surfaces, and the mating edges of the two are respectively provided with protruding insert edges (311) and embedding grooves (321). The raised insert edge (311) is movably and sealingly inserted into the mounting groove (321). When the adjusting member (4) drives the second plate (32) to move relative to or away from the first plate (31), the protruding insertion edge (311) can correspondingly increase or decrease its actual insertion length in the mounting groove (321).

3. The liquid-cooled heat dissipation module according to claim 1, characterized in that, The liquid inlet (11) includes a mounting port (111) and a liquid inlet (112). The liquid inlet end of the first plate (31) is fixedly snapped into the snap-fit ​​port (111) by the snap-fit ​​head (312). The liquid inlet end of the second plate (32) is movably inserted into the liquid inlet (112), and the internal liquid cooling channel is connected to the liquid inlet (112).

4. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The liquid inlet (112) is also provided with a sealing flange (112a) that protrudes toward the center in its inner wall. The liquid inlet end of the liquid cooling plate (3) is inserted into the liquid inlet (112) and seals against the sealing flange (112a); When the adjusting member (4) drives the second plate (32) to move relative to or away from the first plate (31), the liquid inlet end of the second plate (32) can reciprocate along the sealing flange (112a).

5. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The mounting opening (111) includes a mounting slot opened along its own long axis. The mounting head (312) includes a mounting insert edge (312a) that is inserted into the mounting slot, and a sealing edge (312b) that is perpendicularly connected to the mounting insert edge (312a) and is used to seal and cover the mounting slot.

6. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The liquid inlet end of the second plate (32) is also provided with a liquid inlet channel (322). One end of the liquid inlet channel (322) is connected to the liquid inlet (112) and the other end is connected to the internal liquid cooling channel. The cross-sectional area of ​​the liquid inlet channel (322) is smaller than that of the internal liquid cooling channel.

7. The liquid-cooled heat dissipation module according to claim 3, characterized in that, The liquid cooling plate (3) also includes a thermally conductive pad (33); The thermally conductive pads (33) are respectively attached to the side panels of the first plate (31) and the second plate (32) that are facing away from each other.

8. The liquid-cooled heat dissipation module according to any one of claims 1 to 7, characterized in that, The adjusting member (4) includes a memory metal spring disposed in the liquid cooling plate (3); One end of the memory metal spring is connected to the first plate (31), and the other end is connected to the second plate (32). When the temperature in the liquid cooling plate (3) is lower than the deformation temperature, the memory metal spring is in an elastic contraction state so that the first plate (31) and the second plate (32) remain close to each other; When the temperature in the liquid cooling plate (3) is higher than the deformation temperature, the memory metal spring is in an elastic extension state so that the first plate (31) and the second plate (32) remain far apart from each other.

9. The liquid-cooled heat dissipation module according to any one of claims 1 to 7, characterized in that, The adjusting component (4) includes a drive motor and a transmission assembly that is connected to the drive motor. The transmission assembly includes a first transmission component connected to the first plate (31) and a second transmission component connected to the second plate (32); Furthermore, the drive motor can drive and change the relative position of the first transmission member and the second transmission member, so as to make the second plate (32) move relative to or away from the first plate (31).

10. A liquid cooling heat dissipation system, characterized in that, Includes a liquid supply device and a liquid-cooled heat dissipation module as described in any one of claims 1 to 9; The liquid supply device includes an inlet pipe (5) and a return pipe (6), wherein the inlet pipe (5) is connected to the inlet component (1) and the return pipe (6) is connected to the return component (2).

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