Single-layer cantilever beam pressure-sensitive solid key, key feedback system and electronic device

Abstract

The application provides a single-layer cantilever beam pressure-sensitive solid key, a key feedback system and electronic equipment, the single-layer cantilever beam pressure-sensitive solid key comprising: a key, a cantilever beam pressure-sensitive module, a support assembly and a strain pressure sensor; wherein the key is clamped in a mounting top groove; the cantilever beam pressure-sensitive module comprises a fixed segment and a cantilever beam segment, the cantilever beam segment is suspended above a lower cantilever groove and abuts against the key for deformation; the strain pressure sensor is arranged on the lower surface of the cantilever beam pressure-sensitive module, and when the key is pressed and slid, the strain pressure sensor is used for sensing the deformation and converting the pressure size and position of the deformation into a deformation signal. The position and pressure size pressed by the user are converted into the deformation of the single-layer cantilever beam steel sheet structure, so as to be converted into the parameter change which can be read by the strain pressure sensor, and then the single-layer cantilever beam pressure-sensitive solid key is used for detecting the sliding operation of the user, and meanwhile, the structure realizes the thin and light design.

Description

Technical Field

[0001] This invention relates to the field of button technology, and in particular to a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device. Background Technology

[0002] With the development of technology, electronic devices are becoming increasingly widely used, enabling users to capture images and watch videos. Side buttons, as important input interaction components, are typically a key element of an electronic device's competitiveness in terms of performance and user experience. An electronic device consists of a casing with button structures. Pressing these buttons sends different commands to the device, causing it to perform various operations.

[0003] To achieve a slim, lightweight, highly linear, and precise button design, pressure sensors are typically placed at the corresponding pressing positions to detect the pressure parameters at those positions. However, existing pressure sensors are generally used to detect the overall pressure parameters within a corresponding pressing area, and cannot detect changes in the force applied to the button by the user. Therefore, it is difficult to detect the pressure of continuous sliding, and consequently, it is impossible to adjust the volume, camera focus, or light intensity of electronic devices through sliding button operations, making it difficult to meet the personalized functional requirements of current electronic devices.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of this invention is to provide a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device to solve the problem that existing buttons used in electronic devices cannot achieve button slide detection.

[0006] The technical solution of the present invention is as follows: In a first aspect, the present invention provides a single-layer cantilever beam pressure-sensitive solid-state button, comprising: a button, a cantilever beam pressure-sensitive module, a support assembly, and a strain pressure sensor; wherein... The support component has an mounting top groove on top and an upper cantilever space of a first length on the bottom. The lower surface of the upper cantilever space abuts against the cantilever beam pressure-sensitive module, and the bottom of the upper cantilever space is recessed downward to form a lower cantilever groove of a second length. The button is fitted into the mounting groove from top to bottom; The cantilever beam pressure-sensitive module includes a fixed section and a cantilever beam section. The fixed section of the cantilever beam pressure-sensitive module abuts against the inner wall of the upper cantilever space. The cantilever beam section of the cantilever beam pressure-sensitive module is suspended above the lower cantilever groove and abuts against the button, and is used to deform according to the pressure applied by the button and changes in position. The first length is greater than or equal to the length of the cantilever beam pressure-sensitive module, and the length of the cantilever beam pressure-sensitive module is greater than the second length. The strain pressure sensor is disposed on the lower surface of the cantilever beam pressure-sensitive module. When the button is slidably pressed, the strain pressure sensor is used to sense the deformation generated by the cantilever beam pressure-sensitive module and convert the pressure magnitude and position of the deformation into a deformation signal.

[0007] In a further embodiment of the present invention, an adhesive backing is provided between the contact surfaces of the button and the cantilever beam pressure-sensitive module, the adhesive backing being used to bond and fix the button to the cantilever beam pressure-sensitive module.

[0008] In a further embodiment of the present invention, the cantilever beam pressure-sensitive module is an integrally formed cantilever steel sheet, the cantilever steel sheet comprising a first cantilever beam and a second cantilever beam symmetrically arranged; the fixed sections of the first cantilever beam and the second cantilever beam are located at both ends of the cantilever steel sheet, the force-bearing ends of the first cantilever beam and the second cantilever beam are located in the middle of the cantilever steel sheet, and are fixedly connected to the button.

[0009] In a further embodiment of the present invention, a first through hole is provided between the mounting top groove and the upper cantilever space; The button includes a button body and a first linkage part. The button body is installed in the mounting top groove, and the first linkage part is fixed to the surface of the button body facing the mounting top groove. The first linkage part passes through the first through hole and is connected to the upper surface of the cantilever beam pressure-sensitive module. The button is made of elastic material. The end of the first linkage part extends to both sides along the length direction and is provided with a barb structure. The barb structure abuts against the side of the support component away from the button body, and is used to snap the button onto the support component.

[0010] In a further embodiment of the present invention, the single-layer cantilever beam pressure-sensitive solid-state button also includes two hooks, which are respectively disposed at both ends of the cantilever beam pressure-sensitive module along its length. Each of the aforementioned hooks includes a first hook body and a second hook body; The first hook is arranged along the height direction of the cantilever beam pressure-sensitive module, and the top end of the first hook is connected to the cantilever beam pressure-sensitive module; The second hook is formed by extending horizontally from the top of the first hook toward the other hook, and the second hook is fixedly connected to the top of the upper cantilever space.

[0011] In a further embodiment of the present invention, the strain-pressure sensor includes at least one strain-pressure sensing structure, which is respectively disposed on the lower surface of the first cantilever beam and / or the lower surface of the second cantilever beam; the strain-pressure sensing structure disposed on the lower surface of the first cantilever beam is used to detect the deformation of the first cantilever beam and obtain the first cantilever signal; the strain-pressure sensing structure disposed on the lower surface of the second cantilever beam is used to detect the deformation of the second cantilever beam and obtain the second cantilever signal.

[0012] In a further embodiment of the present invention, the strain pressure sensor includes a first strain gauge, a second strain gauge, a third strain gauge, a fourth strain gauge, and an elastic back plate. The first strain gauge, the second strain gauge, the third strain gauge, and the fourth strain gauge are sequentially arranged at the four corners of the elastic back plate in a clockwise direction. The elastic back plate is disposed on the lower surface of the first cantilever beam and / or the lower surface of the second cantilever beam. The first strain gauge and the fourth strain gauge are disposed at positions away from the force-bearing ends of the first cantilever beam and / or the second cantilever beam, while the second strain gauge and the third strain gauge are disposed at positions close to the force-bearing ends of the first cantilever beam and / or the second cantilever beam.

[0013] Secondly, the present invention provides a button feedback system, comprising: at least one single-layer cantilever beam pressure-sensitive solid-state button as described above, a control module, and a tactile feedback module; wherein, the control module is electrically connected to the single-layer cantilever beam pressure-sensitive solid-state button and electrically connected to the tactile feedback module, and is used to collect the deformation signal output when a user presses the single-layer cantilever beam pressure-sensitive solid-state button, calculate operation information data based on the deformation signal, the operation information data including the magnitude and position of the pressing pressure; and is used to output a button feedback signal corresponding to the operation information data to the tactile feedback module; The tactile feedback module includes a vibration motor, which activates a vibration mode based on the press feedback signal.

[0014] In a further embodiment of the present invention, the control module includes a main control chip, a signal amplification unit, and a motor drive unit; The input end of the signal amplification module is connected to the single-layer cantilever beam pressure-sensitive solid-state button, and the output end of the signal amplification module is connected to the sampling end of the main control chip. The signal amplification module is used to collect the deformation signal in the single-layer cantilever beam pressure-sensitive solid-state button, perform data processing and amplification to obtain operation information data, and output the operation information data to the main control chip. The main control chip is connected to the motor drive unit and is used to store the operation information data and output motor control commands to the motor drive unit according to the operation information data. The motor drive unit is connected to the haptic feedback module and is used to convert the motor control command into a motor drive signal and output the motor drive signal to the haptic feedback module.

[0015] Thirdly, the present invention provides an electronic device comprising a housing and the aforementioned single-layer cantilever beam pressure-sensitive solid-state button, wherein the single-layer cantilever beam pressure-sensitive solid-state button is fixed to the housing, and the support component of the single-layer cantilever beam pressure-sensitive solid-state button is integrally formed with the housing, the button of the single-layer cantilever beam pressure-sensitive solid-state button is exposed in the housing, and the cantilever beam pressure-sensitive module, the support component and the strain pressure sensor are disposed inside the housing.

[0016] This invention provides a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device. The single-layer cantilever beam pressure-sensitive solid-state button includes: a button, a cantilever beam pressure-sensitive module, a support assembly, and a strain pressure sensor. The support assembly has a mounting top groove above it and an upper cantilever space of a first length below it. The lower surface of the upper cantilever space abuts against the cantilever beam pressure-sensitive module, and the bottom of the upper cantilever space is recessed downwards to form a lower cantilever groove of a second length. The button is engaged in the mounting top groove from top to bottom. The cantilever beam pressure-sensitive module includes a fixed section and a cantilever beam section. The cantilever beam segment of the cantilever beam pressure-sensitive module abuts against the inner wall of the upper cantilever space, is suspended above the lower cantilever groove, and abuts against the button, for deformation according to the magnitude and position changes of the pressure applied by the button; the first length is greater than or equal to the length of the cantilever beam pressure-sensitive module, and the length of the cantilever beam pressure-sensitive module is greater than the second length; the strain pressure sensor is disposed on the lower surface of the cantilever beam pressure-sensitive module. When the button is slidably pressed, the strain pressure sensor is used to sense the deformation generated by the cantilever beam pressure-sensitive module and convert the magnitude and position of the deformation pressure into a deformation signal. This invention converts the position and pressure of the user's press into the deformation of a single-layer cantilever beam steel sheet structure, thereby converting it into parameter changes that can be read by a strain pressure sensor. This single-layer cantilever beam pressure-sensitive solid-state button is then used to detect the user's sliding operation. Simultaneously, this structure achieves a thin and light design, meeting the comprehensive needs of modern electronic devices for multi-dimensional interaction, integrated aesthetics, thinness, high precision, and high cost-effectiveness. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a structural block diagram of the button feedback system in a preferred embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram showing the position of the single-layer cantilever beam pressure-sensitive solid-state button on an electronic device in this invention.

[0020] Figure 3 yes Figure 2 A partially enlarged schematic diagram of the pressure-sensitive solid-state button on the single-layer cantilever beam in section A.

[0021] Figure 4 This is a schematic diagram of the length direction of the single-layer cantilever beam pressure-sensitive solid-state button in this invention.

[0022] Figure 5 This is a schematic diagram of the width direction of the single-layer cantilever beam pressure-sensitive solid-state button in this invention.

[0023] Figure 6 This is an exploded view of the single-layer cantilever beam pressure-sensitive solid-state button in this invention.

[0024] Figure 7 This is a schematic diagram of the working principle and equivalent circuit of the single-layer cantilever beam pressure-sensitive solid-state button in this invention.

[0025] Figure 8 This is a curve of deformation signal detection at different positions under a 20g force in this invention.

[0026] Figure 9 This is a circuit diagram of the main control chip in the control module of this invention.

[0027] Figure 10 This is a structural block diagram of a button feedback system in a further embodiment of a preferred embodiment of the present invention.

[0028] The markings in the attached diagram are as follows: 100, button; 110, button body; 120, first linkage part; 130, barb structure; 200, cantilever beam pressure-sensitive module; 210, fixed section; 220, cantilever beam section; 230, first cantilever beam; 240, second cantilever beam; 250, hook; 251, first hook body; 252, second hook body; 300, support component; 310, mounting top groove; 320, upper cantilever space; 330, lower cantilever groove; 400, strain pressure sensor; 410, strain pressure sensing structure; 411, elastic back plate; 500, adhesive backing; 600, first through hole; 700, keyway; 1, single-layer cantilever beam pressure-sensitive solid-state button; 2, control module; 21, signal amplification unit; 22, motor drive unit; 3, tactile feedback module. Detailed Implementation

[0029] This invention provides a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0030] In the implementation methods and claims, unless otherwise specified in the text, the terms "a," "an," "the," and "the" may also include plural forms. If the embodiments of the present invention involve descriptions of "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0031] It should be further understood that the term "comprising" as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, "connected" or "coupled" as used herein can include wireless connections or wireless coupling. The term "and / or" as used herein includes all or any unit and all combinations of one or more associated listed items.

[0032] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0033] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0034] The inventors discovered that with the development of technology, electronic devices are being used more and more widely, and their operation and control functions are becoming increasingly diversified as usage scenarios expand. Taking mobile phones as an example, with the iterative upgrades of mobile phone technology, consumers' demands for interactive experiences across multiple application scenarios continue to rise. Side buttons, as important input interaction components, have become a key element of mobile phone product competitiveness in terms of performance and experience. The future development trend of mobile phone side buttons clearly points to supporting multiple adjustment methods such as clicks, hard presses, and swipes; crisp and clean vibration feedback with a delicate and realistic experience; a seamless appearance to achieve an integrated aesthetic; multi-functional interactive capabilities to expand usage scenarios; and simultaneously meeting the requirements of being thin, light, highly linear, highly accurate, and cost-effective. However, conventional touch buttons have limited functionality and can no longer cover the aforementioned multi-dimensional interactive scenarios.

[0035] Currently, the side-mounted shoulder button design solutions in the mobile phone industry are mainly divided into three types: capacitive sensing, magnetic linkage mechanical shoulder buttons, and solid pressure sensing. Capacitive sensing uses a capacitive FPC (Flexible Printed Circuit) attached to the inner surface of the phone's frame, sensing the curvature of the frame's deformation. This solution is advantageous due to its lowest cost, but it has significant drawbacks: signal sensitivity (uv@100g) can only reach below 200g, while current button sensitivity requirements are gradually reaching 100g, making it unsuitable for current button sensitivity needs. Furthermore, it does not support swipe touch control, resulting in a poor user experience, and is particularly difficult to meet the demands of high-performance operation.

[0036] The magnetic linkage mechanical shoulder button solution uses a magnetically driven linkage structure to trigger the button. Its structure is extremely complex, and it is prone to button feel issues during the development and mass production stages, resulting in low product yield, high overall cost, and poor button feel consistency, which affects the user experience.

[0037] Solid-state pressure-sensitive solutions primarily utilize metal keycaps and stacked I-beam steel sheets. The module consists of metal keycaps, adhesive backing, stacked I-beam steel sheets, and keycap plugs. The keycap plugs have steel sheets embedded within the mold, and the module dimensions are 26.8mm × 2.0mm × 1.35mm. Its main drawback is the 1.35mm module thickness, which significantly encroaches on battery capacity or motherboard space, especially given the limited internal space of mobile phones. Furthermore, the solid-state pressure-sensitive stacked steel sheets require welding, a complex and costly process. The winged structure of the metal keycaps necessitates CNC machining, increasing unit cost. Additionally, to prevent keycaps from detaching, keycap plugs with embedded steel sheets are used to hold the wings in place, further increasing material and assembly costs.

[0038] It is evident that none of the existing three solutions can simultaneously meet the comprehensive requirements of multi-dimensional interaction, integrated aesthetics, thinness, high precision, and high cost-effectiveness. An innovative design solution is urgently needed to address these technical pain points. To solve these technical problems, this invention provides a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device. This single-layer cantilever beam pressure-sensitive solid-state button can be used as a shoulder button on electronic devices for gaming, music, graphic design, and other applications. It can be used as a shoulder button on gaming phones, and also as a solid-state power button, volume buttons, solid-state action buttons, and solid-state camera control buttons. The single-layer cantilever beam pressure-sensitive solid-state button detects pressure and triggers a motor or other tactile feedback structure to simulate physical feedback.

[0039] Please see Figure 1 and Figure 2 This invention provides a button feedback system, comprising: at least one single-layer cantilever beam pressure-sensitive solid-state button 1, a control module 2, and a tactile feedback module 3; the input end of the signal amplification module is connected to the single-layer cantilever beam pressure-sensitive solid-state button 1, and the output end of the signal amplification module is connected to the sampling end of the main control chip U1, for acquiring the deformation signal in the single-layer cantilever beam pressure-sensitive solid-state button 1, performing data processing and amplification to obtain operation information data, and outputting the operation information data to the control module 2.

[0040] The single-layer cantilever beam pressure-sensitive solid-state button 1 described in this invention can be used in any electronic device, such as a smart device like a mobile phone, and can be used as a shoulder button on a mobile phone. Please refer to the following: Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 2 This is a schematic diagram showing the position of the single-layer cantilever beam pressure-sensitive solid-state button 1 on the mobile phone in one embodiment. Figure 3 for Figure 2A partial enlarged view of part A. In some preferred embodiments, the present invention provides a single-layer cantilever beam pressure-sensitive solid-state button 1, which includes: a button 100, a cantilever beam pressure-sensitive module 200, a support component 300, and a strain pressure sensor 400; wherein, a mounting top groove 310 is formed above the support component 300, and an upper cantilever space 320 of a first length is formed below it, the lower surface of the upper cantilever space 320 abuts against the cantilever beam pressure-sensitive module 200, and the bottom of the upper cantilever space 320 is recessed downward to form a lower cantilever groove 330 of a second length; the button 100 is engaged in the mounting top groove 310 from top to bottom; the cantilever beam pressure-sensitive module 200 includes a fixed section 210 and a cantilever beam section 220, the fixed section 210 of the cantilever beam pressure-sensitive module 200... 10 abuts against the inner wall of the upper cantilever space 320. The cantilever beam segment 220 of the cantilever beam pressure-sensitive module 200 is suspended above the lower cantilever groove 330 and abuts against the button 100. It is used to deform according to the pressure applied by the button 100 and the position change. The first length is greater than or equal to the length of the cantilever beam pressure-sensitive module 200, and the length of the cantilever beam pressure-sensitive module 200 is greater than the second length. The strain pressure sensor 400 is disposed on the lower surface of the cantilever beam pressure-sensitive module 200. When the button 100 is slidably pressed, the strain pressure sensor 400 is used to sense the deformation generated by the cantilever beam pressure-sensitive module 200 and convert the pressure magnitude and position of the deformation into a deformation signal.

[0041] Specifically, the single-layer cantilever beam pressure-sensitive solid-state button 1 is located outside the housing of any electronic device, or in a position accessible to the user. The support assembly 300 is fixedly connected to the external housing or other structures, or is directly integrated with the housing, forming a mounting top groove 310 for accommodating the button 100, and an upper cantilever space 320 for accommodating the cantilever beam pressure-sensitive module 200 and the strain pressure sensor 400. Specifically, the lower surface of the cantilever beam pressure rod assembly abuts against the inner wall of the upper cantilever space 320, and the lower cantilever groove 330 is located directly below the cantilever beam segment 220 of the cantilever beam pressure-sensitive module 200, so that there is a deformation space below the cantilever beam segment 220. When downward pressure is applied to the button 100, the pressure is transmitted through the button 100 to the cantilever beam segment 220, causing the cantilever beam segment 220 to be pressed down while the fixed segment 210 remains fixed. This causes the cantilever beam pressure-sensitive module 200 to deform, resulting in the strain pressure sensor 400 on the lower surface of the cantilever beam pressure-sensitive module 200 being stretched or compressed according to the direction of bending deformation. This causes a change in its internal equivalent resistance, which in turn converts the deformation into an electrical signal that indicates the magnitude of the pressure and the position of the press. This electrical signal is the deformation signal, which can be used to calculate the magnitude of the pressure and the position of the press by the user.

[0042] In a further embodiment of the present invention, the cantilever beam pressure-sensitive module 200 is an integrally formed cantilever steel sheet, which includes a first cantilever beam 230 and a second cantilever beam 240 symmetrically arranged. The fixed sections 210 of the first cantilever beam 230 and the second cantilever beam 240 are respectively located at both ends of the cantilever steel sheet. Specifically, the cantilever beam section 220 of the first cantilever beam 230 and the second cantilever beam 240 refers to the freely deformable steel sheet position between the end of the lower cantilever groove 330 and the connection position of the button 100. The force-bearing end of the first cantilever beam 230 and the force-bearing end of the second cantilever beam 240 are located in the middle of the cantilever beam section 220 of the cantilever steel sheet, at the position fixedly connected to the button 100. That is, the force-bearing end is determined by the fixed connection position between the button 100 and the cantilever beam pressure-sensitive module 200.

[0043] For example, please refer to Figure 4 and Figure 5 The cantilever beam pressure-sensitive module 200 is integrally stamped from a 304 stainless steel sheet with a thickness B=0.3mm, a width D=2.3mm, and a single-sided cantilever beam length A=3.85mm. The upper surface of the cantilever beam segment 220 is bonded to the adhesive 500 of the button, and the lower surface is bonded to the strain pressure sensor 400 via the adhesive 500. At least one side of the support assembly 300 has a horizontal opening along its length, forming a keyway 700 communicating with the upper cantilever space 320 and the lower cantilever groove 330. During installation, the cantilever beam pressure-sensitive module 200 is horizontally inserted into the keyway 700, allowing it to be directly snapped into the upper cantilever space 320. The upper surface of the cantilever beam pressure-sensitive module 200 is pre-set with adhesive 500. After the cantilever beam pressure-sensitive module 200 is installed, the button 100 is inserted into the support assembly 300 from top to bottom until the button 100 abuts against the upper surface of the cantilever beam pressure-sensitive module 200. The button 100 and the cantilever beam pressure-sensitive module 200 are then bonded together by the adhesive 500 under pressure. The adhesive 500 can be epoxy resin adhesive, or other types of adhesive, which will not be elaborated further here.

[0044] It should be noted that the thickness of the cantilever beam pressure-sensitive module 200 described in this solution is 0.3mm, but it can also use a single-layer cantilever beam steel sheet of other thicknesses as the cantilever beam pressure-sensitive module 200. The cantilever steel sheet includes fixed sections 210 and cantilever beam sections 220 at both ends in the length direction. The fixed sections 210 are connected to the bracket inside the mobile phone frame by screws. The cantilever beam sections 220 are suspended above the lower cantilever groove 330 and have a gap of I1=0.2mm with the bottom end of the lower cantilever groove 330. The cantilever beam sections 220 are located directly below the button 100, with the upper surface bonded to the adhesive 500 of the keycap, and the strain pressure sensor 400 attached to the lower surface.

[0045] Furthermore, the single-layer cantilever beam pressure-sensitive solid-state button 1 also includes two hooks 250, which are respectively disposed at both ends of the cantilever beam pressure-sensitive module along its length. Each hook 250 includes a first hook body 251 and a second hook body 252. The first hook body 251 is disposed along the height direction of the cantilever beam pressure-sensitive module 200, and its top end is connected to the cantilever beam pressure-sensitive module 200. The second hook body 252 is formed by extending horizontally from the top end of the first hook body 251 toward the other hook 250, and is fixedly connected to the top of the upper cantilever space 320. This fixes the fixed section 210 of the cantilever beam pressure-sensitive module 200, specifically, the cantilever beam pressure-sensitive module 200 and the inner wall of the upper cantilever space 320 are screwed together. The hook 250 on the steel sheet has a height of 1.13mm and interferes with the inner wall of the upper cantilever space 320 of the support assembly 300 by 0.1mm, thereby increasing the fixing strength.

[0046] The strain pressure sensor 400 includes at least one strain pressure sensing structure 410, which is respectively disposed on the lower surface of the first cantilever beam 230 and / or the lower surface of the second cantilever beam 240; the strain pressure sensing structure 410 disposed on the lower surface of the first cantilever beam 230 is used to detect the deformation of the first cantilever beam 230 and obtain the first cantilever signal; the strain pressure sensing structure 410 disposed on the lower surface of the second cantilever beam 240 is used to detect the deformation of the second cantilever beam 240 and obtain the second cantilever signal.

[0047] The first and second cantilever signals are used to calculate the magnitude and position of the pressure applied by the button 100, thereby tracking the pressure and position changes when the user presses the button. Specifically, the number of strain pressure sensing structures 410 can be set according to requirements. Multiple strain pressure sensing structures 410 can be arranged on the cantilever beam to simultaneously detect the deformation of the first cantilever beam 230 and / or the second cantilever beam 240. For example, multiple strain pressure sensing structures 410 can be arranged on the lower surfaces of the first cantilever beam 230 and the second cantilever beam 240 respectively, simultaneously detecting multiple deformation signals for data processing and calculation, thereby minimizing measurement errors. In a further embodiment of a preferred embodiment of the present invention, a strain pressure sensing structure 410 is respectively arranged on the lower surface of the first cantilever beam 230 and the lower surface of the second cantilever beam 240. The resistance of the strain pressure sensing structure 410 increases when stretched and decreases when compressed.

[0048] Furthermore, please refer to the following: Figure 2 , Figure 3 and Figure 7 The strain pressure sensor 400 can be a thin-film piezoelectric element used to sense the deformation of the cantilever beam pressure sensing module 200 caused by pressing, and convert the deformation into an electrical signal. The strain pressure sensor 400 includes a first strain gauge R1, a second strain gauge R2, a third strain gauge R3, a fourth strain gauge R4, and an elastic back plate 411. The first strain gauge R1, the second strain gauge R2, the third strain gauge R3, and the fourth strain gauge R4 are arranged sequentially at the four corners of the elastic back plate 411 in a clockwise direction. The elastic back plate 411 is disposed on the lower surface of the first cantilever beam 230 and / or the lower surface of the second cantilever beam 240. The first strain gauge R1 and the fourth strain gauge R4 are disposed away from the force-bearing end of the first cantilever beam 230 and / or the force-bearing end of the second cantilever beam 240, while the second strain gauge R2 and the third strain gauge R3 are disposed close to the force-bearing end of the first cantilever beam 230 and / or the force-bearing end of the second cantilever beam 240.

[0049] Specifically, the strain pressure sensor 400 uses a printable polymer ink material, which is screen-printed on a circuit board such as an FPC or PCB (Printed Circuit Board) to form a strain pressure sensing material layer that can be used for pressure detection, and converts shape changes into corresponding electrical signals. For example, the thickness of the strain pressure sensing material layer formed by the strain pressure sensor 400 is 0.15mm, that is, the cantilever beam pressure sensing module 200 and the strain pressure sensor 400 form a sheet structure with a thickness of 0.45mm.

[0050] The strain pressure sensor 400 of this invention can be equivalent to a Wheatstone bridge. Specifically, each channel is provided with a first strain gauge R1, a second strain gauge R2, a third strain gauge R3, and a fourth strain gauge R4, and the four strain gauges form a bridge. Each bridge has four pins connected to the power supply Vcc, ground GND, the positive voltage detection terminal V+, and the negative voltage detection terminal V-, respectively. V+ and V- are connected to a voltage readout device or readout circuit to detect the voltage difference across the bridge as a deformation signal output. The equivalent bridge inside the strain pressure sensor 400 is as follows:

[0051] Where Vm is the deformation signal voltage value between V+ and V-, Vcc is the power supply, Rm is the resistance value of the 400Ω strain pressure sensor at the current moment, and K is the strain coefficient. The strain per unit length of the strain pressure sensor 400 after being subjected to force.

[0052] When the cantilever beam pressure-sensitive module 200 bends under pressure, a localized area of ​​the first cantilever beam 230 of the cantilever beam pressure-sensitive module 200 experiences tensile stress, while another area experiences compressive stress, and the two stresses are in balance. Taking the first cantilever beam 230 as an example, the resistance of the first strain gauge R1 and the third strain gauge R3 increases under tensile force; the resistance of the second strain gauge R2 and the fourth strain gauge R4 decreases. Thus, the external force causes a change in the resistance values ​​of the four equivalent resistors on the bridge through the deformation of the strain gauges, which is ultimately reflected in the change of the bridge output voltage.

[0053] For ease of explanation, in some preferred embodiments, the strain pressure sensor 400 includes a first strain pressure sensing structure 410 and a second strain pressure sensing structure 410. The first strain pressure sensing structure 410 is located on the lower surface of the first cantilever beam 230, and the second strain pressure sensing structure 410 is located on the lower surface of the second cantilever beam 240. The first strain pressure sensing structure 410 and the second strain pressure sensing structure 410 have the same structure, both of which are provided with four strain resistance elements. The position of the first strain pressure sensing structure 410 on the lower surface of the first cantilever beam 230 and the position of the second strain pressure sensing structure 410 on the lower surface of the second cantilever beam 240 are the same. In this embodiment, two strain pressure sensing structures 410 are provided on the lower surface of the cantilever beam pressure sensing module 200. When the button is pressed, the steel sheets inside the first and second strain pressure sensing structures 410 bend. Since the first cantilever beam 230 and the second cantilever beam 240 are symmetrically arranged, the first strain resistance sheet R1 and the fourth strain resistance sheet R4 are located away from the force-bearing end of the first cantilever beam 230 and / or the force-bearing end of the second cantilever beam 240, while the second strain resistance sheet R2 and the third strain resistance sheet R3 are located near the force-bearing end of the first cantilever beam 230 and / or the force-bearing end of the second cantilever beam 240. When the button 100 is subjected to downward pressure, the lower surface position away from the force-bearing end and near the fixed section 210 is compressed, while the lower surface position near the force-bearing end and away from the fixed section 210 is stretched. As can be seen, the second strain gauge R2 and the third strain gauge R3, located near the through hole (i.e., near the force-bearing end), are stretched, increasing their resistance; while the first strain gauge R1 and the fourth strain gauge R4, located near the fixed section 210, are compressed, decreasing their resistance. Therefore, the voltage signal generated at the voltage detection end of the Wheatstone bridge changes accordingly. Thus, by generating tensile or compressive strain under stress, the resistance value changes positively or negatively, and a differential signal is output via the Wheatstone bridge. This signal, combined with hardware circuitry, enables the detection of minute strains. It should also be noted that the positions of localized stretching and compression on the cantilever beam pressure-sensing assembly can vary according to changes in the fixed section 210 and the force-bearing end; this will not be elaborated further here.

[0054] When the force is not applied at the center, the degree of bending of the steel sheets of the first strain pressure sensing structure 410 and the second strain pressure sensing structure 410 will differ. For example, when the downward pressure is biased towards the left side of the button 100, the steel sheet of the first strain pressure sensing structure 410 bends more severely, resulting in a stronger signal from the first strain pressure sensing structure 410. The ratio of the signals from the first strain pressure sensing structure 410 and the second strain pressure sensing structure 410 will also differ when the force position changes. Furthermore, there is a one-to-one correspondence between the different force application positions and the ratios of the deformation signals CH1 and CH2 of the first strain pressure sensing structure 410 and the second strain pressure sensing structure 410. When the force position is fixed, but the magnitude of the pressure changes, the hardware system remains stable. Therefore, the deformation of each component increases linearly with the pressure, and the magnitudes of the signals CH1 and CH2 of the first strain pressure sensing structure 410 will change to the same extent, with their ratios remaining constant.

[0055] When the magnitude of the force is determined and the position changes, since the force is distributed on the steel cantilever beam where the first strain pressure sensing structure 410 and the second strain pressure sensing structure 410 are located, the ratio of the force and the deformation of the two cantilever beams will change with the change of the applied force position, but the sum of the force and the deformation remains unchanged. That is, the sum of the deformation signal CH1 of the first strain pressure sensing structure 410 and the deformation signal CH2 of the second strain pressure sensing structure 410 remains unchanged.

[0056] It is evident that there is a pattern between the changes in pressure magnitude and the pressure application position and the value of the deformation signal. Therefore, the deformation signal output during changes in force magnitude and position can be used to determine the force. CH1+CH2 represents the force magnitude, independent of position, while CH1 / CH2 represents the force position, independent of magnitude. Based on the calculation results of these two formulas, the force magnitude and position can be accurately determined, enabling precise touch control of pressure magnitude and precise pressure sliding functionality.

[0057] Further features of the present invention, such as Figure 3 and Figure 4As shown, a first through hole 600 is provided between the mounting top groove 310 and the upper cantilever space 320; the button 100 includes a button body 110 and a first linkage part 120. The button body 110 is installed in the mounting top groove 310, and the first linkage part 120 is fixed to the surface of the button body 110 facing the mounting top groove 310. The first linkage part 120 passes through the first through hole 600 and is connected to the upper surface of the cantilever beam pressure-sensitive module 200; the button 100 is made of elastic material, and the ends of the first linkage part 120 extend to both sides along the length direction with barb structures 130. The barb structures 130 abut against the side of the support component 300 away from the button body 110, for snapping and fixing the button 100 onto the support component 300. For further embodiments of some preferred embodiments of the present invention, please refer to... Figure 6 An adhesive backing 500 is provided between the contact surfaces of the button 100 and the cantilever beam pressure-sensitive module 200. The adhesive backing 500 is used to bond and fix the button 100 to the cantilever beam pressure-sensitive module 200. Specifically, the adhesive backing 500 is pre-placed on the upper surface of the cantilever beam pressure-sensitive module 200 before installation. After the button 100 is inserted and installed, the button 100 contacts the upper surface of the cantilever beam pressure-sensitive module 200, and after pressure bonding, the adhesive backing 500 bonds the cantilever beam pressure-sensitive module 200 and the button 100 together. The button 100 is fixed to the force-bearing point of the cantilever beam segment 220 of the cantilever beam pressure-sensitive module 200 through the first linkage part 120.

[0058] Furthermore, the button 100 is made of elastic material, and the end of the first linkage part 120 extends to both sides along the length direction to provide a barb structure 130. The barb structure 130 abuts against the side of the support component 300 away from the button body 110, and is used to snap the button 100 onto the support component 300.

[0059] Specifically, the key 100 is a plastic keycap, which is integrally molded using a two-color injection molding process of hard and soft plastic, forming a thin sheet with a hard plastic layer on the outside and a soft plastic layer on the inside. Preferably, the hard plastic layer 101 is made of PC (Polycarbonate), and the soft plastic layer 102 is made of TPU (Thermoplastic Polyurethanes). The lower surface of the first linkage part 120 of the plastic keycap is connected to the cantilever beam pressure-sensitive module 200, and inverted structures are provided on both sides. The inverted structures are wing-shaped hooks 250 formed by soft plastic injection molding. For example, there is a gap of I2 = 0.2 mm between the inverted structure and the lower surface of the support component 300, that is, between the inverted structure and the inner wall of the top of the upper cantilever space 320, and the outward inverted amount of the soft plastic wing hooks is 0.3 mm. The plastic keycap is externally mounted from top to bottom into the first through hole 600 of the phone frame. During installation, the soft rubber wings can elastically deform to smoothly insert into the first through hole 600 and automatically return to their original shape after insertion, thereby fixing the button 100 in the first through hole 600. After the barbed structure 130 is inserted, the barbed structure and the lower surface of the support component 300, i.e., the inner wall of the upper cantilever space 320, form a locking amount of more than 0.4mm. At the same time, the first linkage part 120 of the button 100 is bonded and fixed to the upper surface of the cantilever beam pressure-sensitive module 200 by the backing adhesive 500, fixing the button 100 in the support component 300. In a further embodiment of some preferred embodiments of the present invention, the height of the barbed structure at the end of the first linkage part 120 is 0.3mm; the button 100 is bonded to the inner hard rubber layer surface of the plastic keycap using double-sided adhesive (recommended model 3M 4914-015, thickness 0.15mm).

[0060] The control module 2 is electrically connected to the single-layer cantilever beam pressure-sensitive solid-state button 1 and the tactile feedback module 3. It is used to collect the deformation signal output when the user presses the single-layer cantilever beam pressure-sensitive solid-state button 1, calculate operation information data based on the deformation signal, and the operation information data includes the magnitude and position of the pressing pressure. It is also used to output a pressing feedback signal corresponding to the operation information data to the tactile feedback module 3. The tactile feedback module 3 includes a vibration motor, which activates a vibration mode based on the pressing feedback signal.

[0061] Specifically, please refer to the following: Figure 1 , Figure 2 and Figure 9In this invention, the control module 2 is connected to the single-layer cantilever beam pressure-sensitive solid-state button 1 and the tactile feedback module 3, respectively. It processes the electrical signals output by the strain pressure sensor 400, identifies operation commands such as clicks, presses, and slides, and drives the tactile feedback module to output corresponding vibration feedback. The single-layer cantilever beam pressure-sensitive solid-state button 1 can be pressed by the user and triggers the corresponding operation. The tactile feedback module 3 provides tactile feedback when the user presses the button 100. For example, the tactile feedback module can be a motor, using the vibration generated during motor operation as tactile feedback. Preferably, the motor can be a 0809X-axis linear motor with a rated voltage of 3.7V, an adjustable vibration frequency of 50-300Hz, and a maximum amplitude of 0.3mm. The tactile feedback module and the motor are embedded inside the electronic device near the cantilever beam pressure-sensitive module 200, and located below the cantilever beam segment 220 of the corresponding cantilever beam pressure-sensitive module 200, to generate simulated force feedback under the control of the control module 2.

[0062] The control module 2 is integrated onto the mobile phone motherboard, preferably, as follows: Figure 10 As shown, the control module 2 includes a main control chip U1, a signal amplification unit 21, and a motor drive unit 22. The main control chip U1 is connected to the motor drive unit and is used to store the operation information data and output motor control commands to the motor drive unit based on the operation information data. The motor drive unit is connected to the haptic feedback module 3 and is used to convert the motor control commands into motor drive signals and output the motor drive signals to the haptic feedback module 3. The main control chip U1 is an AW86802CSR MCU (Microcontroller Unit). The peripheral circuitry includes a signal amplification unit 21 and a motor drive unit 22. The signal amplification unit 21 is electrically connected to the strain pressure sensor 400, amplifying and filtering the weak electrical signal output by the sensor. The MCU receives the processed signal, identifies operation commands such as clicking (pressure ≥ 5g), pressing (pressure ≥ 20g), and sliding (pressure 10-15g and displacement ≥ 0.5mm), and controls the X-axis linear motor to output corresponding vibrations through the motor drive unit 22. For example, clicking corresponds to a 200Hz short vibration, pressing corresponds to a 300Hz long vibration, and sliding corresponds to a 150Hz continuous gradual vibration. Specifically, the deformation signal distribution of 20g force applied to densely packed points (0.25mm spacing) at different locations is as follows: Figure 8As shown, when a pressure of 20g is applied, the deformation signal CH1 of the first strain pressure sensing structure 410 and the deformation signal CH2 of the second strain pressure sensing structure 410 are linearly related to the position change, and both can achieve a deformation signal readout of about 900uV, noise of 5uV, and signal-to-noise ratio SNR=180. It can be seen that the single-layer cantilever beam pressure-sensitive solid-state button 1 in this invention can meet the ultra-high sensitivity and linear readout requirements in actual use.

[0063] When the user operates the single-layer cantilever beam pressure-sensitive solid-state button 1, pressing the button 100 downwards, the button body 110 transmits the pressure to the cantilever beam pressure-sensitive module 200 below, causing a slight deformation in the cantilever beam segment 220; the strain pressure sensor 400 attached to the lower surface of the cantilever beam segment 220 senses the deformation and converts it into a corresponding electrical signal; the electrical signal is filtered and amplified by the signal amplification unit 21 of the control module 2 and then transmitted to the main control chip U1; the main control chip U1 performs analog-to-digital conversion and algorithm processing on the electrical signal, and identifies the operation type based on the pressure value and displacement change. For example, if the pressure is ≥5g and there is no obvious displacement, it is determined to be a click operation, and a click command is output to the game system of the electronic device. At the same time, the X-axis linear motor of model 0809 is driven to generate a 200Hz short vibration feedback. If the pressure is ≥20g, it is determined to be a hard press operation, and a hard press command is output, driving the motor to generate a 300Hz long vibration feedback. If the pressure is maintained at 10-15g and a displacement of ≥0.5mm is detected, it is determined to be a sliding operation. According to the displacement distance (each 0.5mm corresponds to one gear), a sliding gear command is output, driving the motor to generate a 150Hz continuous gradual vibration feedback. After the operation is completed, the cantilever beam pressure sensing module 200 elastically resets, the strain pressure sensor 400 signal returns to zero, the control module 2 stops feedback and waits for the next operation.

[0064] Based on the same inventive concept, the present invention further provides an electronic device, which includes a housing and the aforementioned single-layer cantilever beam pressure-sensitive solid-state button. The single-layer cantilever beam pressure-sensitive solid-state button is fixed to the housing, and the support component of the single-layer cantilever beam pressure-sensitive solid-state button is integrally formed with the housing. The button of the single-layer cantilever beam pressure-sensitive solid-state button is exposed in the housing, and the cantilever beam pressure-sensitive module, the support component, and the strain pressure sensor are disposed within the housing. Correspondingly, the control module is integrated on the mobile phone motherboard or a separate FPC. Specific details are as described in the specific embodiment of the single-layer cantilever beam pressure-sensitive solid-state button, and will not be repeated here.

[0065] This invention provides a single-layer cantilever beam pressure-sensitive solid-state button, a button feedback system, and an electronic device, which have the following beneficial effects: It offers a rich multi-dimensional interactive experience, supporting adjustments through multiple methods such as clicking, pressing, and swiping. The swiping sensitivity can reach 10g, the swiping resolution is 0.5mm, and it has up to 60 swiping levels to meet the precise operation needs in game scenarios, such as character output operations and view adjustment.

[0066] The integrated aesthetic design features a thin, sheet-like outer structure for the buttons, resulting in a flush appearance with the phone's frame after installation. This meets the requirements of integrated aesthetic design and enhances the overall visual quality of the phone.

[0067] With high sensitivity and accuracy, the strain pressure sensor, combined with a single-layer cantilever beam steel sheet structure, achieves a signal sensitivity (uv@100g) of up to 4000, while the button sensitivity is controlled within 5g, which is far superior to existing capacitive sensing solutions. The operation response is fast and highly accurate.

[0068] The lightweight and thin design takes up little space. The thickness of the entire cantilever beam pressure-sensitive module has been reduced from 1.35mm in the existing solution to 0.45mm, which is only 1 / 3 of the original thickness. This significantly reduces the space occupied by the internal battery capacity and motherboard components of the phone, providing more room for the design of other components in the phone.

[0069] The simplified process and reduced costs make it suitable for the mid-to-low-end market. Utilizing plastic keycaps and a single-layer cantilever beam steel sheet structure, this technology reduces the amount of materials required compared to existing technologies that use metal keycaps, keycap plugs, and stacked steel sheets. It also eliminates the welding process for the stacked steel sheets and the CNC machining process for the metal keycaps, significantly reducing process complexity and overall cost. This results in a superior cost-performance ratio, making this pressure-sensitive shoulder button technology applicable to mid-to-low-end mobile phone projects and expanding its applicability.

[0070] This invention transforms the user's pressing position and pressure into the deformation of a single-layer cantilever beam steel sheet structure, thereby converting it into parameter changes that can be read by a strain pressure sensor. This single-layer cantilever beam pressure-sensitive solid-state button is then used to detect the user's sliding operation. At the same time, this structure achieves a thin and light design, meeting the comprehensive needs of modern electronic devices for multi-dimensional interaction, integrated aesthetics, thinness, high precision, and high cost performance.

[0071] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A single-layer cantilever beam pressure-sensitive solid-state button, characterized in that, include: Buttons, cantilever beam pressure-sensitive module, support assembly, and strain pressure sensor; among which, The support component has an mounting top groove on top and an upper cantilever space of a first length on the bottom. The lower surface of the upper cantilever space abuts against the cantilever beam pressure-sensitive module, and the bottom of the upper cantilever space is recessed downward to form a lower cantilever groove of a second length. The button is fitted into the mounting groove from top to bottom; The cantilever beam pressure-sensitive module includes a fixed section and a cantilever beam section. The fixed section of the cantilever beam pressure-sensitive module abuts against the inner wall of the upper cantilever space. The cantilever beam section of the cantilever beam pressure-sensitive module is suspended above the lower cantilever groove and abuts against the button, and is used to deform according to the pressure applied by the button and changes in position. The first length is greater than or equal to the length of the cantilever beam pressure-sensitive module, and the length of the cantilever beam pressure-sensitive module is greater than the second length. The strain pressure sensor is disposed on the lower surface of the cantilever beam pressure-sensitive module. When the button is slidably pressed, the strain pressure sensor is used to sense the deformation generated by the cantilever beam pressure-sensitive module and convert the pressure magnitude and position of the deformation into a deformation signal. The cantilever beam pressure-sensitive module is an integrally formed cantilever steel sheet, which includes a first cantilever beam and a second cantilever beam symmetrically arranged. The fixed sections of the first and second cantilever beams are located at both ends of the cantilever steel sheet, and the force-bearing ends of the first and second cantilever beams are located in the middle of the cantilever steel sheet and are fixedly connected to the button. At least one side of the support assembly has a horizontal opening along the length direction and forms a keyway communicating with the upper cantilever space and the lower cantilever groove. During installation, the cantilever beam pressure-sensitive module is inserted horizontally into the keyway and directly snapped into the upper cantilever space.

2. The single-layer cantilever beam pressure-sensitive solid-state button according to claim 1, characterized in that, An adhesive backing is provided between the contact surfaces of the button and the cantilever beam pressure-sensitive module, and the adhesive backing is used to bond and fix the button to the cantilever beam pressure-sensitive module.

3. The single-layer cantilever beam pressure-sensitive solid-state button according to claim 1, characterized in that, A first through hole is provided between the mounting top groove and the upper cantilever space; The button includes a button body and a first linkage part. The button body is installed in the mounting top groove, and the first linkage part is fixed to the surface of the button body facing the mounting top groove. The first linkage part passes through the first through hole and is connected to the upper surface of the cantilever beam pressure-sensitive module. The button is made of elastic material. The end of the first linkage part extends to both sides along the length direction and is provided with a barb structure. The barb structure abuts against the side of the support component away from the button body, and is used to snap the button onto the support component.

4. The single-layer cantilever beam pressure-sensitive solid-state button according to claim 1, characterized in that, The single-layer cantilever beam pressure-sensitive solid-state button also includes two hooks, which are respectively disposed at both ends of the cantilever beam pressure-sensitive module along its length. Each of the aforementioned hooks includes a first hook body and a second hook body; The first hook is arranged along the height direction of the cantilever beam pressure-sensitive module, and the top end of the first hook is connected to the cantilever beam pressure-sensitive module; The second hook is formed by extending horizontally from the top of the first hook toward the other hook, and the second hook is fixedly connected to the top of the upper cantilever space.

5. The single-layer cantilever beam pressure-sensitive solid-state button according to claim 1, characterized in that, The strain pressure sensor includes at least one strain pressure sensing structure, which is respectively disposed on the lower surface of the first cantilever beam and / or the lower surface of the second cantilever beam; the strain pressure sensing structure disposed on the lower surface of the first cantilever beam is used to detect the deformation of the first cantilever beam and obtain the first cantilever signal. The strain-pressure sensing structure disposed on the lower surface of the second cantilever beam is used to detect the deformation of the second cantilever beam and obtain the second cantilever signal.

6. The single-layer cantilever beam pressure-sensitive solid-state button according to claim 5, characterized in that, The strain pressure sensor includes a first strain gauge, a second strain gauge, a third strain gauge, a fourth strain gauge, and an elastic back plate. The first strain gauge, the second strain gauge, the third strain gauge, and the fourth strain gauge are arranged sequentially at the four corners of the elastic back plate in a clockwise direction. The elastic back plate is disposed on the lower surface of the first cantilever beam and / or the lower surface of the second cantilever beam. The first strain gauge and the fourth strain gauge are disposed at positions away from the force-bearing ends of the first cantilever beam and / or the second cantilever beam, while the second strain gauge and the third strain gauge are disposed at positions close to the force-bearing ends of the first cantilever beam and / or the second cantilever beam.

7. A button feedback system, characterized in that, include: At least one single-layer cantilever beam pressure-sensitive solid-state button, control module, and haptic feedback module as described in any one of claims 1-6; wherein, the control module is electrically connected to the single-layer cantilever beam pressure-sensitive solid-state button and electrically connected to the haptic feedback module, and is used to collect the deformation signal output when the user presses the single-layer cantilever beam pressure-sensitive solid-state button, calculate operation information data based on the deformation signal, the operation information data including the magnitude and position of the pressing pressure; and is used to output a pressing feedback signal corresponding to the operation information data to the haptic feedback module; The tactile feedback module includes a vibration motor, which activates a vibration mode based on the press feedback signal.

8. The button feedback system according to claim 7, characterized in that, The control module includes a main control chip, a signal amplification unit, and a motor drive unit; The input end of the signal amplification unit is connected to the single-layer cantilever beam pressure-sensitive solid-state button, and the output end of the signal amplification unit is connected to the sampling end of the main control chip. The signal amplification unit is used to collect the deformation signal in the single-layer cantilever beam pressure-sensitive solid-state button, perform data processing and amplification to obtain operation information data, and output the operation information data to the main control chip. The main control chip is connected to the motor drive unit and is used to store the operation information data and output motor control commands to the motor drive unit according to the operation information data. The motor drive unit is connected to the haptic feedback module and is used to convert the motor control command into a motor drive signal and output the motor drive signal to the haptic feedback module.

9. An electronic device, characterized in that, The device includes a housing and a single-layer cantilever beam pressure-sensitive solid-state button as described in any one of claims 1-6. The single-layer cantilever beam pressure-sensitive solid-state button is fixed to the housing, and the support component of the single-layer cantilever beam pressure-sensitive solid-state button is integrally formed with the housing. The upper surface of the button of the single-layer cantilever beam pressure-sensitive solid-state button is at the same height as the housing. The cantilever beam pressure-sensitive module, the support component, and the strain pressure sensor are disposed inside the housing.

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