Ultrafast laser cutting method and system for transparent brittle material closed pattern

Abstract

The invention relates to an ultrafast laser cutting method and system for a closed pattern of a transparent brittle material, and relates to the field of ultrafast laser cutting materials, and the ultrafast laser cutting method comprises the steps that the contour of a target element and the physical characteristics of the material are collected; generating an equidistant concentric internal contour based on the target element contour; a guide line layout scheme is obtained by combining the equidistant concentric internal contour and a preset guide line generation rule; determining a laser scanning path based on the guide line layout scheme and the physical properties of the material; controlling the ultrafast Bessel laser beam to carry out scanning processing according to the laser scanning path so as to form a through-type modified belt containing microcracks; and the heat effect laser beam is controlled to conduct irradiation treatment based on the penetrating type modified belt and the preset thermal stress parameters, so that automatic separation of the target element and the surrounding material is achieved by combining thermal stress generated by the irradiation treatment with residual stress in the material. The method has the effect of improving the cutting efficiency of the transparent brittle material.

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