Hot press device and hot press method for fuel cell membrane electrode

Abstract

The application discloses a hot-pressing device and method for a fuel cell membrane electrode. The hot-pressing device is used for hot-pressing and bonding a catalyst-coated membrane and a membrane electrode frame included in a membrane electrode assembly, and comprises an upper die assembly and a lower die assembly. The upper die assembly comprises an upper die hot-pressing block and an upper die cooling block. A working surface of the upper die hot-pressing block is used for pressing and bonding a bonding area of the membrane electrode assembly. The upper die cooling block is arranged on the inner side of the upper die hot-pressing block and is used for pressing and cooling an active area of the membrane electrode assembly. The lower die assembly comprises a lower die hot-pressing block and a lower die cooling block. A working surface of the lower die hot-pressing block corresponds to the working surface of the upper die hot-pressing block and is used for cooperating with the working surface of the upper die hot-pressing block to press and bond the bonding area. The lower die cooling block is arranged on the inner side of the lower die hot-pressing block and corresponds to the upper die cooling block, and is used for cooperating with the upper die cooling block to press and cool the active area. The hot-pressing device and method provided by the application can realize hot-pressing and bonding and effectively protect the active area of the membrane electrode from thermal damage caused by the hot-pressing process.

Description

Technical Field

[0001] This invention relates to the field of fuel cell technology, and in particular to a hot pressing device and method for fuel cell membrane electrode assembly. Background Technology

[0002] The membrane electrode assembly (MEA) is the core component of a fuel cell stack, and its performance and reliability directly determine the power output and lifespan of the fuel cell. During the manufacturing process of the MEA, the catalyst-coated membrane (CCM) is typically encapsulated and bonded to the MEA frame, which provides sealing, insulation, and mechanical support, using a hot-pressing process. This process utilizes a hot-press mold to apply specific temperature and pressure to the pre-coated adhesive component, causing the adhesive to melt, flow, and ultimately solidify, thereby forming a stable and reliable encapsulation structure.

[0003] Currently, mainstream membrane electrode assembly (MEA) thermoforming processes typically employ a flat, heated mold, applying pressure to the MEA assembly while simultaneously heating the entire contact area. However, at the thermoforming temperature, the CCM (Chemical Membrane Molding) swells upon heating. After being subjected to 100°C during thermoforming, the MEA can deform significantly, exceeding its dimensions. This alters the shape, thickness, and position of the adhesive. If the adhesive overflows into the MEA reaction zone, it reduces the stack power, and in severe cases, leads to insufficient bonding width and adhesive gaps, resulting in MEA encapsulation failure.

[0004] Therefore, it is necessary to propose a technical solution to overcome the shortcomings of existing technologies. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, this invention proposes a hot pressing device and hot pressing method for fuel cell membrane electrodes, which can efficiently complete the hot pressing bonding of the frame area while effectively protecting the active area of ​​the membrane electrode from thermal damage during the hot pressing process.

[0006] This invention is achieved through the following technical solution: a hot-pressing device for a fuel cell membrane electrode assembly, used to hot-press and bond the catalyst coating membrane and membrane electrode frame, comprising an upper mold assembly and a lower mold assembly, wherein: The upper mold assembly includes an upper mold hot pressing block and an upper mold cooling block. The working surface of the upper mold hot pressing block is used to press the bonding area of ​​the membrane electrode assembly. The upper mold cooling block is disposed inside the upper mold hot pressing block and is used to press and cool the active area of ​​the membrane electrode assembly. The lower mold assembly includes a lower mold hot pressing block and a lower mold cooling block. The working surface of the lower mold hot pressing block corresponds to the working surface of the upper mold hot pressing block and is used to press the bonding area together with the working surface of the upper mold hot pressing block. The lower mold cooling block is located inside the lower mold hot pressing block and corresponds to the upper mold cooling block. It is used to press and cool the active area together with the upper mold cooling block.

[0007] As a further improved technical solution, at least one of the upper mold cooling block and the lower mold cooling block is a floating component, which can float relative to the hot press block on which it is located in the pressing direction.

[0008] As a further improved technical solution, an elastic element is provided below the floating element. In the initial state, the floating element protrudes from the working surface of the hot press block under the pressure of the elastic element, so that it contacts the membrane electrode assembly before the working surface of the hot press block during the pressing process.

[0009] As a further improved technical solution, at least one of the upper mold hot pressing block and the lower mold hot pressing block is provided with a guide groove on its working surface, and the position of the guide groove is configured to correspond to the inner edge of the membrane electrode frame.

[0010] As a further improved technical solution, the working surfaces of the upper mold hot pressing block and the lower mold hot pressing block extend inward beyond the inner edge of the membrane electrode frame, and the overflow closure line formed by the pressing active area of ​​the upper mold cooling block and the lower mold cooling block at their edges has a gap with the inner edge of the membrane electrode frame to form an overflow area.

[0011] As a further improved technical solution, the upper mold assembly is arranged on one side of the membrane electrode frame, the lower mold assembly is arranged on one side of the catalyst coating film, the floating component is the lower mold cooling block, and the adhesive guide groove is formed on the lower mold hot pressing block.

[0012] As a further improved technical solution, at least one of the upper mold hot pressing block and the lower mold hot pressing block is provided with an adhesive layer.

[0013] As a further improved technical solution, the overlay layer is a heat-resistant rubber with a thickness of 2mm to 10mm and a Shore hardness of 50 to 80.

[0014] As a further improved technical solution, at least one of the upper mold cooling block and the lower mold cooling block is a water-cooled plate. The hot pressing device also includes a temperature sensor for detecting the temperature of the upper mold cooling block, the lower mold cooling block, the upper mold hot pressing block and the lower mold hot pressing block, and a water chiller for providing coolant to the water-cooled plate.

[0015] This invention is also achieved through the following technical solution: a hot-pressing method for a fuel cell membrane electrode assembly, wherein the hot-pressing method uses the hot-pressing device described above to press and cure a membrane electrode assembly pre-sprayed with adhesive, the hot-pressing method comprising: S1. Provide a membrane electrode assembly and place it on the lower mold assembly. In the initial state, the top surface of the lower mold cooling block of the lower mold assembly protrudes from the top surface of the lower mold hot pressing block to support the membrane electrode assembly. S2. Drive the upper mold assembly to press down, and the upper mold cooling block and the lower mold cooling block of the upper mold assembly clamp and press the active area of ​​the film electrode assembly. S3. Continue to press down the upper mold assembly so that the upper mold hot press block contacts the lower mold hot press block and presses the bonding area of ​​the film electrode assembly together. The adhesive flows and solidifies under pressure. During the pressing process, the upper mold cooling block and the lower mold cooling block are cooled to reduce the temperature of the active area.

[0016] The hot pressing device for fuel cell membrane electrode assembly provided by this invention achieves independent temperature control of the bonding area and active area during the pressing process by setting hot pressing blocks and cooling blocks in the upper mold assembly and lower mold assembly respectively. This effectively avoids swelling and deformation of the CCM due to heat during hot pressing, while precisely controlling the flow path and curing form of the adhesive to prevent adhesive contamination of the active area. This ensures the width and reliability of the encapsulation and bonding, and significantly improves the first-pass yield and product performance consistency of the hot pressing encapsulation of the membrane electrode assembly. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the membrane electrode assembly.

[0018] Figure 2 This is a schematic diagram of the hot pressing device and membrane electrode assembly of the present invention.

[0019] Figure 3 This is a partial schematic diagram of the lower mold assembly and the membrane electrode assembly of the hot pressing device of the present invention.

[0020] Figure 4 This is a schematic diagram of the pressing of the hot pressing device and the membrane electrode assembly of the present invention.

[0021] Figure 5 This is a perspective view of the upper mold cooling block of the hot pressing device of the present invention.

[0022] Figure 6 This is a perspective view of the upper mold hot pressing block of the hot pressing device of the present invention.

[0023] Figure 7 This is a perspective view of the lower mold hot pressing block of the hot pressing device of the present invention.

[0024] Figure 8 This is a perspective view of the lower mold cooling block of the hot pressing device of the present invention.

[0025] Reference numerals: 100, Membrane electrode assembly; 1, Membrane electrode frame; 101, Active area frame opening; 102, Inner edge; 103, Adhesive overflow area; 2, Catalyst coating membrane; 201, Active area; 3, Adhesive; 4, Cathode gas diffusion layer; 5, Cathode-side adhesive; 6, Anode gas diffusion layer; 7, Anode-side adhesive; 10, Upper mold assembly; 11, Upper mold hot press block; 111, Coating layer; 112, Upper mold heating element; 113. Upper hot press temperature sensor; 12. Upper mold cooling block; 121. Upper water cooling pipe; 122. Upper water cooling temperature sensor; 20. Lower mold assembly; 21. Lower mold hot press block; 211. Glue guide groove; 212. Lower mold heating element; 213. Lower hot press temperature sensor; 22. Lower mold cooling block; 221. Lower water cooling pipe; 222. Lower water cooling temperature sensor; 23. Elastic element; 231. Floating plate; L. Glue overflow closure line. Detailed Implementation

[0026] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] This invention provides a hot-pressing device and method for fuel cell membrane electrodes, addressing problems such as the susceptibility of catalyst coated membranes (CCMs) to heat deformation and uncontrollable binder flow in existing hot-pressing processes. The structure, working principle, and steps of the hot-pressing method of this invention will be described in detail below with reference to the accompanying drawings.

[0029] like Figures 1 to 8As shown, a hot pressing device for a fuel cell membrane electrode assembly is used to hot press and bond the catalyst coating membrane 2 and the membrane electrode frame 1 of the membrane electrode assembly 100. The device includes an upper mold assembly 10 and a lower mold assembly 20. The upper mold assembly 10 includes an upper mold hot pressing block 11 and an upper mold cooling block 12. The working surface of the upper mold hot pressing block 11 is used to press the bonding area of ​​the membrane electrode assembly 100. The upper mold cooling block 12 is disposed inside the upper mold hot pressing block 11 and is used to press and cool the active area 201 of the membrane electrode assembly 100. The lower mold assembly 20 includes a lower mold hot pressing block 21 and a lower mold cooling block 22. The working surface of the lower mold hot pressing block 21 corresponds to the working surface of the upper mold hot pressing block 11 and is used to press the bonding area together with the working surface of the upper mold hot pressing block 11. The lower mold cooling block 22 is located inside the lower mold hot pressing block 21 and corresponds to the upper mold cooling block 12. It is used to press and cool the active area 201 together with the upper mold cooling block 12.

[0030] The hot pressing device for fuel cell membrane electrode assembly provided by the present invention achieves independent temperature control of the bonding area and active area 201 during the pressing process by setting a hot pressing block and a cooling block on the upper mold assembly 10 and the lower mold assembly 20 respectively. This effectively avoids swelling and deformation of the CCM due to heat during the hot pressing process. At the same time, it precisely controls the flow path and curing form of the adhesive 3, preventing the adhesive 3 from contaminating the active area 201, ensuring the width and reliability of the encapsulation and bonding, and significantly improving the first-pass yield and product performance consistency of the hot pressing encapsulation of the membrane electrode.

[0031] First, please refer to Figure 1 This illustrates the basic structure of the membrane electrode assembly 100 to be bonded. The membrane electrode assembly 100 includes a membrane electrode frame 1, a catalyst-coated film 2, an adhesive 3 sprayed onto the bonding area between the membrane electrode frame 1 and the catalyst-coated film 2, a cathode gas diffusion layer 4, a cathode-side adhesive 5, an anode gas diffusion layer 6, and an anode-side adhesive 7. Please refer to the attached document. Figure 3 As shown, the membrane electrode frame 1 has an active area frame opening 101 in the middle, and its inner edge 102 defines the range of the active area 201 of the catalyst coating membrane 2 after encapsulation. Before hot-pressing encapsulation, the components are assembled together through preliminary positioning, and the adhesive 3 has not yet fully cured. During the hot-pressing process, the cathode gas diffusion layer 4 can be connected and fixed to the membrane electrode frame 1 through the cathode-side adhesive 5, and the anode gas diffusion layer 6 can be connected and fixed to the catalyst coating membrane 2 through the anode-side adhesive 7.

[0032] The core design concept of the hot pressing device of this invention lies in physically separating and coordinating the hot pressing function for heating and curing the adhesive 3 with the cooling function for protecting the active area 201 in the mold structure. For example... Figures 2 to 4 As shown, the hot pressing device mainly includes an upper mold assembly 10 and a lower mold assembly 20.

[0033] like Figure 2 , Figures 4 to 6 As shown, the upper mold assembly 10 includes an upper mold hot pressing block 11 and an upper mold cooling block 12. The upper mold hot pressing block 11 can be made of a metal material with good thermal conductivity and is generally frame-shaped. An upper mold heating element 112 is embedded inside the upper mold hot pressing block 11. The upper mold heating element 112 is, for example, an electric heating rod, used to heat the upper mold hot pressing block 11. The working surface of the upper mold hot pressing block 11, that is, its lower surface, is used to contact and press the bonding area of ​​the membrane electrode assembly 100 during pressing, that is, the area where the edge of the membrane electrode frame 1 overlaps with the edge of the catalyst coating film 2 and is coated with adhesive 3. In order to accurately control the working temperature of the upper mold hot pressing block 11, an upper hot pressing temperature sensor 113 is also installed on it to monitor the temperature in real time and participate in the temperature closed-loop control to ensure that the hot pressing temperature is stable within the curing temperature range required by the adhesive 3.

[0034] The upper mold cooling block 12 is disposed inside the frame-shaped upper mold hot pressing block 11, corresponding to the position of the central active area 201 of the membrane electrode assembly 100 during pressing. The upper mold cooling block 12 is preferably a water-cooled plate structure, with an internal water-cooling channel connected to an external water chiller (not shown in the figure) via an upper water-cooling pipe 121. The external water chiller circulates coolant into the upper mold cooling block 12, stabilizing its temperature within a low range, for example, 21°C to 26°C. Similarly, an upper water-cooling temperature sensor 122 is provided on the upper mold cooling block 12 to monitor its temperature and ensure cooling effectiveness. The working surface of the upper mold cooling block 12 is used to contact and press the active area 201 of the membrane electrode assembly 100 during pressing. By actively cooling the active area 201, the temperature of the catalyst-coated membrane 2 is effectively prevented from rising due to heat radiation from the hot pressing block, thereby preventing thermal swelling and deformation of the CCM and ensuring the dimensional stability of the finished membrane electrode. In some other embodiments, the upper mold cooling block 12 is not limited to water cooling; it can also be cooled by gas cooling or semiconductor refrigeration.

[0035] like Figures 2 to 4 , Figure 7 and Figure 8As shown, the lower mold assembly 20 corresponds to the upper mold assembly 10 and includes a lower mold hot pressing block 21 and a lower mold cooling block 22. The structure of the lower mold hot pressing block 21 is similar to that of the upper mold hot pressing block 11. It has an embedded lower mold heating element 212 and is equipped with a lower hot pressing temperature sensor 213 for heating and controlling the temperature of the working surface of the lower mold hot pressing block 21, so that it works in conjunction with the upper mold hot pressing block 11 to heat and pressurize the bonding area. The lower mold cooling block 22 is located inside the lower mold hot pressing block 21 and corresponds vertically to the upper mold cooling block 12. The lower mold cooling block 22 is also preferably a water-cooled plate structure, which is connected to a lower water-cooling pipe 221 and equipped with a lower water-cooling temperature sensor 222. It is cooled by an external water chiller, and its working surface is used to cooperate with the upper mold cooling block 12 to clamp and cool the active area 201. In some other embodiments, the lower mold cooling block 22 is not limited to water cooling; it can also be cooled by gas cooling or semiconductor refrigeration.

[0036] Please refer to this carefully. Figures 2 to 4 As shown, in the hot pressing device provided by the present invention, at least one of the upper mold cooling block 12 and the lower mold cooling block 22 is a floating member, which can float relative to the hot pressing block it is located on in the pressing direction. An elastic member 23 is disposed below the floating member. In the initial state, the floating member protrudes from the working surface of the hot pressing block it is located on due to the abutment of the elastic member 23, so that it contacts the membrane electrode assembly 100 before the working surface of the hot pressing block it is located on during the pressing process. In this embodiment, the lower mold cooling block 22 is designed as a floating member that can float relative to the lower mold hot pressing block 21 in the vertical pressing direction. Specifically, the lower mold cooling block 22 is mounted via a floating plate 231, and an elastic member 23 is disposed below the floating plate 231. The elastic member 23 is, for example, multiple springs. In the initial state, i.e., the unpressed state, the elastic force of the elastic member 23 causes the top surface of the lower mold cooling block 22 to protrude from the top surface of the lower mold hot pressing block 21 by a certain height, for example, 5mm to 8mm. This design ensures that when the membrane electrode assembly 100 is placed, the active area 201 of the membrane electrode assembly 100 is first supported by the lower mold cooling block 22, while the bonding area coated with adhesive 3 is suspended and does not come into contact with the high-temperature lower mold hot pressing block 21. This effectively prevents the adhesive 3 from partially curing due to premature contact with the heat source before the formal pressing begins, avoiding the risk that the adhesive 3 will not be able to be evenly pressed apart due to decreased fluidity during subsequent pressing. Since the adhesive 3 is not heated in advance, the heating time is from the beginning of the upper and lower mold closing to the end of the upper and lower mold separation, thus allowing for precise control of the hot pressing time.

[0037] In some embodiments, at least one of the upper mold hot pressing block 11 and the lower mold hot pressing block 21 has a guide groove 211 on its working surface. The guide groove 211 is positioned corresponding to the inner edge 102 of the membrane electrode frame 1. Specifically, in order to accurately guide and control the flow path of the molten adhesive 3 during the pressing process, and to prevent the adhesive 3 from flowing disorderly during the pressing process, causing contamination of the active area 201, or resulting in less adhesive 3 remaining in the bonding area and affecting the bonding effect, this embodiment has a guide groove 211 on the working surface of the lower mold hot pressing block 21. The guide groove 211 is positioned near the inner edge 102 of the membrane electrode frame 1. During the pressing process, because the guide groove 211 is a recessed groove structure, the pressure in this area is relatively small, so excess adhesive 3 can flow between the membrane electrode frame 1 and the catalyst coating film 2 towards the area directly above the guide groove 211. This area is an important bonding area, which can ensure a relatively reliable adhesive layer in this area. This not only controls the final shape and width of the adhesive line, ensuring the reliability of the encapsulation and sealing, but also the adhesive gathered in the area directly above the adhesive guide groove 211 forms a buffer pad, which can protect the catalyst coating film 2 from being crushed or punctured by the sharp inner edge 102 of the membrane electrode frame 1.

[0038] Furthermore, the working surfaces of the upper mold hot pressing block 11 and the lower mold hot pressing block 21 extend inward beyond the inner edge 102 of the membrane electrode frame 1. The upper mold cooling block 12 and the lower mold cooling block 22 have a gap between the overflow adhesive closed line L formed at the edge of the pressed active area 201 and the inner edge 102 of the membrane electrode frame 1, thus forming an overflow adhesive area 103. During the pressing process, the upper mold cooling block 12 and the lower mold cooling block 22 are first pressed onto the active area 201, that is, the cathode gas diffusion layer 4, the active area 201 of the catalyst coated film 2, and the anode gas diffusion layer 6 are first subjected to pressure, and an overflow adhesive closed line L is formed at the edge of the pressed area. As the upper and lower molds continue to press down until the adhesive 3 area reaches the set pressure, the adhesive 3 is forced open under pressure and flows upwards towards the guide groove 211. Since the cathode gas diffusion layer 4, catalyst coating film 2, and anode gas diffusion layer 6 have been pressed together to form an overflow closure line L, the adhesive 3 is prevented from flowing into the active area 201. The adhesive 3 is blocked and retained in the overflow area 103, thereby controlling the adhesive line size. Because the working surfaces of the upper mold hot pressing block 11 and the lower mold hot pressing block 21 extend radially inward beyond the inner edge 102 of the membrane electrode frame 1, an overflow area 103 is formed between the overflow closure line L and the inner edge 102. The presence of this overflow area 103, in conjunction with the guide groove 211, further ensures that the adhesive 3 is confined within the predetermined sealing area.

[0039] In the above embodiments, the upper mold assembly 10 is arranged on one side of the membrane electrode frame 1, the lower mold assembly 20 is arranged on one side of the catalyst coating film 2, the floating element is the lower mold cooling block 22, and the adhesive guiding groove 211 is formed on the lower mold hot pressing block 21. Of course, in other embodiments, the upper mold cooling block 12 can also be configured to be floating, and the adhesive guiding groove 211 can also be formed on the upper mold hot pressing block 11.

[0040] Please refer to it again. Figure 2 As shown, to compensate for potential flatness errors and cumulative assembly tolerances in the hot press mold itself, and to ensure uniform pressure distribution during pressing, avoiding excessively high or low local pressure, a rubber coating layer 111 is provided on the working surface of the upper mold hot press block 11 and / or the lower mold hot press block 21. This rubber coating layer 111 is made of high-temperature resistant rubber material, such as silicone rubber or fluororubber, with a thickness between 2mm and 10mm and a Shore hardness between 50 and 80. Preferably, a 3-5mm thick high-temperature resistant rubber with a Shore hardness of 60-70 is used. The soft rubber coating layer 111 can elastically deform during pressing, adhering to the surface of the membrane electrode, and uniformly distributing the applied pressure, thereby effectively preventing problems such as local underpressure, poor adhesion, or pressure concentration damage to the membrane electrode caused by uneven mold.

[0041] Based on the above-described hot pressing device, the present invention also provides a hot pressing method for a fuel cell membrane electrode. The hot pressing method uses the hot pressing device described above to press and cure the membrane electrode assembly 100 pre-sprayed with adhesive 3. The hot pressing method includes: S1, providing the membrane electrode assembly 100 and placing it on the lower mold assembly 20. In the initial state, the top surface of the lower mold cooling block 22 of the lower mold assembly 20 protrudes from the top surface of the lower mold hot pressing block 21 to support the membrane electrode assembly 100; S2, driving the upper mold assembly 10 to press down, the upper mold cooling block 12 of the upper mold assembly 10 and the lower mold cooling block 22 clamp and press the active area 201 of the membrane electrode assembly 100; S3, continuing to press down the upper mold assembly 10, so that the upper mold hot pressing block 11 and the lower mold hot pressing block 21 contact and press the bonding area of ​​the membrane electrode assembly 100, and the adhesive 3 flows and cures under pressure; wherein, during the pressing process, the upper mold cooling block 12 and the lower mold cooling block 22 are cooled to reduce the temperature of the active area 201.

[0042] In one specific embodiment, the hot pressing method of the present invention specifically includes the following steps.

[0043] Preparation: The pre-assembled membrane electrode assembly 100, coated with adhesive 3, is placed on the lower mold assembly 20. In its initial state, the lower mold cooling block 22, supported by the elastic element 23, has its top surface protruding beyond the top surface of the lower mold hot press block 21. Therefore, the active region 201 of the membrane electrode assembly 100, specifically including the central region of the catalyst-coated membrane 2 and the cathode gas diffusion layer 4 and anode gas diffusion layer 6 on both sides, is stably supported by the lower mold cooling block 22, while the bonding area with adhesive 3 is suspended and does not contact the high-temperature lower mold hot press block 21. At this time, the upper mold cooling block 12 and the lower mold cooling block 22 are maintained at a low temperature by a water cooling system.

[0044] Initial pressing and fixation of the active area: The upper mold assembly 10 is driven to move downwards. The upper mold cooling block 12 first contacts the upper surface of the membrane electrode assembly 100, i.e., the active area 201 on the side of the anode gas diffusion layer 6, and continues to press down, overcoming the elastic force of the elastic element 23 in the lower mold assembly 20, so that the upper mold cooling block 12 and the lower mold cooling block 22 together clamp the active area 201 of the membrane electrode assembly 100. During this process, the active area 201 is always under the low temperature protection of the cooling block, and the CCM will not be affected by high temperature. At the same time, the cathode gas diffusion layer 4, the catalyst coating film 2, and the anode gas diffusion layer 6 are tightly pressed together under the pressure of the cooling block, and an overflow closure line L is formed in the contact area at the edge of the cooling block. This closure line acts as a barrier, preventing the subsequent flow of adhesive 3 from penetrating into the active area 201.

[0045] Adhesive bonding and adhesive curing: The upper mold assembly 10 continues to move downwards. At this time, since the active area 201 has been pressed, the lower mold cooling block 22 no longer moves downwards, and the upper mold hot pressing block 11 and the lower mold hot pressing block 21 begin to contact and press the adhesive area of ​​the membrane electrode assembly 100. The adhesive 3 melts and flows under the combined action of heat and pressure, and is evenly spread between the membrane electrode frame 1 and the catalyst coating film 2. Due to the presence of the adhesive guide groove 211 and the obstruction of the overflow closure line L, the excess adhesive 3 is guided to the overflow area 103 above the adhesive guide groove 211, and does not flow to the active area 201. After maintaining the set pressure and temperature for a certain period of time, the adhesive 3 is fully cured, firmly bonding the membrane electrode frame 1 and the catalyst coating film 2 together.

[0046] Mold opening and part removal: After pressing, the upper mold assembly 10 returns to its original position and moves away from the membrane electrode assembly 100. The lower mold cooling block 22 returns to its initial protruding state under the action of the elastic element 23, making it easy to remove the finished membrane electrode that has been packaged.

[0047] Throughout the hot pressing process, the temperature of each key component is monitored in real time by various temperature sensors, and precise closed-loop control of heating and cooling is achieved through a control system (not shown in the figure) to ensure the stability of process parameters.

[0048] As can be seen from the above description of specific embodiments, the present invention achieves the separation and control of the hot pressing area and the cooling area through a unique mold structure design. Combined with specific technical means such as floating cooling blocks, encapsulation layers, adhesive guide grooves, and adhesive overflow areas, it effectively solves the problems of CCM thermal deformation and adhesive flow control, and significantly improves the quality and consistency of membrane electrode packaging.

[0049] This invention has been illustrated through several specific embodiments. Those skilled in the art will understand that various modifications and equivalent substitutions can be made to this invention without departing from its scope. Furthermore, various modifications can be made to this invention for specific situations or circumstances without departing from its scope. Therefore, this invention is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims.

Claims

1. A hot-pressing device for a fuel cell membrane electrode assembly, used for hot-pressing and bonding a catalyst-coated membrane and a membrane electrode frame comprising a membrane electrode assembly, comprising an upper mold assembly and a lower mold assembly, characterized in that: The upper mold assembly includes an upper mold hot pressing block and an upper mold cooling block. The working surface of the upper mold hot pressing block is used to press the bonding area of ​​the membrane electrode assembly. The upper mold cooling block is disposed inside the upper mold hot pressing block and is used to press and cool the active area of ​​the membrane electrode assembly. The lower mold assembly includes a lower mold hot pressing block and a lower mold cooling block. The working surface of the lower mold hot pressing block corresponds to the working surface of the upper mold hot pressing block and is used to press the bonding area together with the working surface of the upper mold hot pressing block. The lower mold cooling block is located inside the lower mold hot pressing block and corresponds to the upper mold cooling block. It is used to press and cool the active area together with the upper mold cooling block. Wherein, at least one of the upper mold cooling block and the lower mold cooling block is a floating member, which can float relative to the hot press block on which it is located in the pressing direction. An elastic member is provided below the floating member. In the initial state, the floating member is pushed out of the working surface of the hot press block by the elastic member, so as to contact the membrane electrode assembly before the working surface of the hot press block on which it is located during the pressing process. At least one of the upper and lower hot pressing blocks has a guide groove on its working surface. The guide groove is positioned to correspond to the inner edge of the membrane electrode frame. The working surfaces of the upper and lower hot pressing blocks extend inward beyond the inner edge of the membrane electrode frame. The overflow closure line formed by the pressing active area of ​​the upper and lower cooling blocks at their edges has a gap with the inner edge of the membrane electrode frame to form an overflow area.

2. The hot-pressing device for the fuel cell membrane electrode as described in claim 1, characterized in that, The upper mold assembly is arranged on one side of the membrane electrode frame, the lower mold assembly is arranged on one side of the catalyst coating membrane, the floating component is the lower mold cooling block, and the adhesive guide groove is formed on the lower mold hot pressing block.

3. The hot-pressing device for the fuel cell membrane electrode as described in claim 1, characterized in that, At least one of the upper mold hot pressing block and the lower mold hot pressing block is provided with an adhesive layer.

4. The hot-pressing device for the fuel cell membrane electrode as described in claim 3, characterized in that, The overlay is a heat-resistant rubber with a thickness of 2mm to 10mm and a Shore hardness of 50 to 80.

5. The hot-pressing device for the fuel cell membrane electrode as described in claim 1, characterized in that, At least one of the upper mold cooling block and the lower mold cooling block is a water-cooled plate. The hot pressing device further includes a temperature sensor for detecting the temperature of the upper mold cooling block, the lower mold cooling block, the upper mold hot pressing block and the lower mold hot pressing block, and a water chiller for supplying coolant to the water-cooled plate.

6. A hot-pressing method for a fuel cell membrane electrode assembly, characterized in that, The hot pressing method uses the hot pressing device as described in any one of claims 1 to 5 to press and cure the membrane electrode assembly pre-sprayed with adhesive, and the hot pressing method includes: S1. Provide a membrane electrode assembly and place it on the lower mold assembly. In the initial state, the top surface of the lower mold cooling block of the lower mold assembly protrudes from the top surface of the lower mold hot pressing block to support the membrane electrode assembly. S2. Drive the upper mold assembly to press down, and the upper mold cooling block and the lower mold cooling block of the upper mold assembly clamp and press the active area of ​​the film electrode assembly. S3. Continue to press down the upper mold assembly so that the upper mold hot press block contacts the lower mold hot press block and presses the bonding area of ​​the film electrode assembly together. The adhesive flows and solidifies under pressure. During the pressing process, the upper mold cooling block and the lower mold cooling block are cooled to reduce the temperature of the active area.

Images