High-flatness cooking film with symmetrical structure and preparation method of high-flatness cooking film
CN121650322AInactive Publication Date: 2026-03-13杭州星点包装材料有限公司
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-15
- Publication Date
- 2026-03-13
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
The invention discloses a high-flatness cooking film with a symmetrical structure and a preparation method thereof, the high-flatness cooking film sequentially comprises a surface heat-resistant CPP layer, a first glue layer, a PA layer, an ink layer, a second glue layer and an inner heat-resistant CPP layer, and the surface heat-resistant CPP layer and the inner heat-resistant CPP layer form the symmetrical structure; the first glue layer and the second glue layer adopt an adhesive; a unique CPP symmetrical structure design is adopted, the problem of curling deformation under high-temperature cooking is effectively solved by utilizing a stress balance mechanism, the flatness and dimensional stability of the film are remarkably improved, and the product is endowed with excellent high-temperature resistance, high barrier and interlayer bonding performance in cooperation with the specially-made cooking-resistant adhesive and the barrier layer.
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