Miniaturized platform-based micro fast mirror apparatus

Abstract

The micro fast mirror device based on miniaturization platform belongs to the field of optoelectromechanical precise control technology, and solves the problems of large volume and low integration of traditional fast mirror. The device comprises a mirror, a mirror frame, a flexible connection structure, a driver module, a base and a displacement sensor, the mirror is rigidly connected with the motion end of the flexible connection structure through the mirror frame, the fixed end of the flexible connection structure is fixed on the base, the driver module comprises three or four circumferentially symmetrical distributed drivers, each driver is composed of a magnetic core fixed inside the motion end of the flexible connection structure and a coil fixed on the base, and the displacement sensor corresponds to the driver one by one and monitors the deflection angle of the mirror. The device adopts the design of support-free coil and integrated displacement sensor, significantly reduces the volume and weight, is suitable for scenes needing sub-micro-radian level precision such as laser communication, fiber coupling and optical tracking, and is especially suitable for integrated applications such as satellite platform which have strict requirements on weight and volume.

Description

Technical Field

[0001] This invention belongs to the field of opto-mechatronics precision control technology. More specifically, this invention relates to a miniature fast-reflecting mirror device based on a miniaturized platform. Background Technology

[0002] A fast-reflecting mirror (FSM), also known as a quick-reflecting mirror or deflecting mirror, is a precision opto-mechatronic device capable of accurately controlling the direction of a light beam. Through a combination of high-precision angle measurement technology, micro-displacement driving technology, and advanced control theory, it achieves rapid and accurate pointing of the light beam within the desired angle range, offering significant advantages such as small size, high positioning accuracy, high bandwidth, and fast response speed. A fast-reflecting mirror mainly consists of a mirror, driving elements, a flexible shaft / flexible hinge, a displacement sensor, a base, and a drive control system. Its core function is to adjust the direction of the light beam through the rapid deflection of the mirror.

[0003] The existing fast-reflecting mirror has its reflector fixed on the frame. The frame and the reflector rotate around a flexible axis / flexible hinge. The drive element provides power for the rotation of the reflector. The displacement sensor monitors the movement of the reflector in real time and provides feedback on the current position for adjustment. The base can be used to install the above components.

[0004] Its applications include: 1. Laser communication and optical communication: In free-space optical communication (such as inter-satellite and satellite-to-ground links), fast-reflecting mirrors compensate for beam drift caused by platform vibration and atmospheric turbulence, ensuring communication stability (such as NASA's LCRD program).

[0005] 2. Fiber coupling: Efficiently coupling the laser into a single-mode fiber requires sub-microradian precision, and a fast-reflecting mirror is needed to correct alignment errors in real time.

[0006] 3. Optical Imaging and Tracking: In astronomical observation, adaptive optics systems use fast-reflecting mirrors in conjunction with wavefront sensors to correct aberrations caused by atmospheric turbulence; in target tracking, military / civilian optoelectronic systems (such as UAVs and missile seekers) to quickly lock onto moving targets and suppress platform jitter.

[0007] 4. In laser processing and manufacturing, fast-reflecting mirrors enable micron-level dynamic adjustment of the beam path in laser cutting, drilling, and other applications, improving processing accuracy (e.g., semiconductor wafer processing); and in 3D printing, they control the laser scanning path to improve the forming efficiency of complex structures.

[0008] 5. Biomedical and Microscopic Imaging: Confocal microscopy improves imaging resolution and speed by rapidly scanning the laser focus.

[0009] However, traditional fast-reflecting mirrors have problems such as large size, heavy weight, and high power consumption, making them unsuitable for integration into miniaturized devices. As the requirements for system integration become increasingly stringent, a fast-reflecting mirror that is small in size, lightweight, and low in power is needed to solve these problems. Summary of the Invention

[0010] This invention achieves miniaturization, lightweighting, and high-precision control of the device through an integrated design of the frame and flexible structure, a supportless coil, an integrated displacement sensor, and a circumferentially symmetrical actuator layout, significantly improving its integration applicability in small platforms such as drones and portable devices.

[0011] To address the aforementioned problems and achieve the objectives and other advantages of this invention, a miniature fast-reflecting mirror device based on a miniaturized platform is provided, comprising: The components include a reflector, a frame, a flexible connection structure, a driver module, a base, and multiple displacement sensors. The mirror is rigidly fixed to the mirror frame; The moving end of the flexible connection structure connecting the eyeglass frame; The fixed end of the flexible connection structure is fixed to the base; The driver module contains three or four drivers, which are symmetrically distributed in a circle on the base. Each driver includes a magnetic core and a coil; Multiple magnetic cores are fixed within a flexible connection structure and located directly below the reflector; The coil is fixed to the base; Multiple displacement sensors are integrated on the base, and one driver corresponds to at least one displacement sensor; Each displacement sensor is positioned near the mounting location of the coil of its corresponding driver; Multiple displacement sensors are used to monitor the deflection angle of the reflector.

[0012] Preferably, in the miniature fast reflector device based on a miniaturized platform, the coil is deposited or fixed in the guide post or guide hole of the base.

[0013] Preferably, in the miniature fast reflector device based on the miniaturized platform, a stress sensing layer is embedded at the rotation axis position of the flexible connection structure, and the stress sensing layer is composed of an array of stress sensing units. The control circuit has a built-in deformation compensation module, which executes the following control method: Simultaneously acquire the deflection angle signal of the reflector and the charge signal of the stress sensing layer from multiple displacement sensors; Calculate the real-time deformation stress value and its direction in the rotating shaft region based on the charge signal of the stress sensing layer; When the deformation stress value exceeds the preset safety threshold: Generate a compensating current that is opposite to the direction of the deformation stress; The compensation current amplitude is calculated according to the formula. I c = k 1 s calculate, I c The compensation current is expressed in mA. k 1 represents the preset proportional coefficient, in mA / MPa; s This represents the deformation stress value, in MPa. The compensation current is added to the driving current of the corresponding coil; Read the deflection angle of the reflector monitored by the displacement sensor i 实测 ; calculate i 实测 Deflection angle of the target relative to the mirror i 目标 Angular deviation ratio d : δ= | i 实测 - i 目标 | / i 目标 ; like d >1% Adjust the compensation current amplitude to I ' c = I c × (1 - 0.3) d ); The adjusted compensation current is then superimposed onto the driving current of the corresponding coil. like d ≤1% Maintain the current compensation current amplitude unchanged; Continuous monitoring of deformation stress values s until the deformation stress value s The price fell back to the preset safety threshold range and remained there for a certain period of time. t After step 1, the generation of compensation current stops.

[0014] Preferably, in the miniature fast reflector device based on the miniaturized platform, a heat deformation buffer layer is provided between the base and the fixed end of the flexible connection structure; The heat deformation buffer layer is made of a low thermal conductivity ceramic material with a thermal conductivity of no more than 5 W / (m·K); The control circuit has a built-in thermal drift compensation module, which performs the following control method: Measure the resistance value of each coil; According to the formula T = T 0+ ( R - R 0) / ( α × R 0) Calculate the coil operating temperature, where, T 0 is the reference temperature. R This is the real-time resistance value. R 0 is the reference resistance value. α It is the temperature coefficient of resistance; When the coil temperature exceeds the preset threshold: Calculate the temperature difference Δ T = Coil temperature - Preset threshold; Formula for calculating compensation current: I h = β × △ T ,in, I h To compensate for the current, β The thermal deformation compensation coefficient was determined through calibration experiments: the target coil was heated to a temperature increase of 10°C, the thermal deformation at the fixed end of the flexible connection structure was measured using a laser interferometer, and a compensation current was injected into the coil. I comp Until the deformation reaches zero, β = I comp / 10; The compensation current is added to the drive current of the corresponding driver; Continuously monitor the temperature until it drops back to the threshold range and remains there for the preset duration. t 2; Stop the compensation current and perform zero-point calibration of the displacement sensors: record the current readings of all displacement sensors as the zero-point reference values.

[0015] Preferably, in the miniature fast-reflecting mirror device based on a miniaturized platform, the control circuit has a built-in vibration suppression module, which performs the following control method: A. Real-time acquisition of vibration signals output by displacement sensors; B. Extract high-frequency components above 500Hz from the vibration signal using a digital filter; C. Based on the amplitude of the high-frequency components V vib and gain G Generate initial offset current: I cancel = G × V vib ×K v2i , K v2i This is the voltage-to-current conversion factor; D. Add the canceling current to the drive current of the corresponding driver; E. Real-time measurement of the reflector deflection angle via the angle monitoring module. i Then, calculate i Desired deflection angle set by the user i d The difference is used to obtain the deflection angle error value. e , e = i - i d ; F. If | e |>0.05μrad: Press △ G = G × k 2× (| e | / e ref Calculate the gain adjustment amount. k 2 represents the preset adjustment coefficient, ranging from 0.1 to 0.3, which is the preset reference angle error value. e ref = 0.05μrad; Update gain value: G new = G - △ G ; Regenerate the offsetting current: I cancel_new = G new × V vib × K v2i ; G. Repeat step DF until | e |≤0.05μrad.

[0016] Preferably, in the miniature fast reflector device based on the miniaturized platform, a variable stiffness layer is provided in the rotation axis region of the flexible connection structure. The variable stiffness layer is composed of an electric field response stiffness material and an electrode array embedded therein, wherein the stiffness modulus of the electric field response stiffness material varies with the applied electric field strength. The control circuit has a built-in dynamic stiffness adjustment module, which performs the following control methods: Real-time monitoring of the current change rate of each driver yes / dt;in, yes / dt This represents the rate of change of current over time. When | is detected yes / dt When |>10mA / ms: Based on the rate of change of current, a control voltage is applied to the electrode array in the corresponding region of the variable stiffness layer, thereby changing the stiffness modulus of the electric field response stiffness material in that region. Adjust the amplitude of the voltage V Satisfying the formula: V = k 3× | yes / dt |;Among them, k 3 represents the stiffness gain coefficient; Maintain the control voltage until | yes / dt | < 2mA / ms; Remove the control voltage to restore the stiffness modulus of the electric field response stiffness material to its initial value.

[0017] Preferably, in the miniature fast reflector device based on the miniaturized platform, a thermal deformation coordination layer is provided between the base and the fixed end of the flexible connection structure. The thermal deformation coordination layer is made of a low thermal conductivity ceramic material with a thermal conductivity of no more than 5 W / (m·K). The control circuit has a built-in thermal coordination module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature difference between any two coils exceeds 5°C: The position coordinates are determined based on the circumferential symmetrical layout of the actuator: in a three-point layout, the position coordinates are 0°, 120°, and 240°; in a four-point layout, the position coordinates are 0°, 90°, 180°, and 270°. A temperature gradient distribution map is generated based on location coordinates, and temperature regions are divided: the average temperature of each region is calculated; regions with temperatures 3°C higher than the overall average are defined as high-temperature regions; regions with temperatures 3°C lower than the overall average are defined as low-temperature regions. Dynamically adjust the current distribution ratio: reduce the driver current by 10-15% in the high-temperature region; increase the driver current by 10-15% in the low-temperature region. Maintain the adjusted current distribution ratio and continuously monitor the temperature difference until it drops below 2°C; Restore standard current distribution mode: equal current distribution among drivers in a three-point layout; equal current distribution among drivers in a four-point layout.

[0018] Preferably, in the miniature fast reflector device based on a miniaturized platform, a heat diffusion layer is provided inside the base. The heat diffusion layer is made of a high thermal conductivity material and extends to the outer surface of the base to form a heat dissipation structure. The control circuit has a built-in thermal management module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature of any coil exceeds the threshold T 'hour: Temperature exceeds threshold T The driving current of the coil of ' I original Adjusted to I adjusted , I adjusted Determined according to the following formula: I adjusted = I original × [1 - 0.03 × ( T coil - T ')],in: T coil The current temperature of the coil whose temperature exceeds the threshold; At the same time, reduce the rate of change of current for all adjacent drivers of the coil whose temperature exceeds the threshold to below 5 mA / ms; Continuously monitor the temperature until all coil temperatures drop below the preset safe temperature; Restore the standard drive current to all drivers.

[0019] Preferably, in the miniature fast reflector device based on a miniaturized platform, the control circuit has a built-in thermal compensation module. The thermal compensation module executes the following control method: Real-time monitoring of the operating temperature of each coil; The thermal deformation compensation angle of the flexible connection structure is predicted based on the operating temperature data of each coil. The prediction methods include: Calculate the average temperature of the coil T avg = (∑ T i ) / n ,in T i For the temperature of each coil, n This refers to the number of coils; Query the temperature-angle offset mapping table to obtain the corresponding thermal deformation compensation angle. i comp ; Perform thermal compensation and record the reference angle, including the following methods: When thermal deformation compensation angle i comp When the threshold of 0.1 μrad is exceeded: Set the current execution angle to the user-defined angle. i target and i comp sum; Will i target + i comp Records are kept for reference and implementation purposes; Real-time updates of thermal deformation compensation angle i comp ; When the updated thermal deformation compensation angle i comp When it drops below 0.02 μrad: Restore the current execution angle to the user-defined angle. i target ; This i target The value is recorded as a reference execution angle; When thermal deformation compensation angle i comp When the value is between 0.02 and 0.1 μrad: Set the current execution angle to the most recently recorded reference execution angle value.

[0020] The present invention has at least the following beneficial effects: This invention significantly reduces the size and weight of the device through the integrated design of the frame and flexible connection structure, realizing the miniaturization and lightweighting of the fast reflector device, which enables it to be better integrated into application platforms with strict space and weight requirements, such as drones and portable devices.

[0021] This invention employs a bracketless coil design and an integrated displacement sensor, which not only further reduces the size of the device but also lowers the complexity and assembly difficulty of the system, while improving the reliability and stability of the device, providing a more compact solution for precision optical systems.

[0022] This invention achieves collaborative operation of multiple drivers through a symmetrically distributed driver layout, improving the system's control accuracy and response speed, enabling it to meet the stringent requirements of sub-microradian level accuracy in applications such as laser communication and fiber optic coupling.

[0023] This invention incorporates a stress-sensing layer and a deformation compensation module in the rotating shaft area, enabling real-time monitoring and compensation for deformation caused by mechanical stress. This effectively solves the problem of decreased accuracy due to material creep during long-term operation and extends the service life of the equipment.

[0024] This invention employs a thermal deformation buffer layer and a thermal drift compensation mechanism. Through precise temperature monitoring and compensation current control, it effectively suppresses thermal deformation caused by coil heating, ensuring the angular stability of the equipment under different temperature environments.

[0025] This invention achieves real-time monitoring and active suppression of high-frequency vibrations through a high-precision angle monitoring module combined with an adaptive vibration suppression algorithm, significantly improving the stability and control accuracy of the equipment in dynamic working environments.

[0026] This invention introduces a variable stiffness layer into a flexible connection structure. By dynamically adjusting the structural stiffness, it effectively suppresses mechanical resonance caused by rapid current changes, thus balancing the system's high-speed response capability and stability requirements.

[0027] This invention achieves temperature balance and dynamic current distribution among multiple actuators through a thermal deformation coordination layer and an intelligent temperature coordination mechanism, solving the torque imbalance problem caused by uneven temperature and improving the accuracy of multi-actuator collaborative operation.

[0028] This invention employs a high-efficiency heat diffusion layer and an intelligent thermal management strategy. Through active temperature control and current regulation, it effectively prevents performance degradation caused by local overheating and ensures reliable operation of the equipment in high-temperature environments.

[0029] This invention achieves smooth thermal compensation transition through thermal deformation prediction and reference execution angle recording mechanism, avoiding the command oscillation problem caused by traditional threshold switching, and improving the stability and static accuracy of angle output.

[0030] This invention combines microelectromechanical micromachining technology to achieve a high degree of integration of the actuator, sensor and motion mechanism, which not only improves the reliability and stability of the system, but also reduces production costs and power consumption, laying the foundation for the widespread application of fast reflectors.

[0031] Other advantages, objectives and features of the present invention will become apparent in part from the following description, and in part from those skilled in the art through study and practice of the invention. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a miniature fast-reflecting mirror device based on a miniaturized platform according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a four-point arrangement of a driver according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a three-point arrangement of a driver according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a four-point arrangement of a driver and a displacement sensor according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a four-point arrangement of a driver and a displacement sensor according to another embodiment of the present invention; The attached figures are labeled as follows: 1-Reflector; 2-Flexible connection structure; 3-Driver module; 4-Base; 401-Guide post; 402-Guide hole; 5-Displacement sensor. Detailed Implementation

[0033] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0034] It should be noted that in the description of this invention, the terms "lateral", "longitudinal", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] like Figure 1 to Figure 5 As shown, the present invention provides a miniature fast-reflecting mirror device based on a miniaturized platform, comprising: 1. Reflector, frame, flexible connection structure, driver module, base, and multiple displacement sensors; The mirror is rigidly fixed to the mirror frame; The moving end of the flexible connection structure connecting the eyeglass frame; The fixed end of the flexible connection structure is fixed to the base; The driver module contains three or four drivers, which are symmetrically distributed in a circle on the base. Each driver includes a magnetic core and a coil; Multiple magnetic cores are fixed within a flexible connection structure and located directly below the reflector; The coil is fixed to the base; Multiple displacement sensors are integrated on the base, and one driver corresponds to at least one displacement sensor; Each displacement sensor is positioned near the mounting location of the coil of its corresponding driver; Multiple displacement sensors are used to monitor the deflection angle of the reflector. When a three-point arrangement is used, the three displacement sensors monitor the displacement at their respective positions, and the tilt change of the reference plane formed by the three monitoring points reflects the rotation angle of the reflector. When a four-point arrangement is used, the four displacement sensors calculate the rotation angle of the reflector by measuring the change in height difference between adjacent points.

[0036] Flexible connection structures are typically manufactured using micromachining techniques (such as micromilling and deep etching). The moving end is an elastically deformable region that connects to the frame. This region is connected to the fixed end (connecting base) via flexible hinges or thin-walled structures, forming a controllable deflection mechanism around a rotation axis.

[0037] A rotation axis is a virtual or actual structural axis, typically located at the geometric center or axis of symmetry of a flexible connection structure.

[0038] The deflection motion of the moving end is performed around the rotation axis, and its deflection angle is controlled collaboratively by multiple drives.

[0039] The low stiffness of the rotation axis region allows for elastic deflection at small angles, while providing a restoring force to return the mirror to its initial position.

[0040] The reflector can be made of silicon or glass substrates with polished surfaces and coated with a high-reflectivity film, rigidly fixed to the frame using epoxy resin adhesive. The frame can be made of aluminum alloy or titanium alloy, machined using micro-milling technology, and connected via a flexible connection structure with a moving end, also made using micro-milling or deep etching technology. The fixed end of the flexible connection structure is fixed to the base by anodic bonding or adhesive bonding. The base is made of silicon or glass, and may also include metal materials, and is a substrate made using microelectromechanical systems (MEMS) processing technology.

[0041] The actuator module contains three or four actuators, which are circumferentially integrated and distributed around the rotation axis using microelectromechanical (MEMS) micromachining processes. Each actuator includes a magnetic core and a coil. The magnetic core can be made of permanent magnet materials such as neodymium iron boron and is fixed to different positions on the circumferential edge of the moving end of the flexible connection structure by sputtering deposition or bonding processes. The coil is a supportless coil fabricated using MEMS processes (such as electroplating or sputtering deposition of copper wires on a photoresist sacrificial layer). This coil is directly deposited and fixed in the base within guide posts or guide holes formed by anisotropic etching.

[0042] Multiple displacement sensors, employing thin-film, capacitive, or inductive methods, are integrated onto the base using a single-layer process. Each driver corresponds to at least one displacement sensor. Each sensor is positioned near the mounting location of its corresponding driver coil, with its sensing surface facing the corresponding magnetic core above it. It monitors the vertical displacement of the magnetic core relative to the base, thereby indirectly and accurately measuring the deflection angle of the reflector.

[0043] Micro-electromechanical systems (MEMS) technology is specifically embodied in miniaturized fast-reflecting mirror devices based on miniaturized platforms. Using single-crystal silicon or SOI (silicon-on-insulator) wafers as substrates, the excellent mechanical properties of silicon and its perfect compatibility with microfabrication processes are utilized.

[0044] Photolithography is used to define patterns of coils, sensors, and electrodes on a silicon substrate; copper or aluminum metal wire layers are formed through electroplating or sputtering processes.

[0045] High aspect ratio guide posts / holes, cavities and other three-dimensional structures are manufactured using deep etching (DRIE) technology; platform structures are fabricated using micro-milling or surface machining techniques.

[0046] By using bulk silicon processing or surface sacrificial layer technology, the mirror, frame, and flexible hinge structure are released from the substrate as a monolithic integrated whole, forming a frictionless and hysteresis-free elastic motion mechanism.

[0047] The magnetic core of permanent magnet materials such as neodymium iron boron is precisely fixed to the moving end of a flexible structure through anodic bonding, eutectic bonding or adhesive bonding processes.

[0048] Displacement sensors (such as capacitive sensing electrodes) are fabricated directly on the base and system-level packaged with the drive coil; finally, wafer-level bonding packaging technology is used to provide a vacuum or inert gas protection environment for the device.

[0049] Through the integration of the aforementioned multi-layer microfabrication technology, high-precision, high-consistency, and circumferentially symmetrical layouts of the actuators, sensors, and motion mechanisms are achieved, ultimately resulting in advantages in terms of size, weight, resonant frequency, and production cost. The fast-reflecting mirror device based on microelectromechanical technology offers the following beneficial effects: Highly integrated and miniaturized design: By integrating the frame with the flexible connection structure (including flexible shafts / hinges) into a single design and manufacturing process, the shaft system in traditional fast-reflecting mirrors is significantly reduced, resulting in a substantial decrease in the size and weight of the device. This structure is achieved using precision machining processes (such as precision wire cutting, laser processing, ion beam cutting, or precision cutting), ensuring high dimensional accuracy and structural consistency.

[0050] Supportless Coil and Integrated Sensor: Employing a supportless coil design, the coil is directly deposited or mounted on the base, eliminating the traditional method of winding on a support and further reducing the overall size. The displacement sensor is integrated into the base, with one driver corresponding to at least one displacement sensor, achieving a high degree of integration between sensing and actuation, improving the system's compactness and reliability.

[0051] Multi-drive layout flexibility: The drives can be arranged in a three- or four-point circumferential symmetrical manner. By coordinating the thrust of each drive, high-precision deflection control of the reflector around the rotation axis can be achieved, which has the advantages of small size and large rotation range.

[0052] High-precision motion control: The reflector rotates around the axis through the coordinated motion of the flexible connection structure and the actuator. The displacement sensor monitors the position in real time and provides feedback, forming a closed-loop control to ensure sub-micro-radian angular resolution and stability.

[0053] Suitable for miniaturized platforms: The compact overall structure, light weight, and low power consumption significantly improve its integration suitability in space- and weight-sensitive platforms such as small drones and portable devices.

[0054] Advanced manufacturing process: Relying on microelectromechanical micromachining technology and precision assembly process, the high integration of actuators, sensors and motion mechanisms is achieved, which not only improves production consistency and reliability, but also reduces manufacturing costs and power consumption.

[0055] Highly expandable functionality: The equipment can also integrate various intelligent compensation modules (such as deformation compensation, thermal drift compensation, vibration suppression, etc.), further improving performance stability and service life in complex working environments.

[0056] This invention, through a combination of structural innovation, material optimization, and intelligent control, successfully achieves miniaturization, lightweighting, and high precision of fast reflector devices, providing a technological foundation for their widespread application in fields such as laser communication, optical tracking, and unmanned aerial vehicle systems.

[0057] When the fast reflector is in operation, the control circuit applies a drive current to the coil of a specific driver according to the required deflection angle. The coil, manufactured based on microelectromechanical technology, is directly formed on the base through a thin-film deposition process. When the current passes through these micron-level precision coils, it generates a magnetic field, which interacts with the magnetic core fixed to the circumferential edge of the moving end of the flexible connection structure to produce an Ampere force.

[0058] The Ampere force drives the moving end of the flexible connection structure, fabricated using microelectromechanical micromachining technology, causing it to deflect around the rotation axis. The rotation axis region employs a honeycomb structure formed by microelectromechanical etching, with feature sizes down to the micrometer level, providing the system with a precise rotation center and elastic restoring force.

[0059] Three or four actuators are integrated and distributed symmetrically around the rotation axis using microelectromechanical technology. By coordinating the magnitude and direction of the thrust of each actuator, torques in different directions can be synthesized to achieve precise real-time deflection control of the reflector around the rotation axis.

[0060] The displacement sensor, manufactured using microelectromechanical systems (MEMS) technology, is integrated onto a base via micro-nano fabrication processes. Located near the mounting position of the corresponding driver coil, it is used to monitor the vertical displacement of the magnetic core in real time. Since the magnetic core is fixed to the moving end of the flexible connection structure, its displacement directly reflects the deflection angle and angular velocity of the moving end around the rotation axis.

[0061] The displacement sensor feeds back the monitored signals to the control circuit in real time, forming a high-precision closed-loop control. The system integration and dimensional accuracy achieved through microelectromechanical processes ensure that the relative positional error between components is controlled within the micrometer level, guaranteeing the accuracy of the monitoring data.

[0062] By adjusting the magnitude, direction, and rate of change of the current in each driver, precise deflection control of the reflector in two axes can be achieved. This device utilizes microelectromechanical technology to achieve a miniaturized structure and precise control capabilities, enabling a deflection angle range of ±5 degrees and an angular resolution of 0.1 microradians, thus meeting the application requirements for high-precision beam control.

[0063] The application of microelectromechanical technology in this device is not only reflected in its miniaturization, but more importantly, it achieves a high degree of integration of actuators, sensors and motion mechanisms through micro-nano fabrication processes, which improves the reliability and stability of the system while reducing power consumption and production costs.

[0064] In another embodiment, in the miniature fast reflector device based on a miniaturized platform, the coil is deposited or fixed within the guide post 401 or guide hole 402 of the base.

[0065] The coil can be fixed in the guide post or guide hole of the base. The diameter of the guide post can be selected between 0.5-2mm, and the height between 1-3mm. The diameter of the guide hole can be selected between 0.5-2mm, and the depth between 1-3mm. The guide post or guide hole can be made of aluminum alloy or stainless steel and integrally formed with the base through precision machining. The coil can be installed on the guide post by interference fit or fixed in the guide hole by epoxy resin adhesive.

[0066] The guide post or guide hole structure provides precise positioning and fixation for the coil, while its metallic material has good thermal conductivity, helping heat dissipate quickly. This design maintains temperature stability in the flexible connection structure area, reducing the impact of thermal deformation on system accuracy.

[0067] This solution ensures the precise installation position of the coil through a guide structure, and the guide post or guide hole provides reliable mechanical fixation, ensuring the stability of the coil during operation.

[0068] In another embodiment, in the miniature fast reflector device based on a miniaturized platform: a stress sensing layer is embedded at the rotation axis position of the flexible connection structure, and the stress sensing layer is composed of an array of stress sensing units. The control circuit has a built-in deformation compensation module, which executes the following control method: Simultaneously acquire the deflection angle signal of the reflector and the charge signal of the stress sensing layer from multiple displacement sensors; Calculate the real-time deformation stress value and its direction in the rotating shaft region based on the charge signal of the stress sensing layer; The stress sensing layer consists of an array of stress sensing units, such as piezoelectric ceramic units (e.g., PZT), whose output charge is proportional to the applied stress. The calculation steps are as follows: 1. Charge signal acquisition and preprocessing: The charge signal of each stress sensing unit is converted into a voltage signal using a charge amplifier or a high-impedance voltage amplifier.

[0069] Filter the signal (such as with a low-pass filter) to remove high-frequency noise.

[0070] 2. Stress value calculation: The relationship between the charge output Q of each stress sensing unit and the applied stress σ is: Q = d⋅σ⋅A Where: d is the piezoelectric constant (unit: C / N), and A is the effective force-bearing area of ​​the stress sensing unit.

[0071] Therefore, the stress value is: σ = Q / (d⋅A) 3. Direction determination: The stress sensing units are arranged in an array, and units at different positions respond to stress in different directions.

[0072] By comparing the output charge of each unit, the stress distribution gradient can be determined, and thus the deformation direction can be identified. If the output charge of a unit on one side is significantly greater than that on the other side, it indicates that the stress mainly comes from that direction. By combining the position coordinates of the element, the direction vector of the deformation gradient can be calculated.

[0073] 4. Real-time output of deformation stress value and direction: The control system calculates σ for each unit in real time; Stress distribution maps of the rotation axis region are generated using interpolation or weighted averaging methods. The maximum stress value and its direction are further extracted for subsequent deformation compensation control.

[0074] When the deformation stress value exceeds the preset safety threshold: Generate a compensating current that is opposite to the direction of the deformation stress; The compensation current amplitude is calculated according to formula I. c = k1σ calculation, I c The compensation current is expressed in mA; k1 is the preset proportional coefficient, expressed in mA / MPa; σ is the deformation stress value, expressed in MPa. The compensation current is added to the driving current of the corresponding coil; Read the deflection angle of the reflector monitored by the displacement sensor i 实测 ; calculate i 实测 Deflection angle of the target relative to the mirror i 目标 Angular deviation ratio d : δ = |θ 实测 - θ 目标 | / θ 目标 ; If δ > 1%: Adjust the compensation current amplitude to I' c = I c × (1 - 0.3δ); The adjusted compensation current is then superimposed onto the driving current of the corresponding coil. If δ≤1%: Maintain the current compensation current amplitude unchanged; The deformation stress value σ is continuously monitored until it falls back to the preset safety threshold range and remains there for a duration of t1, at which point the generation of compensation current is stopped.

[0075] To enable those skilled in the art to more clearly understand the present invention, the "stress sensing layer" and its output "deformation stress value" are now described in detail as follows: The "stress sensing layer," embedded at the rotation axis of the flexible connection structure, functions primarily to monitor the internal stress state of the region in real time due to external forces or thermal effects. This "stress sensing layer" is composed of an array of "stress sensing units." In a preferred embodiment of the invention, the "stress sensing units" are made of piezoelectric materials (such as PZT-5H piezoelectric ceramic).

[0076] It is important to clarify that the "stress sensing layer" acquires stress information through an indirect measurement method. Its core lies in converting mechanical quantities into electrical signals using the piezoelectric effect, and then calculating the stress value using the material's constitutive relationship. The entire calculation process involves two key steps: Step 1: Calculate local strain (ε) from charge output (Q) 局 ) When a piezoelectric material undergoes mechanical strain, its internal electric dipole moment changes, resulting in bound charges on the unit surface that are proportional to the strain. For each "stress-sensing unit," the output charge Q is related to the local strain ε. 局 There exists a direct piezoelectric relationship between them. This relationship is described by the piezoelectric charge equation, which is expressed as: Q = d · E · ε 局 · A Therefore, strain ε 局 = Q / (d ﹒ E ﹒ A) Where: Q is the charge output by the stress sensing unit (unit: coulomb, C); d is the piezoelectric constant of the piezoelectric material (unit: meter / volt, m / V or coulomb / newton, C / N); E is the elastic modulus of the matrix material of the flexible connection structure (unit: Pascal, Pa); ε 局 The local strain (dimensionless) at the location of the stress sensing unit. A is the effective force-bearing area of ​​the stress sensing unit (unit: square meters, m). 2 ).

[0077] This formula clarifies how to calculate the local strain value ε from the directly measured charge Q. 局 This fills a crucial gap in the conversion process from electrical signals to mechanical deformations.

[0078] Step 2: From local strain (ε) 局 Calculate the deformation stress value (σ) In obtaining the strain value ε 局 Subsequently, the control system calculates the stress based on classical material mechanics constitutive relations. For flexible connection structure materials within the elastic deformation range, their constitutive relations follow Hooke's law: σ = E · ε 局 Where: σ is the "deformation stress value" (unit: Pascal, Pa) ultimately used for control decisions as described in this scheme; E is the elastic modulus of the material (unit: Pascal, Pa); ε 局 The strain value is obtained from the first step.

[0079] Unifying the overall calculation process with existing specifications Combining the above two steps, we obtain the comprehensive expression previously given in the instruction manual: σ = Q / (d ﹒ A). It can be seen that this expression is ε 局 = Q / (d ﹒ E ﹒ A) and σ = E ﹒ ε 局 The result after combining and simplifying the two formulas. This detailed explanation aims to reveal the complete, two-step physical process and computational logic behind this synthesized expression.

[0080] Direction Determination: Because the "stress sensing layer" is arranged in an array, groups of "stress sensing units" at different spatial locations can sense strain in different directions. By comparing the magnitude and distribution gradient of the "deformation stress values" calculated by each unit, the direction of the overall stress field in the rotation axis region can be comprehensively determined.

[0081] In summary, in this invention, the term "stress-sensing layer" should be understood as a functional layer capable of indirectly calculating the stress state by measuring strain and based on the constitutive relations of material mechanics; the term "deformation stress value" refers to the physical quantity reflecting the magnitude of mechanical stress obtained through the aforementioned complete calculation process. The core of the entire technical solution lies in the control method of active deformation compensation through real-time monitoring and feedback of the stress state in the rotating shaft region, and indirect stress measurement through the piezoelectric effect is the preferred technical means to achieve this core innovation.

[0082] This solution addresses the issue of microscopic creep in materials caused by temperature variations or long-term stress in fast reflector devices, as well as the complex deformation problems resulting from the coupling effect of coil heating and mechanical stress. Traditional displacement sensors struggle to detect deflection angle shifts and decreased reset accuracy caused by microscopic material deformation, which affects the long-term stability of the device in precision optical applications.

[0083] This solution embeds a stress-sensing layer in the rotation axis region of the flexible connection structure. This sensing layer consists of an array of stress-sensing units, such as piezoelectric ceramic units. The piezoelectric ceramic units can be made of PZT-5H material, with individual unit dimensions of 2.0mm × 2.0mm × 0.5mm and an array spacing of 0.1mm. The stress-sensing layer is bonded to the rotation axis region of the flexible connection structure using epoxy resin adhesive. The installation position is located in the central area of ​​the rotation axis, covering 80-90% of the rotation axis diameter.

[0084] The control circuit incorporates a deformation compensation module, which employs a 32-bit microprocessor and a sampling frequency of 1kHz. The module synchronously acquires deflection angle signals from displacement sensors and charge signals from the stress sensing layer, and calculates the real-time deformation stress value and its direction in the rotation axis region using an algorithm. The system sets a deformation stress safety threshold; when the monitored value exceeds this threshold, the compensation mechanism is automatically triggered.

[0085] During the compensation mechanism execution, the system first generates a reverse compensation current based on the stress direction. The amplitude of the compensation current is calculated proportionally to the stress value and output to the corresponding coil's drive circuit via a digital-to-analog converter. The system reads the deflection angle monitored by the displacement sensor in real time and calculates the angle deviation ratio. When the deviation ratio exceeds 1%, the system automatically adjusts the compensation current amplitude and re-adds it to the drive current. The entire compensation process continues until the deformation stress value falls back to the preset safety threshold range and remains there for a certain period before stopping.

[0086] This solution effectively prevents material fatigue and structural damage by real-time monitoring of the stress state in the rotating shaft area and timely compensation for excessive stress. The stress sensing layer provides a direct stress measurement method, and the compensation mechanism ensures the long-term stable operation of the system. This design improves the reliability of the equipment in complex working environments and extends its service life.

[0087] Example 1 The fast-reflecting mirror device comprises a mirror, a frame, a flexible connection structure, a base, four symmetrically distributed actuators and their coils, and four capacitive displacement sensors integrated into the base. A sensing layer made of PZT-5H piezoelectric ceramic material is embedded in the rotation axis region of the fast-reflecting mirror device. This sensing layer contains 16 arrayed piezoelectric ceramic units, each measuring 2mm × 2mm × 0.5mm. The sensing layer is tightly bonded to the rotation axis region of the flexible connection structure using epoxy resin adhesive. The control circuit employs a 32-bit microprocessor with a built-in deformation compensation algorithm, and the sampling frequency is set to 1kHz. The displacement sensors are capacitive micro-displacement sensors with a measurement range of ±100μm and a resolution of 10nm. The system has a set deformation stress safety threshold of 20MPa; when the monitored value exceeds this threshold, the compensation mechanism is automatically triggered.

[0088] Comparative Example 1 Unlike Example 1, no deformation compensation module or stress monitoring device was set up. Position feedback was only provided by displacement sensors, and no automatic compensation function was integrated.

[0089] During a 120-minute continuous operation test, the maximum deformation stress measured by the device in Example 1 was 18 MPa, consistently below the 20 MPa safety threshold. The deflection angle error was controlled within 0.12 μrad, and the displacement deviation ratio remained below 3%. The compensation mechanism was activated twice during the entire test, with each activation lasting 12 seconds and 14 seconds, and the maximum compensation currents were 85 mA and 92 mA, respectively.

[0090] Under the same test conditions, the deformation stress in the rotating shaft area of ​​the equipment in Comparative Example 1 reached 35 MPa after 60 minutes of operation, exceeding the material's yield strength. After 90 minutes of operation, the deflection angle error increased to 0.8 μrad, and the displacement deviation ratio reached 7%. By the end of the 120-minute test, the displacement deviation ratio had further increased to 12%, and the equipment showed a significant decrease in reset accuracy.

[0091] Test results show that Example 1, through real-time stress monitoring and dynamic compensation mechanisms, effectively controlled material creep and thermal stress coupling issues, maintaining the stability of the equipment during long-term operation. In contrast, Comparative Example 1, lacking effective stress monitoring and compensation methods, was unable to cope with the gradually accumulating deformation stress, leading to a significant decrease in accuracy and equipment reliability issues. This difference is particularly evident under long-term continuous operation conditions, demonstrating the advantages of the present invention in maintaining the long-term accuracy and stability of the equipment.

[0092] In another embodiment, in the miniature fast reflector device based on a miniaturized platform: a heat deformation buffer layer is provided between the base and the fixed end of the flexible connection structure; The heat deformation buffer layer is made of a low thermal conductivity ceramic material; a low thermal conductivity ceramic material refers to a ceramic material whose thermal conductivity at 25°C is not higher than 5W / (m·K), preferably not higher than 2W / (m·K), such as alumina ceramic, zirconia ceramic, etc.

[0093] The control circuit has a built-in thermal drift compensation module, which performs the following control method: Measure the resistance value of each coil; The coil operating temperature is calculated using the formula T = T0 + (R - R0) / (α × R0), where T0 is the reference temperature (standard operating temperature, such as 25℃), R is the real-time resistance value, R0 is the reference resistance value (the coil resistance value measured at the reference temperature T0), and α is the temperature coefficient of resistance. When the coil temperature exceeds the preset threshold: Calculate the temperature difference ΔT = coil temperature - preset threshold; Compensation current calculation formula: I h = β × △T, where, I h To compensate for the current, β is the thermal deformation compensation coefficient, which is determined through calibration experiments: the target coil is heated to increase its temperature by 10°C, the thermal deformation at the fixed end of the flexible connection structure is measured using a laser interferometer, and a compensation current I is injected into the coil. comp Until the deformation reaches zero, β=I comp / 10; The compensation current is superimposed on the driving current of the corresponding driver; because the compensation current has a small amplitude and short duration, the Joule heat caused can be naturally dissipated by the base, and the temperature rise effect can be ignored.

[0094] Continuously monitor the temperature until it drops back to the threshold range and maintains it for a preset duration t2; Stop the compensation current and perform zero-point calibration of the displacement sensors: record the current readings of all displacement sensors as the zero-point reference values.

[0095] This solution provides an effective solution to the problem of mirror deflection error caused by the heat conduction path between the base and the fixed end of the flexible connection structure in a fast reflector device. Traditional displacement sensors struggle to detect structural thermal deformation caused by temperature gradients and cannot compensate for thermally induced deformation at the fixed end in real time. This results in angular drift and decreased reset accuracy during long-term operation, severely impacting the long-term stability and reliability of the precision optical system.

[0096] Compared to existing technologies, this solution incorporates a heat deformation buffer layer made of alumina ceramic material between the base and the fixed end of the flexible connection structure. The buffer layer is bonded to the base substrate via a high-temperature sintering process, with its surface flatness controlled within ±5μm, ensuring complete adhesion to the fixed end of the flexible connection structure. This buffer layer effectively blocks the heat conduction path to the flexible structure, reducing heat conduction efficiency to 1 / 20th that of traditional metal materials.

[0097] The system calculates the operating temperature by measuring the resistance of each coil in real time. A four-wire measurement method is used to eliminate lead resistance errors, achieving a temperature measurement accuracy of ±0.5℃. When the temperature of any coil exceeds a set threshold, the control system calculates the difference between the actual temperature and the threshold and generates a corresponding compensation current. This compensation current is injected into the drive current of the corresponding driver through a high-precision digital-to-analog converter. The current injection response time is less than 10ms, effectively offsetting the effects of thermal deformation in real time.

[0098] After the temperature drops back to the threshold range and remains within the preset time, the system automatically initiates the displacement sensor zero-point calibration procedure. During calibration, the system records the readings of all displacement sensors under the current thermal state, stores them as new reference values ​​in non-volatile memory, and updates the reference zero point in the control algorithm in real time. This process ensures the accuracy of the measurement reference, enabling the equipment to maintain stable operating performance under different temperature environments.

[0099] Example 2 The fast-reflecting mirror device comprises a mirror, a frame, a flexible connection structure, a base, four symmetrically distributed actuators and their coils, and four capacitive displacement sensors integrated on the base. A 0.3mm thick alumina ceramic heat deformation buffer layer with a thermal conductivity of 1.5W / m·K is placed between the base and the fixed end of the flexible connection structure. A PT100 temperature sensor is used to monitor the coil temperature in real time, and the control chip is an STM32F407 with a sampling frequency of 100Hz. The temperature compensation coefficient was determined to be 12mA / ℃ through calibration experiments, and the set temperature threshold was 60℃. The test environment temperature was 25℃ and the relative humidity was 45%. During 120 minutes of continuous operation, the highest coil temperature was 58℃, the mirror deflection error remained within 0.15μrad, and the zero-point drift of the displacement sensors did not exceed 0.5μm.

[0100] Comparative Example 2 Unlike Example 2, a traditional polyimide thermal insulation pad was used, with a pad thickness of 0.3 mm and a thermal conductivity of 0.3 W / m·K. No temperature monitoring and compensation system was implemented. Under the same test conditions, due to the lack of effective thermal management, the coil temperature rapidly rose to 75°C. Thermal deformation caused significant deformation at the fixed end, with a deflection error reaching 1.2 μrad after 60 minutes of operation and further increasing to 2.5 μrad after 120 minutes. The zero-point drift of the displacement sensor reached 3.2 μm, severely affecting the equipment's operating accuracy.

[0101] Test results show that this solution achieves multi-level control of thermal deformation through the synergistic combination of a low thermal conductivity ceramic buffer layer and an active temperature compensation system. The ceramic buffer layer, made of alumina, has an optimized thickness of 0.3 mm, which, while ensuring structural strength, reduces thermal conductivity to 1.5 W / m·K, effectively blocking approximately 85% of the heat conduction path to the flexible structure. This buffer layer forms a stable bond with the base substrate through a high-temperature sintering process, with an interfacial thermal resistance of less than 0.5 K·m. 2 / W (meaning that the temperature rise caused by each watt of heat power per unit area does not exceed 0.5K) ensures the stability of thermal management.

[0102] The active temperature compensation system, acting as a second layer of protection, accurately calculates temperature by monitoring changes in coil resistance in real time, achieving a measurement accuracy of ±0.5℃. When the temperature exceeds the 60℃ threshold, the system generates a compensation current with a compensation coefficient of 12mA / ℃. This coefficient, calibrated through extensive experiments, accurately offsets the thermal deformation caused by a unit temperature rise. The compensation current is injected into the drive current via a 16-bit digital-to-analog converter, with a response time controlled within 10ms, ensuring timely compensation for any remaining thermal deformation effects.

[0103] The combination of these two technologies forms a complete thermal management solution: the ceramic buffer layer provides the primary thermal insulation, reducing thermal deformation to a basic level; the active compensation system precisely compensates for residual thermal deformation that cannot be completely eliminated by insulation. This tiered approach ensures both system thermal stability and control precision, enabling the equipment to maintain deflection accuracy within 0.15 μrad even under varying temperature conditions. Furthermore, the system possesses adaptive capabilities, adapting to performance changes during long-term use through periodic zero-point calibration, providing reliable thermal management for precision optical systems.

[0104] In another embodiment, the miniature fast-reflecting mirror device based on a miniaturized platform includes a built-in vibration suppression module in the control circuit. This vibration suppression module executes the following control method: A. Real-time acquisition of vibration signals output by displacement sensors; B. Extract high-frequency components above 500Hz from the vibration signal using a digital filter; C. Based on the amplitude V of the high-frequency component vib The gain G generates the initial cancelling current: I cancel = G × V vib × K v2i K v2i This is the voltage-to-current conversion factor; D. Add the canceling current to the drive current of the corresponding driver; E. After measuring the reflector deflection angle θ in real time via the angle monitoring module, calculate θ and the user-defined desired deflection angle θ. d The difference is used to obtain the deflection angle error value ε, where ε = θ - θ d The angle monitoring module consists of an eddy current sensor mounted on the back of the reflector (the eddy current sensor is typically fixed to a separate bracket or base, rather than mounted on the back of the moving reflector, with a small initial gap between its probe and the back of the reflector). The eddy current sensor measures the real-time change in the gap Δd between itself and the back of the reflector. Based on the preset radial distance L from the eddy current sensor to the reflector's rotation axis, the real-time deflection angle θ of the reflector is calculated according to the relationship θ = Δd / L. The angle θ is then compared with the user-defined desired deflection angle θ. d The difference is used to obtain the deflection angle error value ε, that is, ε = θ - θ d ; F. If |ε|>0.05μrad: According to △G = G × k2× (|ε| / ε ref Calculate the gain adjustment amount, where k2 is a preset adjustment coefficient with a value range of 0.1-0.3, and the preset reference angle error value ε. ref= 0.05μrad; Update gain value: G new = G - △G; Regenerate the offsetting current: I cancel_new = G new × V vib × K v2i ; G. Repeat step DF until |ε|≤0.05μrad.

[0105] The principle and specific implementation method for calculating the real-time deflection angle θ in the vibration suppression module are as follows: The eddy current sensor is mounted at the non-rotational center point on the back of the reflector, and the distance between its probe and the rotation axis of the reflector is a preset radial distance L. When the reflector deflects around this axis, the precise geometric relationship between the normal displacement at the probe (i.e., the gap change Δd) and the deflection angle θ is: Δd = L ﹒ sinθ; Because the deflection angle θ of the miniature fast reflector is extremely small (typically on the order of sub-milliradians), it satisfies the small-angle approximation condition sinθ ≈ θ (θ is in radians). Substituting this approximation into the above formula, we can obtain the solution formula: θ ≈ △d / L.

[0106] In fast reflector devices, the basic approach is to monitor the deflection of the reflector using a displacement sensor. However, when there is external or internal high-frequency mechanical vibration, the control system that relies solely on the feedback from the displacement sensor is unable to effectively suppress the high-frequency angular jitter of the reflector, resulting in a decrease in the stability of the beam pointing.

[0107] To address the high-frequency vibration issue, a high-precision angle monitoring module was added to the back of the reflector. Vibration signals from the displacement sensor are acquired in real time to obtain the reflector's real-time motion status. A digital filter extracts components with frequencies above 500Hz from the vibration signal to separate high-frequency interference components that affect beam stability. An initial cancellation current is generated based on the amplitude of this high-frequency component and the system gain, aiming to produce an electromagnetic force opposite to the vibration direction to initially counteract its effects. This cancellation current is then superimposed on the drive current of the corresponding actuator to directly apply a reaction force via an electromagnetic actuator to suppress reflector jitter.

[0108] The deflection angle error of the reflector is measured in real time using a high-precision angle monitoring module to accurately assess the actual effect of vibration suppression. If the absolute value of this angle error is greater than 0.05 μrad, the gain adjustment is calculated and the system gain is updated. Subsequently, the cancellation current is regenerated. The purpose is to adaptively optimize the vibration suppression parameters through closed-loop feedback to improve compensation accuracy. The above process of applying the cancellation current and adjusting parameters is repeated until the absolute value of the angle error drops to 0.05 μrad or less, aiming to ensure that high-frequency vibrations are sufficiently suppressed, thereby achieving stable beam control of the reflector.

[0109] Example 3 The fast-reflecting mirror device comprises a mirror, a frame, a flexible connection structure, a base, four symmetrically distributed actuators and their coils, four capacitive displacement sensors integrated on the base, and an angle monitoring module added to the back of the mirror. The device is mounted on a vibration test platform. During testing, the vibration table generates sinusoidal vibrations with a frequency of 650Hz and an amplitude of 0.05μrad. The displacement sensors output vibration signals in real time. The vibration suppression module within the control circuit accurately extracts the components above 500Hz from the vibration signal and generates an initial canceling current injected into the coils of the corresponding actuators. A laser interferometer synchronously monitors the actual deflection of the mirror. When the measured angle error ε is 0.06μrad, the system adaptively adjusts the gain and updates the canceling current. After the adjustment is completed within 20ms, the mirror angle jitter amplitude decreases from the initial 0.18μrad to 0.04μrad and stabilizes within 0.05μrad.

[0110] Comparative Example 3 Unlike Example 3, no angle monitoring module was integrated on the back of the reflector, and no vibration suppression algorithm was included in the control circuit. Under the same vibration test conditions, the displacement sensor detected vibration signals, but the control system could only perform conventional PID position closed-loop control and could not specifically handle high-frequency components. Test results showed that the reflector experienced continuous resonance due to high-frequency excitation, with an angle jitter amplitude of 0.22 μrad and a maximum instantaneous error of 0.45 μrad, indicating a significantly worse control performance than Example 3.

[0111] Performance Description: Example 3, by introducing an angle monitoring module and a vibration suppression algorithm, can actively sense and counteract high-frequency vibrations. Test results clearly show that this solution can quickly and effectively suppress the angle jitter of the reflector to an extremely low level, significantly improving the beam pointing stability and control accuracy of the equipment under dynamic vibration environments. In contrast, Comparative Example 3, lacking a targeted high-frequency vibration suppression mechanism, shows a significant degradation in system performance under vibration environments.

[0112] In another embodiment, in the miniaturized fast reflector device based on a miniaturized platform: a variable stiffness layer is provided in the rotation axis region of the flexible connection structure. The variable stiffness layer is composed of an electric field-responsive stiffness material and an electrode array embedded therein, wherein the stiffness modulus of the electric field-responsive stiffness material varies with the applied electric field strength; the electric field-responsive stiffness material includes electrorheological fluids and magnetorheological fluids. The control circuit has a built-in dynamic stiffness adjustment module, which performs the following control methods: Real-time monitoring of the current change rate di / dt of each driver; where di / dt represents the rate of change of current over time; When |di / dt| > 10mA / ms is detected: Based on the rate of change of current, a control voltage is applied to the electrode array in the corresponding region of the variable stiffness layer, thereby changing the stiffness modulus of the electric field response stiffness material in that region. The amplitude V of the regulating voltage satisfies the formula: V = k3 × |di / dt|; where k3 is the stiffness gain coefficient; Maintain the control voltage until |di / dt| < 2mA / ms; Remove the control voltage to restore the stiffness modulus of the electric field response stiffness material to its initial value.

[0113] In fast reflector devices, the basic scheme controls the deflection of the reflector through a driver. However, when the driver current changes rapidly, the flexible connection structure may generate mechanical resonance due to the excitation of its own natural frequency, causing the reflector to jitter continuously or overshoot, which seriously affects the stability and response speed of the system.

[0114] To address the resonance problem caused by rapid current changes, a variable stiffness layer was incorporated into the rotation axis region of the flexible connection structure. The current change rate of each actuator was monitored in real time to promptly detect rapid current transients that could trigger resonance. When the absolute value of the current change rate exceeded 10 mA / ms, it indicated a risk of resonance and required immediate intervention. A control voltage was applied to the electrode array in the corresponding region to alter the material properties of the variable stiffness layer through the electric field, thereby instantaneously increasing the local structural stiffness in that region. The control voltage was maintained until the absolute value of the current change rate was less than 2 mA / ms to ensure the structure maintained high stiffness during periods of rapid current change, thus suppressing vibration. Finally, the control voltage was removed to restore the initial stiffness, allowing the structure to regain its original flexibility after the current stabilized and ensuring normal deflection performance.

[0115] Example 4 The fast reflector device comprises a reflector, a frame, a flexible connection structure, a base, and three circumferentially symmetrically distributed actuators and their coils. The rotation axis region of the flexible connection structure incorporates a variable stiffness layer composed of an electrorheological fluid and an electrode array. In a step response test with a current change rate of 15 mA / ms, the system detected the current transient and applied a control voltage to the electrode array within 2 ms. Test results showed that the reflector angle overshoot was reduced from 25% in the traditional structure to 8%, and the settling time was shortened from 50 ms to 20 ms. In repeated tests, the system effectively suppressed resonance, maintaining angle control accuracy within 0.2 μrad.

[0116] Comparative Example 4 Unlike Example 4, this system does not integrate a variable stiffness layer or electrode array. Under the same step response test conditions, the system exhibits significant resonance. The mirror angle overshoot reaches 30%, and the settling time is as long as 60ms. Resonance leads to a significant decrease in angle control accuracy, with a maximum instantaneous error of 1.5μrad.

[0117] Performance Description: Example 4, by introducing a variable stiffness layer and a dynamic stiffness adjustment mechanism, can sense drastic changes in the driving current in real time and actively adjust the structural stiffness. Test results show that this scheme can effectively suppress mechanical resonance, significantly reduce angle overshoot, and accelerate the system stabilization process, thereby improving the control accuracy and stability of the equipment during rapid dynamic response. In contrast, Comparative Example 4, lacking stiffness adjustment capability, exhibits significant performance degradation when the current changes rapidly.

[0118] In another embodiment, in the miniature fast reflector device based on a miniaturized platform: a thermal deformation coordination layer is provided between the base and the fixed end of the flexible connection structure. The thermal deformation coordination layer is made of a low thermal conductivity ceramic material. The low thermal conductivity ceramic material refers to a ceramic material whose thermal conductivity at 25°C is not higher than 5 W / (m·K), preferably not higher than 2 W / (m·K), such as alumina ceramic, zirconium oxide ceramic, etc.

[0119] The control circuit has a built-in thermal coordination module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature difference between any two coils exceeds 5°C: The position coordinates are determined based on the circumferential symmetrical layout of the actuator: in a three-point layout, the position coordinates are 0°, 120°, and 240°; in a four-point layout, the position coordinates are 0°, 90°, 180°, and 270°. A temperature gradient distribution map is generated based on location coordinates, and temperature regions are divided: the average temperature of each region is calculated; regions with temperatures 3°C higher than the overall average are defined as high-temperature regions; regions with temperatures 3°C lower than the overall average are defined as low-temperature regions. Dynamic adjustment of current distribution ratio: The current of the high-temperature region driver is reduced by 10-15%; the current of the low-temperature region driver is increased by 10-15%. This dynamic adjustment of current distribution ratio aims to compensate for the changes in the electromagnetic force characteristics of each driver caused by temperature gradients. By reducing the current of the high-temperature region driver and increasing the current of the low-temperature region driver, the effective output force of each driver is rebalanced, thereby ensuring the accuracy of the synthesized torque and eliminating deflection errors caused by thermal unevenness. The purpose of dynamically adjusting the current distribution ratio is not to avoid affecting the driving force, but to actively and precisely counteract the driving force distortion caused by temperature unevenness through intervention. This system reduces the current of the high-temperature region driver to match its actual reduced output force due to thermal decay with other drivers; at the same time, it increases the current of the low-temperature region driver to compensate for the thrust lost by the high-temperature driver, thereby ensuring that the total torque generated by all drivers in synergy is consistent with the theoretical torque expected by the control command, ultimately maintaining the stability and accuracy of the reflector attitude.

[0120] Maintain the adjusted current distribution ratio and continuously monitor the temperature difference until it drops below 2°C; Restore standard current distribution pattern: In a three-point layout, the current of each driver is equally distributed (each accounting for 33.3%); in a four-point layout, the current of each driver is equally distributed (each accounting for 25%).

[0121] This solution addresses the torque imbalance problem caused by uneven coil temperature in multi-driver collaborative operation of fast reflector systems, providing an effective solution. Traditional fast reflector systems typically employ a fixed-ratio current distribution strategy. When uneven temperature occurs in the coils of different drivers due to differences in heat dissipation conditions or workload, the electromagnetic force characteristics of each driver change, leading to torque imbalance and deflection errors. Existing technologies mainly mitigate temperature differences by improving heat dissipation conditions or reducing the overall operating current, but these methods limit system performance or increase device size.

[0122] This design incorporates a thermal deformation coordination layer made of low thermal conductivity ceramic material between the base and the fixed end of the flexible connection structure. This layer uses zirconia ceramic material with a thermal conductivity of 2.0 W / m·K and a thickness of 0.4 mm. The system monitors the operating temperature of each coil in real time using a PT1000 temperature sensor, achieving a measurement accuracy of ±0.1℃. When the temperature difference between any two coils exceeds 5℃, the system determines the position coordinates based on the circumferential symmetrical layout of the driver. In a three-point layout, the coordinates are allocated at 0°, 120°, and 240°; in a four-point layout, they are allocated at 0°, 90°, 180°, and 270°. Based on these position coordinates, a temperature gradient distribution map is generated, defining regions with temperatures 3℃ higher than the overall average as high-temperature regions and regions with temperatures 3℃ lower than the overall average as low-temperature regions.

[0123] This solution monitors the operating temperature of each coil in real time to promptly detect temperature unevenness. When a temperature difference exceeds 5°C, the system determines the location coordinates based on the layout to accurately identify abnormal temperature areas. It generates a temperature gradient distribution map and divides temperature regions, providing a basis for current adjustment. The current distribution ratio is dynamically adjusted: the driver current is reduced by 10-15% in high-temperature regions and increased by 10-15% in low-temperature regions, effectively balancing the driving force differences caused by temperature gradients. The adjusted current distribution is maintained until the temperature difference drops below 2°C to ensure stable system operation. Finally, the standard current distribution mode is restored, with each coil accounting for 33.3% in a three-point layout and 25% in a four-point layout, ensuring normal control performance.

[0124] In another embodiment, in the miniature fast reflector device based on a miniaturized platform: a heat diffusion layer is provided inside the base, the heat diffusion layer is made of a high thermal conductivity material, and extends to the outer surface of the base to form a heat dissipation structure; The control circuit has a built-in thermal management module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature of any coil exceeds the threshold T' (e.g., 80°C): The driving current I of the coil whose temperature exceeds the threshold T' original Adjusted to I adjusted I adjusted Determined according to the following formula: I adjusted = I original × [1 - 0.03 × (T coil - T')], where: T coil The current temperature of the coil whose temperature exceeds the threshold; At the same time, reduce the rate of change of current for all adjacent drivers of the coil whose temperature exceeds the threshold to below 5 mA / ms; Continuously monitor the temperature until all coil temperatures drop below the preset safe temperature (e.g., 70°C); The standard drive current of all drivers is restored. This restoration occurs after the system temperature has rebalanced, at which point the physical states of each driver tend to be consistent, and the current adjustment is minimal and symmetrical. More importantly, the system remains under high-bandwidth closed-loop control, with displacement sensors monitoring the mirror attitude in real time. Any microsecond-level torque fluctuations that may be caused by current switching are immediately detected and compensated for by the control algorithm. Therefore, this process has no observable impact on the net effect of the driving force or the overall stability of the system.

[0125] This solution addresses the issue of localized coil overheating encountered in the miniaturization design of fast reflector devices, providing an effective thermal management solution. Traditional fast reflector devices typically employ passive cooling methods, such as heat conduction through a metal base or the application of thermal paste. However, these methods suffer from insufficient heat dissipation area after miniaturization, leading to performance degradation issues such as insulation aging and core demagnetization when the coil temperature exceeds 80°C. Existing technologies primarily mitigate temperature rise by reducing overall operating power or increasing heat sink volume, but these methods sacrifice system performance or increase device size.

[0126] This design incorporates a heat diffusion layer made of a highly thermally conductive material within the base. This layer, crafted from a copper alloy, boasts a thermal conductivity of 400 W / m·K and a thickness of 0.5 mm, and is bonded to the base substrate via a hot-pressing process. The heat diffusion layer extends to the outer surface of the base, forming a heat dissipation structure with a total heat dissipation area five times that of traditional designs. The system monitors the operating temperature of each coil in real time using a DS18B20 digital temperature sensor with a measurement accuracy of ±0.5℃. When the temperature of any coil exceeds the 80℃ threshold, the system proportionally reduces the drive current of that coil by 3% for every 1℃ increase in temperature. Simultaneously, it limits the current change rate of all adjacent drivers of that coil to below 5 mA / ms to prevent thermal shock.

[0127] This solution monitors the operating temperature of each coil in real time to promptly detect overheating risks. When the temperature exceeds the 80°C threshold, the drive current of the overheated coil is reduced proportionally to prevent further temperature increases. The current change rate of adjacent drivers is limited to prevent thermal shocks caused by sudden current changes. Temperature is continuously monitored until all coil temperatures drop below the safe 70°C level, ensuring the system operates within a safe range. Finally, the standard drive current of all drivers is restored to guarantee normal control performance. These measures work together to solve the localized overheating problem while maintaining the overall system performance.

[0128] Example 5 The fast reflector device comprises a reflector, a frame, a flexible connection structure, a base, four symmetrically distributed actuators and their coils, and four capacitive displacement sensors integrated on the base. Full-load testing was conducted at an ambient temperature of 35°C. The device employs a four-point layout, with each actuator initially receiving a current of 3.0 mA. During testing, the heat dissipation of one actuator was limited, causing its temperature to gradually rise to 82°C. Upon detecting overheating, the system automatically reduced the current of that actuator to 2.65 mA (a 12% reduction) and simultaneously limited the current change rate of its adjacent actuators to 4.8 mA / ms. After adjustment, the temperature of the overheated actuator returned to 75°C within 150 seconds, with the maximum temperature difference controlled within 5°C. No performance degradation was observed throughout the process, and the reflector control accuracy remained within 0.2 μrad.

[0129] Comparative Example 5 Unlike Example 5, a traditional passive heat dissipation scheme using an aluminum substrate was employed. Under the same test conditions, when the temperature of a certain driver rose to 82°C, due to the lack of active temperature control, the temperature continued to rise to 90°C. After 25 minutes of testing, the coil insulation layer of the driver softened, the resistance increased by 15%, and the electromagnetic force output decreased by 20%. The reflector control accuracy gradually deteriorated, with the deflection error reaching 1.8 μrad, and the system eventually shut down due to overheat protection. After cooling, it was found that the magnetic core of the overheated driver experienced irreversible magnetic performance decay, with a 12% reduction in remanence.

[0130] Test results show that this solution effectively solves the heat dissipation problem of miniaturized devices by combining a high-efficiency heat diffusion layer and intelligent current regulation. The heat diffusion layer provides an efficient heat conduction path, the heat dissipation structure significantly increases the heat dissipation area, and intelligent current regulation ensures that the temperature is controlled within a safe range. Compared with traditional heat dissipation solutions, this method reduces the risk of local overheating by 80%, enabling the device to operate stably in high-temperature environments and extending the lifespan of the coil.

[0131] In another embodiment, the miniature fast-reflecting mirror device based on a miniaturized platform includes a control circuit with a built-in thermal compensation module. The thermal compensation module executes the following control method: Real-time monitoring of the operating temperature of each coil; The thermal deformation compensation angle of the flexible connection structure is predicted based on the operating temperature data of each coil. The prediction methods include: Calculate the average temperature T of the coil avg = (∑T i ) / n, where T i Let n be the temperature of each coil, and n be the number of coils. Query the temperature-angle offset mapping table to obtain the corresponding thermal deformation compensation angle θ. comp ; Perform thermal compensation and record the reference angle, including the following methods: When the thermal deformation compensation angle θ comp When the threshold of 0.1 μrad is exceeded: Set the current execution angle to the user-defined angle θ. target With θ comp sum; θ target + θ comp Records are kept for reference and implementation purposes; Real-time updates of thermal deformation compensation angle θ comp ; When the updated thermal deformation compensation angle θ comp When it drops below 0.02 μrad: Restore the current execution angle to the user-defined angle θ. target ; This i target The value is recorded as a reference execution angle; When the thermal deformation compensation angle θ comp When the value is between 0.02 and 0.1 μrad: Set the current execution angle to the most recently recorded reference execution angle value.

[0132] This solution addresses the command oscillation problem encountered in fast reflector systems during thermal deformation compensation by providing a stable control strategy. Traditional fast reflector systems typically employ a simple threshold switching method for thermal compensation. When the thermal deformation compensation angle fluctuates around the threshold, the system frequently switches between compensation and non-compensation modes, resulting in jitter and instability in the angle output. Existing technologies mainly reduce the switching frequency by increasing the hysteresis loop or decreasing sensitivity, but these methods reduce compensation accuracy or prolong response time.

[0133] This solution incorporates a thermal deformation prediction module, a thermal compensation module, and a reference execution angle recording unit in the control circuit. The system monitors the operating temperature of each coil in real time, employing multiple DS18B20 temperature sensors with a sampling frequency of 10Hz and a measurement accuracy of ±0.5℃. By calculating the average coil temperature and consulting a pre-calibrated temperature-angle offset mapping table, the corresponding thermal deformation compensation angle is obtained. The mapping table contains calibration data for 81 temperature points from 20℃ to 100℃, with a temperature interval of 1℃ and an angle resolution of 0.01μrad.

[0134] This solution monitors the operating temperature of each coil in real time to accurately perceive the system's thermal state; calculating the average coil temperature eliminates random errors at individual temperature measurement points; querying the temperature angle offset mapping table provides accurate predicted values ​​for thermal deformation; when the thermal deformation compensation angle exceeds the 0.1μrad threshold, the current execution angle is set to the target angle plus the compensation angle and recorded as the reference execution angle to ensure the compensation effect; when the compensation angle drops below 0.02μrad, the original target angle is restored and the reference value is updated to ensure static accuracy; within the transition range of 0.02-0.1μrad, the most recently recorded reference execution angle is maintained to avoid frequent jumps in angle commands.

[0135] Example 6 The fast-reflecting mirror device comprises a mirror, a frame, a flexible connection structure, a base, four symmetrically distributed actuators and their coils, and four capacitive displacement sensors integrated on the base. Testing was conducted during an ambient temperature increase from 20°C to 50°C. The system monitored an average coil temperature gradually rising from 25°C to 45°C, with the thermal deformation compensation angle increasing accordingly from 0.05 μrad to 0.12 μrad. When the compensation angle exceeded the 0.1 μrad threshold, the system set the execution angle to the target angle plus 0.12 μrad and recorded this value as the reference execution angle. During temperature stabilization, the compensation angle fluctuated between 0.06 μrad and 0.15 μrad, with the system maintaining fine-tuning around the reference execution angle without any command jumps. Throughout the temperature rise process, the standard deviation of the angle output was 0.08 μrad, and the maximum instantaneous error was 0.18 μrad.

[0136] Comparative Example 6 Unlike Example 6, a traditional threshold switching scheme was used, with the same 0.1 μrad switching threshold set. Under the same test conditions, when the compensation angle fluctuated around the threshold, the system underwent 23 mode switches within 120 minutes. Each switch resulted in a step change in the angle output from 0.3 μrad to 0.8 μrad, with an angle output standard deviation of 0.35 μrad and a maximum instantaneous error of 1.2 μrad. Spectrum analysis showed a significant jitter component at 0.1 Hz, with an amplitude reaching -25 dB, severely affecting the system's stability and accuracy.

[0137] Test results show that this solution effectively solves the command oscillation problem during thermal compensation by using reference execution angle recording and intelligent transition strategies. The reference execution angle recording unit ensures the continuity of angle commands, and the transition zone maintenance strategy avoids frequent mode switching. Compared with traditional threshold switching schemes, this method reduces angle output fluctuation by 77% and the number of mode switching times by 95%, significantly improving the output stability and control accuracy of the equipment under temperature variation environments.

[0138] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A miniature fast-reflecting mirror device based on a miniaturized platform, characterized in that, include: The components include a reflector, a frame, a flexible connection structure, a driver module, a base, and multiple displacement sensors. The mirror is rigidly fixed to the mirror frame; The moving end of the flexible connection structure connecting the eyeglass frame; The fixed end of the flexible connection structure is fixed to the base; The driver module contains three or four drivers, which are symmetrically distributed in a circle on the base. Each driver includes a magnetic core and a coil; Multiple magnetic cores are fixed within a flexible connection structure and located directly below the reflector; The coil is fixed to the base; Multiple displacement sensors are integrated on the base, and one driver corresponds to at least one displacement sensor; Each displacement sensor is positioned near the mounting location of the coil of its corresponding driver; Multiple displacement sensors are used to monitor the deflection angle of the reflector; A stress sensing layer is embedded at the rotation axis position of the flexible connection structure. The stress sensing layer is composed of an array of stress sensing units. The control circuit has a built-in deformation compensation module, which executes the following control method: Simultaneously acquire the deflection angle signal of the reflector and the charge signal of the stress sensing layer from multiple displacement sensors; Calculate the real-time deformation stress value and its direction in the rotating shaft region based on the charge signal of the stress sensing layer; When the deformation stress value exceeds the preset safety threshold: Generate a compensating current that is opposite to the direction of the deformation stress; The compensation current amplitude is calculated according to the formula. I c = k 1 σ calculate, I c The compensation current is expressed in mA. k 1 represents the preset proportional coefficient, in mA / MPa; σ This represents the deformation stress value, in MPa. The compensation current is added to the driving current of the corresponding coil; Read the deflection angle of the reflector monitored by the displacement sensor θ 实测 ; calculate θ 实测 Deflection angle of the target relative to the mirror θ 目标 Angular deviation ratio δ : δ = | θ 实测 - θ 目标 | / θ 目标 ； like δ >1% Adjust the compensation current amplitude to I ' c = I c × (1 - 0.3) δ ); The adjusted compensation current is then superimposed onto the driving current of the corresponding coil. like δ ≤1% Maintain the current compensation current amplitude unchanged; Continuous monitoring of deformation stress values σ until the deformation stress value σ The price fell back to the preset safety threshold range and remained there for a certain period of time. t After step 1, the generation of compensation current stops.

2. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that, The coil is deposited or fixed in the guide post or guide hole of the base.

3. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: A thermal deformation buffer layer is provided between the base and the fixed end of the flexible connection structure; The heat deformation buffer layer is made of a low thermal conductivity ceramic material with a thermal conductivity of no more than 5 W / (m·K); The control circuit has a built-in thermal drift compensation module, which performs the following control method: Measure the resistance value of each coil; According to the formula T = T 0 + ( R - R 0) / ( α × R 0) Calculate the coil operating temperature, where, T 0 is the reference temperature. R This is the real-time resistance value. R 0 is the reference resistance value. α It is the temperature coefficient of resistance; When the coil temperature exceeds the preset threshold: Calculate the temperature difference Δ T = Coil temperature - Preset threshold; Formula for calculating compensation current: I h = β × △ T ,in, I h To compensate for the current, β The thermal deformation compensation coefficient was determined through calibration experiments: the target coil was heated to a temperature increase of 10°C, the thermal deformation at the fixed end of the flexible connection structure was measured using a laser interferometer, and a compensation current was injected into the coil. I comp Until the deformation reaches zero, β = I comp / 10; The compensation current is added to the drive current of the corresponding driver; Continuously monitor the temperature until it drops back to the threshold range and remains there for the preset duration. t 2; Stop the compensation current and perform zero-point calibration of the displacement sensors: record the current readings of all displacement sensors as the zero-point reference values.

4. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: The control circuit has a built-in vibration suppression module, which performs the following control methods: A. Real-time acquisition of vibration signals output by displacement sensors; B. Extract high-frequency components above 500Hz from the vibration signal using a digital filter; C. Based on the amplitude of the high-frequency components V vib and gain G Generate initial offset current: I cancel = G × V vib × K v2i , K v2i This is the voltage-to-current conversion factor; D. Add the canceling current to the drive current of the corresponding driver; E. Real-time measurement of the reflector deflection angle via the angle monitoring module. θ Then, calculate θ Desired deflection angle set by the user θ d The difference is used to obtain the deflection angle error value. ε , ε = θ - θ d ; F. If | ε |>0.05μrad: Press △ G = G × k 2 × (| ε | / ε ref Calculate the gain adjustment amount. k 2 represents the preset adjustment coefficient, ranging from 0.1 to 0.3, which is the preset reference angle error value. ε ref = 0.05μrad; Update gain value: G new = G - △ G ; Regenerate the offsetting current: I cancel_new = G new × V vib × K v2i ; G. Repeat step DF until | ε |≤0.05μrad.

5. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: A variable stiffness layer is provided in the rotation axis region of the flexible connection structure. The variable stiffness layer is composed of an electric field response stiffness material and an electrode array embedded therein. The stiffness modulus of the electric field response stiffness material varies with the applied electric field strength. The control circuit has a built-in dynamic stiffness adjustment module, which performs the following control methods: Real-time monitoring of the current change rate of each driver di / dt ;in, di / dt This represents the rate of change of current over time. When | is detected di / dt When |>10mA / ms: Based on the rate of change of current, a control voltage is applied to the electrode array in the corresponding region of the variable stiffness layer, thereby changing the stiffness modulus of the electric field response stiffness material in that region. Adjust the amplitude of the voltage V Satisfying the formula: V = k 3 × | di / dt |;Among them, k 3 represents the stiffness gain coefficient; Maintain the control voltage until | di / dt | < 2mA / ms; Remove the control voltage to restore the stiffness modulus of the electric field response stiffness material to its initial value.

6. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: A thermal deformation coordination layer is provided between the base and the fixed end of the flexible connection structure. The thermal deformation coordination layer is made of a low thermal conductivity ceramic material with a thermal conductivity of no more than 5 W / (m·K). The control circuit has a built-in thermal coordination module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature difference between any two coils exceeds 5°C: The position coordinates are determined based on the circumferential symmetrical layout of the actuator: in a three-point layout, the position coordinates are 0°, 120°, and 240°; in a four-point layout, the position coordinates are 0°, 90°, 180°, and 270°. A temperature gradient distribution map is generated based on location coordinates, and temperature regions are divided: the average temperature of each region is calculated; regions with temperatures 3°C higher than the overall average are defined as high-temperature regions; regions with temperatures 3°C lower than the overall average are defined as low-temperature regions. Dynamically adjust the current distribution ratio: reduce the driver current by 10-15% in the high-temperature region; increase the driver current by 10-15% in the low-temperature region. Maintain the adjusted current distribution ratio and continuously monitor the temperature difference until it drops below 2°C; Restore standard current distribution mode: equal current distribution among drivers in a three-point layout; equal current distribution among drivers in a four-point layout.

7. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: A heat diffusion layer is set inside the base. The heat diffusion layer is made of a high thermal conductivity material and extends to the outer surface of the base to form a heat dissipation structure. The control circuit has a built-in thermal management module, which performs the following control methods: Real-time monitoring of the operating temperature of each coil; When the temperature of any coil exceeds the threshold T 'hour: Temperature exceeds threshold T The driving current of the coil of ' I original Adjusted to I adjusted , I adjusted Determined according to the following formula: I adjusted = I original × [1 - 0.03 × ( T coil - T ')],in: T coil The current temperature of the coil whose temperature exceeds the threshold; At the same time, reduce the rate of change of current for all adjacent drivers of the coil whose temperature exceeds the threshold to below 5 mA / ms; Continuously monitor the temperature until all coil temperatures drop below the preset safe temperature; Restore the standard drive current to all drivers.

8. The miniature fast-reflecting mirror device based on a miniaturized platform as described in claim 1, characterized in that: The control circuit has a built-in thermal compensation module; The thermal compensation module executes the following control method: Real-time monitoring of the operating temperature of each coil; The thermal deformation compensation angle of the flexible connection structure is predicted based on the operating temperature data of each coil. The prediction methods include: Calculate the average temperature of the coil T avg = (∑ T i ) / n ,in T i For the temperature of each coil, n This refers to the number of coils; Query the temperature-angle offset mapping table to obtain the corresponding thermal deformation compensation angle. θ comp ; Perform thermal compensation and record the reference angle, including the following methods: When thermal deformation compensation angle θ comp When the threshold of 0.1 μrad is exceeded: Set the current execution angle to the user-defined angle. θ target and θ comp sum; Will θ target + θ comp Records are kept for reference and implementation purposes; Real-time updates of thermal deformation compensation angle θ comp ; When the updated thermal deformation compensation angle θ comp When it drops below 0.02 μrad: Restore the current execution angle to the user-defined angle. θ target ; This θ target The value is recorded as a reference execution angle; When thermal deformation compensation angle θ comp When the value is between 0.02 and 0.1 μrad: Set the current execution angle to the most recently recorded reference execution angle value.

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