An antenna array based on ridge substrate integrated waveguide cavities

Abstract

The present disclosure provides a kind of antenna array based on ridge substrate integrated waveguide cavity, comprising: first dielectric layer, second dielectric layer, third dielectric layer and fourth dielectric layer are sequentially stacked from top to bottom;Wherein, fourth dielectric layer, input signal is converted from coplanar waveguide mode to substrate integrated waveguide mode, to input signal is coupled to third dielectric layer;Third dielectric layer, including substrate integrated waveguide cavity, for input signal is divided into multiple first signals, and first signal is coupled to second dielectric layer;Second dielectric layer, including ridge substrate integrated waveguide cavity, for multiple first signal is divided into multiple second signals, and second signal is coupled to first dielectric layer;First dielectric layer, including multiple magnetic electric dipoles corresponding to second signal, for the excitation based on second signal from second dielectric layer produces electromagnetic wave radiation.

Description

Technical Field

[0001] This disclosure relates to the field of antennas, and more particularly to an antenna array based on a ridge substrate integrated waveguide cavity. Background Technology

[0002] Millimeter-wave antenna design faces challenges such as conductor loss, dielectric loss, and increased surface wave effects due to its high-frequency characteristics. Traditional technologies such as microstrip antennas and waveguide slot antennas each have their advantages, but they also suffer from problems such as large size, high loss, narrow bandwidth, and low integration. Summary of the Invention

[0003] This disclosure proposes an antenna array based on a ridge substrate integrated waveguide cavity to address, to some extent, technical problems such as large size, high loss, narrow bandwidth, and low integration.

[0004] In a first aspect, this disclosure provides an antenna array based on a ridge substrate integrated waveguide cavity, comprising:

[0005] The first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are stacked sequentially from top to bottom; wherein, The fourth dielectric layer is used to convert the input signal from a coplanar waveguide mode to a substrate integrated waveguide mode, so as to couple the input signal to the third dielectric layer; The third dielectric layer includes a substrate integrated waveguide cavity, used to divide the input signal into a first number of first signals and couple the first signals to the second dielectric layer; The second dielectric layer includes a ridge substrate integrated waveguide cavity for dividing a first number of the first signals into a second number of second signals and coupling the second signals to the first dielectric layer; The first dielectric layer includes a plurality of magnetoelectric dipoles corresponding to the second signal, for generating electromagnetic wave radiation based on excitation from the second signal from the second dielectric layer.

[0006] As described above, the antenna array based on a ridge substrate integrated waveguide cavity provided in this disclosure couples to the ridge substrate integrated cavity through slots in the substrate integrated waveguide, exciting multiple modes of the cavity, and setting eighteen metal pillars to suppress unwanted modes. Coupled to the ridge substrate integrated waveguide cavity through slots on the upper surface of the substrate integrated cavity, multiple modes are excited, and the cross ridge improves matching, reduces antenna size, and achieves miniaturization and wide bandwidth. Coupled to a magnetoelectric dipole through slots on the upper surface of the ridge substrate integrated waveguide cavity, the gain is improved by chamfering the dipole patch and introducing multiple metal strips. The antenna array based on the ridge substrate integrated waveguide cavity in this specification achieves miniaturization, wide bandwidth, and stable gain, and can be widely applied in the field of communication. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a three-dimensional overall schematic diagram of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0009] Figure 2 This is a top view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0010] Figure 3 This is a front view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0011] Figure 4 This is a bottom view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0012] Figure 5 This is a schematic diagram of an antenna array structure based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0013] Figure 6 This is a top view of the first radiating layer of an antenna array based on a spine substrate integrated waveguide cavity, according to an embodiment of this disclosure.

[0014] Figure 7 This is a top view of the first dielectric substrate of the second layer of the antenna array based on the ridge substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0015] Figure 8 This is a top view of the second dielectric substrate of the second layer of the antenna array based on the ridge substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0016] Figure 9 This is a top view of the third dielectric substrate of the second layer of the antenna array based on the ridge substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0017] Figure 10 This is a top view of the third layer of the substrate integrated waveguide cavity in an antenna array based on a ridge substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0018] Figure 11 This is a top view of the fourth layer of the substrate integrated waveguide in the antenna array based on the ridge substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0019] Figure 12This is a graph showing the variation of the reflection coefficient and frequency of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0020] Figure 13 This is a graph showing the gain versus frequency of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0021] Figure 14 This is the normalized radiation pattern of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] Millimeter-wave antenna design faces numerous technical challenges due to high frequencies. Because of the high operating frequency, conductor loss, dielectric loss, and surface wave effects are more pronounced. Ridge-substrate integrated waveguide cavities can reduce losses and achieve high gain. However, these cavities are relatively large, resulting in low space utilization and large element spacing. Therefore, developing a high-gain, wideband, and miniaturized millimeter-wave antenna structure is one of the critical technical challenges that needs to be addressed in the engineering of 5G millimeter-wave antennas.

[0025] In view of this, the present disclosure provides an antenna array based on a ridge substrate integrated waveguide cavity. Multiple modes are excited in the cavity via slots in the substrate integrated waveguide, and eighteen metal pillars are used to suppress unwanted modes. Multiple modes are excited by slots on the upper surface of the substrate integrated cavity, and cross ridges improve matching, reduce antenna size, and achieve miniaturization and wide bandwidth. A magnetoelectric dipole is coupled to the upper surface of the ridge substrate integrated waveguide cavity, and chamfering and multiple metal strips are introduced on the magnetoelectric dipole patch to improve gain. The antenna array based on the ridge substrate integrated waveguide cavity in this specification achieves miniaturization, wide bandwidth, and stable gain, and can be widely applied in the field of communication.

[0026] See Figures 1-4 , Figure 1 This is a three-dimensional overall schematic diagram of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure. Figure 2 This is a top view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure. Figure 3 This is a front view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure. Figure 4 This is a bottom view of an antenna array based on a spine substrate integrated waveguide cavity according to an embodiment of this disclosure.

[0027] Figures 1-4 The antenna array based on a ridge substrate integrated waveguide cavity includes: The first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are stacked sequentially from top to bottom; wherein, The fourth dielectric layer is used to convert the input signal from a coplanar waveguide mode to a substrate integrated waveguide mode, so as to couple the input signal to the third dielectric layer; The third dielectric layer includes a substrate integrated waveguide cavity, used to divide the input signal into multiple first signals and couple the first signals to the second dielectric layer; The second dielectric layer includes a ridge substrate integrated waveguide cavity for dividing the plurality of first signals into a plurality of second signals and coupling the second signals to the first dielectric layer; The first dielectric layer includes a plurality of magnetoelectric dipoles corresponding to the second signal, for generating electromagnetic wave radiation based on excitation from the second signal from the second dielectric layer.

[0028] The system employs a four-layer dielectric stack structure, achieving efficient signal distribution and radiation through functional layered design: the fourth dielectric layer utilizes a coplanar waveguide-substrate integrated waveguide (SIW) mode conversion structure to couple the input signal with low loss to the SIW cavity of the third dielectric layer; the third layer divides the signal into a first number of paths through cavity resonance, transmitting it to the ridge substrate integrated waveguide (RSIW) cavity of the second dielectric layer; the second layer further divides the signal into a second number of paths using the broadband characteristics of the ridge waveguide, achieving multi-path power distribution; finally, the magnetoelectric dipole antenna element of the first dielectric layer is excited by the second signal, generating electromagnetic wave radiation with wide beam and low backlobe characteristics. While maintaining a compact structure, it achieves array performance with high isolation, wide bandwidth, and high gain, making it particularly suitable for scenarios with stringent requirements for integration and radiation efficiency, such as 5G millimeter-wave communication and automotive radar.

[0029] Furthermore, the first dielectric layer has a radiating structure 3 with a thickness of 0.787 mm using a Rogers RT5880 dielectric substrate. The second layer, the ridge substrate integrated waveguide cavities 4 and 46, use a 0.254 mm Rogers RT5880 dielectric substrate and a 0.2 mm thick Rogers RO4450F dielectric substrate 44. The third layer, the substrate integrated waveguide cavity 5, uses a 0.254 mm thick Rogers RT5880 dielectric substrate. The fourth layer, the substrate integrated waveguide 6, uses a 0.254 mm thick Rogers RT5880 dielectric substrate for its transmission line.

[0030] In some embodiments, the first dielectric layer includes: The first upper surface 32 is provided with a plurality of the magnetoelectric dipoles 31; The first dielectric layer is provided with metal through-holes 33 corresponding to the magnetoelectric dipole; The first lower surface 34 is provided with a first lower power feeding transverse groove 35, which corresponds to the second upper power feeding transverse groove 41.

[0031] In this design, multiple magnetoelectric dipoles are arranged on the first upper surface of the first dielectric layer. Corresponding metal vias are formed inside the dielectric layer, and a first lower-feed transverse slot is formed on the first lower surface, corresponding to a second upper-feed transverse slot on the second dielectric layer. This allows the first dielectric layer to work collaboratively with the upper and lower layers. The metal vias help guide and confine the electromagnetic field, while the first lower-feed transverse slot ensures effective signal coupling and transmission with the second dielectric layer. When excited by a second signal from the second dielectric layer, the magnetoelectric dipole antenna elements on the first dielectric layer can better generate electromagnetic wave radiation. Combined with the functional layered design of the overall four-layer dielectric stack structure, while maintaining a compact structure, this design helps achieve high isolation, wide bandwidth, and high gain performance of the antenna array, meeting the stringent requirements for integration and radiation efficiency in scenarios such as 5G millimeter-wave communication and automotive radar.

[0032] like Figures 5-6 As shown, sixteen magnetoelectric dipoles 31 are placed on the upper surface 32 of the radiation structure 3 in the first dielectric layer, and the metal through-holes 33 of the dielectric layer form magnetoelectric dipoles. Sixteen transverse slots 35 are opened on the lower surface 34.

[0033] In some embodiments, the magnetoelectric dipole is surrounded by annular strips and a second metal pillar, and the patch size of the magnetoelectric dipole is 1.5 × 2.2 mm. 2 .

[0034] Among them, setting an annular strip and metal pillars around the magnetoelectric dipole can adjust the distribution and transmission characteristics of the electromagnetic field.

[0035] In some embodiments, the second dielectric layer includes: The first sub-dielectric layer 42 is provided with a first sub-cavity 43 consisting of a second upper feed transverse slot 41 and a metal through hole, which is used to divide the first signal into the second signal. The second sub-dielectric layer 45 is provided with a second sub-cavity 44 composed of metal through holes; The third sub-dielectric layer 47 is provided with a third sub-cavity 46 composed of metal through holes and a ridge composed of metal strips and through holes within the third sub-cavity; The second lower surface 48 is provided with a second lower power feeding transverse groove 49, which corresponds to the third upper power feeding transverse groove 51.

[0036] The second dielectric layer employs a layered, refined design. Its first sub-dielectric layer contains a cavity composed of a second upper-feed transverse slot and metal vias, responsible for distributing the first signal into the second signal. The second sub-dielectric layer contains a cavity composed of metal vias, and the third sub-dielectric layer contains a cavity composed of metal vias and a ridge composed of metal strips and vias. This facilitates further optimization of signal transmission and processing. Simultaneously, a second lower-feed transverse slot is located on the second lower surface, corresponding to the third upper-feed transverse slot of the third dielectric layer, ensuring effective coupling of signals between layers. Through this multi-sublayer structure and specific functional design, the second dielectric layer can fully utilize the characteristics of the substrate-integrated ridge waveguide to efficiently and rationally distribute the first signal into the second signal within the overall antenna array, achieving multi-path power distribution. Working collaboratively with the upper and lower layers, it helps the antenna array achieve high isolation, wide bandwidth, and high gain performance while maintaining a compact structure, meeting the application requirements of high integration and high radiation efficiency.

[0037] Specifically, such as Figures 5-9 As shown, the ridge substrate integrated waveguide cavity 4 excites an octagonal magnetoelectric dipole 31 through sixteen transverse slots 41 and 35. An annular strip is added to the electric dipole 31 to lengthen the current path and improve gain. Metal pillars and strips are added around the magnetoelectric dipole 31 to reduce coupling between units and improve gain.

[0038] In some embodiments, the distance between the second up-feed transverse slots is 5.4 mm or 4.12 mm, and the size of the second up-feed transverse slot is 0.4 mm × 4 mm; the size of the ridge substrate integrated waveguide cavity is 5.64 × 9.9 mm. 2 The metal strip in the ridge substrate integrated waveguide cavity is 0.5mm×9mm or 0.5mm×2.5mm.

[0039] Specifically, the spacing and dimensions of the second feed transverse slots were precisely set, for example, distances of 5.4mm, 4.12mm, or 0.4mm×4mm. Simultaneously, the dimensions of the ridge substrate integrated waveguide cavity were determined to be 5.64×9.9mm², and the dimensions of the metal strips within this cavity were specified as 0.5mm×9mm or 0.5mm×2.5mm. This optimizes the signal transmission and distribution characteristics in the second dielectric layer. It allows the second dielectric layer to better fulfill its function of rationally distributing the first signal into the second signal, fully utilizing the advantages of the ridge substrate integrated waveguide, ensuring stable signal transmission and processing within the cavity, and working collaboratively with other layers of the antenna array to further improve the overall antenna array performance. This meets stringent communication requirements such as high isolation and wide bandwidth, making it suitable for scenarios with high integration and performance requirements.

[0040] In some embodiments, the substrate-integrated waveguide cavity has a size of 16 × 10.5 mm. 2A third metal pillar is disposed within the substrate integrated waveguide cavity, the third metal pillar having a diameter of 0.6 mm or 0.3 mm.

[0041] Based on considerations of the electromagnetic field distribution and signal transmission characteristics within the cavity, the structure can be optimized by rationally planning the cavity size and selecting metal pillars of different diameters. This effectively adjusts the electromagnetic characteristics of the substrate-integrated waveguide cavity. The metal pillars can constrain and guide the propagation of electromagnetic waves, and combinations of metal pillars of different diameters help to further optimize signal transmission efficiency and quality. Working synergistically with the overall antenna array structure, this enhances the antenna array's performance in terms of high isolation and wide bandwidth, meeting the requirements of high-performance antennas for 5G millimeter-wave communication and other applications.

[0042] In some embodiments, the third dielectric layer includes: The third upper surface 52 is provided with a third upper feed transverse groove 51, which is used to divide the input signal into the first signal; The third intermediate dielectric layer is provided with the substrate integrated waveguide cavity 53 surrounded by metal through holes; The third lower surface 54 is provided with a third lower power supply horizontal groove 55, which corresponds to the fourth power supply horizontal groove 61.

[0043] Specifically, a third upper-feed transverse slot is provided on the third upper surface of the third dielectric layer to distribute the input signal as a first signal; a substrate-integrated waveguide cavity surrounded by metal vias is provided inside the third dielectric layer to provide a specific channel for signal transmission; a third lower-feed transverse slot is provided on the third lower surface, corresponding to the fourth feed transverse slot of the fourth dielectric layer, to ensure effective signal transmission between layers. In this way, the third dielectric layer can utilize the characteristics of the substrate-integrated waveguide cavity to achieve initial signal distribution through the third upper-feed transverse slot, and then stably couple the signal to the next layer through the third lower-feed transverse slot. Working in conjunction with the four-layer dielectric stacked structure of the entire antenna array, it ensures efficient signal transmission and distribution within the array, contributing to the antenna array's excellent performance such as high isolation, wide bandwidth, and high gain.

[0044] Specifically, such as Figure 5 and Figure 10 As shown, the upper surface 52 of the ridge substrate integrated waveguide cavity 5 has four transverse slots 51, a cavity 53 formed by metal vias is placed in the sub-dielectric layer, and the lower surface 54 has one transverse slot 55. The dimensions of the substrate integrated waveguide cavity 5 are 16 × 10.5 mm. 2 Eighteen metal pillars are added to the cavity to create intracavity modes, maintaining a more stable electric field distribution within the cavity. Furthermore, the two largest metal pillars have a diameter of 0.6 mm, while the others have a diameter of 0.3 mm. The substrate-integrated waveguide cavity 5 is fed to the ridge substrate-integrated waveguide cavity 4 through four transverse slots 51, exciting multiple modes within the ridge substrate-integrated waveguide cavity.

[0045] In some embodiments, the fourth dielectric layer includes: The fourth upper surface 62 is provided with a fourth feed transverse slot 61 and a coplanar waveguide slot 64; The fourth intermediate dielectric layer is provided with a substrate integrated waveguide transmission line surrounded by the first metal pillar, and a transition structure from the substrate integrated waveguide to the coplanar waveguide; The fourth lower surface is provided with a metal ground 65 for providing an electromagnetic reference.

[0046] The fourth upper surface features a fourth feed slot and a coplanar waveguide slot, providing a channel for signal input and initial transmission. The fourth dielectric layer contains a substrate-integrated waveguide transmission line surrounded by metal vias, as well as a transition structure from the substrate-integrated waveguide to the coplanar waveguide, enabling signal mode conversion and stable transmission. The fourth lower surface contains a metal ground plane, providing a stable electromagnetic reference plane for the entire layer. This allows the fourth dielectric layer to efficiently convert the input signal from the coplanar waveguide mode to the substrate-integrated waveguide mode, and then couple the signal to the third dielectric layer with low loss via the substrate-integrated waveguide transmission line. Working in conjunction with the entire antenna array structure, this ensures smooth signal transmission and distribution within the system, laying the foundation for achieving high-performance antenna arrays such as high isolation and wide bandwidth, and meeting the stringent communication quality requirements of various application scenarios.

[0047] In some embodiments, the fourth feed slot has dimensions of 0.1mm × 4mm, the spacing between the first metal pillars is 0.5mm, and the diameter of the first metal pillars is 0.3mm; the gap width of the coplanar waveguide structure is 0.1mm, and the spacing between the gaps is 0.6mm.

[0048] By configuring the key structural parameters of the fourth dielectric layer, the fourth dielectric layer can better realize the functions of signal input, mode conversion and transmission, ensuring that the input signal is efficiently and stably converted from the coplanar waveguide mode to the substrate integrated waveguide mode and smoothly coupled to the next layer, working together with the entire antenna array, further improving the performance of the antenna array in terms of signal transmission efficiency and isolation, and meeting high-standard communication requirements.

[0049] Specifically, such as Figure 5 and Figure 11As shown, a feed transverse slot 61 and a coplanar waveguide slot 64 are placed on the upper surface 62 of the substrate integrated waveguide 6. A ridge substrate integrated waveguide transmission line formed by metal vias and a transition structure 63 from the substrate integrated waveguide to the coplanar waveguide are placed on its sub-dielectric layer. A metal ground plane 65 is placed on the lower surface. The substrate integrated waveguide 6 is fed to the substrate integrated waveguide cavity 5 through the transverse slot, exciting multiple modes in the cavity and effectively realizing a broadband antenna array. Furthermore, the dimensions of the feed transverse slots 61 and 55 are 0.1mm × 4mm, the metal pillar spacing is 0.5mm, and the metal pillar diameter is 0.3mm. Furthermore, the width of the coplanar waveguide slot is 0.1mm, and the spacing between the coplanar waveguide slots is 0.6mm.

[0050] In some embodiments, the edges of the first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are provided with a plurality of through holes for fixing the first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer; The metal ground in the fourth dielectric layer is provided with fixing holes for fixing the connectors in the antenna array.

[0051] Multiple through-holes are provided at the edges of the first, second, third, and fourth dielectric layers of the antenna array structure to secure the layers together. Simultaneously, fixing holes are provided on the metal ground plane of the fourth dielectric layer specifically for securing connectors within the antenna array, such as Sub-Miniature Version A (SMA) connectors. By providing through-holes at the edges of the dielectric layers, the four dielectric layers are ensured to be tightly and stably stacked together, maintaining the integrity and stability of the antenna array structure. The fixing holes on the metal ground plane precisely secure the SMA connectors, ensuring a stable connection of the signal transmission interface, reducing signal loss and interference caused by loose connectors, thereby improving the signal transmission quality and reliability of the antenna array, making it more suitable for scenarios with high requirements for communication stability.

[0052] like Figure 1 As shown, 1 and 11 are the fixing holes for the solderless SMA head, and the outer through holes 2, 21, 22, etc., are screw positioning holes, serving a fixing function. Figure 5 As shown, the dimensions of the radiating layer, the ridge substrate integrated waveguide cavities 4, 44, and 46, and the substrate integrated waveguide cavity 5 are all 25.5 × 30.2 mm. 2 The dielectric substrate 6 measures 25 × 37 mm. 2 .

[0053] In some embodiments, there is a layer of sixteen linearly polarized magnetoelectric dipole antenna elements; a layer of ridge substrate integrated waveguide cavity feed layer, which consists of three dielectric layers. The first and second dielectric layers have only a back cavity formed by metal vias, and the third dielectric layer has a cross ridge formed by metal strips and metal vias, as well as a back cavity.

[0054] Specifically, the magnetoelectric dipole units can be separated by metal strips and surrounded by metal through-hole enclosures. Multiple strips can also be added around the magnetoelectric dipoles to extend the current path. The patch shape of the magnetoelectric dipoles is chamfered. In some embodiments, the metal strips and metal through-holes form ridges at approximately one-quarter of the way from the center of the cavity.

[0055] In some embodiments, the peripheral metal vias of the ridge substrate integrated waveguide cavity are higher than the height of the metal vias forming the ridge. In some embodiments, the center of the transverse groove on the upper surface of the ridge substrate integrated waveguide cavity corresponds to the center of the magnetoelectric dipole, and its length is approximately half a wavelength.

[0056] In some embodiments, the antenna array based on the ridge substrate integrated waveguide cavity further includes: a substrate integrated waveguide cavity feeding structure, a substrate integrated waveguide to coplanar waveguide conversion structure, a dielectric substrate, a metal plate and a metal ground, and surrounding screw positioning holes and fixing holes.

[0057] In some embodiments, eighteen metal pillars are added inside the substrate integrated waveguide cavity.

[0058] In some embodiments, the length of the transverse grooves on the upper and lower surfaces of the substrate integrated waveguide cavity is approximately half a wavelength.

[0059] In some embodiments, the width of the substrate integrated waveguide is approximately half a wavelength.

[0060] In some embodiments, the substrate integrated waveguide is converted to a coplanar waveguide and fed with a solderless SMA.

[0061] In some embodiments, the multilayer dielectric substrate is fixed to the antenna array based on the ridge substrate integrated waveguide cavity by screw positioning holes around it. The fixing holes also secure a solderless SMA (Sub-Miniature version A connector) head.

[0062] As described above, this disclosure provides an antenna array based on a ridge substrate integrated waveguide cavity, comprising a magnetoelectric dipole and a metal via enclosure; a first-stage feed network ridge substrate integrated waveguide cavity, including a cross ridge formed by metal vias and metal strips, an excitation slot, and a metal back cavity; a second-stage feed network substrate integrated waveguide cavity, including a back cavity and eighteen internal metal pillars, and an excitation slot; and a substrate integrated waveguide, including a coplanar waveguide structure and an excitation slot. Multiple modes are excited in the ridge substrate integrated cavity via the substrate integrated waveguide slots, and the eighteen metal pillars suppress unwanted modes. Multiple modes are excited in the ridge substrate integrated waveguide cavity via slots on the upper surface of the substrate integrated cavity. The cross ridges improve matching, reduce antenna size, and achieve miniaturization and wide bandwidth. Gain is improved by chamfering and introducing multiple metal strips on the magnetoelectric dipole patch via slots on the upper surface of the ridge substrate integrated waveguide cavity. The antenna array based on the ridge substrate integrated waveguide cavity described in this specification features miniaturization, wide bandwidth, and stable gain, making it widely applicable in the field of communication.

[0063] Existing high-order mode antenna arrays have a bandwidth of less than 40%. Figure 12 This diagram illustrates the S-parameter simulation results of an antenna array based on a ridge substrate integrated waveguide cavity according to an embodiment of this disclosure, with an impedance bandwidth range of 45.23% (24.09-38.17 GHz). This disclosure utilizes magnetoelectric dipoles and multiple modes of the ridge substrate integrated waveguide cavity to achieve multi-point resonance and broaden the bandwidth.

[0064] Existing high-order mode antennas have an element spacing of 0.7 wavelengths. The element spacing of the ridge substrate integrated waveguide cavity in this disclosure embodiment is calculated to be 0.42 wavelengths along the E-plane and 0.55 wavelengths along the H-plane, based on the slot spacing. The ridge substrate integrated waveguide cavity introduces capacitance through the ridge, reducing the resonant frequency of the modes within the cavity, achieving cavity miniaturization, and further reducing the element spacing.

[0065] Figure 13 This is a schematic diagram of the gain simulation results of an antenna array based on a ridge substrate integrated waveguide cavity according to an embodiment of this disclosure. The 3dB bandwidth range is 43.4% (24.5-38.1GHz), and the maximum gain is 18.27dBi.

[0066] Figure 14 This is the 34.5 GHz normalized radiation pattern of an antenna array based on a ridge substrate integrated waveguide cavity according to an embodiment of this disclosure. The E-plane sidelobe level is 12 dB, and the H-plane sidelobe level is 17.2 dBi. Miniaturization contributes to the reduction of high-frequency sidelobes.

[0067] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure (including the claims) is limited to these examples; within the framework of this disclosure, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this disclosure as described above, which are not provided in detail for the sake of brevity.

[0068] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this disclosure, the provided drawings may or may not show well-known power / ground connections to integrated circuit (IC) chips and other components. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this disclosure, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this disclosure will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this disclosure, it will be apparent to those skilled in the art that the embodiments of this disclosure can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0069] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0070] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. An antenna array based on a ridge substrate integrated waveguide cavity, characterized in that, include: The first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are stacked sequentially from top to bottom; wherein, The fourth dielectric layer is used to convert the input signal from a coplanar waveguide mode to a substrate integrated waveguide mode, so as to couple the input signal to the third dielectric layer; the fourth dielectric layer includes: a fourth upper surface, on which a fourth feed slot and a coplanar waveguide slot are provided; a fourth intermediate dielectric layer, on which a substrate integrated waveguide transmission line surrounded by a first metal pillar is provided, and a substrate integrated waveguide to coplanar waveguide transition structure is provided; a fourth lower surface, on which a metal ground is provided, for providing an electromagnetic reference; The third dielectric layer includes a substrate integrated waveguide cavity for dividing the input signal into multiple first signals and coupling the first signals to the second dielectric layer; the third dielectric layer includes: a third upper surface with a third upper feed slot for dividing the input signal into the first signals; a third intermediate dielectric layer with the substrate integrated waveguide cavity surrounded by metal vias; and a third lower surface with a third lower feed slot corresponding to the fourth feed slot. The second dielectric layer includes a ridge substrate integrated waveguide cavity for dividing multiple first signals into multiple second signals and coupling the second signals to the first dielectric layer; the second dielectric layer includes: a first sub-dielectric layer having a first sub-cavity formed by a second upper feed transverse slot and metal vias for dividing the first signals into the second signals; a second sub-dielectric layer having a second sub-cavity formed by metal vias; a third sub-dielectric layer having a third sub-cavity formed by metal vias and a ridge formed by metal strips and vias within the third sub-cavity forming a cross ridge; and a second lower surface having a second lower feed transverse slot corresponding to the third upper feed transverse slot. The first dielectric layer includes a plurality of magnetoelectric dipoles corresponding to the second signal, for generating electromagnetic wave radiation based on the excitation of the second signal from the second dielectric layer; the first dielectric layer includes: a first upper surface having a plurality of the magnetoelectric dipoles; a first dielectric layer having metal through holes corresponding to the magnetoelectric dipoles; and a first lower surface having a first lower feed slot corresponding to the second upper feed slot.

2. The antenna array according to claim 1, characterized in that, The edges of the first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer are provided with a plurality of through holes for fixing the first dielectric layer, the second dielectric layer, the third dielectric layer, and the fourth dielectric layer; The metal ground in the fourth dielectric layer is provided with fixing holes for fixing the connectors in the antenna array.

3. The antenna array according to claim 1, characterized in that, Each of the magnetoelectric dipoles is surrounded by annular strips and a second metal pillar, and the patch size of the magnetoelectric dipole is 1.5 × 2.2 mm. 2 .

4. The antenna array according to claim 1, characterized in that, The distance between the second upward-feed transverse slots is 5.4 mm or 4.12 mm, and the dimensions of the second upward-feed transverse slots are 0.4 mm × 4 mm; the dimensions of the ridge substrate integrated waveguide cavity are 5.64 × 9.9 mm. 2 The metal strip in the ridge substrate integrated waveguide cavity is 0.5mm×9mm or 0.5mm×2.5mm.

5. The antenna array according to claim 1, characterized in that, The substrate-integrated waveguide cavity has dimensions of 16 × 10.5 mm. 2 A third metal pillar is disposed within the substrate integrated waveguide cavity, the third metal pillar having a diameter of 0.6 mm or 0.3 mm.

6. The antenna array according to claim 1, characterized in that, The fourth feed slot has dimensions of 0.1mm × 4mm, the spacing between the first metal pillars is 0.5mm, and the diameter of the first metal pillars is 0.3mm; the width of the coplanar waveguide slot is 0.1mm, and the spacing between the coplanar waveguide slots is 0.6mm.

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