Manufacturing method of double-stacked full-color MicroLED display device

Abstract

The invention discloses a manufacturing method of a double-stacked full-color MicroLED display device, which is a stacked full-color MicroLED preparation method capable of reducing the bonding times of a driving substrate and shortening the process cycle so as to balance the device performance and the production cost, and comprises the following steps of: providing the driving substrate comprising a driving circuit and a driving electrode; providing a first epitaxial wafer emitting first color light, and bonding the first epitaxial wafer with the driving substrate to form a first bonding wafer; providing a second epitaxial wafer and a third epitaxial wafer which emit second color light and third color light, transferring the two epitaxial wafers through the temporary substrate, carrying out patterning processing, and then carrying out horizontal staggered bonding to form a second bonding wafer; and bonding the second bonding sheet with the driving substrate, so that the second bonding sheet and the first bonding sheet are stacked in the thickness direction of the driving substrate.

Images