Semiconductor device manufacturing method using dicing tape, and dicing tape

Abstract

Provided is a high-quality semiconductor device that suppresses chip scattering at the outermost peripheral portion of a workpiece. According to one embodiment, the semiconductor device manufacturing method comprises the following steps: pasting a dicing tape on an annular frame; the dicing tape is provided with a base material, an adhesive material which is arranged on the upper surface of the base material and contains a material which can be deteriorated by light irradiation, and a release film which is arranged in a manner of being overlapped with a part of the adhesive material when viewed from above. By performing light irradiation from below the base material, the adhesiveness of a first portion of the upper surface of the adhesive material, which overlaps the mold release film when viewed from above, is different from the adhesiveness of a second portion of the upper surface of the adhesive material, which does not overlap the first portion; the center of a processed body is made to correspond to the center of the area, where the demolding film is arranged, of the cutting belt, and the processed body is pasted to the adhesive material; and singulating each of the plurality of semiconductor devices by dicing the object to be processed.

Images