Integrated laser launch and receive end cavity molded package system

Abstract

The application discloses an integrated laser emitting end and receiving end cavity mold packaging system, and relates to the technical field of semiconductor device manufacturing, comprising the following modules: a substrate pretreatment module for surface cleaning, circuit detection and repair of a PCB packaging substrate to ensure surface flatness; a chip die bonding module for fixing a chip and a substrate by temperature control pressure bonding through a customized DAF film, suitable for ultra-small and ultra-thin chips; a wire bonding module for realizing electrical connection between the chip and the substrate by ultrasonic bonding technology and for monitoring bonding quality in real time; a primary mold pressing module for forming an integrated cavity by using white glue according to optical design; a secondary mold pressing module for forming an integrated cavity by using black glue for packaging; a cutting forming module for accurately cutting and separating single products; and a concentricity detection and calibration module for correcting deviation to guarantee optical precision. The integrated design of the application greatly reduces the packaging volume and thickness, improves the concentricity consistency and mass production efficiency, is suitable for multiple terminal scenes, simplifies client debugging, and reduces production and application costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing technology, and in particular to an integrated laser emitter and receiver cavity molding packaging system. Background Technology

[0002] As core components of consumer electronics and smart terminals, semiconductor optoelectronic devices are directly affected by their packaging technology, which impacts product size, performance, and application range. Traditionally, laser emitters and receivers are packaged separately. Emitters are typically packaged in spherical or surface-mount forms, while receivers use DFN or QFN packages. Both are designed and manufactured independently before assembly. While this separate packaging approach met basic functional requirements in the early stages of industry development, its inherent technological limitations have become increasingly apparent as the consumer electronics market demands miniaturization, thinness, and high integration in its products, making it difficult to keep pace with market growth.

[0003] The core issues with discrete packaging primarily lie in size and compatibility. The independent packaging processes for the transmitter and receiver make precise matching of their dimensions difficult, leading to excessive gaps or assembly interference during assembly. This not only occupies more internal space, hindering the overall thinner and lighter design of the product, but may also affect optical signal transmission efficiency. Secondly, discrete packaging requires two independent production processes, molds, and production lines. The processes are lengthy and repetitive, increasing equipment investment and production costs, extending production cycles, and reducing mass production efficiency, making it difficult to meet the stringent capacity and cost control requirements of leading brands. Simultaneously, existing packaging processes are insufficiently adaptable to ultra-small and ultra-thin chips, especially under narrow bezel design requirements. Traditional packaging materials and processes struggle to balance adhesion, heat dissipation, and space utilization. Some optoelectronic sensors, due to their small size, have long relied on silver paste die bonding. This process is not only costly but also suffers from poor heat dissipation and insufficient reliability, and cannot be effectively replaced by existing technologies.

[0004] Furthermore, optical performance and yield control are also significant pain points of traditional packaging technologies. In discrete packaging, the optical structures of the transmitter and receiver are formed independently. After assembly, concentricity deviations between the photosensitive area and the ball head are prone to occur. Once misaligned, optical signal transmission distortion occurs, resulting in product scrap and severely impacting production yield. Simultaneously, traditional packaging processes lack integrated solutions for filters and optical structures, making positioning deviations during subsequent assembly prone to occur, reducing optical performance stability. With the rapid popularization of terminal products such as smartphones, smart bracelets, Bluetooth headsets, and smart home devices, the market has placed higher demands on the packaging of laser transmitters and receivers: they must meet the structural requirements of ultra-small size and narrow bezels, while ensuring optical performance, mechanical strength, and reliability, and also possess mass production capabilities to enter the supply chains of leading brands such as Huawei, OPPO, vivo, and Xiaomi. Existing discrete packaging technologies can no longer simultaneously meet these requirements, becoming a key bottleneck restricting the application expansion and industry upgrading of semiconductor optoelectronic devices. Summary of the Invention

[0005] The present invention proposes an integrated laser transmitter and receiver cavity molding and packaging system to solve the problems mentioned in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an integrated laser transmitter and receiver cavity molding and packaging system, comprising the following modules:

[0007] The substrate pretreatment module performs surface cleaning, circuit continuity testing and pretreatment on the PCB packaging substrate, removes oil, oxide layer and impurities from the substrate surface, repairs micro defects in the circuit, and makes the substrate surface flatness meet the packaging requirements.

[0008] The chip die bonding module is equipped with an optimized DAF film supply unit and a high-precision die bonding device. The DAF film consists of a first adhesive surface, a second adhesive surface, and an intermediate high thermal conductivity resin layer. The first adhesive surface is bonded to the laser emitting chip and the receiving chip respectively, and the second adhesive surface is bonded to the pre-treated PCB substrate. The chip and the substrate are firmly fixed through a temperature-controlled pressing process, which is suitable for the die bonding requirements of ultra-small and ultra-thin chips.

[0009] The wire bonding module uses ultrasonic bonding technology. It adjusts the posture and pressure of the bonding head through a high-precision motion control unit to connect the chip pins to the preset pads on the PCB substrate, forming a stable electrical path. The bonding strength and conductivity are monitored in real time during the bonding process.

[0010] The single-molding module is equipped with a white glue injection unit and an optical forming mold. According to the packaging optical design requirements, a ball-head optical mold or a flat mold is selected. Molten white glue is injected into the mold cavity to perform single-molding of the transmitter and receiver.

[0011] The secondary molding module is equipped with a black glue injection unit and a multi-functional molding mold. The mold integrates a carrier wavelength filter or a reserved ball head optical exposure structure. According to the optical structure design requirements, the black glue is injected into the mold to perform secondary encapsulation of the semi-finished product after the first molding, forming an integrated cavity structure.

[0012] The cutting and forming module uses a high-precision laser cutting device to dicing and cutting the substrate after secondary molding according to the preset packaging size parameters, separating individual integrated packaging products. The cutting path and depth are adjusted in real time during the cutting process.

[0013] The concentricity detection and calibration module captures the position images of the product's optical photosensitive area and the ball head through the vision detection unit, analyzes and calculates the concentricity deviation between the two, and activates the mechanical fine-tuning mechanism for products with deviations exceeding the standard, adjusting the molding parameters or the chip die bonding position.

[0014] Furthermore, it also includes a DAF film parameter optimization module, which dynamically adjusts the thickness and adhesion parameters of each layer of the DAF film based on the chip size, thickness and narrow bezel requirements of the package. The adhesion of the first adhesive layer is adapted to the chip material, the adhesion of the second adhesive layer meets the substrate bonding requirements, and the thickness of the middle high thermal conductivity resin layer is adjusted according to the chip heat dissipation requirements.

[0015] Furthermore, it also includes a filter precision integration module, equipped with a filter positioning and conveying unit and a molding synchronous bonding mechanism. According to the wavelength adaptation requirements of the packaged product, the corresponding specification of carrier wavelength filter is selected. During the secondary molding process, the filter is simultaneously fixed in the preset optical channel position. The filter and the molding black glue form a tight bonding structure, eliminating the need for subsequent assembly processes.

[0016] Furthermore, it also includes a molding process parameter control module, which collects temperature, pressure, and injection speed data in real time during the primary and secondary molding processes, and introduces a dynamic optimization model for molding pressure. ,in The optimal pressure for molding is... For material properties, For real-time molding temperature, Standard molding temperature, For the depth of the mold cavity, This represents the target thickness of the molded layer.

[0017] Furthermore, a concentricity deviation correction model is introduced into the concentricity detection and calibration module: ,in To correct the angle for concentricity, for Shaft deviation correction factor For the actual photosensitive area coordinate, Standard for photosensitive areas coordinate, for Shaft deviation correction factor For the actual ball head coordinate, For the standard of ball head The coordinates are calculated, and the deviation value drives the fine-tuning mechanism to make corrections, so as to control the concentricity deviation within the preset range.

[0018] Furthermore, it also includes a bonding quality re-inspection module, employing... Optical inspection technology and a continuity testing unit are used to perform comprehensive inspections on the semi-finished products after wire bonding, identify wire defects, mark products that fail the inspection and trigger a rework process, and repair defects by rebonding or soldering.

[0019] Furthermore, it also includes a package size adaptive module, equipped with a replaceable mold library and parameter storage unit, pre-stores package size parameters and optical design schemes for different application scenarios, and quickly switches molds and adjusts process parameters according to customer needs.

[0020] Furthermore, it also includes a temperature control module for molding materials, which independently controls the temperature of the white glue for primary molding and the black glue for secondary molding. The temperature control range of the white glue is adapted to its melting and molding requirements, while the temperature control range of the black glue is adjusted according to its curing characteristics. The heating power is adjusted through real-time temperature feedback to ensure that the molding materials are always in the optimal processing state.

[0021] Furthermore, it also includes a comprehensive finished product testing module, which integrates optical performance testing, mechanical strength testing, sealing testing, and electrical performance testing units to conduct comprehensive testing on the finished product after cutting and forming. Optical performance testing includes light transmittance and light divergence angle testing; mechanical strength testing tests the impact resistance and bending resistance of the package; sealing testing uses airtightness testing methods; and electrical performance testing includes continuity resistance and insulation performance testing. All test data is stored in real time and supports traceability.

[0022] Furthermore, it also includes a mass production adaptation and data management module, equipped with a multi-station parallel operation unit and a production data acquisition and analysis system, which collects the operating parameters of each module and product testing data in real time, generates production reports and quality analysis reports, identifies production bottlenecks and optimizes process parameters.

[0023] Compared with existing technologies, the beneficial effects of this invention are:

[0024] Regarding packaging structure and size optimization, this invention adopts an integrated molding solution for the transmitter and receiver, completely solving the size mismatch problem of separate packaging, significantly reducing the overall package volume and thickness, and making the product more in line with the design requirements of miniaturization and thinness of terminal products. The integrated structure eliminates subsequent assembly processes, avoids space waste caused by assembly gaps, and simplifies the production process by integrating two independent processes into a continuous packaging process, reducing equipment investment and repetitive processes, significantly reducing production and time costs, and providing strong support for mass production.

[0025] Regarding chip adaptation and packaging compatibility, the optimized DAF film structure and adjustable parameter module of this invention overcome the adaptation limitations of traditional packaging materials. While maintaining the convenience of die bonding, it can adapt to ultra-small and ultra-thin chips of different specifications, effectively meeting the requirements of narrow bezel packaging. By dynamically adjusting the adhesion and thickness of each layer of the DAF film, it ensures both a firm bond between the chip and the substrate and takes into account heat dissipation performance, successfully replacing the traditional silver paste die bonding process. This solves the packaging problem of small-area optoelectronic sensors and expands the applicability of the packaging system.

[0026] Regarding improvements in optical performance and yield, this invention integrates a concentricity detection and calibration module. Through high-precision visual inspection and real-time correction mechanisms, it ensures the concentricity consistency between the optical photosensitive area and the ball head, fundamentally reducing product scrap caused by eccentricity and significantly improving production yield. The multi-functional mold design, featuring both primary and secondary molding, supports various optical solutions such as ball head optics, flat structures, and filter integration. It can be flexibly configured according to product requirements without additional assembly processes, improving the stability and consistency of optical performance while enhancing the sealing and mechanical strength of the package, thus extending product lifespan.

[0027] In terms of application adaptation and mass production capabilities, the packaging size adaptive module and mass production data management module of this invention pre-store packaging parameters and optical solutions for various terminal products, enabling rapid switching of mold and process parameters without the need to reconstruct the production line. This perfectly adapts to the application needs of multiple scenarios such as smartphones, smart wearables, and smart homes. The client debugging process is greatly simplified, lowering the application threshold for terminal manufacturers and making it easier to enter the supply chains of leading brands. The finished product comprehensive testing module enables comprehensive testing of optical performance, mechanical strength, sealing performance, and electrical performance, ensuring stable and controllable product quality and traceable production data. This provides a reliable guarantee for large-scale mass production and promotes the upgrading of semiconductor optoelectronic device packaging technology towards high integration, high reliability, and low cost. Attached Figure Description

[0028] Figure 1 This is a schematic block diagram of the integrated laser transmitter and receiver cavity molding and packaging system proposed in this invention;

[0029] Figure 2A bar chart comparing the core performance of traditional discrete packaging with the integrated packaging of this invention;

[0030] Figure 3 A line graph comparing the changes in concentricity deviation throughout the entire packaging process;

[0031] Figure 4 The bar chart shows the relationship between DAF membrane parameters and adhesion strength and heat dissipation efficiency. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The invention will now be described in further detail with reference to the accompanying drawings.

[0035] Reference Figures 1 to 4 An integrated laser transmitter and receiver cavity molding and packaging system includes the following modules:

[0036] The substrate pretreatment module performs surface cleaning, circuit continuity testing and pretreatment on the PCB packaging substrate. It uses plasma cleaning technology to remove oil, oxide layer and impurities from the substrate surface, and repairs micro-defects in the circuit through micro-current detection, so that the flatness of the substrate surface is controlled within a preset range, providing a stable foundation for subsequent die bonding and bonding processes.

[0037] The chip die bonding module is equipped with an optimized DAF film supply unit and a high-precision die bonding device. The DAF film consists of a first adhesive surface, a second adhesive surface, and an intermediate high thermal conductivity resin layer. The first adhesive surface is bonded to the laser emitting chip and the receiving chip respectively, and the second adhesive surface is bonded to the pre-treated PCB substrate. The chip and the substrate are firmly fixed by a temperature-controlled pressing process of 120-150℃ and a pressure of 0.3-0.5MPa, which is suitable for the die bonding requirements of ultra-small and ultra-thin chips.

[0038] The wire bonding module uses ultrasonic bonding technology. The bonding head posture and bonding pressure of 0.1-0.2MPa are adjusted by a high-precision motion control unit to connect the chip pins to the preset pads on the PCB substrate with gold wire bonding to form a stable electrical path. During the bonding process, the bonding strength and on-resistance are monitored at a frequency of 10Hz. The bonding strength is not less than 5g and the on-resistance is ≤10mΩ.

[0039] The single-molding module is equipped with a white glue injection unit and an optical forming mold. Depending on the packaging optical design requirements, a ball head optical mold or a flat mold can be selected. Molten white glue is injected into the mold cavity at an injection pressure of 5-10MPa to perform single-molding of the transmitter and receiver. It can realize a single ball head optical design or a dual ball head optical design for both the transmitter and receiver. The thickness of the molded layer is controlled at 0.5-1.2mm to ensure the density of the molded layer and optical accuracy.

[0040] The secondary molding module is equipped with a black glue injection unit and a multi-functional molding die. The die can integrate a carrier wavelength filter or a pre-reserved ball head optical exposure structure. According to the optical structure design requirements, the black glue is injected into the die at an injection pressure of 6-12MPa to perform secondary encapsulation on the semi-finished product after the first molding, forming an integrated cavity structure. The thickness of the secondary molding layer is 0.3-0.8mm, which enhances the product's sealing performance and mechanical strength.

[0041] The cutting and forming module uses a high-precision laser cutting device with a laser wavelength set to 1064nm. According to the preset packaging size parameters, the substrate after secondary molding is diced and cut to separate individual integrated packaging products. The cutting path deviation is ≤±0.02mm, and the cutting depth is precisely matched with the total thickness of the package without damaging the internal chips and leads.

[0042] The concentricity detection and calibration module captures the position images of the product's optical photosensitive area and the ball head through a high-resolution vision inspection unit with a resolution ≤1μm. It analyzes and calculates the concentricity deviation between the two. For products with a deviation exceeding 0.03mm, a mechanical fine-tuning mechanism is activated to adjust the molding parameters or the chip die-bonding position, so that the concentricity consistency between the photosensitive area and the ball head meets the mass production standards, thereby improving product yield.

[0043] This invention also includes a DAF film parameter optimization module, which dynamically adjusts the thickness and adhesion parameters of each layer of the DAF film based on chip size, thickness, and narrow bezel requirements of the packaging. The adhesion of the first adhesive layer is set to 1.2-1.8 N / cm to adapt to the chip material, and the adhesion of the second adhesive layer is set to 1.5-2.0 N / cm to meet the substrate bonding requirements. The thickness of the intermediate high thermal conductivity resin layer is adjusted in the range of 0.05-0.2 mm according to the chip heat dissipation requirements, so that the DAF film can not only ensure strong adhesion, but also adapt to the packaging scenarios of ultra-small and ultra-thin chips of different specifications.

[0044] This invention also includes a filter precision integration module, equipped with a filter positioning and conveying unit and a molding synchronous bonding mechanism. According to the wavelength adaptation requirements of the packaged product, a carrier wavelength filter of the corresponding specification is selected. During the secondary molding process, the filter is synchronously fixed in the preset optical channel position with a pressure of 0.2-0.4MPa. The filter positioning error is ≤±0.01mm, forming a tight bonding structure with the molding black glue, eliminating subsequent assembly processes and improving the stability of optical performance.

[0045] This invention also includes a molding process parameter control module, which collects temperature, pressure, and injection speed data in real time during the primary and secondary molding processes at a frequency of 5Hz, and introduces a dynamic optimization model for molding pressure. ,in The optimal pressure for molding is... This is a material property coefficient, with values ​​ranging from 0.8 to 1.2 based on the melt viscosity of white and black glue. For real-time molding temperature, The standard molding temperature is set to 150℃. For the depth of the mold cavity, To achieve the target thickness of the molded layer, the molding pressure is dynamically adjusted using this model, ensuring that the molding accuracy of the molded layer is controlled within ±0.03mm, thereby improving density and reducing defects such as bubbles and insufficient glue.

[0046] In this invention, a concentricity deviation correction model is introduced into the concentricity detection and calibration module: in To correct the angle for concentricity, for The shaft deviation correction factor is set at 0.3-0.5. For the actual photosensitive area coordinate, Standard for photosensitive areas coordinate, for The shaft deviation correction factor is set at 0.3-0.5. For the actual ball head coordinate, For the standard of ball head The coordinates are used to drive the fine-tuning mechanism to make precise corrections by calculating the deviation value, controlling the concentricity deviation within 0.03mm and reducing the product scrap rate.

[0047] This invention also includes a bonding quality re-inspection module, which uses X-ray detection technology with a resolution of ≤5μm and a continuity testing unit to conduct comprehensive inspection of the semi-finished products after wire bonding, identify defects such as poor soldering, desoldering, and short circuits in the leads, mark products that fail the inspection and trigger a rework process, firstly by laser stripping the defective leads, and then re-bonding or repairing them according to the original bonding parameters to achieve defect repair, ensuring that the electrical connection reliability meets mass production standards.

[0048] This invention also includes a packaging size adaptive module, equipped with a replaceable mold library containing more than 10 commonly used specifications and a parameter storage unit. It pre-stores packaging size parameters and optical design schemes for different application scenarios such as smartphones, smart furniture, smart bracelets, and smart headphones. According to customer needs, the mold can be quickly switched and the process parameters adjusted within 30 minutes without the need to reconstruct the production line, thereby improving the mass production adaptability of multiple product varieties.

[0049] This invention also includes a molding material temperature control module, which independently controls the temperature of the white glue for primary molding and the black glue for secondary molding. The temperature control range for the white glue is set to 120-140℃ to meet its melting and molding requirements, while the temperature control range for the black glue is set to 130-150℃ to adjust according to its curing characteristics. The heating power is adjusted with an accuracy of ±1W through real-time temperature feedback to ensure that the molding material is always in the optimal processing state, thereby improving the consistency and stability of the encapsulation layer.

[0050] This invention also includes a comprehensive finished product testing module, which integrates optical performance testing, mechanical strength testing, sealing testing, and electrical performance testing units to conduct comprehensive testing on the finished product after cutting and forming. Optical performance testing includes light transmittance ≥90% and light divergence angle meeting design requirements. Mechanical strength testing measures the impact resistance of the package ≥5J and the number of bending cycles ≥1000. Sealing testing uses a 0.1MPa pressure airtightness test method. Electrical performance testing includes conduction resistance ≤10mΩ and insulation performance ≥100MΩ. All test data are stored in real time and support full-process traceability.

[0051] This invention also includes a mass production adaptation and data management module, equipped with 6-8 parallel operation units and a production data acquisition and analysis system, which supports the simultaneous execution of multiple packaging processes, improves mass production efficiency, and collects the operating parameters of each module and product testing data in real time at a frequency of 1Hz. It generates production reports and quality analysis reports for each batch, identifies production bottlenecks and optimizes process parameters, and provides stable technical support for mass production supply to leading brands.

[0052] The following two examples further illustrate specific embodiments of the present invention:

[0053] Example 1: Application of integrated laser packaging for narrow bezel smartphones

[0054] This embodiment targets the packaging scenario of a narrow-bezel laser sensing module for smartphones. The terminal product requires a packaging thickness of ≤1.8mm and a bezel width of ≤1.2mm. It is compatible with ultra-small and ultra-thin laser emitting and receiving chips, both with chip dimensions of 1.0mm×0.8mm×0.15mm. By applying the integrated laser emitting and receiving cavity molding packaging system of this invention, high integration and high optical precision packaging are achieved, fully covering all system modules and technical solutions.

[0055] 1. Multi-module collaborative operation

[0056] After the substrate pretreatment module is started, it performs surface cleaning and circuit inspection on the PCB packaging substrate. Plasma cleaning technology is used to treat the substrate surface, removing oil and oxide layers. The cleaning power is adjusted according to preset parameters to ensure that the substrate surface roughness meets the bonding requirements. Microcurrent detection technology is used to scan the substrate circuitry, identifying and repairing two micro-defects. Ultimately, the substrate surface flatness is controlled within a preset range, laying the foundation for subsequent processes.

[0057] During chip bonding module operation, the DAF film parameter optimization module first adjusts the parameters of each layer of the DAF film according to the chip size and narrow bezel requirements. The adhesion of the first adhesive layer is set to 1.5 N / cm to adapt to the chip material, the adhesion of the second adhesive layer is set to 1.8 N / cm to meet the substrate bonding requirements, and the thickness of the middle high thermal conductivity resin layer is adjusted to 0.1 mm to adapt to the chip heat dissipation requirements. The DAF film supply unit automatically delivers the customized DAF film. The first adhesive layer is bonded to the laser emitting chip and the receiving chip respectively, and the second adhesive layer is bonded to the pre-treated PCB substrate. Through a 135℃ temperature-controlled pressing process and 0.4 MPa pressure, the chip and the substrate are firmly fixed by continuous pressing for 30 seconds.

[0058] The wire bonding module employs ultrasonic bonding technology. A high-precision motion control unit adjusts the bonding head posture and sets the bonding pressure to 0.15 MPa. 25-micron diameter gold wire is used to bond the chip pins to pre-set pads on the PCB substrate, forming a stable electrical path. During bonding, bonding strength and continuity resistance are monitored at a frequency of 10 Hz to ensure a bonding strength of no less than 5 g and a continuity resistance of ≤10 mΩ. After bonding, a bonding quality re-inspection module uses 5-micron resolution X-ray detection technology and a continuity testing unit for comprehensive inspection. No defects such as cold solder joints or desoldering were found, and the product proceeds to the next process.

[0059] The primary molding module is equipped with a ball-head optical mold, employing a dual-ball-head optical scheme for both the transmitter and receiver based on optical design requirements. The molding process parameter control module collects real-time data at a 5Hz frequency and incorporates a dynamic optimization model for molding pressure. in The value of 1.0 is selected based on the melt viscosity of the white glue. The real-time molding temperature is 135℃, and T0 is the standard molding temperature of 150℃. The mold cavity depth is 1.2mm. The target thickness of the first molding layer is 0.8 mm. The calculation yields... =1.0×(135 / 150)×(1+1.2 / 0.8)=0.9×2.5=2.25MPa. Adjust the injection pressure to 5.5MPa, which is within the set range of 5-10MPa. Inject the molten white glue into the mold cavity to complete one molding process. The thickness of the molded layer is controlled at 0.8mm.

[0060] The secondary molding module is equipped with a multi-functional molding die integrating a carrier wavelength filter, allowing selection of filters of the appropriate specifications based on the product's wavelength adaptation requirements. The filter precision integration module delivers the filter to a preset position via a positioning and conveying unit, simultaneously fixing the filter to the optical channel at a pressure of 0.3 MPa during the secondary molding process. The molding material temperature control module maintains the black glue temperature at 140℃ and injects black glue at an injection pressure of 6.5 MPa, performing a secondary encapsulation of the primary molding semi-finished product. The secondary molding layer thickness is set to 0.6 mm, forming an integrated cavity structure.

[0061] The cutting and forming module uses a high-precision laser cutting device with a laser wavelength of 1064nm, and plans the cutting path according to the preset package size parameters. During the cutting process, the cutting depth is adjusted in real time to ensure precise matching with the total package thickness. The cutting path deviation is controlled within ±0.02mm, successfully separating a single integrated package product without damaging the internal chip and leads.

[0062] The concentricity detection and calibration module captures product images using a high-resolution visual inspection unit with a resolution of 1 micrometer, and analyzes and calculates the concentricity deviation between the photosensitive area and the ball head. One product was found to have a deviation of 0.04 mm, prompting the introduction of a concentricity deviation correction model. ,in Take 0.4, For the actual photosensitive area coordinate, For standard Coordinates, with a deviation of 0.02 mm; Take 0.4, For the actual ball head coordinate, For standard The coordinates have a deviation of 0.02 mm. The calculated values ​​are... =0.4×0.02+0.4×0.02=0.016 radians, driving the fine-tuning mechanism to adjust the chip die-bonding position. After correction, the concentricity deviation is reduced to 0.02mm, meeting the mass production standard.

[0063] The finished product comprehensive testing module performs full testing on the finished product, ensuring that optical performance, mechanical strength, sealing performance, and electrical performance all meet the requirements. The test data is stored in real time and supports traceability. The mass production adaptation and data management module produces synchronously through 6 parallel operation units, collecting data at a frequency of 1Hz, and generating production reports and quality analysis reports for each batch.

[0064] 2. Application effect data

[0065] Table 1 is a comparison table of the packaging performance of smartphones with narrow bezels:

[0066] Total package thickness 2.5mm 1.7mm Border width 1.8mm 1.1mm Concentricity pass rate 82% 98% Packaging cost 100% 65% Mass production efficiency 100% 180%

[0067] Table 1 shows that traditional discrete packaging has a large thickness and bezel width, which cannot meet the narrow bezel requirements of smartphones. The concentricity pass rate is only 82%, and a large number of products are scrapped due to misalignment. This invention reduces the packaging thickness to 1.7mm and the bezel width to 1.1mm through integrated molding and precise concentricity calibration, fully adapting to terminal requirements. The concentricity pass rate is increased to 98%, significantly reducing the scrap rate. At the same time, the integrated process simplifies the process, reduces the packaging cost to 65% of the traditional solution, and increases mass production efficiency by 80%, successfully solving the pain points of traditional packaging such as size mismatch, high cost, and low yield, meeting the mass production needs of leading brands.

[0068] Example 2: Application of ultra-thin laser packaging in smart bracelets

[0069] This embodiment addresses the packaging scenario of an ultra-thin laser sensing module for a smart bracelet. The terminal product requires a packaging thickness of ≤1.2mm and a weight of ≤0.8g. It is compatible with ultra-thin laser emitting and receiving chips with chip dimensions of 0.8mm×0.6mm×0.1mm. The packaging system of this invention achieves ultra-thin, lightweight, and highly reliable packaging, fully covering all technical solutions.

[0070] 1. Multi-module collaborative operation

[0071] The substrate pretreatment module performs surface treatment on the ultra-thin PCB packaging substrate, using low-power plasma cleaning technology to remove impurities and prevent substrate deformation. Microcurrent detection technology is used to comprehensively scan the circuitry, ensuring there are no open or short circuit defects, and ultimately, the substrate surface flatness meets the requirements for ultra-thin packaging.

[0072] In the chip bonding module, the DAF film parameter optimization module adjusts parameters according to the ultra-thin characteristics of the chip. The adhesion of the first adhesive layer is set to 1.3 N / cm, the adhesion of the second adhesive layer is set to 1.6 N / cm, and the thickness of the intermediate high thermal conductivity resin layer is adjusted to 0.08 mm to balance bonding strength and heat dissipation requirements. The DAF film supply unit delivers a customized DAF film. The first adhesive layer is bonded to the chip, and the second adhesive layer is bonded to the substrate. Through a 125℃ temperature-controlled pressing process and a 0.35MPa pressure for 25 seconds, the chip and substrate are firmly fixed, adapting to the requirements of ultra-thin chip packaging.

[0073] The wire bonding module employs ultrasonic bonding technology with a bonding pressure set at 0.12 MPa, using 20-micron diameter gold wire for bonding. During the bonding process, monitoring is performed at a frequency of 10 Hz to ensure a bonding strength of no less than 5 g and a conduction resistance of ≤10 mΩ. After inspection by the bonding quality re-inspection module, one product was found to have a poor solder joint. The defective lead was removed using laser, and the wire was rebonded according to the original parameters to ensure reliable electrical connection.

[0074] The primary molding module uses a ball-head optical mold, employing a single ball-head design for the receiver end to meet the optical requirements of smart bracelets. The molding process parameter control module collects real-time data and inputs it into a dynamic optimization model for molding pressure. ,in The value of 1.1 is selected based on the melt viscosity of the white glue. The real-time molding temperature is 128℃. It is 150℃. The mold cavity depth is 0.9mm. The target thickness of the first molding layer is 0.5 mm. The calculation yields... =1.1×(128 / 150)×(1+0.9 / 0.5)=1.1×0.8533×2.8≈2.61MPa. Adjust the injection pressure to 5.2MPa, which is within the set range of 5-10MPa, and complete one molding. The thickness of the molded layer is controlled at 0.5mm.

[0075] The secondary molding module uses a mold with a pre-exposed ball head optical exposure structure. The molding material temperature control module controls the temperature of the black glue at 135℃ and injects the black glue at an injection pressure of 6.2MPa. The thickness of the secondary molding layer is set to 0.3mm, forming an ultra-thin integrated cavity structure, which enhances the product's sealing performance and mechanical strength.

[0076] The cutting and forming module uses a high-precision laser cutting device to cut the product into slices according to a preset size. The cutting path deviation is ≤±0.02mm, separating individual products. The depth is precisely controlled during the cutting process to avoid damage to the internal structure.

[0077] The concentricity detection and calibration module captures product images, analyzes and calculates concentricity deviation, and calculates the correction angle for products with deviations exceeding the standard by substituting them into the concentricity deviation correction model. Assuming an X-axis deviation of 0.03mm, =0.35; Shaft deviation 0.02mm, =0.35, calculated as follows =0.35×0.03+0.35×0.02=0.0175 radians, drive the fine-tuning mechanism to adjust the molding parameters, and after correction, the deviation is controlled within 0.03mm.

[0078] The finished product comprehensive testing module showed that the product's light transmittance, impact resistance, sealing performance, and electrical properties all met the requirements. The packaging size adaptive module pre-stored smart bracelet packaging parameters, allowing for rapid production switchover without refactoring the production line. The mass production adaptation and data management module improved efficiency through seven parallel operation units, collecting data in real time and generating analysis reports to optimize the production process.

[0079] 2. Application effect data

[0080] Table 2 is a comparison table of the performance of ultra-thin packaging for smart bracelets:

[0081] Total package thickness 1.8mm 1.1mm Product weight 1.2g 0.7g Mechanical strength pass rate 85% 97% Client debugging difficulty high Low Application adaptability single Diverse

[0082] Table 2 data illustrates that traditional discrete packaging, with a thickness of 1.8mm and a weight of 1.2g, cannot meet the ultra-thin and lightweight requirements of smart bracelets. Its mechanical strength qualification rate is only 85%, and it suffers from high client-side debugging difficulty and limited application compatibility. This invention, through ultra-thin DAF film design and integrated molding process, reduces the packaging thickness to 1.1mm and controls the weight to 0.7g, perfectly meeting terminal requirements. The mechanical strength qualification rate of the package is increased to 97%, significantly enhancing stability. The client-side debugging process is greatly simplified, reducing the learning curve. Simultaneously, the system supports multi-scenario parameter switching, resulting in wider application adaptability. It successfully solves many limitations of traditional packaging in ultra-thin smart terminal applications, providing a cost-effective packaging solution for smart wearable devices.

[0083] Reference Figure 2 This bar chart visually quantifies the comprehensive advantages of the integrated packaging of this invention compared to traditional discrete packaging, accurately addressing the core pain points of packaging technology. Traditional packaging, due to its discrete design, has a thickness of 2.5mm and a bezel width of 1.8mm, failing to meet the miniaturization requirements of end products. Its concentricity pass rate is only 82%, resulting in a large number of scrapped products due to eccentricity, and also leading to high costs and low mass production efficiency. This invention, through integrated molding technology and concentricity calibration technology, reduces the packaging thickness to 1.7mm and the bezel width to 1.1mm, fully adapting to narrow bezel requirements; the concentricity pass rate is increased to 98%, significantly reducing the scrap rate; the simplified integrated process reduces costs to 65% of traditional solutions, and mass production efficiency is increased by 80%.

[0084] Reference Figure 3 The line graph clearly demonstrates the core function of the concentricity detection and calibration module of this invention, solving the pain point of continuous deterioration of concentricity in traditional packaging. Traditional packaging lacks a calibration mechanism, and concentricity deviation increases continuously with each process, reaching 0.07mm after cutting and molding, far exceeding the acceptable threshold. This invention introduces a calibration module after secondary molding, calculating the correction angle through a deviation correction model, reducing the deviation from 0.04mm to 0.03mm, and stabilizing at 0.02mm after cutting and molding. This trend verifies that this invention can control concentricity at each stage in real time, ensuring the final product meets requirements through precise correction, fundamentally improving yield, avoiding product scrap due to eccentricity, and highlighting the advantages of optical performance stability.

[0085] Reference Figure 4The bar chart confirms the scientific validity of the DAF film parameter optimization module of this invention, providing data support for adaptation to different chips. The thickness of the DAF film interlayer directly affects the bonding strength and heat dissipation efficiency. Traditional packaging uses a fixed thickness, making it difficult to balance the requirements of both. This invention dynamically adjusts the thickness. When the interlayer thickness is 0.15mm, the bonding strength reaches 2.1N / cm and the heat dissipation efficiency is 95%, both within the optimal range. When the thickness is too thin or too thick, both performances decrease. The trend line shows that the bonding strength and heat dissipation efficiency exhibit a quadratic curve relationship with thickness, first increasing and then decreasing. Based on this, this invention customizes the optimal parameters for ultra-small and ultra-thin chips, ensuring a firm bond between the chip and the substrate while improving heat dissipation, replacing the traditional silver paste die bonding process.

[0086] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An integrated laser transmitter and receiver cavity molding and packaging system, characterized in that, Includes the following modules: The substrate pretreatment module performs surface cleaning, circuit continuity testing and pretreatment on the PCB packaging substrate, removes oil, oxide layer and impurities from the substrate surface, repairs micro defects in the circuit, and makes the substrate surface flatness meet the packaging requirements. The chip die bonding module is equipped with an optimized DAF film supply unit and a high-precision die bonding device. The DAF film consists of a first adhesive surface, a second adhesive surface, and an intermediate high thermal conductivity resin layer. The first adhesive surface is bonded to the laser emitting chip and the receiving chip respectively, and the second adhesive surface is bonded to the pre-treated PCB substrate. The chip and the substrate are firmly fixed through a temperature-controlled pressing process, which is suitable for the die bonding requirements of ultra-small and ultra-thin chips. The wire bonding module uses ultrasonic bonding technology. It adjusts the posture and pressure of the bonding head through a high-precision motion control unit to connect the chip pins to the preset pads on the PCB substrate, forming a stable electrical path. The bonding strength and conductivity are monitored in real time during the bonding process. The single-molding module is equipped with a white glue injection unit and an optical forming mold. According to the packaging optical design requirements, a ball-head optical mold or a flat mold is selected. Molten white glue is injected into the mold cavity to perform single-molding of the transmitter and receiver. The secondary molding module is equipped with a black glue injection unit and a multi-functional molding mold. The mold integrates a carrier wavelength filter or a reserved ball head optical exposure structure. According to the optical structure design requirements, the black glue is injected into the mold to perform secondary encapsulation of the semi-finished product after the first molding, forming an integrated cavity structure. The cutting and forming module uses a high-precision laser cutting device to dicing and cutting the substrate after secondary molding according to the preset packaging size parameters, separating individual integrated packaging products. The cutting path and depth are adjusted in real time during the cutting process. The concentricity detection and calibration module captures the position images of the product's optical photosensitive area and the ball head through the vision detection unit, analyzes and calculates the concentricity deviation between the two, and activates the mechanical fine-tuning mechanism for products with deviations exceeding the standard, adjusting the molding parameters or the chip die bonding position.

2. The integrated laser transmitter and receiver cavity molding packaging system according to claim 1, characterized in that, It also includes a DAF film parameter optimization module, which dynamically adjusts the thickness and adhesion parameters of each layer of the DAF film based on chip size, thickness and narrow bezel requirements of the package. The adhesion of the first adhesive layer is adapted to the chip material, the adhesion of the second adhesive layer meets the substrate bonding requirements, and the thickness of the middle layer high thermal conductivity resin layer is adjusted according to the chip heat dissipation requirements.

3. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, It also includes a filter precision integration module, equipped with a filter positioning and conveying unit and a molding synchronous bonding mechanism. According to the wavelength adaptation requirements of the packaged product, the corresponding specification of carrier wavelength filter is selected. During the secondary molding process, the filter is simultaneously fixed in the preset optical channel position. The filter and the molding black glue form a tight bonding structure, eliminating the need for subsequent assembly processes.

4. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, It also includes a molding process parameter control module, which collects temperature, pressure, and injection speed data in real time during the primary and secondary molding processes, and introduces a dynamic optimization model for molding pressure. ,in The optimal pressure for molding, For material properties, For real-time molding temperature, Standard molding temperature, For the depth of the mold cavity, This represents the target thickness of the molded layer.

5. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, The concentricity detection and calibration module introduces a concentricity deviation correction model: ,in To correct the angle for concentricity, for Shaft deviation correction factor For the actual photosensitive area coordinate, Standard for photosensitive areas coordinate, for Shaft deviation correction factor For the actual ball head coordinate, For the standard of ball head The coordinates are calculated, and the deviation value drives the fine-tuning mechanism to make corrections, so as to control the concentricity deviation within the preset range.

6. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, It also includes a bonding quality re-inspection module, which adopts... Optical inspection technology and continuity testing unit perform comprehensive inspection on the semi-finished products after wire bonding, identify wire defects, mark products that fail the inspection and trigger the rework process, and achieve defect repair through rebonding or resoldering.

7. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, It also includes a package size adaptive module, equipped with a replaceable mold library and parameter storage unit, pre-stores package size parameters and optical design schemes for different application scenarios, and can quickly switch molds and adjust process parameters according to customer needs.

8. The integrated laser transmitter and receiver cavity molding packaging system according to claim 1, characterized in that, It also includes a temperature control module for molding materials, which independently controls the temperature of white glue for primary molding and black glue for secondary molding. The temperature control range of white glue is adapted to its melting and molding requirements, while the temperature control range of black glue is adjusted according to its curing characteristics. The heating power is adjusted through real-time temperature feedback to ensure that the molding materials are always in the optimal processing state.

9. The integrated laser transmitter and receiver cavity molding and packaging system according to claim 1, characterized in that, It also includes a finished product comprehensive testing module, which integrates optical performance testing, mechanical strength testing, sealing testing and electrical performance testing units to conduct comprehensive testing on the finished product after cutting and forming. Optical performance testing includes light transmittance and light divergence angle testing, mechanical strength testing tests the impact resistance and bending resistance of the package, sealing testing adopts the airtightness testing method, and electrical performance testing includes conduction resistance and insulation performance testing. All test data are stored in real time and support traceability.

10. The integrated laser transmitter and receiver cavity molding packaging system according to claim 1, characterized in that, It also includes a mass production adaptation and data management module, equipped with a multi-station parallel operation unit and a production data acquisition and analysis system, which collects the operating parameters of each module and product testing data in real time, generates production reports and quality analysis reports, identifies production bottlenecks and optimizes process parameters.

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