An optical device glass solder automatic pick-and-place coupling and soldering apparatus and method

Abstract

The application provides an optical device glass solder automatic taking and placing coupling welding device and method, and belongs to the technical field of optical device production. The device comprises a device tool, a tray tool, a feeding mechanism and a coupling mechanism. The tray tool is provided with a supporting part and a positioning recess. The tray tool limits the glass solder in the groove through the supporting part, and simultaneously uses the positioning recess to accommodate the part corresponding to the two sides of the groove of the glass solder, so that the glass solder cannot be poured in the first direction, thereby keeping the glass solder vertical or close to vertical, and facilitating automatic feeding. Therefore, the optical device glass solder automatic taking and placing coupling welding device in the embodiment can effectively solve the feeding problem of the glass solder with thin thickness, and can improve the production efficiency.

Description

Technical Field

[0001] This application belongs to the field of optical device manufacturing technology, specifically relating to an automatic pick-and-place coupling welding device and method for optical device glass solder. Background Technology

[0002] In some laser devices, due to considerations of coupling efficiency and cost, as well as matching the laser's output beam with the optical fiber, a coupling focusing lens is not required; the optical fiber is directly coupled to the laser's output side. In related existing technologies, the optical fiber is welded and fixed using glass solder after coupling. When the glass solder is thin, it is difficult to neatly arrange it on the tray for automatic loading by the coupling equipment, thus requiring manual loading, which restricts production efficiency. Summary of the Invention

[0003] This application aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, in a first aspect, this application provides an automatic pick-and-place coupling welding device for optical device glass solder, capable of solving the problem of feeding thin glass solder.

[0004] Secondly, this application provides an automatic pick-and-place coupling welding method for optical device glass solder applied to the aforementioned automatic pick-and-place coupling welding equipment for optical device glass solder.

[0005] An automatic pick-and-place coupling welding apparatus for optical device glass solder according to an embodiment of the first aspect of this application includes: A device fixture, configured to fix an optical device; A tray fixture configured to hold glass solder; A feeding mechanism configured to pick up glass solder from the tray fixture and place it onto the optical component of the device fixture; A coupling mechanism configured to couple an optical fiber to an optical device of the device tooling; The tray fixture is provided with a support part along the first direction, the outer diameter of the support part is the same as that of the optical fiber, and the tray fixture is provided with a plurality of positioning recesses along the first direction. The support part passes through the positioning recesses laterally. The tray fixture is configured to be supported by the groove of the glass solder by the support part and to accommodate the glass solder by the positioning recesses.

[0006] The automatic pick-and-place coupling welding device for optical device glass solder according to the embodiments of this application has at least the following beneficial effects: During operation, the coupling mechanism couples the optical fiber to the optical device in the device fixture, and the feeding mechanism takes the glass solder from the tray fixture and places it into the welding position of the optical fiber in the optical device. Then, welding is performed to complete the coupling of the optical fiber.

[0007] The automatic pick-and-place coupling welding equipment for optical device glass solder in this embodiment uses a tray fixture with a support and a positioning recess. Since the glass solder has a sheet-like structure and grooves extending upwards from the bottom, it can be placed on the support. The support limits the glass solder within the grooves, while the positioning recesses accommodate portions of the glass solder corresponding to the sides of the grooves, preventing it from tilting in the first direction. This keeps the glass solder vertical or nearly vertical, facilitating automatic pick-up. Therefore, the automatic pick-and-place coupling welding equipment for optical device glass solder in this embodiment effectively solves the problem of feeding thin glass solder, improving production efficiency.

[0008] According to some embodiments of this application, the support portion is configured as an optical fiber, and the tray tooling is provided with a receiving groove for accommodating the support portion.

[0009] According to some embodiments of this application, the feeding mechanism is provided with a negative pressure suction nozzle, which is configured to draw the glass solder from the side end face of the glass solder.

[0010] According to some embodiments of this application, the device tooling includes: A support base, wherein two support plates are spaced apart at the upper end of the support base; The mounting module is connected between the two support plates and is used to clamp the optical device; A cooling module is disposed at the bottom of the mounting module and configured to cool the mounting module.

[0011] According to some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder further includes a welding mechanism, which is disposed on the side of the device fixture close to the coupling mechanism and configured to weld the tail tube to the optical device.

[0012] According to some embodiments of this application, the welding mechanism includes: A split-type resistance welding module, wherein the split-type resistance welding module can be opened and closed for adjustment; A pneumatic module is connected to the split-type resistance welding module to drive the split-type resistance welding module to open and close. When the pneumatic module drives the split-type resistance welding module to clamp the tail tube, it stops applying clamping driving force to the split-type resistance welding module.

[0013] According to some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder further includes a temperature control mechanism, which is configured to heat the optical device and / or cool the optical device.

[0014] According to some embodiments of this application, the temperature control mechanism includes an air blowing pipe mounted above the device fixture, the air blowing pipe being used to blow compressed air at a set temperature onto the optical device on the device fixture.

[0015] According to some embodiments of this application, the optical device has a built-in heating part and a welding part, the welding part and the heating part are spaced apart, the heating part is configured to be able to generate heat by being energized to heat the welding part, and the welding part is configured to be used for welding optical fibers with glass solder; The automatic pick-and-place coupling welding equipment for optical device glass solder also includes a temperature monitoring mechanism. The temperature monitoring mechanism is mounted above the device fixture and is configured to monitor the temperature of the optical device using infrared technology.

[0016] According to some embodiments of this application, the coupling mechanism includes: An optical fiber angle coupling module is configured to clamp the optical fiber along its length and control the optical fiber to rotate around its own axis. An optical fiber feed module is configured to clamp an optical fiber inserted into the optical device to a coupling position.

[0017] The automatic pick-and-place coupling welding method for optical device glass solder according to the second aspect of this application, applied to the aforementioned automatic pick-and-place coupling welding equipment for optical device glass solder, includes: Angular coupling of optical fibers is performed between optical fiber insertions into optical devices; After the optical fiber is angle-coupled, insert the optical fiber into the coupling position of the optical device and fix it by optical fiber welding; Then weld the tail tube and weld the tail tube to the optical fiber.

[0018] The automatic pick-and-place coupling welding method for optical device glass solder according to the embodiments of this application has at least the following beneficial effects: The automatic pick-and-place coupling welding method for optical device glass solder in this embodiment, based on the aforementioned automatic pick-and-place coupling welding equipment for optical device glass solder, can keep the glass solder in a vertical or near-vertical position, thereby facilitating automatic picking and automatic feeding, and effectively improving production efficiency.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and some of these additional aspects and advantages will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0020] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of an overall structure of this application; Figure 2 A schematic diagram of a device tooling structure; Figure 3 A schematic diagram of a material tray tooling structure; Figure 4 A schematic diagram illustrating a material handling process by a feeding mechanism. Figure 5 This is a schematic diagram illustrating the structural principle of a feeding mechanism; Figure 6 This is a schematic diagram of a state where an optical device is coupled to an optical fiber. Figure 7 This is a schematic diagram of a welding mechanism. Figure 8 A schematic diagram of a feeding mechanism and a temperature control mechanism; Figure 9 A schematic diagram of a temperature control mechanism; Figure 10 A schematic diagram of a coupling mechanism; Figure 11 This is a schematic diagram of a coupling mechanism. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0024] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0025] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] In some laser devices, due to considerations of coupling efficiency and cost, as well as matching the laser's output beam with the optical fiber, a coupling focusing lens is not required; the optical fiber is directly coupled to the laser's output side. In related existing technologies, the optical fiber is welded and fixed using glass solder after coupling. When the glass solder is thin, it is difficult to neatly arrange it on the tray for automatic loading by the coupling equipment, thus requiring manual loading, which restricts production efficiency.

[0027] In response, this application provides an automatic pick-and-place coupling welding device for optical device glass solder, which can solve the problem of feeding thin glass solder.

[0028] Reference Figures 1 to 11 In some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical devices includes an equipment platform and a device fixture 100, a tray fixture 200, a loading mechanism 300, and a coupling mechanism 400 disposed on the equipment platform. The device fixture 100 is configured to fix the optical device 10 to position it on the equipment platform. The tray fixture 200 is configured to place the glass solder. The loading mechanism 300 is configured to pick up the glass solder from the tray fixture 200 and transfer it to the optical device 10 on the device fixture 100. The coupling mechanism 400 is configured to couple an optical fiber to the optical device 10 on the device fixture 100.

[0029] In application, the optical device 10 is first placed on the device fixture 100 for positioning. Then, the coupling mechanism 400 couples the optical fiber to the optical device 10 in the device fixture 100. The feeding mechanism 300 then takes the glass solder from the material tray fixture 200 and places it into the welding position of the optical fiber in the optical device 10 for welding to complete the coupling of the optical fiber.

[0030] Reference Figure 3Furthermore, in this embodiment, the tray fixture 200 is provided with a support portion 201 along the first direction. The outer diameter of the support portion 201 is consistent with that of the optical fiber. At the same time, the tray fixture 200 is provided with a plurality of positioning recesses 202 along the first direction. The support portion 201 passes laterally through the positioning recesses 202. The tray fixture 200 is configured to be supported by the support portion 201 in the groove of the glass solder and to accommodate the glass solder through the positioning recesses 202.

[0031] like Figure 3 As shown, the glass solder is thin and sheet-like, with grooves from bottom to top to accommodate optical fibers. When the glass solder is placed at the welding position of the optical fiber, it spans across both sides of the fiber through the grooves, and is then heated and melted to cover and fix the fiber. In this embodiment, a support portion 201 with an outer diameter matching the optical fiber is provided, which can be inserted into the groove of the glass solder to support it and restrict its movement in a second direction perpendicular to the first direction. Since the support portion 201 passes laterally through the positioning recess 202, which is located on both sides of the support portion 201, when the glass solder is placed on the support portion 201, its bottom portion is accommodated in the positioning recess 202, preventing the glass solder from tilting in the first direction. This stably limits the glass solder to a vertical or near-vertical position, facilitating automatic material handling. In this embodiment, multiple positioning recesses 202 are provided along the first direction, so multiple glass solders can be placed along the length of the support 201, and the glass solders can be arranged in an orderly manner.

[0032] Therefore, the automatic pick-and-place coupling welding equipment for optical device glass solder in this embodiment can effectively solve the problem of feeding thin glass solder and improve production efficiency.

[0033] In some embodiments of this application, the support portion 201 is configured as an optical fiber, and the tray fixture 200 is provided with a receiving groove to accommodate the support portion 201. Using the structural configuration of this embodiment, the support portion 201 is made of optical fiber, which helps reduce manufacturing costs. Furthermore, the optical fiber is elastic; using it to support the glass solder allows the feeding mechanism 300 to automatically pick up the glass solder from top to bottom, preventing the upper and lower ends of the glass solder from being rigidly compressed and broken. Based on this, the receiving groove in the tray fixture 200 effectively positions the optical fiber, ensuring it remains stably in the first direction. Simultaneously, reducing the height of the optical fiber relative to the positioning recess 202 increases the size of the glass solder accommodated within the positioning recess 202, improving the stability of the glass solder.

[0034] Understandably, during the process of the feeding mechanism 300 picking up the glass solder downwards, the glass solder can move by squeezing the optical fiber downwards, thereby avoiding rigid compression. Due to the material properties of the optical fiber, it can effectively support the glass solder and deform under slight force. It is sensitive to force and can deform downwards immediately when the glass solder is subjected to the downward docking force of the feeding mechanism 300, effectively protecting the glass solder.

[0035] Reference Figure 1 and Figure 4 In some embodiments of this application, the feeding mechanism 300 is provided with a negative pressure suction nozzle 301, which is configured to draw glass solder from the side end face of the glass solder.

[0036] Specifically, the bottom of the negative pressure suction nozzle 301 includes a downwardly protruding first protrusion and a laterally protruding second protrusion, with a stepped surface formed between the first and second protrusions. The lower end face of the second protrusion has an arc that matches the glass solder, allowing the stepped surface to conform to the upper end of the glass solder. A negative pressure port is provided on the side of the first protrusion near the second protrusion. When picking up the glass solder, the negative pressure suction nozzle 301 abuts against the top of the glass solder via the stepped surface and adsorbs the end face of the glass solder through the negative pressure port.

[0037] Furthermore, the negative pressure port extends upwards to the stepped surface, allowing the upper end of the glass solder to be adsorbed as well. Its extension distance should be less than the thickness of the glass solder, ensuring that the entire negative pressure port is sealed by the glass solder when it is adsorbed.

[0038] Furthermore, in some embodiments, the feeding mechanism 300 is equipped with a pressure sensor to detect the downward pressure applied when the negative pressure suction nozzle 301 contacts the glass solder. When the set pressure is reached, it is determined that the bonding is in place, thus avoiding further downward pressure that could damage the optical fiber supporting the glass solder.

[0039] Reference Figure 5In some embodiments, the feeding mechanism 300 is provided with a vertical guide rail 302, and a slider 303 is slidably mounted on the vertical guide rail 302. Springs are provided at both the upper and lower ends of the slider 303 for support. A negative pressure suction nozzle 301 is mounted on the slider 303. A detection contact is provided below the slider 303 in the feeding mechanism 300. Simultaneously, the feeding mechanism 300 also limits and brakes the sliding stroke of the slider 303 on the vertical guide rail 302. Under normal conditions, under the combined gravity of the slider 303 and the negative pressure suction nozzle 301, the slider 303 is in a state of gravitational equilibrium under the action of the springs on both sides. In this state, the slider 303 contacts the detection contact. When the glass solder is drawn downwards, the negative pressure suction nozzle 301 contacts the solder, disrupting the balance of the slider 303. This causes the slider 303 to move upwards relative to the vertical guide rail 302, separating from the detection contact. Based on the triggering of the detection contact, the feeding mechanism 300 stops moving downwards, thus preventing the negative pressure suction nozzle 301 from continuing to descend and damaging the glass solder or optical fiber. In practical applications, the sliding stroke of the slider 303 only needs to be a few micrometers to achieve control feedback for the detection contact.

[0040] With the structural configuration of this embodiment, the feeding mechanism 300 uses a mechanical triggering mechanism that triggers the downward stop by retracting after the negative pressure suction nozzle 301 is in position. This mechanism is more reliable and sensitive.

[0041] It is understood that the negative pressure suction nozzle 301 in this embodiment adopts a contour-following design, which can effectively adsorb glass solder and ensure the reliability of picking up glass solder.

[0042] Reference Figure 2 In some embodiments of this application, the device fixture 100 includes a support base 101, a mounting module 103, and a cooling module 104. The lower end of the support base 101 is connected to the equipment platform, and two support plates 102 are spaced apart at the upper end. The mounting module 103 is connected between the two support plates 102 and is used to clamp the optical device 10. The upper end of the mounting module 103 has a recess matching the width of the optical device 10, and is provided with a first positioning part 1031 and a second positioning part 1032 that can be opened and closed for adjustment. The first positioning part 1031 and the second positioning part 1032 clamp and fix the optical device 10 in the length direction. The cooling module 104 is suspended at the bottom of the mounting module 103 and is configured to cool the mounting module 103. In this embodiment, by suspending the cooling module 104, the cooling structure of the device fixture 100 can be simplified, while providing cooling for the power-on detection of the optical device 10 during fiber coupling.

[0043] Furthermore, the device fixture 100 also includes a power connection module 1033, which is disposed on both sides of the recess for energizing the optical device 10. The optical device 10 to be processed in this application includes a laser chip, a heating part 12, and a welding part 11. The welding part 11 and the heating part 12 are spaced apart. The heating part 12 is configured to be energized and heat the welding part 11, and the welding part 11 is configured to supply glass solder for welding optical fibers. In this embodiment, by providing the power connection module 1033, the power connection of the laser chip can be detected during optical fiber coupling, and during optical fiber welding, the heating part 12 is energized, causing the welding part 11 to heat up, melting the glass solder, and welding the optical fiber onto the welding part 11.

[0044] Reference Figure 1 , Figure 6 and Figure 7 In some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder further includes a welding mechanism 500. The welding mechanism 500 is disposed on the side of the device fixture 100 near the coupling mechanism 400 and is configured to weld the tail tube 13 to the optical device 10. Since the optical device 10 typically has a tail tube 13 at the end where the optical fiber is inserted to fix the optical fiber, this embodiment improves production efficiency by using the welding mechanism 500 to weld the tail tube 13, eliminating the need to transfer to other equipment processes for welding.

[0045] In some embodiments of this application, the welding mechanism 500 includes a split-type resistance welding module 501 and a pneumatic module. The split-type resistance welding module 501 is adjustable in opening and closing to clamp and abut against the tail tube 13 during welding, and to remain separated from it when not welding, so as to facilitate the loading of the tail tube 13. The pneumatic module is connected to the split-type resistance welding module 501 to drive the split-type resistance welding module 501 to open and close, and the pneumatic module stops applying clamping driving force to the split-type resistance welding module 501 when driving the split-type resistance welding module 501 to clamp the tail tube 13.

[0046] This embodiment uses a pneumatic module to control the opening and closing adjustment of the split-type resistance welding module 501. Simultaneously, it stops acting on the split-type resistance welding module 501 after clamping, which helps ensure the welding quality of the tailpipe 13 and prevents it from being displaced or even deformed due to excessive force. Specifically, the pneumatic module can use a multi-position multi-way valve to control the air circuit connection, so that the air circuit connection is disconnected after the split-type resistance welding module 501 is clamped. Furthermore, the structure and control mode of the pneumatic module can be flexibly configured as needed.

[0047] In some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder also includes a temperature control mechanism 600, which is configured to heat and / or cool the optical device 10.

[0048] It should be noted that after welding the tail tube 13, it is necessary to fix the tail tube 13 to the optical fiber, which is generally done by soldering. Since the tail tube 13 has a certain length, traditional processes are difficult to effectively fill the tail tube 13 with solder for fixation. In this embodiment, by setting a temperature control mechanism 600, the optical device 10 can be locally heated, making the solder more fluid and thus filling the tail tube 13. After welding, rapid cooling can be performed.

[0049] Reference Figure 1 , Figure 8 and Figure 9 In some embodiments of this application, the temperature control mechanism 600 includes an air blowing pipe 601 mounted above the device fixture 100. The air blowing pipe 601 is used to blow compressed air at a set temperature onto the optical device 10 on the device fixture 100. Specifically, the air blowing pipe 601 includes a heating pipe 6011 and a cooling pipe 6012, which are used to blow heating air and cooling air respectively. This embodiment uses air blowing for heating or cooling, which can quickly and directly heat and cool the required components, thus improving welding efficiency. During welding, the heating pipe 6011 heats the inside of the optical device 10, while the cooling pipe 6012 cools the side of the optical fiber away from the optical device 10, thereby improving the welding effect and preventing damage to the tail of the optical fiber from high temperature. It can be understood that the simultaneous blowing of the heating pipe 6011 and the cooling pipe 6012 can achieve automatic zoning of hot and cold air, thereby achieving the effect of heating and cooling a set area.

[0050] It is also understandable that the air pipe 601 can be used for cooling after the glass solder is welded.

[0051] In some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder further includes a temperature monitoring mechanism. The temperature monitoring mechanism is mounted above the device fixture 100 and configured to monitor the temperature of the optical device 10 using infrared technology. As described in the foregoing embodiments, since the welding section 11 is heated by thermal radiation from the heating section 12 rather than directly, the temperature monitoring mechanism in this embodiment can effectively detect the temperature of the welding section 11, preventing excessive temperature from damaging the optical device 10. Simultaneously, the cooling of the device fixture 100 can be controlled based on the temperature monitoring results.

[0052] Reference Figure 10 and Figure 11In some embodiments of this application, the coupling mechanism 400 includes an optical fiber angle coupling module 401 and an optical fiber feeding module 402. The optical fiber angle coupling module 401 is configured to clamp the optical fiber along the length direction of the optical fiber and control the optical fiber to rotate around its own axis. The optical fiber feeding module 402 is configured to clamp the optical fiber inserted into the optical device 10 to the coupling position.

[0053] The structural configuration of this embodiment is mainly designed for situations where the end face of the optical fiber has an angle requirement. During operation, the coupling mechanism 400 first adjusts the angle of the optical fiber through the optical fiber angle coupling module 401. After the angle is coupled in place, the optical fiber feed module 402 inserts the optical fiber into the set position of the optical device 10.

[0054] It is understandable that the fiber angle coupling module 401 is used to control the rotation of the fiber for angle adjustment, while the fiber feed module 402 is used to clamp the fiber and move it into the optical device 10. Their specific structures can be flexibly set as needed, and no specific limitations are made here.

[0055] In some embodiments, the fiber optic feed module 402 is equipped with a pressure sensor to detect the pressure when clamping the fiber optic cable. When the clamping pressure reaches a set pressure value, the clamping will stop and the two sides will stop clamping to avoid damaging the fiber optic cable.

[0056] Combination Figure 1 and Figure 8 In some embodiments of this application, the automatic pick-and-place coupling welding equipment for optical device glass solder also includes a vision monitoring mechanism 700. The vision monitoring mechanism 700 includes a top vision module and a side vision module to monitor from different angles. For example, during optical fiber angle coupling, the side vision module is used to accurately detect the angle of the optical fiber end face. Or, during optical fiber welding, the top vision module is used to accurately identify the insertion distance of the optical fiber and the placement position of the glass solder.

[0057] Reference Figure 7 Furthermore, the top vision module is equipped with a filter 701 to prevent the laser emitted by the laser chip from interfering with visual monitoring.

[0058] Based on the structural foundation provided by the above embodiments, embodiments of this application also propose an automatic pick-and-place coupling welding method for optical device glass solder, including: Manual loading involves placing the optical device 10 onto the device fixture 100 for fixation, and then inserting the tail tube 13 into the optical device 10. Then, control the coupling mechanism 400 to perform angular coupling of the optical fiber; After the optical fiber is angle-coupled, the coupling mechanism 400 controls the optical fiber to be inserted from the tail tube 13 into the coupling position of the optical device 10. The control feeding mechanism 300 places the glass solder onto the optical fiber located in the welding section 11, and the heating section 12 heats and melts the glass solder to fix the optical fiber. Then control the welding mechanism 500 to weld the tail pipe 13; Then, solder is manually placed into the tail tube 13, and the temperature control mechanism 600 is activated to heat the tail tube 13 and the part of the optical device 10 near the tail tube 13, so that the solder melts and fills the tail tube 13. After cooling, the welding of the tail tube 13 and the optical fiber is completed.

[0059] The automatic pick-and-place coupling welding method for optical device glass solder in this embodiment, based on the aforementioned automatic pick-and-place coupling welding equipment for optical device glass solder, can keep the glass solder in a vertical or near-vertical position, thereby facilitating automatic picking and automatic feeding, and effectively improving production efficiency.

[0060] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. An automatic pick-and-place coupling welding device for glass solder in optical devices, characterized in that, include: A device fixture, configured to fix an optical device; A tray fixture configured to hold glass solder; A feeding mechanism configured to pick up glass solder from the tray fixture and place it onto the optical component of the device fixture; A coupling mechanism configured to couple an optical fiber to an optical device of the device tooling; The glass solder has a sheet-like structure and a groove is provided from bottom to top. The tray fixture is provided with a support part along the first direction. The outer diameter of the support part is the same as that of the optical fiber. At the same time, the tray fixture is provided with a plurality of positioning recesses along the first direction. The support part passes through the positioning recesses laterally. The tray fixture is configured to support the groove of the glass solder through the support part and to accommodate the glass solder through the positioning recesses. The support part is configured as an optical fiber, and the tray tooling is provided with a receiving groove for accommodating the support part.

2. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 1, characterized in that, The feeding mechanism is equipped with a negative pressure suction nozzle, a vertical guide rail, a slider, and a spring. The slider is slidably connected to the vertical guide rail, and the spring is provided at both the upper and lower ends of the slider. The negative pressure suction nozzle is provided on the slider and is configured to pick up the glass solder from the side end face of the glass solder.

3. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 1, characterized in that, The device fixture includes: A support base, wherein two support plates are spaced apart at the upper end of the support base; The mounting module is connected between the two support plates and is used to clamp the optical device; A cooling module is disposed at the bottom of the mounting module and configured to cool the mounting module.

4. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 1, characterized in that, The automatic pick-and-place coupling welding equipment for optical device glass solder also includes a welding mechanism, which is located on the side of the device fixture close to the coupling mechanism and is configured to weld the tail tube to the optical device.

5. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 4, characterized in that, The welding mechanism includes: A split-type resistance welding module, wherein the split-type resistance welding module can be opened and closed for adjustment; A pneumatic module is connected to the split-type resistance welding module to drive the split-type resistance welding module to open and close. When the pneumatic module drives the split-type resistance welding module to clamp the tail tube, it stops applying clamping driving force to the split-type resistance welding module.

6. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 1, characterized in that, The automatic pick-and-place coupling welding equipment for optical device glass solder also includes a temperature control mechanism, which is configured to heat the optical device and / or cool the optical device.

7. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 6, characterized in that, The temperature control mechanism includes an air blowing pipe mounted above the device fixture. The air blowing pipe is used to blow compressed air at a set temperature onto the optical device on the device fixture. The air blowing pipe includes a heating pipe and a cooling pipe, which are used to simultaneously blow heating air and cooling air to different positions of the optical device.

8. The automatic pick-and-place coupling welding equipment for optical device glass solder according to claim 1, characterized in that, The optical device has a built-in heating part and a welding part, the welding part and the heating part are spaced apart, the heating part is configured to be able to generate heat through electricity to heat the welding part, and the welding part is configured to weld optical fibers with glass solder; The automatic pick-and-place coupling welding equipment for optical device glass solder also includes a temperature monitoring mechanism. The temperature monitoring mechanism is mounted above the device fixture and is configured to monitor the temperature of the optical device using infrared technology.

9. An automatic pick-and-place coupling welding method for glass solder in optical devices, characterized in that, The automatic pick-and-place coupling welding equipment for optical device glass solder as described in any one of claims 1 to 8 comprises: Angular coupling of optical fibers is performed between optical fiber insertions into optical devices; After the optical fiber is angle-coupled, insert the optical fiber into the coupling position of the optical device and fix it by optical fiber welding; Then weld the tail tube and weld the tail tube to the optical fiber.

Images