BOPET (Biaxially Oriented Polyethylene Terephthalate) pre-coating film for electronic tag as well as preparation method and application thereof

Abstract

The invention discloses a BOPET (Biaxially Oriented Polyethylene Terephthalate) precoating film for an electronic tag as well as a preparation method and application of the BOPET precoating film, and belongs to the technical field of BOPET precoating films. The anti-static adhesive tape sequentially comprises an anti-static layer, a base material layer, a glue layer and a hot melt adhesive layer from outside to inside, the antistatic layer is prepared from the following raw materials in parts by mass: 0.05 to 10 parts of antistatic agent, 0.05 to 5 parts of resin, 1 to 5 parts of wetting agent and 80 to 95 parts of water; the base material layer is a composite BOPET film; the glue layer is prepared from the following raw materials in parts by mass: 0.1 to 10 parts of glue, 0.1 to 10 parts of coupling agent, 0.1 to 5 parts of antioxidant, 50 to 80 parts of water and 20 to 50 parts of alcohol; the hot melt adhesive layer is prepared from the following raw materials in parts by mass: 70 to 95 parts of ethylene-vinyl acetate, 5 to 10 parts of paraffin and 5 to 20 parts of compatilizer. The BOPET pre-coating film meets the requirement of BOPET on electronic tags in the prior art, is simple in process operation and has good industrial practicability.

Description

Technical Field

[0001] This invention belongs to the field of BOPET pre-coated film technology, specifically relating to a BOPET pre-coated film for electronic tags, its preparation method, and its application. Background Technology

[0002] BOPET pre-coated film has wide applications in the electronic tag industry. In logistics and warehousing, it can serve as a surface protective layer and substrate for electronic tags, improving their abrasion resistance and weather resistance, ensuring long-term legibility. In retail goods, it can be used as a printing carrier and protective layer for electronic tags, providing excellent printability and gloss, enhancing the tag's aesthetics and durability. In the medical and pharmaceutical industry, it can serve as an isolation layer and protective film for pharmaceutical electronic tags, possessing excellent chemical resistance and hygiene safety, ensuring the stability and reliability of tag information. In anti-counterfeiting and traceability, it can be used as a functional substrate for high-end electronic tags, leveraging its excellent barrier and mechanical properties to help tags achieve precise anti-counterfeiting and traceability functions.

[0003] However, ordinary BOPET pre-coated films are prone to accumulating dust and impurities due to static electricity during production, storage, and use. This not only damages the cleanliness of the electronic tags but also interferes with signal transmission stability, a problem that is particularly pronounced in scenarios with high cleanliness and signal stability requirements, such as medical pharmaceuticals and high-end electronic anti-counterfeiting. Furthermore, static electricity can damage sensitive components inside the tags, shortening their lifespan. Existing pre-coated films lack specific optimizations in anti-static properties, making it difficult to meet the needs of practical applications. Summary of the Invention To address the shortcomings of existing technologies, the present invention aims to provide a BOPET pre-coated film for electronic tags, its preparation method, and its application, thereby solving the problems in the prior art.

[0004] The objective of this invention can be achieved through the following technical solutions: A BOPET pre-coated film for electronic tags comprises, from the outside to the inside: an antistatic layer, a substrate layer, an adhesive layer, and a hot melt adhesive layer. The antistatic layer comprises the following raw materials in parts by weight: 0.05-10 parts antistatic agent, 0.05-5 parts resin, 1-5 parts wetting agent, and 80-95 parts water; The substrate layer is a composite BOPET film, comprising: substrate A layer and substrate B layer; substrate A layer comprises 60-80 parts by weight of PET polyester chips; substrate B layer comprises: 20-40 parts by weight of PEB polyester chips and 20-40 parts by weight of PETG polyester chips.

[0005] The adhesive layer comprises the following raw materials in parts by weight: 0.1-10 parts adhesive, 0.1-10 parts coupling agent, 0.1-5 parts antioxidant, 50-80 parts water, and 20-50 parts alcohol; The hot melt adhesive layer comprises the following raw materials in parts by weight: 70-95 parts ethylene-vinyl acetate, 5-10 parts paraffin wax, and 5-20 parts compatibilizer.

[0006] Furthermore, the antistatic agent is one or more of polythiophene, carbon nanotubes, and ionic liquids.

[0007] Furthermore, the resin is one or more of waterborne polyester, polyurethane resin, and acrylate.

[0008] Furthermore, the wetting agent is one or more of sulfosuccinate salt, perfluoroalkyl ether, thioether polyether, and fatty acid ester ether.

[0009] Furthermore, the adhesive is one or more of polyethyleneimine, vinyl acetate polymer, polyurethane, and epoxy resin.

[0010] Further, the coupling agent is one or more selected from isooctoxyzirconium aluminate, 3-isocyanatopropyltriethoxysilane, allyl borate diethyl ester, tetra-n-propylzirconate, and N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane.

[0011] Further, the antioxidant is one or more of 2,4-di(dodecylthiomethyl)-6-methylphenol, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, N,N'-diisopropyl-p-phenylenediamine, and bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite; The compatibilizer is one or more of C5 petroleum resin, high-density polyethylene, and polyolefin elastomer.

[0012] Furthermore, the preparation process of the composite BOPET film includes: Step 1: After drying and crystallizing the PET polyester chips, add them to the main extruder, heat to 275-285℃ for melt extrusion, and filter to obtain layer A melt; Step 2: Mix PEB polyester chips and PETG polyester chips evenly, add to the auxiliary extruder, heat to 275-285℃ and melt extrude, vacuum and filter to obtain B layer melt; Step 3, co-extrusion into thick sheet: The melt of layers A and B is co-extruded through a double-layer die to obtain a thick sheet; Step 4: The thick sheet is first stretched longitudinally, then stretched laterally, and finally heat-set and cooled to obtain a composite BOPET film.

[0013] The above-mentioned method for preparing BOPET pre-coated film for electronic tags includes the following steps: The antistatic agent, resin, wetting agent and water are mixed and stirred to obtain an antistatic dispersion. The biaxially oriented composite BOPET film is unwound to obtain the substrate layer, and the surface of the substrate A layer is subjected to pre-corona treatment. The adhesive, coupling agent, antioxidant, water and alcohol are mixed and then coated on the surface of the substrate layer after pre-corona treatment. After drying, an adhesive layer is formed. After mixing and stirring ethylene-vinyl acetate, compatibilizer and paraffin, a hot melt adhesive layer material is obtained; the hot melt adhesive layer material is cast into a hot melt adhesive layer by melt casting method; then the surface of the hot melt adhesive layer is subjected to post-corona treatment, and the hot melt adhesive layer is pressed onto the adhesive layer; The antistatic dispersion is coated onto substrate B to form an antistatic layer.

[0014] The above-mentioned BOPET pre-coated film is used in the preparation of electronic tags.

[0015] The beneficial effects of this invention are: 1. The antistatic layer of the present invention uses high-conductivity materials such as polythiophene and carbon nanotubes, which can form a conductive network on the surface, effectively dissipate static electricity, avoid dust adsorption and signal interference, protect the internal components of the label, and meet the requirements of high-cleanliness application scenarios.

[0016] 2. In this invention, layer A is mainly composed of PET to provide strength and dimensional stability, while layer B introduces a blend of PEB and PETG to enhance flexibility and improve tensile processing performance, so that the film has both good mechanical strength and molding adaptability.

[0017] 3. The adhesive layer of this invention uses colloids such as polyethyleneimine, and a coupling agent is used to enhance the interfacial adhesion. The addition of antioxidants delays material aging and ensures that each layer does not peel off and maintains stable performance during long-term use.

[0018] 4. The hot melt adhesive layer of the present invention is based on ethylene-vinyl acetate and combined with compatibilizers such as petroleum resin to achieve low-temperature activation and high bonding strength, so that the label is firmly attached and suitable for various backing surfaces. Detailed Implementation

[0019] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] A BOPET pre-coated film for electronic tags comprises, from the outside to the inside: an antistatic layer, a substrate layer, an adhesive layer, and a hot melt adhesive layer. The antistatic layer comprises the following raw materials in parts by weight: 0.05-10 parts antistatic agent, 0.05-5 parts resin, 1-5 parts wetting agent, and 80-95 parts water; wherein the antistatic agent is selected from one or more of polythiophene (PEDOT), carbon nanotubes, and ionic liquids; wherein the resin is selected from one or more of waterborne polyester, polyurethane resin, and acrylate; and wherein the wetting agent is selected from one or more of sulfosuccinate salt, perfluoroalkyl ether, thioether polyether, and fatty acid ester ether.

[0021] The substrate layer is a composite BOPET film, comprising a substrate A layer and a substrate B layer, each comprising the following parts by weight of raw materials: Substrate A layer comprises 60-80 parts of PET polyester chips; Substrate B layer comprises 20-40 parts of PEB polyester chips and 20-40 layers of PETG polyester chips. The preparation process of composite BOPET film includes: Step 1: After drying and crystallizing the raw material of substrate A layer (60-80 parts of PET polyester chips), add it to the main extruder, heat it to 275-285℃ and melt it for extrusion, then filter it to obtain the core layer melt; Step 2: Mix the substrate B layer raw materials (20-40 parts of PEB polyester chips + 20-40 parts of PETG polyester chips) evenly, add them to the auxiliary extruder, heat to 275-285℃ and melt extrude, vacuum and filter to obtain the upper surface melt.

[0022] Step 3, co-extrusion into thick sheet: The melt of substrate A layer and the melt of substrate B layer are co-extruded through a double die to obtain a thick sheet; the thick sheet is first subjected to longitudinal stretching: preheating 50-100℃, stretching temperature 103-110℃, stretching ratio 4.1-4.3 times; Step 4, followed by transverse stretching: preheating to 99-105℃, stretching temperature to 110-125℃, and stretching ratio to 3.8-4.1 times; Step 5: Finally, heat set (temperature 225-240℃) and cool to obtain the finished product.

[0023] The adhesive layer comprises the following raw materials in parts by weight: 0.1-10 parts adhesive, 0.1-10 parts coupling agent, 0.1-5 parts antioxidant, 50-80 parts water, and 20-50 parts alcohol; the adhesive is selected from one or more of polyethyleneimine, vinyl acetate polymer, polyurethane, and epoxy resin; the coupling agent is selected from one or more of isooctyloxyzirconium aluminate, 3-isocyanate-propyltriethoxysilane, allyl borate diethyl ester, tetra-n-propylzirconate, and N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane; the antioxidant is selected from one or more of 2,4-di(dodecylthiomethyl)-6-methylphenol, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, N,N'-diisopropyl-p-phenylenediamine, and bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite.

[0024] The hot melt adhesive layer comprises the following raw materials in parts by weight: 70-95 parts of ethylene-vinyl acetate, 5-10 parts of paraffin wax, and 5-20 parts of compatibilizer; The vinyl acetate (VA) content in the ethylene-vinyl acetate mixture in the hot melt adhesive layer is 10wt%-30wt%; the compatibilizer is one or more of C5 petroleum resin, high-density polyethylene (0.941-0.960 g / cm³), and polyolefin elastomer.

[0025] The thickness of the substrate layer is 8-25 μm, the thickness of the adhesive layer is 1-8 μm, the thickness of the antistatic layer is 5-10 μm, and the thickness of the hot melt adhesive layer is 3-20 μm.

[0026] The above-mentioned method for preparing BOPET pre-coated film for electronic tags includes the following steps: S1. Mix the antistatic agent, resin, wetting agent and water according to the above mass parts, and stir for 30 minutes to obtain an antistatic dispersion. S2, Unwind the biaxially oriented composite BOPET film to obtain the substrate layer, and perform high-frequency high-voltage pre-corona treatment on the surface of substrate layer A (power 8-15W / m). 2 ); S3, after mixing the adhesive, coupling agent, antioxidant, water and alcohol in the above mass proportions, apply the mixture to the surface of the substrate layer after pre-corona treatment, and dry it in an oven to form an adhesive layer. S4, after mixing and stirring ethylene-vinyl acetate, compatibilizer, and paraffin according to the above-mentioned mass proportions, a hot melt adhesive layer material is obtained; the hot melt adhesive layer material is cast into a hot melt adhesive layer by melt casting method; then the surface of the hot melt adhesive layer is subjected to high-frequency high-voltage corona treatment (power of 5-15W / m). 2 ), and then press the hot melt adhesive layer onto the adhesive layer; S5, the antistatic dispersion in S1 is coated onto the substrate B layer to form an antistatic layer; finally, after trimming, thickness measurement and winding, the BOPET pre-coated film for electronic tags can be obtained.

[0027] The technical solution of the present invention will be described in detail below through the following embodiments; the sources of the raw materials used in the embodiments and comparative examples are as follows: Polythiophene: purchased from Sigma-Aldrich, grade 200000 (Mw); Polyurethane resin: Wanhua Chemical Group Co., Ltd., brand name WHT-1180; Fatty acid ester ethers: BASF (China) Co., Ltd., brand name Lutensol XP-50; Polyethyleneimine: BASF (China) Co., Ltd., brand name Lupasol® PS 40; Alcohol: Analytical grade (AR), purity ≥ 99.7%; Coupling agent (3-isocyanate-propyltriethoxysilane, Nanjing Quanxi Chemical Co., Ltd., brand name QX-225); Antioxidant (2,4-Di(dodecylthiomethyl)-6-methylphenol, Shanghai Titan Technology Co., Ltd., brand name Antioxidant 1726); Compatibilizer (high-density polyethylene, Formosa Plastics: grade 9001); Ethylene-vinyl acetate: Hanwha Total, grade E181L; Paraffin wax: Maoming Petrochemical Company, Grade 58 fully refined paraffin wax.

[0028] The composite BOPET film was prepared in-house using the following process: Step 1: After drying and crystallizing the raw material of substrate A layer (70 parts of PET polyester chips), add it to the main extruder, heat it to 276°C and melt it for extrusion, and filter it to obtain the substrate A layer melt; Step 2: Mix the substrate B layer raw materials (30 parts of PEB polyester chips + 30 parts of PETG polyester chips) evenly, add them to the auxiliary extruder, heat to 280℃ and melt and extrude, then vacuum and filter to obtain the substrate B layer melt.

[0029] Step 3, co-extrusion into thick sheet: The melt of substrate A layer and the melt of substrate B layer are co-extruded through a double die to obtain a thick sheet; the thick sheet is first subjected to longitudinal stretching: preheating 80℃, stretching temperature 108℃, stretching ratio 4.2 times; Step 4, followed by transverse stretching: preheating to 100℃, stretching temperature to 115℃, stretching ratio to 4 times; Step 5: Finally, heat set (temperature 230℃) and cool to obtain the finished product.

[0030] Example 1 A method for preparing a BOPET pre-coated film for electronic tags includes the following steps: S1, by weight, mix 5 parts of antistatic agent (polythiophene), 0.08 parts of resin (polyurethane resin), 1 part of wetting agent (fatty acid ester ether) and 92 parts of water, and stir for 30 minutes to obtain an antistatic dispersion. S2, the biaxially stretched composite BOPET film is unwound to obtain the substrate layer, and the surface of the substrate A layer is subjected to high-frequency high-voltage pre-corona treatment with a voltage of 12kw. S3, by weight, mix 5 parts adhesive (polyethyleneimine), 5 parts coupling agent (3-isocyanate-propyltriethoxysilane), 2 parts antioxidant (2,4-di(dodecylthiomethyl)-6-methylphenol), 63 parts water and 25 parts alcohol, apply the mixture to the surface of the substrate layer after pre-corona treatment, and dry it in an oven to form an adhesive layer with a thickness of 2.5 μm; S4, by weight, 80 parts of ethylene-vinyl acetate, 12 parts of compatibilizer (high-density polyethylene), and 8 parts of paraffin wax are mixed and stirred to obtain a hot melt adhesive layer material; the hot melt adhesive layer material is cast to form a hot melt adhesive layer with a thickness of 12 μm by melt casting method; then the surface of the hot melt adhesive layer is subjected to high-frequency high-voltage corona treatment (corona power 7W / m). 2 ), and then press the hot melt adhesive layer onto the adhesive layer; S5, the antistatic dispersion in S1 is coated onto the substrate B layer to form an antistatic layer with a thickness of 8um; finally, after trimming, thickness measurement and winding, the BOPET pre-coated film for electronic tags can be obtained.

[0031] Example 2 A method for preparing a BOPET pre-coated film for electronic tags includes the following steps: S1, by weight, mix 0.05 parts of antistatic agent (polythiophene), 0.05 parts of resin (polyurethane resin), 1 part of wetting agent (fatty acid ester ether) and 80 parts of water, and stir for 30 minutes to obtain an antistatic dispersion. S2, the biaxially stretched composite BOPET film is unwound to obtain the substrate layer, and the surface of the substrate A layer is subjected to high-frequency high-voltage pre-corona treatment with a voltage of 12kw. S3, by weight, mix 0.1 parts adhesive (polyethyleneimine), 0.1 parts coupling agent (3-isocyanate-propyltriethoxysilane), 0.1 parts antioxidant (2,4-di(dodecylthiomethyl)-6-methylphenol), 50 parts water and 20 parts alcohol, apply the mixture to the surface of the substrate layer after pre-corona treatment, and dry it in an oven to form an adhesive layer with a thickness of 2.5 μm; S4, by weight, 70 parts of ethylene-vinyl acetate, 5 parts of compatibilizer (high-density polyethylene), and 5 parts of paraffin wax are mixed and stirred to obtain a hot melt adhesive layer material; the hot melt adhesive layer material is cast to form a hot melt adhesive layer with a thickness of 12 μm by melt casting method; then the surface of the hot melt adhesive layer is subjected to high-frequency high-voltage corona treatment (corona power 7W / m). 2 ), and then press the hot melt adhesive layer onto the adhesive layer; S5, the antistatic dispersion in S1 is coated onto the substrate B layer to form an antistatic layer with a thickness of 8um; finally, after trimming, thickness measurement and winding, the BOPET pre-coated film for electronic tags can be obtained.

[0032] Example 3 A method for preparing a BOPET pre-coated film for electronic tags includes the following steps: S1, by weight, mix 10 parts of antistatic agent (polythiophene), 5 parts of resin (polyurethane resin), 5 parts of wetting agent (fatty acid ester ether) and 95 parts of water, stir for 30 minutes to obtain an antistatic dispersion. S2, the biaxially stretched composite BOPET film is unwound to obtain the substrate layer, and the surface of the substrate layer is subjected to high-frequency high-voltage pre-corona treatment with a voltage of 12kw. S3, by weight, mix 10 parts of adhesive (polyethyleneimine), 10 parts of coupling agent (3-isocyanate-propyltriethoxysilane), 5 parts of antioxidant (2,4-di(dodecylthiomethyl)-6-methylphenol), 80 parts of water and 50 parts of alcohol, apply the mixture to the surface of the substrate layer after pre-corona treatment, and dry it in an oven to form an adhesive layer with a thickness of 2.5 μm; S4, by weight, 95 parts of ethylene-vinyl acetate, 10 parts of compatibilizer (high-density polyethylene), and 20 parts of paraffin wax are mixed and stirred to obtain a hot melt adhesive layer material; the hot melt adhesive layer material is then cast to form a hot melt adhesive layer with a thickness of 12 μm using a melt casting method; subsequently, the surface of the hot melt adhesive layer is subjected to high-frequency high-voltage corona treatment (corona power 7 W / m). 2 ), and then press the hot melt adhesive layer onto the adhesive layer; S5, the antistatic dispersion in S1 is coated onto the substrate B layer to form an antistatic layer with a thickness of 8um; finally, after trimming, thickness measurement and winding, the BOPET pre-coated film for electronic tags can be obtained.

[0033] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the prepared BOPET pre-coated film does not have an antistatic layer, the adhesive layer is a single polyethyleneimine, and the hot melt adhesive layer is a single ethylene-vinyl acetate. Experimental Test 1) The surface resistivity of the BOPET pre-coated films prepared in Examples 1-3 and Comparative Example 1 was tested according to GB / T 33398; the test results are shown in Table 1 below: Table 1. Surface resistivity test results of BOPET pre-coated film Analysis of the data in Table 1 shows that the antistatic effect of the BOPET pre-coated films in Examples 1-3 is significantly improved; this is because: 1.1) In Examples 1-3, an antistatic layer was provided. The polythiophene, as a conductive antistatic agent, forms a continuous conductive network with the polyurethane resin in the aqueous system, which can quickly conduct the static charge accumulated on the surface, thereby reducing the surface resistivity.

[0034] 1.2) The addition of the wetting agent fatty acid ester ether improves the spreadability and wetting effect of the antistatic dispersion on the substrate layer surface, avoids the agglomeration of polythiophene particles, ensures the uniform distribution of the conductive network, and further optimizes the antistatic performance.

[0035] 1.3) In Example 3, the amount of antistatic agent added was the highest (10 parts), resulting in a denser conductive network and therefore the lowest surface resistivity (3.15 × 10⁻⁶). 7 Ω); In Example 2, the amount of antistatic agent added was the lowest (0.05 parts), the conductive network was relatively sparse, and the surface resistivity was relatively high (8.72×10). 8 (Ω), but it is still far superior to Comparative Example 1 without an antistatic layer, verifying the effectiveness of the antistatic layer design.

[0036] 2) Use a laminating machine to hot-press the ink-coated paper and aluminum foil together to obtain the peel strength value; Specific standards include GB / T8808.

[0037] The test results are shown in Table 2: Table 2. Peel strength test results of BOPET pre-coated film Analysis of the test data in Table 2 shows that the adhesion of the BOPET pre-coated film to the paper and aluminum layer in Examples 1-3 is significantly improved; this is because: 2.1) 3-isocyanate-propyltriethoxysilane coupling agent was added to the adhesive layer. The functional groups at both ends of its molecule formed chemical bonds with the hydroxyl groups on the surface of the substrate layer and the ethylene-vinyl acetate of the hot melt adhesive layer, respectively, thus constructing a stable "substrate-adhesive-hot melt adhesive" connection system, which greatly improved the interlayer bonding force.

[0038] 2.2) The addition of the antioxidant 2,4-bis(dodecylthiomethyl)-6-methylphenol inhibited the oxidative degradation of the adhesive layer during drying and subsequent lamination processes, reduced interfacial defects, and ensured the stability of the interlayer bonding.

[0039] 2.3) High-density polyethylene compatibilizer and paraffin wax were added to the hot melt adhesive layer. High-density polyethylene improved the compatibility of ethylene-vinyl acetate with other components and enhanced the cohesiveness of the hot melt adhesive layer. Paraffin wax optimized the melt flow of the hot melt adhesive, allowing the hot melt adhesive layer to contact the glue layer more fully and further enhancing the adhesion.

[0040] 2.4) In Example 3, the amounts of adhesive, coupling agent, antioxidant and compatibilizer were the highest, resulting in stronger interlayer chemical bonding and fewer interface defects, thus achieving the best peel strength. In Example 2, the amounts of each additive were the lowest, resulting in relatively lower peel strength, but it was still better than Comparative Example 1 without the relevant additives, verifying the rationality of the formulation design of the adhesive layer and hot melt adhesive layer.

[0041] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A BOPET pre-coated film for electronic labels, characterized by, From outside to inside, the anti-static layer, the base material layer, the glue layer and the hot melt adhesive layer are sequentially included; The anti-static layer includes the following raw materials by mass fraction: 0.05-10 parts of anti-static agent, 0.05-5 parts of resin, 1-5 parts of wetting agent, 80-95 parts of water; The base material layer is a composite BOPET film, which includes base material A layer and base material B layer; the base material A layer includes 60-80 parts of PET polyester chips by mass; the base material B layer includes 20-40 parts of PEB polyester chips and 20-40 parts of PETG polyester chips by mass. The glue layer includes the following raw materials by mass fraction: 0.1-10 parts of glue, 0.1-10 parts of coupling agent, 0.1-5 parts of antioxidant, 50-80 parts of water, 20-50 parts of alcohol; The hot melt adhesive layer includes the following raw materials by mass fraction: 70-95 parts of ethylene-vinyl acetate, 5-10 parts of paraffin wax, 5-20 parts of compatibilizer.

2. A BOPET pre-coated film for electronic tags according to claim 1, characterized by the fact that, The anti-static agent is one or more of polythiophene, carbon nanotube and ionic liquid.

3. A BOPET pre-coated film for electronic tags according to claim 1, characterized by the fact that, The resin is one or more of water-based polyester, polyurethane resin and acrylate.

4. A BOPET pre-coated film for electronic tags according to claim 1, characterized by, The wetting agent is one or more of sulfosuccinate salt, perfluoroalkyl ether, thioether polyether and fatty acid ester ether.

5. A BOPET pre-coated film for electronic labels according to claim 1, characterized by the fact that, The glue is one or more of polyethyleneimine, vinyl acetate polymer, polyurethane and epoxy resin.

6. A BOPET pre-coated film for electronic labels according to claim 1, characterized by the fact that, The coupling agent is one or more of isooctyloxy zirconium aluminate, 3-isocyanate propyl triethoxysilane, allyl borate diethyl ester, tetra-n-propyl zirconate and N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane.

7. A BOPET pre-coated film for electronic labels according to claim 1, characterized by the fact that, The antioxidant is one or more of 2,4-bis(dodecylthiomethyl)-6-methylphenol, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, N,N'-diisopropyl-p-phenylenediamine and bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite. The compatibilizer is one or more of C5 petroleum resin, high-density polyethylene and polyolefin elastomer.

8. A BOPET pre-coated film for electronic labels according to claim 1, characterized by the fact that, The preparation process of the composite BOPET film includes: Step 1, after drying and crystallizing the PET polyester chips, adding them into the main extruder, heating to 275-285℃ for melting extrusion, and filtering to obtain the A layer melt; Step 2, uniformly mixing the PEB polyester chips and PETG polyester chips, adding them into the auxiliary extruder, heating to 275-285℃ for melting extrusion, vacuumizing and filtering to obtain the B layer melt; Step 3, co-extruding the A and B layer melts through a double-layer die to prepare a thick sheet; Step 4, first stretching the thick sheet in the longitudinal direction, then stretching it in the transverse direction, and finally heat setting and cooling to obtain the composite BOPET film.

9. Process for the production of BOPET pre-coated films for electronic tags according to any one of claims 1 to 8, characterized in that, The process includes the following steps: Mixing and stirring the anti-static agent, resin, wetting agent and water to obtain an anti-static dispersion liquid; Unwinding the biaxially stretched composite BOPET film to obtain the base material layer, and performing front corona treatment on the surface of the base material A layer; Mixing the glue, coupling agent, antioxidant, water and alcohol, and coating them on the surface of the base material layer after the front corona treatment, and drying to form the glue layer; The hot melt adhesive layer material is obtained by mixing and stirring ethylene-vinyl acetate, a compatilizer and paraffin wax; The hot melt adhesive layer material is flow casted into a hot melt adhesive layer by a melt flow casting method, and the surface of the hot melt adhesive layer is subjected to post-corona treatment, and the hot melt adhesive layer is pressed on the glue layer; The antistatic dispersion liquid is coated on the base material B layer to form an antistatic layer.

10. Use of the BOPET pre-coated film according to any one of claims 1 to 8 for the manufacture of electronic labels.

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