Surface defect detection method based on linear array camera

By introducing a linear array camera detection method with a spatiotemporal fusion module and a dynamic upsampling module, the motion blur and low contrast problems of detecting tiny solder ball defects under high-speed acquisition are solved, and high sensitivity and stability detection of tiny solder ball defects are achieved.

CN121685494BActive Publication Date: 2026-07-21VICTORY GIANT TECH HUIZHOU CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
VICTORY GIANT TECH HUIZHOU CO LTD
Filing Date
2025-12-16
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing surface defect detection methods based on line scan cameras are prone to motion blur under high-speed acquisition conditions, making it difficult to effectively detect small, low-contrast solder ball defects. Furthermore, they do not fully utilize the spatiotemporal correlation information between images, resulting in a high false negative rate.

Method used

A surface defect detection method based on a linear array camera is adopted, which introduces a spatiotemporal fusion module and a dynamic upsampling module. Through the temporal attention layer and feature pyramid network of the Transformer architecture, combined with multi-scale fusion and data augmentation, the detection capability of micro solder ball defects is improved.

Benefits of technology

While maintaining high-speed detection, it improves the accuracy and stability of detecting minute defects, enhances the sensitivity and robustness to minute defects, and outputs structured defect information.

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Abstract

The application discloses a surface defect detection method based on a linear array camera and relates to the technical field of image data processing and image analysis. The application introduces a space-time fusion module, a dynamic up-sampling module and a multi-scale feature pyramid network on an image sequence formed by continuous scanning of the linear array camera, and the overall representation ability of micro solder ball defects under high-speed acquisition conditions is enhanced. Time attention and space attention are jointly modeled, the same spatial position simultaneously refers to multiple frame information, weights are adaptively allocated according to inter-frame similarity and time interval, transient defect signals such as cracks and bridges appearing in a short time are amplified, and stable background constraints are provided by long-distance frames, so that high sensitivity and discrimination of real defects are maintained even when there is motion blur and noise.
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