一种集成电路制造用元器件贴片装置及方法

By employing a rotating disk and placement arm structure in the placement device, and utilizing negative pressure, elastic elements, and damping fluid to enhance adsorption force, the problem of component detachment in single-head placement machines is solved, thereby improving placement efficiency and finished product quality.

CN121692633BActive Publication Date: 2026-07-17HUNAN DANUO TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HUNAN DANUO TECH CO LTD
Filing Date
2026-01-27
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In existing single-head placement machines, components are easily detached due to centrifugal force during the placement process, affecting production efficiency and quality, and may also lead to component damage or finished product quality problems.

Method used

A component placement device for integrated circuit manufacturing was designed, which adopts a rotating disk and placement arm structure. The nozzle can slide and rotate along the placement arm. Combined with negative pressure adsorption, elastic elements and damping fluid, the positive pressure and buffering effect between the component and the nozzle are enhanced to prevent it from falling off.

Benefits of technology

This effectively prevents components from falling off during the surface mount process, improves production efficiency and product quality, and reduces production costs and finished product defects.

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Abstract

本发明涉及集成电路制造技术领域，具体涉及一种集成电路制造用元器件贴片装置及方法，贴片装置包括机座、输料组件、贴片机构和移动组件，贴片机构包括设置在机座上的转动盘，且能够绕自身轴线转动；转动盘上沿周向设置有多个贴片臂；每个贴片臂上均设置有吸嘴，吸嘴既能够相对贴片臂沿贴片臂的延伸方向滑动，又能够通过负压将元器件吸附住；贴片臂既能够沿转动盘的径向方向滑动，又能够绕平行于转动盘轴线的轴线转动，并在转动前后具有相应的第一位置和第二位置，处于第二位置时，吸嘴较贴片臂位于内侧，且吸附有元器件，此时随着转动盘的转动，吸嘴所吸附的元器件所受离心力和吸力均朝外，且能够增大元器件和吸嘴之间的正压力，避免脱落。
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Citation Information

Patent Citations

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  • High accuracy PCB chip mounter

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