An integrated circuit board packaging device

Abstract

The application discloses an integrated circuit board packaging device, which comprises a rack and a box body at the upper end of the rack, wherein the box body is provided with a drying structure and a glue injection structure; a rotating frame is arranged on a shaft; a spiral groove is arranged on a short shaft; a sleeve is arranged on the short shaft, and the inner wall of the sleeve is provided with a protrusion located in the spiral groove; a movable frame is arranged in the sleeve and located in a guide groove; when the shaft drives the rotating frame to rotate, the circuit board can be sequentially opposed to the drying structure and the glue injection structure; when the movable frame is located in the reversing groove, the short shaft, the damping shaft and the circuit board can rotate and rotate by 180 degrees. The rotatable rotating frame and the special guide groove structure are arranged, so that the circuit board can automatically turn over during the glue injection and drying process, manual operation is not needed, the glue injection and the drying can be simultaneously performed and do not interfere with each other, the drying quality can be detected during the packaging process, the drying time can be timely adjusted, and the efficiency of double-sided packaging of the circuit board is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit packaging technology, and more particularly to an integrated circuit board packaging device. Background Technology

[0002] An integrated circuit is a circuit with a specific function that integrates a certain number of commonly used electronic components, such as resistors, capacitors, transistors, and the interconnections between these components, using semiconductor technology.

[0003] An existing integrated circuit packaging device with the publication number CN112234020A uses a bidirectional lead screw to drive two fixed seats to move, center and clamp the circuit board, and prevent the circuit board from arching and tilting upwards. However, this device can only operate on single-sided packaged circuit boards. Bidirectional circuit boards need to be manually flipped before they can be used, which is very inconvenient for packaging double-sided circuit boards.

[0004] The existing integrated circuit packaging method, disclosed in CN116646264A, involves first packaging one side of the circuit board after positioning it, followed by drying. After drying, the circuit board is rotated 180° and then packaged and dried again to complete double-sided packaging. This packaging method requires waiting for one side to be packaged and dried before packaging and drying the next side, reducing the efficiency of circuit board packaging. Furthermore, the packaged circuit board must be removed before proceeding to the next packaging step, further reducing the overall packaging efficiency.

[0005] Therefore, this application proposes a device capable of efficient double-sided packaging of circuit boards. Summary of the Invention

[0006] The purpose of this invention is to solve the above-mentioned technical problems by providing an integrated circuit board packaging device.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: An integrated circuit board packaging device includes a frame and a housing at its upper end. The housing is provided with a drying structure and a glue injection structure. A shaft is rotatably mounted on the frame, and a rotating frame is mounted on the shaft. Four short shafts are rotatably mounted on the rotating frame. A damping rotating shaft is mounted on each short shaft and a circuit board is clamped thereon. A collar is provided on the frame, and a guide groove is provided on the collar. The guide groove includes a circular groove and transition grooves located at both ends thereto. Two transition grooves are connected by a reversing groove. The short shaft is provided with a spiral groove, and the short shaft is provided with a sleeve with a protrusion located in the spiral groove on the inner wall. The sleeve is provided with a movable frame located in the guide groove. When the shaft drives the rotating frame to rotate, the circuit board can be aligned with the drying structure and the glue injection structure one by one. When the movable frame is located in the reversing groove, the short shaft, the damping shaft and the circuit board can rotate 180°.

[0008] Preferably, the rotating frame includes a mounting block fixed to the upper end of the shaft, and four supports arranged in a circular array are fixed on the mounting block. The short shaft is rotatably mounted on the supports, and a drive mechanism is installed at the bottom of the frame. The output end of the drive mechanism is connected to the shaft.

[0009] Preferably, the bracket includes two connecting blocks fixed on the mounting block, and a mounting plate is fixed on the two connecting blocks. The short shaft passes through the mounting plate and is rotatably configured therewith.

[0010] Preferably, a U-shaped rod is fixed on the damping shaft, the inner wall of the U-shaped rod is provided with a U-shaped groove, the circuit board is placed in the U-shaped groove, and the end of the U-shaped rod is provided with a detachable connecting plate, which abuts against the circuit board and limits the circuit board to the U-shaped groove.

[0011] Preferably, the circumferential diameter of the reversing groove is larger than the circumferential diameter of the circular groove, and the transition groove is tangentially arranged with the circular groove and the reversing groove; The circular groove has a superior arc, the reversing groove has a inferior arc, the arc of the reversing groove extends outward relative to the axis of the circular groove, the upper part of the reversing groove is an arc-shaped groove, and the arc-shaped groove and the circular groove are arranged coaxially.

[0012] Preferably, the movable frame includes a movable rod fixed on the sleeve, a horizontal block fixedly connected to the movable rod, a movable column rotatably connected to the bottom of the horizontal block, and the movable column is movably disposed in the guide groove.

[0013] Preferably, a support tube is fixed to the upper end of the frame, the support tube is sleeved on the outside of the shaft, and the collar is fixed on the support tube.

[0014] Preferably, the mounting block is a circular block, and the mounting block is provided with four slots, which are arranged opposite to the short axis.

[0015] Preferably, a plurality of support rods are fixed to the upper end of the frame, and a limiting ring is fixed to the upper end of the plurality of support rods. The upper end of the limiting ring is provided with a PTFE film, and the limiting ring is provided with a notch, the width of which is greater than the width of the U-shaped rod.

[0016] Preferably, the housing is provided with a switch door that can move up and down, and the switch door is provided with a glass observation window.

[0017] Compared with the prior art, the beneficial effects of this invention are as follows: 1. By setting a rotatable rotating frame, and using a short shaft, sleeve, movable frame and other structures in conjunction with the guide groove, the circuit board can automatically rotate 180° during the glue injection and drying process when the drive mechanism drives the shaft to rotate, thus achieving double-sided encapsulation without the need for manual flipping, solving the problem of inconvenient bidirectional circuit board encapsulation operation.

[0018] 2. Multiple working positions are set up. When the drive mechanism drives the rotating frame to rotate, multiple circuit boards can be in different states such as glue injection, drying, and placement. Glue injection and drying do not interfere with each other, which can continuously encapsulate the circuit boards and achieve double-sided encapsulation, greatly improving work efficiency.

[0019] 3. A circuit board in a vertical position allows for quality inspection immediately after packaging and drying. Due to the gravity of the adhesive, if the drying effect is not good, the adhesive will flow downwards, resulting in uneven thickness of the packaging adhesive. This allows staff to adjust the drying time in time after removing the packaged circuit board to ensure the quality of the packaging.

[0020] In summary, this invention, by setting up a rotatable rotating frame and a special guide groove structure, enables the circuit board to automatically flip during the glue injection and drying process without manual operation; moreover, glue injection and drying can be carried out simultaneously without interference, and the drying quality can be detected during the packaging process, allowing for timely adjustment of the drying time, which greatly improves the efficiency of double-sided packaging of circuit boards. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an integrated circuit board packaging device proposed in this invention; Figure 2 This is a front view of an integrated circuit board packaging device proposed in this invention; Figure 3 This is a top view of the interior of a housing in an integrated circuit board packaging device proposed in this invention; Figure 4 This is a schematic diagram of the circuit board and U-shaped rod in an integrated circuit board packaging device proposed in this invention. Figure 5 This is a schematic diagram of the disassembled circuit board and U-shaped rod in an integrated circuit board packaging device proposed in this invention. Figure 6 This is a schematic diagram of the U-shaped groove and damping shaft in an integrated circuit board packaging device proposed in this invention. Figure 7This is a schematic diagram of the mounting block and collar in an integrated circuit board packaging device proposed in this invention; Figure 8 This is a schematic diagram of the structure of the collar and guide groove in an integrated circuit board packaging device proposed in this invention.

[0022] In the diagram: 1. Frame, 2. Housing, 3. Switch door, 4. Support tube, 5. Drying structure, 6. Glue injection structure, 7. Limiting ring, 8. Support rod, 9. U-shaped rod, 10. Circuit board, 11. Mounting block, 12. Connecting plate, 13. Mounting plate, 14. Drive mechanism, 15. Notch, 16. U-shaped groove, 17. Damping shaft, 18. Short shaft, 19. Spiral groove, 20. Horizontal block, 21. Movable column, 22. Moving rod, 23. Sleeve, 24. Protrusion, 25. Connecting block, 26. Groove, 27. Shaft, 28. Collar, 29. Circular groove, 30. Reversing groove, 31. Arc groove, 32. Transition groove. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0024] Reference Figures 1-8 An integrated circuit board packaging device includes a frame 1 and a housing 2 at its upper end. A plate is fixed to the upper end of the frame 1, and the housing 2 is bolted to the plate on the frame 1. The housing 2 is equipped with a sliding door 3, which can move up and down, and has a glass observation window. The glass observation window is made of high-strength, high-transparency tempered glass with a moderate thickness, ensuring clear observation of the circuit board 10 packaging inside the housing 2 while also providing some impact resistance to prevent accidental breakage.

[0025] The housing 2 is equipped with a guide rail, which is a precision linear guide rail characterized by high precision and low friction, ensuring smooth and stable sliding of the slider. The slider is mounted on the guide rail, and a special ball bearing structure further reduces friction between the slider and the guide rail. The opening / closing door 3 is fixed to the slider, facilitating its vertical movement. The opening / closing door 3 is electrically driven, and the electric drive device includes a motor, transmission mechanism, and other components. The motor is a high-performance servo motor, characterized by fast response and high control precision, enabling rapid and accurate opening and closing of the housing 2. The motor transmits power to the opening / closing door 3 through a transmission mechanism, such as gear transmission or synchronous belt transmission, allowing it to move vertically according to the set speed and stroke.

[0026] A shaft 27 is rotatably mounted on the frame 1, passing through and rotatably connected to the plate on the frame 1; a rotating frame is mounted on the shaft 27, and four short shafts 18 are rotatably mounted on the rotating frame. The rotating frame includes a mounting block 11 fixed to the upper end of the shaft 27, wherein the mounting block 11 is a circular block and is coaxially arranged with the shaft 27; and the mounting block 11 is provided with four slots 26, which are arranged opposite to the short shafts 18 to provide space for the movement of subsequent related components.

[0027] A drive mechanism 14 is installed at the bottom of the frame 1. The output end of the drive mechanism 14 is connected to the shaft 27. The drive mechanism 14 is a reducer. The shaft end of the reducer is fixedly connected to the shaft 27. When the drive mechanism 14 is working, it can drive the shaft 27 to rotate.

[0028] Four brackets arranged in a circular array are fixed on the mounting block 11. The short shaft 18 is rotatably mounted on the bracket. The bracket includes two connecting blocks 25 fixed on the mounting block 11. The slot 26 is located between the two connecting blocks 25. The two connecting blocks 25 are fixed with mounting plates 13. The short shaft 18 passes through the mounting plate 13 and is rotatably set therewith.

[0029] A damping shaft 17 is mounted on the short shaft 18, and a circuit board 10 is clamped on it. A U-shaped rod 9 is fixed on the damping shaft 17. The damping shaft 17 can support the U-shaped rod 9, the circuit board 10 after glue injection, etc., so that it is not easy to rotate. The inner wall of the U-shaped rod 9 has a U-shaped groove 16. The circuit board 10 is placed in the U-shaped groove 16. The end of the U-shaped rod 9 has a detachable connecting plate 12. The connecting plate 12 abuts against the circuit board 10 and limits the circuit board 10 in the U-shaped groove 16. Rubber pads are fixed on the inner wall of the U-shaped groove 16 and the connecting plate 12 to protect the circuit board 10 and prevent it from being damaged by friction.

[0030] The connecting plate 12 can be connected to the U-shaped rod 9 by magnetic attraction or by snap-fit, so as to facilitate the quick assembly and disassembly of the connecting plate 12, thereby facilitating the subsequent placement and removal of the circuit board 10, while ensuring the stable positioning of the circuit board 10.

[0031] The frame 1 is provided with a collar 28, and a support tube 4 is fixed at the upper end of the frame 1. The support tube 4 is sleeved on the outside of the shaft 27, and the collar 28 is fixed on the support tube 4. The inner diameter of the support tube 4 is larger than the outer diameter of the shaft 27, and the two do not contact each other to avoid unnecessary friction during the rotation of the shaft 27.

[0032] The collar 28 is provided with a guide groove, which includes a circular groove 29 and transition grooves 32 located at both ends. The two transition grooves 32 are connected by a reversing groove 30. The circumferential diameter of the reversing groove 30 is larger than the circumferential diameter of the circular groove 29. The transition groove 32 is tangent to the circular groove 29 and the reversing groove 30, which makes the movable column 21 move more smoothly inside and reduces the jamming phenomenon during the movement.

[0033] The circular groove 29 has a superior arc, providing a longer movement path for the movable column 21 and ensuring its stable movement within a certain range. The reversing groove 30 has a inferior arc, extending outward in an arc shape relative to the axis of the circular groove 29. This continuously limits the movable column 21 from the axis of the shaft 27, thus continuously driving the sleeve 23 to move on the short shaft 18. The upper part of the reversing groove 30 is an arc-shaped groove 31, which is coaxial with the circular groove 29. The transition groove 32 is tangential to the arc-shaped groove 31, further ensuring the smoothness of the movable column 21's internal movement.

[0034] The short shaft 18 is provided with a spiral groove 19, which is located on the outer surface of the short shaft 18; the short shaft 18 is provided with a sleeve 23 and the inner wall is provided with a protrusion 24 located in the spiral groove 19, which can slide in the spiral groove 19; the sleeve 23 is provided with a movable frame located in the guide groove, and since the groove opening 26 is opposite to the short shaft 18, it also provides space for the movement of the movable frame.

[0035] The movable frame includes a movable rod 22 fixed on the sleeve 23, a cross block 20 fixedly connected to the movable rod 22, and a movable column 21 rotatably connected to the bottom of the cross block 20. The movable column 21 is movably disposed in the guide groove. The outer wall of the movable column 21 and the inner wall of the guide groove are both fixed with PTFE film to reduce the friction between them. In order to ensure that the movable rod 22 moves axially along the sleeve 23, a telescopic rod can be added in the groove 26, and the other end of the telescopic rod is fixedly connected to the movable rod 22.

[0036] When the shaft 27 drives the rotating frame to rotate, the circuit boards 10 can be positioned one by one opposite the drying structure 5 and the glue injection structure 6. When the movable frame is located in the reversing groove 30, the short shaft 18, the damping shaft 17 and the circuit board 10 can rotate 180°.

[0037] To ensure the stability of the circuit board 10, a number of support rods 8 are fixed to the upper end of the frame 1. A limit ring 7 is fixed to the upper end of the support rods 8. The upper end of the limit ring 7 is provided with a PTFE film. The outer wall of the U-shaped rod 9 is also provided with a PTFE film to reduce the friction between the limit ring 7 and the limit ring 7. The limit ring 7 is provided with a notch 15. The width of the notch 15 is greater than the width of the U-shaped rod 9 so that the U-shaped rod 9 can drive the circuit board 10 to rotate and flip within the notch 15.

[0038] The housing 2 is equipped with a drying structure 5 and a glue injection structure 6. When the mounting block 11 stops rotating, the two circuit boards 10 are respectively positioned opposite the drying structure 5 and the glue injection structure 6. The glue injection structure 6 includes a glue tank and a glue pump, etc. The glue tank is made of corrosion-resistant plastic or metal and has a certain capacity to store sufficient glue. The glue pump is a high-precision gear pump or plunger pump, which can accurately control the flow and pressure of the glue, and accurately inject an equal amount of glue onto the clamped circuit board 10. The drying structure 5 includes a heating device installed on the rear side of the housing 2, and the exhaust end is connected to a drying channel fixed to the top of the housing 2. The heating device uses an electric heating tube or a hot air generator to generate stable hot air. The drying channel adopts a special airflow design to evenly blow hot air onto the circuit board 10 for drying the packaged circuit board 10. The housing 2 is not sealed and has appropriate ventilation openings to allow air circulation during drying, ensuring uniformity and efficiency of the drying effect. This part is prior art and will not be described in detail again.

[0039] The working process of the circuit board 10 package in this invention is as follows: The staff first opened the switch door 3, removed the connecting plate 12, placed the circuit board 10 in the U-shaped groove 16, and then installed the connecting plate 12 on the U-shaped rod 9 to clamp and limit the circuit board 10.

[0040] The drive mechanism 14 is activated, and its drive shaft 27 rotates, thereby causing the mounting block 11, connecting block 25, mounting plate 13, U-shaped rod 9, and circuit board 10 to rotate 90° (e.g., Figure 4 (As shown in the diagram, the rotation is counterclockwise), after which the drive mechanism 14 stops working. At this time, the circuit board 10 placed on the U-shaped rod 9 is opposite to the glue injection structure 6, and the glue injection structure 6 begins to inject glue onto the circuit board 10. At the same time, an adjacent U-shaped rod 9 is opposite to the switch door 3. The operator opens the switch door 3, places the circuit board 10 in the U-shaped groove 16 of the U-shaped rod 9 and limits its movement, and then closes the switch door 3.

[0041] After the glue-dispensing structure 6 finishes dispensing glue onto the circuit board 10, the drive mechanism 14 operates again, driving the shaft 27, the rotating frame, and the circuit board 10 to rotate. At this time, the glue-dispensed circuit board 10 is located below the drying structure 5, and the adjacent circuit board 10 is located below the glue-dispensing structure 6. The drying structure 5 dries the glue-dispensed circuit board 10, while the glue-dispensing structure 6 dispenses glue onto the circuit board 10 below. Similarly, other U-shaped rods 9 are opposite the switch door 3, and the operator places and limits the circuit board 10 on these U-shaped rods 9. By setting up multiple workstations, the glue dispensing and drying of the circuit board 10 do not interfere with each other, thereby improving the encapsulation efficiency of the circuit board 10.

[0042] It is important to note that when the drive mechanism 14 drives the shaft 27, the rotating frame, and the circuit board 10 to rotate, it will also drive the short shaft 18, sleeve 23, moving rod 22, horizontal block 20, and movable column 21 to rotate. At this time, the movable column 21 slides within the circular groove 29. Since the entire circular groove 29 is located on the same circumference, it cannot drive the movable column 21, sleeve 23, moving rod 22, and horizontal block 20 to move; that is, the sleeve 23 and the short shaft 18 are relatively stationary. During the process of the movable column 21 being positioned within the circular groove 29, the encapsulated circuit board 10 remains horizontal (supported by the limiting ring 7). This prevents the freshly encapsulated adhesive from shifting to one side due to gravity, resulting in uneven encapsulation thickness and affecting the encapsulation quality.

[0043] Then the drive mechanism 14 continues to work (rotating 90° and stopping), and the dried circuit board 10, the circuit board 10 after glue application, and the circuit board just placed on the U-shaped rod 9 are driven to continue rotating. Corresponding to the movable frame of the dried circuit board 10, the movable column 21 on it moves from the circular groove 29 to the lower transition groove 32 (e.g. Figure 8 As shown), it then moves through the transition groove 32 into the reversing groove 30. During the movement of the movable column 21 into the transition groove 32 and the reversing groove 30, the movable column 21 moves away from the axis of the shaft 27, thereby driving the moving rod 22 and the sleeve 23 to move towards the circuit board 10. The sleeve 23 moves on the short shaft 18. Due to the rotation of the sleeve 23, its movement drives the protrusion 24 to move. The protrusion 24 moves within the spiral groove 19, driving the spiral groove 19 and the short shaft 18 to rotate. The rotation of the short shaft 18 drives the damping shaft 17, the U-shaped rod 9, and the circuit board 10 to rotate. At this time, the U-shaped rod 9 is partially located at the notch 15, i.e., above the notch 15. When the drive mechanism 14 stops rotating, as... Figure 4 As shown, the encapsulated and dried circuit board 10 is in a vertical position and remains stationary; in other parts, the circuit board 10 located below the drying structure 5 is dried, the circuit board 10 located below the glue injection structure 6 is glued and encapsulated, and a new circuit board 10 is placed on the U-shaped rod 9 located at the switch door 3, so that circuit boards 10 are placed on all four U-shaped rods 9.

[0044] Then, the drive mechanism 14 continues to work, and the drive shaft 27 rotates 90 degrees and stops. During the movement of the movable column 21 located in the reversing groove 30, due to the outward expansion of the curvature of the reversing groove 30 relative to the axis of the circular groove 29, the movable column 21 will be continuously limited away from the axis of the shaft 27, thereby continuously driving the sleeve 23 to move on the short shaft 18, and in turn driving the short shaft 18, U-shaped rod 9, and circuit board 10 to rotate continuously. When the movable column 21 moves to the arc groove 31, the arc groove 31 and the circular groove 29 are set coaxially. At this time, the movement of the movable column 21 in the arc groove 31 will make the sleeve 23 and the short shaft 18 relatively stationary. At this time, the circuit board 10 has been flipped 180°. When the drive mechanism 14 stops working, the movable column 21 is still in the arc groove 31, and the U-shaped rod 9 slides on the limiting ring 7, thus realizing the flipping of the circuit board 10. The entire flipping process is within the notch 15.

[0045] When the drive mechanism 14 operates again, the movable column 21 re-enters the circular groove 29 through the upper transition groove 32. The transition groove 32 and the circular groove 29 limit the movement of the movable frame and sleeve 23 away from the short axis 18. Under the limitation of the protrusion 24, the short axis 18 flips. At this time, the U-shaped rod 9 is limited by the limiting ring 7 and cannot rotate. Therefore, the short axis 18 drives the damping shaft 17 to rotate, resulting in relative rotation inside the damping shaft 17. When the drive mechanism 14 is stationary, the flipped circuit board 10 is located at the switch door 3. Thus, the drive mechanism 14 operates intermittently. The flipped circuit board 10 moves to the underside of the injection structure 6 for injection, then moves to the underside of the drying structure 5 for drying, and then flips again to the switch door 3. The operator removes the encapsulated circuit board 10 and places a new circuit board 10. This cycle continues, continuously encapsulating the circuit board 10 and achieving double-sided encapsulation, greatly improving work efficiency.

[0046] The vertically positioned circuit board 10 facilitates quality inspection immediately after encapsulation and drying. Due to gravity, if the drying process is inadequate, the adhesive will flow downwards, resulting in uneven adhesive thickness. When removing the encapsulated circuit board 10, staff can adjust the drying time accordingly. If the adhesive is uniform, it indicates good drying, and no adjustment of the drying time is necessary.

[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An integrated circuit board packaging device, comprising a frame (1) and a housing (2) at its upper end, wherein the housing (2) is provided with a drying structure (5) and a glue injection structure (6), characterized in that, The frame (1) is rotatably provided with a shaft (27) and a rotating frame at its upper end. The rotating frame is rotatably provided with four short shafts (18). A damping shaft (17) is mounted on the short shaft (18) and a clamped circuit board (10) is provided on it. The frame (1) is provided with a collar (28). The collar (28) is provided with a guide groove. The guide groove includes a circular groove (29) and transition grooves (32) located at both ends thereon. The two transition grooves (32) are connected by a reversing groove (30) that extends outward relative to the axis of the circular groove (29). The short shaft (18) is provided with a spiral groove (19), the short shaft (18) is provided with a sleeve (23) and the inner wall is provided with a protrusion (24) located in the spiral groove (19), the sleeve (23) is provided with a movable frame located in the guide groove, when the shaft (27) drives the rotating frame to rotate, the circuit board (10) can be aligned with the drying structure (5) and the glue injection structure (6) one by one, when the movable frame is located in the reversing groove (30), the short shaft (18), the damping shaft (17) and the circuit board (10) rotate and can rotate 180°.

2. The integrated circuit board packaging device according to claim 1, characterized in that, The rotating frame includes a mounting block (11) fixed to the upper end of the shaft (27), and four supports arranged in a circular array are fixed on the mounting block (11). The short shaft (18) is rotatably mounted on the supports. A drive mechanism (14) is installed at the bottom of the frame (1), and the output end of the drive mechanism (14) is connected to the shaft (27).

3. The integrated circuit board packaging device according to claim 2, characterized in that, The bracket includes two connecting blocks (25) fixed on the mounting block (11), and a mounting plate (13) is fixed on the two connecting blocks (25). The short shaft (18) passes through the mounting plate (13) and is rotatably set therewith.

4. The integrated circuit board packaging device according to claim 1, characterized in that, A U-shaped rod (9) is fixed on the damping shaft (17). The inner wall of the U-shaped rod (9) is provided with a U-shaped groove (16). The circuit board (10) is placed in the U-shaped groove (16). The end of the U-shaped rod (9) is provided with a detachable connecting plate (12). The connecting plate (12) abuts against the circuit board (10) and limits the circuit board (10) in the U-shaped groove (16).

5. The integrated circuit board packaging device according to claim 1, characterized in that, The circumferential diameter of the reversing groove (30) is greater than the circumferential diameter of the circular groove (29), and the transition groove (32) is tangentially arranged with the circular groove (29) and the reversing groove (30); The arc of the circular groove (29) is a superior arc, the arc of the reversing groove (30) is a inferior arc, the upper part of the reversing groove (30) is an arc-shaped groove (31), and the arc-shaped groove (31) and the circular groove (29) are arranged coaxially.

6. The integrated circuit board packaging device according to claim 1, characterized in that, The movable frame includes a movable rod (22) fixed on the sleeve (23), a horizontal block (20) is fixedly connected to the movable rod (22), and a movable column (21) is rotatably connected to the bottom of the horizontal block (20). The movable column (21) is movably arranged in the guide groove.

7. The integrated circuit board packaging device according to claim 1, characterized in that, The upper end of the frame (1) is fixed with a support tube (4), which is sleeved on the outside of the shaft (27), and the collar (28) is fixed on the support tube (4).

8. The integrated circuit board packaging device according to claim 2, characterized in that, The mounting block (11) is a circular block, and the mounting block (11) is provided with four slots (26), which are arranged opposite to the short shaft (18).

9. An integrated circuit board packaging device according to claim 4, characterized in that, The upper end of the frame (1) is fixed with a plurality of support rods (8), and the upper end of the plurality of support rods (8) is fixed with a limiting ring (7). The upper end of the limiting ring (7) is provided with a PTFE film, and the limiting ring (7) is provided with a notch (15). The width of the notch (15) is greater than the width of the U-shaped rod (9).

10. An integrated circuit board packaging device according to claim 1, characterized in that, The box (2) is provided with a switch door (3), which can move up and down, and the switch door (3) is provided with a glass observation window.

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