Semiconductor carrier co-processing molding apparatus and products thereof

Abstract

The application discloses a kind of semiconductor carrier synergic processing forming device and its product, it is related to semiconductor carrier technical field, including base, stamping mechanism and punching copper bar, the surface of the base is provided with discharge port, the top center position of the base is provided with discharge port, discharge port is communicated with discharge port and is set, the top surface of the base and the position close to two ends are respectively provided with mounting bracket one and mounting bracket two, one end of the base is provided with discharge table, cutting mechanism is provided on the discharge table, deburring assembly is provided on the mounting bracket one, the inner side of the mounting bracket two is provided with conveying deviation prevention component.Punching copper bar can be completed in turn stamping forming, deburring, fixed-distance cutting and unloading, without transfer between multiple equipment, effectively reduce the deviation, knock problem in transfer process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor carrier technology, and in particular to a semiconductor carrier co-processing molding apparatus and its products. Background Technology

[0002] As a core supporting component in the semiconductor device packaging process, the semiconductor carrier's processing precision, surface flatness, and dimensional consistency directly affect the packaging quality and electrical performance of the semiconductor device. Among them, stamped copper strip semiconductor carriers are widely used in various semiconductor packaging scenarios due to their good conductivity and structural stability. However, the existing semiconductor carrier straight slot pads have insufficient welding strength, which easily leads to connection failures and affects product reliability. The lack of silver plating on the pad cross-section results in poor oxidation resistance, and the conductivity decreases after long-term use, leading to insufficient signal transmission stability.

[0003] Currently, during the transfer of stamped copper strips between equipment, deviation and collisions are prone to occur, leading to decreased processing accuracy and even scrap. The lack of effective anti-deviation mechanisms during transport causes the copper strips to easily shift laterally during stamping and transport, resulting in misalignment between the stamping die and the copper strip, affecting stamping quality and increasing the difficulty of subsequent processing. Furthermore, after actual stamping, the inner walls of the stamped holes and the broken edges of the semiconductor carrier semi-finished product contain a large number of stamping burrs. If this is directly used to manufacture semiconductor lead frame semi-finished products, the burrs can easily overlap with other components in the integrated circuit, creating poor bridging pathways. To address the shortcomings of the existing technology, there is an urgent need for a semiconductor carrier co-processing and forming device that can achieve multi-process collaborative processing, stable transport, thorough deburring, strong adaptability, and convenient operation. This device would solve the defects of existing processing methods, improve the processing quality and production efficiency of semiconductor carriers, and reduce production costs. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a semiconductor carrier co-processing and forming device, comprising a base, a stamping mechanism, and a stamped copper strip. The surface of the base is provided with a discharge port, and the top center of the base is provided with a discharge outlet, which is connected to the discharge port. Mounting frame one and mounting frame two are respectively provided on the top surface of the base near both ends. A discharge platform is provided at one end of the base, and a cutting mechanism is provided on the discharge platform. A deburring component is provided on mounting frame one, and a conveying anti-deviation component is provided on the inner side of mounting frame two. A guide rod is provided on the top of the base, and an upper stamping platform is provided at the top of the guide rod. The stamping mechanism is provided on the upper stamping platform, and the output end of the stamping mechanism is fixedly connected to the upper stamping platform. A stamping die is provided at the discharge port on the base, and the stamping die is located directly below the upper stamping platform. The stamped copper strip passes through the conveying anti-deviation component, the stamping die, and the deburring component.

[0006] As a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, the cutting mechanism includes a cutting frame and a pneumatic cutting blade. The cutting frame is disposed on both sides of the unloading table, and the pneumatic cutting blade is disposed on the top of the cutting frame. The output end of the pneumatic cutting blade is provided with a cutting blade. A cutting table is provided on the inner bottom wall of the unloading table, and a conveying roller is provided in front of the cutting table.

[0007] In a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, the conveying anti-deviation component includes a second mounting frame, a slider, a conveying roller, and a drive motor. A limiting groove is provided on the opposite side of the second mounting frame. The slider is movably disposed inside the limiting groove. The drive motor is disposed on the top of the slider. The conveying roller is movably disposed inside the slider via a transmission part.

[0008] As a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, the transmission part includes a bevel gear set, the middle of the slider is provided with a right-angle communicating cavity, the bevel gear set is composed of a rotating rod and bevel gears, the two sets of bevel gears are arranged perpendicular to each other, one set of rotating rods is fixedly connected to the output end of the drive motor, and the other set of rotating rods is fixedly connected to the end face of the conveying roller.

[0009] As a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, the mounting frame two is symmetrically provided with two sets of conveying anti-deviation components, the bottom end of the mounting frame two is provided with two metal guide rods, the slider is sleeved on the outside of the metal guide rods, the outside of the metal guide rods is threaded and threaded with a nut, the outside of the metal guide rods is sleeved with a positioning spring, and the lower conveying anti-deviation component abuts against the top of the positioning spring.

[0010] In a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, a limiting groove is formed on the outer side of the conveying roller, a rubber ring is sleeved on the outer side of the limiting groove, a cavity is formed in the middle of the conveying roller, and a plurality of inner tubes are arranged inside the cavity. The outer ends of the inner tubes are connected to the rubber ring, wherein the end face of the rubber ring is fixedly connected to the side wall of the limiting groove.

[0011] As a preferred embodiment of the semiconductor carrier co-processing and forming device of the present invention, the deburring assembly includes a cleaning roller, a pneumatic telescopic rod, an inner groove, a copper sheet groove, a mounting groove, a recess, and a deburring roller. The top of the base is provided with a serrated mounting hole. The deburring assembly is telescopically disposed inside the serrated mounting hole. The deburring assembly is located directly below a set of conveying anti-deviation assemblies. The position where the deburring assembly is disposed is the output end of the semiconductor carrier frame after the stamped copper strip has been stamped.

[0012] In a preferred embodiment of the semiconductor carrier co-processing and forming apparatus of the present invention, one end of the pneumatic telescopic rod is disposed on the inner wall of the serrated mounting hole, the deburring roller is sleeved on the output end of the pneumatic telescopic rod through a convex shaft, the deburring roller is fixedly installed in the mounting slot opened on the cleaning roller, the inner groove is opened in the middle of the cleaning roller, the copper sheet slot is opened through the outer side of the cleaning roller, and the notch is opened on the outer circumference of the cleaning roller.

[0013] In a preferred embodiment of the semiconductor carrier co-processing and molding apparatus of the present invention, the outer side of the deburring roller is provided with a bead groove, the inner side of the bead groove is movably installed with a deburring bead, the middle of the deburring roller is movably installed with a drive shaft, the middle of the deburring roller is movably installed with a transmission shaft, the transmission shaft is fitted with the drive shaft, the transmission shaft is fitted with the deburring bead, and a high-speed motor is fixedly installed at one end of the drive shaft, the high-speed motor is fixedly connected to the outer side of a set of pneumatic telescopic rods.

[0014] A semiconductor carrier includes a carrier frame, on which dovetail grooves are formed and a silver plating layer is disposed.

[0015] The beneficial effects of this invention are: 1. This semiconductor carrier co-processing and forming device integrates the stamping mechanism, conveying and anti-deviation components, deburring components, cutting mechanism, and unloading structure on the same base. The stamped copper strip can be stamped, deburred, cut at a fixed distance, and unloaded in sequence without the need for transfer between multiple devices. This effectively reduces the offset and collision problems during the transfer process and ensures processing accuracy. At the same time, it avoids the time-consuming debugging and transfer of multiple devices, significantly improves production efficiency, and reduces manual transfer costs.

[0016] 2. This semiconductor carrier co-processing and forming device, through an adjustable conveying anti-deviation component, allows the slider to move along the limiting groove and metal guide rod of the mounting frame. With the help of nuts and positioning springs, the spacing between the two sets of conveying rollers can be flexibly adjusted to accommodate stamping copper strips of different thicknesses. The limiting groove and rubber ring on the outer side of the conveying rollers can precisely limit the copper strip. At the same time, after the inner tube inflates the rubber ring, it can increase the contact area between the rubber ring and the copper strip, improve the conveying friction and stability, effectively prevent the copper strip from shifting left and right during the conveying process, ensure the precise alignment of the stamping die and the copper strip, and improve the stamping forming quality.

[0017] 3. The semiconductor carrier co-processing and forming device can flexibly adjust the height of the cleaning roller through a pneumatic telescopic rod, so that it fits tightly with the punched copper strip; the high-speed motor drives the drive shaft and transmission shaft to rotate, which drives the burr ball to rotate. The friction between the burr ball and the surface of the copper strip is used to polish and clean the burrs after punching, which can effectively remove the fine burrs on the surface of the copper strip and ensure the surface flatness and electrical performance of the semiconductor carrier. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below, wherein: Figure 1 This is a three-dimensional schematic diagram of a semiconductor carrier co-processing and molding apparatus according to the present invention; Figure 2 This is a side view schematic diagram of a semiconductor carrier co-processing and molding apparatus according to the present invention; Figure 3 This is a schematic cross-sectional view of the overall structure of the present invention; Figure 4 This is a schematic cross-sectional view of the conveyor roller structure of the present invention; Figure 5 This is a partial structural diagram of the present invention. Figure 1 ; Figure 6 This is a schematic diagram of the cleaning roller structure in this invention; Figure 7 This is a schematic diagram of the de-burring roller structure and some of its components according to the present invention; Figure 8 This is a schematic diagram of the slider structure and its internal structure of the present invention; Figure 9 This is a schematic cross-sectional view of the cleaning roller structure of the present invention; Figure 10 This is a schematic cross-sectional view of the de-burring roller structure of the present invention; Figure 11 This is a schematic diagram of the connection structure of the stamping die of the present invention; Figure 12 This is a schematic diagram of a semiconductor carrier structure according to the present invention; Figure 13This is a schematic diagram of the carrier frame structure of the present invention.

[0019] In the picture: 1. Base; 2. Unloading port; 3. Unloading table; 4. Cutting frame; 5. Pneumatic cutting knife; 6. Mounting bracket one; 7. Upper stamping table; 8. Stamping mechanism; 9. Mounting bracket two; 10. Stamped copper strip; 11. Guide rod; 12. Stamping die; 13. Conveying roller; 14. Rubber ring; 15. Inner tube; 16. Limiting groove; 17. Slider; 18. Drive motor; 19. Cleaning roller; 20. Pneumatic telescopic rod; 21. Inner groove; 22. Copper sheet groove; 23. Mounting groove; 24. Notch; 25. High-speed motor; 26. Deburring roller; 27. Bead groove; 28. Deburring bead; 29. ​​Bevel gear set; 30. Drive shaft; 31. Stamping groove; 32. Lower die; 33. Middle die; 34. Feed port; 35. Carrier frame; 36. Dovetail groove; 37. Silver plating layer; 38. Drive shaft. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] This implementation example Figures 1-13 As shown: Example 1: A semiconductor carrier co-processing and forming device includes a base 1, a stamping mechanism 8, and a punched copper strip 10. The surface of the base 1 is provided with a discharge port 2, and a discharge outlet is provided at the center of the top of the base 1. The discharge outlet is connected to the discharge port 2. Mounting bracket 1 6 and mounting bracket 2 9 are respectively provided on the top surface of the base 1 near both ends. A discharge table 3 is provided at one end of the base 1. A cutting mechanism is provided on the discharge table 3. A deburring component is provided on the mounting bracket 1 6. A conveying anti-deviation component is provided on the inner side of the mounting bracket 2 9. A guide rod 11 is provided on the top of the base 1. An upper stamping table 7 is provided at the top of the guide rod 11. The stamping mechanism 8 is provided on the upper stamping table 7. The output end of the stamping mechanism 8 is fixedly connected to the upper stamping table 7. A stamping die 12 is provided at the discharge port on the base 1. The stamping die 12 is located directly below the upper stamping table 7. The punched copper strip 10 passes through the conveying anti-deviation component, the stamping die 12, and the deburring component.

[0022] In use, the stamping die 12 is fixedly installed at the top center of the base 1, and the upper stamping table 7 is connected to the stamping die 12. The copper strip 10 to be stamped then passes through the conveying rollers 13 in the two sets of conveying anti-deviation components, and passes through the stamping die 12. The stamping die 12 includes a lower die 32, a middle die 33, and a feed inlet 34. The feed inlet 34 is located at one end of the middle die 33 and the stamping die 12. The lower die 32, middle die 33, and stamping die 12 are arranged sequentially from bottom to top. Several sets of stamping grooves 31 are equidistantly provided on the lower die 32 and the middle die 33. The copper strip 10 to be cut passes through the feed inlet 34, and is stamped by the drive of the upper stamping table 7. The stamped copper strip... The copper strip 10 passes through the copper strip slot 22, so that the bottom of the punched copper strip 10 is above the deburring roller 26. By energizing the high-speed motor 25, the drive shaft 38 in the deburring assembly is driven. The drive shaft 38 drives the transmission shaft 30 and the deburring bead 28 to rotate to clean the burrs on the bottom of the punched copper strip 10. During the rotation, the deburring bead 28 will lightly contact the bottom surface of the punched copper strip 10 to polish the protruding burrs. The polished punched copper strip 10 is conveyed to the bottom of the cutting frame 4. The pneumatic cutting knife 5 is driven by the air source under the control of the solenoid valve to reciprocate, thereby realizing the fixed-distance cutting of the punched copper strip 10. After cutting, the punched copper strip 10 enters the unloading table 3 under the conveying roller and slides down under the action of gravity.

[0023] Specifically, the cutting mechanism includes a cutting frame 4 and a pneumatic cutting blade 5. The cutting frame 4 is set on both sides of the unloading platform 3, and the pneumatic cutting blade 5 is set on the top of the cutting frame 4. The output end of the pneumatic cutting blade 5 is equipped with a cutting blade. The inner bottom wall of the unloading platform 3 is equipped with a cutting table, and a conveying roller is set in front of the cutting table.

[0024] Furthermore, a round hole is provided at the top of the cutting frame 4, through which the output end of the pneumatic cutting blade 5 passes. The pneumatic cutting blade 5 is fixedly connected to the top of the cutting frame 4 by bolts. By supplying air to the pneumatic cutting blade 5 under the control of the solenoid valve, the cutting blade is reciprocated, thereby achieving fixed-distance cutting of the stamped copper strip 10. After cutting, the stamped copper strip 10 enters the unloading table 3 under the conveying roller and slides down under the action of gravity. The cutting table set below the cutting blade is used to support the stamped copper strip 10, thereby ensuring that the stamped copper strip 10 is completely cut along the strip groove of the cutting table under the action of the cutting blade. A fixed blade can be set on the cutting table.

[0025] Operation process: The pneumatic cutting blade 5 uses compressed air as a power source. After filtration and pressure regulation, the airflow direction is controlled by the solenoid valve. The air pressure energy is converted into linear reciprocating mechanical energy through the cylinder and transmitted to the blade so that the moving blade and the fixed blade cooperate to form a shearing force to cut the copper strip 10. After the cutting is completed, the control valve reverses, the airflow drives the actuator to reset, the exhaust gas is discharged, and the equipment returns to the standby state.

[0026] Example 2: This embodiment differs from the first embodiment in that: a semiconductor carrier co-processing and forming device includes a base 1, a stamping mechanism 8, and a stamped copper strip 10. The surface of the base 1 is provided with a discharge port 2, and a discharge outlet is provided at the center of the top of the base 1. The discharge outlet is connected to the discharge port 2. Mounting brackets 9 are respectively provided on the top surface of the base 1 near both ends. A discharge platform 3 is provided at one end of the base 1. A cutting mechanism is provided on the discharge platform 3. A conveying anti-deviation component is provided on the inner side of the mounting brackets 9. A guide rod 11 is provided on the top of the base 1. An upper stamping platform 7 is provided at the top of the guide rod 11. The stamping mechanism 8 is provided on the upper stamping platform 7. The output end of the stamping mechanism 8 is fixedly connected to the upper stamping platform 7. A stamping die 12 is provided at the discharge port on the base 1.

[0027] Specifically, the conveying anti-deviation assembly includes a mounting frame 2 9, a slider 17, a conveying roller 13, and a drive motor 18. A limit groove is provided on the opposite side of the mounting frame 2 9. The slider 17 is movably disposed inside the limit groove. The drive motor 18 is disposed on the top of the slider 17. The conveying roller 13 is movably disposed inside the slider 17 via a transmission part.

[0028] The transmission unit includes a bevel gear set 29. A right-angle connecting cavity is opened in the middle of the slider 17. The bevel gear set 29 consists of a rotating rod and bevel gears. The two sets of bevel gears are arranged perpendicular to each other. One set of rotating rods is fixedly connected to the output end of the drive motor 18, and the other set of rotating rods is fixedly connected to the end face of the conveying roller 13.

[0029] Two sets of conveyor anti-deviation components are symmetrically arranged on the mounting frame 29. Two metal guide rods are provided at the bottom of the mounting frame 29. The slider 17 is sleeved on the outside of the metal guide rods. The outside of the metal guide rods is threaded and connected to a nut. A positioning spring is sleeved on the outside of the metal guide rods. The lower conveyor anti-deviation component abuts against the top of the positioning spring.

[0030] A limiting groove 16 is provided on the outer side of the conveying roller 13, and a rubber ring 14 is sleeved on the outer side of the limiting groove 16. A cavity is provided in the middle of the conveying roller 13, and several sets of inner tubes 15 are provided inside the cavity. The outer end of the inner tube 15 is connected to the rubber ring 14, and the end face of the rubber ring 14 is fixedly connected to the side wall of the limiting groove 16.

[0031] Furthermore, the slider 17 is cross-shaped and is movably mounted inside the mounting bracket 9. The top of the slider 17 has two sets of round holes for the insertion of the metal guide rod. Optionally, the distance between the two sets of sliders 17 can be adjusted by rotating the nut on the outside of the metal guide rod to allow the passage of punched copper strips 10 of different thicknesses. The positioning spring at the bottom provides upward support to the bottom conveying anti-deviation component, ensuring the tight fit of the two conveying rollers 13. The drive motor 18 connected to the transmission unit is externally connected to a PLC and a motor driver. The PLC sends signals to the motor driver, and the motor driver amplifies the signals to drive the drive motor 18. The two sets of drive motors 18 have the same speed.

[0032] Operation process: The copper strip 10 to be stamped is passed through the conveyor rollers 13 symmetrically arranged on the two sets of conveyor anti-deviation components. The drive motor 18 on the slider 17 is energized to make it rotate at a constant speed. The output end of the drive motor 18 drives a set of rotating rods in the bevel gear set 29 to rotate, thereby realizing that one set of bevel gears drives the other set of bevel gears to rotate, thus converting the vertical circumferential motion into the horizontal circumferential motion, thereby driving the conveyor rollers 13 to rotate. As the conveyor rollers 13 rotate, the inner tube 15 inside the conveyor rollers 13 inflates the rubber ring 14, so that the surface of the rubber ring 14 is in full contact with the surface of the copper strip 10. Specifically, the cylinder inside the inner tube 15 compresses the gas inside, thereby causing the compressed air to expand the rubber ring 14, increasing the surface area with the copper strip 10 and improving the stability of the conveying. During the conveying process, the copper strip 10 is always in contact with the side of the limiting groove 16, thus ensuring that the copper strip 10 will not deviate during the conveying process.

[0033] The rest of the structure is the same as in Example 1.

[0034] Example 3: This embodiment differs from the above embodiments in that: Specifically, the deburring assembly includes a cleaning roller 19, a pneumatic telescopic rod 20, an inner groove 21, a copper sheet groove 22, a mounting groove 23, a notch 24, and a deburring roller 26. The top of the base 1 is provided with a serrated mounting hole. The deburring assembly is telescopically installed inside the serrated mounting hole. The deburring assembly is located directly below a set of conveying anti-deviation components. The position where the deburring assembly is located is at the output end of the semiconductor carrier frame after the stamped copper strip 10 has been stamped.

[0035] One end of the pneumatic telescopic rod 20 is set on the inner wall of the rabbit-shaped mounting hole. The deburring roller 26 is sleeved on the output end of the pneumatic telescopic rod 20 through the convex shaft. The deburring roller 26 is fixedly installed in the mounting slot 23 opened on the cleaning roller 19. The inner groove 21 is opened in the middle of the cleaning roller 19. The copper plate slot 22 is opened through the outer side of the cleaning roller 19. The notch 24 is opened on the outer circumference of the cleaning roller 19.

[0036] The outer side of the deburring roller 26 is provided with a bead groove 27, and the inner side of the bead groove 27 is movably installed with a deburring bead 28. The middle of the deburring roller 26 is movably installed with a drive shaft 38 and a transmission shaft 30. The transmission shaft 30 is fitted with the drive shaft 38 and the deburring bead 28. A high-speed motor 25 is fixedly installed at one end of the drive shaft 38. The high-speed motor 25 is fixedly connected to the outer side of a set of pneumatic telescopic rods 20.

[0037] Furthermore, a cleaning roller 19 is used to install the deburring roller 26. The punched copper strip 10 passes through the copper strip groove 22, so that the burrs on the bottom surface of the punched copper strip 10 are cleaned by the deburring assembly. Specifically, the inner groove 21 is used to collect the debris on the punched copper strip 10. The cleaning roller 19 is lifted from the inner wall of the serrated mounting hole by the extension and retraction of the pneumatic telescopic rod 20, so that it is in contact with the conveying roller 13. The high-speed motor 25 is energized to drive the drive shaft 38 to rotate. The drive shaft 38 drives the transmission shaft 30 to rotate. The burr bead 28 rotates under the drive of the transmission shaft 30. The surfaces of the drive shaft 38, the transmission shaft 30 and the burr bead 28 are rough. The friction causes the burr bead 28 to rotate. The burr bead 28 is in contact with the back of the punched copper strip 10 to polish the burrs on the back of the punched copper strip 10.

[0038] The rest of the structure is the same as in Examples 1 and 2.

[0039] A semiconductor carrier includes a carrier frame 35, a dovetail groove 36 formed on the carrier frame 35, and a silver plating layer 37 disposed on the carrier frame 35.

[0040] Furthermore, the carrier frame 35 adopts a dovetail groove structure to increase the contact area of ​​the plastic and reduce the risk of detachment. The cross-section of the carrier frame 35 is silver-plated to improve conductivity and oxidation resistance, and extend service life.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0042] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor carrier co-processing and forming apparatus, comprising a base (1), a stamping mechanism (8), and a stamped copper strip (10), characterized in that: The base (1) has a discharge port (2) on its surface and a discharge outlet at the center of its top. The discharge outlet and the discharge port (2) are connected. Mounting bracket 1 (6) and mounting bracket 2 (9) are respectively provided on the top surface of the base (1) near both ends. A discharge platform (3) is provided at one end of the base (1). A cutting mechanism is provided on the discharge platform (3). A deburring component is provided on mounting bracket 1 (6). A conveying anti-deviation component is provided on the inner side of mounting bracket 2 (9). The base (1) is provided with a guide rod (11) at the top, and an upper stamping table (7) is provided at the top of the guide rod (11). The stamping mechanism (8) is provided on the upper stamping table (7). The output end of the stamping mechanism (8) is fixedly connected to the upper stamping table (7). The discharge port on the base (1) is provided with a stamping die (12). The stamping die (12) is located directly below the upper stamping table (7). The blanking copper strip (10) passes through the conveying anti-deviation component, the stamping die (12) and the deburring component. The cutting mechanism includes a cutting frame (4) and a pneumatic cutting knife (5). The cutting frame (4) is set on both sides of the unloading platform (3), and the pneumatic cutting knife (5) is set on the top of the cutting frame (4). The output end of the pneumatic cutting knife (5) is equipped with a cutting knife. The inner bottom wall of the unloading platform (3) is equipped with a cutting table, and a conveying roller is set in front of the cutting table. The conveying anti-deviation assembly includes a second mounting frame (9), a slider (17), a conveying roller (13), and a drive motor (18). The second mounting frame (9) has a limit groove on its opposite side. The slider (17) is movably disposed inside the limit groove. The drive motor (18) is disposed on the top of the slider (17). The conveying roller (13) is movably disposed inside the slider (17) through a transmission part. Two sets of conveying anti-deviation components are symmetrically arranged on the mounting frame two (9). Two metal guide rods are provided at the bottom of the mounting frame two (9). The slider (17) is sleeved on the outside of the metal guide rod. The outside of the metal guide rod is threaded and connected to a nut. A positioning spring is sleeved on the outside of the metal guide rod. The conveying anti-deviation component located below abuts against the top of the positioning spring. A limiting groove (16) is provided on the outer side of the conveying roller (13), and a rubber ring (14) is sleeved on the outer side of the limiting groove (16). A cavity is provided in the middle of the conveying roller (13), and several sets of inner tubes (15) are provided inside the cavity. The outer end of the inner tube (15) is connected to the rubber ring (14), and the end face of the rubber ring (14) is fixedly connected to the side wall of the limiting groove (16). The deburring assembly includes a cleaning roller (19), a pneumatic telescopic rod (20), an inner groove (21), a copper sheet groove (22), a mounting groove (23), a notch (24), and a deburring roller (26). The top of the base (1) is provided with a serrated mounting hole. The deburring assembly is telescopically installed inside the serrated mounting hole. The deburring assembly is located directly below a set of conveying anti-deviation components. The position where the deburring assembly is located is the output end of the semiconductor carrier frame after the stamped copper strip (10) has been stamped.

2. The semiconductor carrier co-processing and molding apparatus as described in claim 1, characterized in that: The transmission unit includes a bevel gear set (29), and the middle part of the slider (17) has a right-angle connecting cavity. The bevel gear set (29) consists of a rotating rod and bevel gears. The two sets of bevel gears are arranged perpendicular to each other. One set of rotating rods is fixedly connected to the output end of the drive motor (18), and the other set of rotating rods is fixedly connected to the end face of the conveying roller (13).

3. The semiconductor carrier co-processing and molding apparatus as described in claim 1, characterized in that: One end of the pneumatic telescopic rod (20) is set on the inner wall of the grass-shaped mounting hole. The deburring roller (26) is sleeved on the output end of the pneumatic telescopic rod (20) through a convex shaft. The deburring roller (26) is fixedly installed in the mounting slot (23) opened on the cleaning roller (19). The inner groove (21) is opened in the middle of the cleaning roller (19). The copper plate slot (22) is opened through the outer side of the cleaning roller (19). The notch (24) is opened on the outer circumference of the cleaning roller (19).

4. The semiconductor carrier co-processing and molding apparatus as described in claim 1, characterized in that: The outer side of the deburring roller (26) is provided with a bead groove (27), and a burr bead (28) is movably installed on the inner side of the bead groove (27). A drive shaft (38) is movably installed in the middle of the deburring roller (26), and a transmission shaft (30) is movably installed in the middle of the deburring roller (26). The transmission shaft (30) is fitted with the drive shaft (38), and the transmission shaft (30) is fitted with the burr bead (28). A high-speed motor (25) is fixedly installed at one end of the drive shaft (38), and the high-speed motor (25) is fixedly connected to the outer side of a set of pneumatic telescopic rods (20).

5. A semiconductor carrier according to any one of claims 1-4, comprising a carrier frame (35), characterized in that, The carrier frame (35) has a dovetail groove (36) and a silver plating layer (37) is provided on the carrier frame (35).

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