3D packaging chip high-uniformity automatic layer-removing equipment and control method

Abstract

The application relates to the technical field of semiconductor packaging, in particular to a 3D packaging chip high-uniformity automatic layer-removing equipment and a control method. The 3D packaging chip high-uniformity automatic layer-removing equipment comprises a rack, an outer functional disc and a center support, wherein the middle part of the rack is connected with the center support, and the outer functional disc is arranged at the outer edge of the rack. Compared with the prior art, the 3D packaging chip high-uniformity automatic layer-removing equipment and the control method are provided, the size needing to be thinned is set through the equipment and the method, automatic high-precision thinning and layer-removing of samples can be realized, the thinned sample is good in flatness, the size precision of the removed sample layer is high, and the abnormal points and the circuit state diagram of the layer level where the failure point is located can be effectively observed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to an automatic delamination device and control method for high uniformity of 3D packaged chips. Background Technology

[0002] Due to the complex internal structure of 3D advanced packaged chips, which involve multi-layered stacking and contain hybrid bonding and transition boards, failure analysis often requires further destructive analysis. If a specific bonding location or layer is found to be abnormal using 3D thermal / TDR / 3D-X-ray or FT methods, manual layer-by-layer grinding is necessary to thin the chip. Engineers adjust grinding speed, pressure, and time parameters while observing the process to expose the target location. This process heavily relies on the engineer's experience and skills. Furthermore, the sample warping caused by the structural complexity often results in only a flat circuit in a localized area. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, this invention provides a high-uniformity automatic delamination device and control method for 3D packaged chips. By setting the required thinning size, the device and method of this invention can achieve automatic and high-precision thinning and delamination of the sample. The thinned sample has good flatness, the removed sample layer has high dimensional accuracy, and it can effectively observe the abnormal points and circuit status diagrams at the layer where the failure point is located.

[0004] To achieve the above objectives, a high-uniformity automatic delamination device for 3D packaged chips is designed, comprising a frame, an outer functional disk, and a central support. The device is characterized in that the central support is connected to the middle of the frame, and the outer functional disk is located on the outer edge of the frame.

[0005] The external functional discs include an upper plate, a sealing plate, a coarse grinding plate, a fine grinding plate, a polishing plate, and a lower plate. The upper plate, sealing plate, coarse grinding plate, fine grinding plate, polishing plate, and lower plate are all distributed on the outer edge of the frame. An upper plate and lower plate feeding mechanism is provided on one side of the upper plate, and a liquid feeding mechanism is provided on one side of the sealing plate.

[0006] The upper plate and the lower plate have the same structure. The upper plate is a circular plate with a plate slot for installing disposable plates. A diffuse reflection laser limiter is provided on one side of the plate slot.

[0007] The plastic sealing tray is equipped with a sample slot, a temperature sensor is located at the bottom of the sample slot, and a heating wire is located inside the plastic sealing tray.

[0008] The loading and unloading mechanism includes a motor mounting base, a lifting motor, a lifting screw, a displacement motor, a crossbeam, a displacement slider, a displacement screw, a displacement slide bar, a support slide bar, a positioning motor, and an electrically controlled magnetic suction head. One end of the crossbeam is slidably connected to the upper side of the motor mounting base, and a support slide bar is located below the other end of the crossbeam. The bottom of the crossbeam is connected to the displacement slide bar. The lower part of the motor mounting base is connected to the base of the lifting motor. The driving end of the lifting motor is connected to one end of the lifting screw, and the other end of the lifting screw is connected to the base of the displacement motor. The driving end of the displacement motor is connected to the displacement screw, and a displacement slider is fitted onto the displacement screw. The upper part of the displacement slider is slidably connected to the displacement slide bar, and the lower part of the displacement slider is connected to one end of the support slide bar. The lower part of the other end of the support slide bar is connected to the base of the positioning motor, and the driving end of the positioning motor is connected to the electrically controlled magnetic suction head.

[0009] The liquid dosing mechanism includes a liquid dosing needle, a liquid dosing screw, a liquid dosing motor, a curing agent tube, a resin tube, a flow meter, and a liquid dosing mechanism support. One end of the liquid dosing mechanism support is connected to the equipment, and the other end of the liquid dosing mechanism support is connected to the base of the liquid dosing motor. The drive end of the liquid dosing motor is connected to the liquid dosing screw, and the liquid dosing screw is connected to the liquid dosing tube via a slider. One end of the liquid dosing tube is connected to the liquid dosing needle, and the other end of the liquid dosing tube is connected to the curing agent tube and the resin tube, respectively. Flow meters are respectively installed between the curing agent tube, the resin tube, and one end of the liquid dosing tube.

[0010] The central support includes a rotary stepper motor, a rotary gear, a central column, a cantilever, a lifting arm slide rod, a lifting arm lead screw, a lifting arm stepper motor, a pressure sensor, and an adaptive clamping head. A rotating base is connected to the middle of the frame, and the base of the rotary stepper motor is mounted on the rotating base. The drive end of the rotary stepper motor is connected to the rotary gear via a drive gear. The rotary gear shaft is connected to the central column, and a support rod is connected to the middle of the central column. Several cantilever arms are connected to one end of each arm via a cantilever fulcrum at the top outer edge of the central column. The other end of each cantilever arm is connected to the adaptive clamping head. A pressure sensor is mounted on the support rod between the central column and the adaptive clamping head. The base of the lifting arm stepper motor is mounted on the pressure sensor. The drive end of the lifting arm stepper motor is connected to one end of the lifting arm lead screw, and the other end of the lifting arm lead screw is connected to the lifting arm slide rod via a sliding component. The sliding component is connected to the cantilever via a connector.

[0011] The adaptive clamping head includes a depth motor, a depth lead screw, a depth crossbeam, a depth slide bar, a left clamping slide rail, a right clamping slide rail, a rotation motor, a left clamping motor, a right clamping motor, a left clamping slider, a right clamping slider, a clamping ring, a universal rotating shaft, and an electromagnetic control plate. The other end of the cantilever is connected to the base of the depth motor. The drive end of the depth motor is connected to one end of the depth lead screw. The other end of the depth lead screw is connected to the base of the rotation motor via a connector. The drive end of the rotation motor is connected to the middle of the universal rotating shaft via a connecting rod. Both ends of the universal rotating shaft are connected to the electromagnetic control plate via fork-type connectors. The clamping ring is located on the outside of the universal rotating shaft. The ring is surrounded by a left and right clamping slider, respectively, located on the left and right sides of the clamping ring. The tops of the left and right clamping sliders are slidably connected to the left and right clamping slide rails, respectively. The left and right clamping slide rails are connected to the connectors for the self-rotating motor. The middle parts of the left and right clamping sliders are connected to the drive ends of the left and right clamping motors via lead screws. The bases of the left and right clamping motors are connected to the connectors for the self-rotating motor. A depth slide rod is located on the outside of the left and right clamping motors, with the top of the depth slide rod connected to the depth crossbeam, which is connected to the depth motor.

[0012] The drive components of the automatic delamination device are controlled by the ESP32 control system.

[0013] A control method for an automatic delamination device for high uniformity of 3D packaged chips, the specific control method flow is as follows: S1, Place the sample in the sample slot on the plastic sealing tray and manually enter the sample model and required grinding thickness information; The S2 and ESP32 control systems read the minimum warpage temperature value T based on the sample model and turn on the heating wire. Based on the temperature sensor readings, they control the heating wire's on / off state to bring the sealing disc to the required temperature T. S3, the lifting motor above the upper tray rotates to raise the crossbeam, and the displacement motor rotates to move the electronically controlled magnetic suction head above the disposable carrier. According to the remaining number of disposable carriers, the lifting motor rotates in the opposite direction, and the electronically controlled magnetic suction head descends to the position of the top carrier. The power of the electronically controlled magnetic suction head is turned on, and a carrier is attracted. S4, the rotating lifting motor raises the crossbeam to a certain height, the reverse displacement motor moves the electronically controlled magnetic suction head with the carrier sheet to the center of the carrier sheet slot on the upper tray, the rotating positioning motor moves the positioning piece of the carrier sheet to the upper tray above the diffuse reflection laser limiter to trigger the limit, and the electronically controlled magnetic suction head is closed to release the carrier sheet. S5, the rotary depth motor returns to the zero position, the left clamping motor and the right clamping motor are rotated in the opposite direction to return the clamping slider to the zero position, the lifting arm stepper motor is turned on to raise the adaptive clamping head to a certain height, the rotary stepper motor is turned on to drive the rotary gear and the central column to rotate 60°, so that the electromagnetic control plate at the bottom of the adaptive clamping head is directly above the plate on the upper plate tray. S6, the reverse rotation of the lifting arm stepper motor gradually lowers the adaptive clamping head. When the pressure sensor decreases by a certain value, the switch of the electromagnetic control plate is turned on to attract the carrier plate. S7, rotate the lifting arm stepper motor to raise the adaptive clamping head to a certain position, turn on the rotary stepper motor to drive the rotary gear and the central column, so that the carrier position at the bottom of the adaptive clamping head moves to directly above the sample slot of the plastic sealing tray; S8, turn on the liquid dispensing motor, move the liquid dispensing needle directly above the sample, calculate the required amount of resin and curing agent based on the sample size and thickness, and turn on two flow meters at the same time to control the amount of resin and curing agent added by the flow rate and time. The calculated amount of liquid dispensing should not overflow the edge of the sample. S9, rotate the liquid adding motor in the opposite direction to move the liquid adding needle out of the sealing plate, rotate the lifting arm stepper motor in the opposite direction to lower the adaptive clamping head, record the current maximum value F0 of the pressure sensor, when the pressure value of the pressure sensor decreases by a certain value F1 from F0, turn on the left clamping motor and the right clamping motor of the adaptive clamping head, move the left clamping slider and the right clamping slider to squeeze the clamping ring to fix it, and keep it for 2 hours to wait for the resin to cure. S10, turn off the heating wire switch, wait for it to cool down to below 30°C, slowly rotate the lifting arm stepper motor to raise the adaptive clamping head to a certain position, and record the maximum value of the pressure sensor during this period as the normal pressure F2; S11, turn on the rotary stepper motor to drive the rotary gear and the central column to rotate 60°, then slowly rotate the lifting arm stepper motor in the opposite direction to make the adaptive gripper head slowly fall. When the value of the pressure sensor F3 is equal to F2-F1, stop rotating the lifting arm stepper motor and maintain the pressure. S12, turn on the switch of the coarse grinding disc and the switch of the self-rotating motor, keep the speed at 50~500 rpm. When the pressure sensor value is greater than F3, rotate the depth motor in the forward direction to move the sample down. When the pressure sensor value is less than F3, rotate the depth motor in the reverse direction to move the sample up, ensuring that the pressure sensor value is F3. S13, when the step value of the depth motor is 100um smaller than the required grinding thickness, stop the switching of the coarse grinding disc, the self-rotating motor, and the depth motor, rotate the lifting arm step motor to raise the adaptive clamping head to a certain position, turn on the rotating step motor, and drive the rotating gear and the central column to rotate 60°. S14, reverse the rotation of the lifting arm stepper motor to lower the adaptive gripper head. When the pressure sensor value F4 equals F3, stop rotating the lifting arm stepper motor and maintain pressure. Turn on the switch of the fine grinding disc and the switch of the self-rotating motor, maintaining the speed at 50~500 rpm, and maintaining the pressure sensor value of F4. S15, when the step value of the depth motor is 10um smaller than the required grinding thickness, stop the switching of the fine grinding disc, the self-rotating motor, and the depth motor, rotate the lifting arm step motor to raise the adaptive clamping head to a certain position, turn on the rotating step motor, and drive the rotating gear and the central column to rotate 60°. S16, reverse the rotation of the lifting arm stepper motor to lower the adaptive gripper head. When the pressure sensor value F5 equals F3, stop rotating the lifting arm stepper motor and maintain pressure. Turn on the polishing disc switch and the self-rotating motor switch, and maintain the rotation speed at 50~500 rpm, keeping the pressure sensor value at F5. S17, when the step value of the depth motor reaches the required grinding thickness, stop the switch of the polishing disc, the self-rotating motor, and the depth motor, rotate the lifting arm step motor to raise the adaptive clamping head to a certain position, turn on the rotating step motor, and drive the rotating gear and the central column to rotate 60°. S18, the depth motor returns to zero, the lifting arm stepper motor rotates in the opposite direction to lower the adaptive clamping head, and the sample reaches the position above the substrate slot of the unloading tray according to the position feedback of the lifting arm stepper motor. The self-rotating motor rotates slowly, and stops rotating when the positioning plate of the substrate triggers the diffuse reflection laser limiter. The electromagnetic control plate is turned off to release the sample, waiting for the next sample grinding requirement.

[0014] Compared with the prior art, the present invention provides a high-uniformity automatic delamination device and control method for 3D packaged chips. By setting the required thinning size, the device and method of the present invention can achieve automatic high-precision thinning and delamination of the sample. The thinned sample has good flatness, the removed sample layer has high dimensional accuracy, and the abnormal points and circuit status diagrams at the layer where the failure point is located can be effectively observed. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the chip packaging structure.

[0016] Figure 2 This is a simplified schematic diagram of the device of the present invention.

[0017] Figure 3 This is a schematic diagram of the upper plate and lower plate structures in the device of the present invention.

[0018] Figure 4 The diagram shows the front, back, and front views of the disposable slide structure.

[0019] Figure 5This is a schematic diagram of the loading and unloading mechanism in the device of the present invention.

[0020] Figure 6 This is a schematic diagram of the liquid addition mechanism in the device of the present invention.

[0021] Figure 7 This is a schematic diagram of the central support structure of the device of the present invention.

[0022] Figure 8 This is a schematic diagram of the adaptive clamping head structure in the central support.

[0023] Figure 9 , Figure 10 This is the control flowchart of the present invention. Detailed Implementation

[0024] The present invention will now be further described with reference to the accompanying drawings.

[0025] like Figures 2 to 8 As shown, a high-uniformity automatic delamination device for 3D packaged chips includes a frame, an outer functional disk, and a central support. The device is characterized in that the central support 2 is connected to the middle of the frame 1, and the outer functional disk is located on the outer edge of the frame 1.

[0026] The external functional discs include a loading disc, a sealing disc, a coarse grinding disc, a fine grinding disc, a polishing disc, and a unloading disc. The loading disc 3, sealing disc 4, coarse grinding disc 5, fine grinding disc 6, polishing disc 7, and unloading disc 8 are evenly distributed on the outer edge of the frame 1. A loading and unloading mechanism 9 is provided on one side of the loading disc 3, and a liquid adding mechanism 10 is provided on one side of the sealing disc 4.

[0027] The upper plate 3 and the lower plate 8 have the same structure. The upper plate 3 is a circular plate structure. The upper plate 3 is provided with a plate slot 3-1 for installing disposable plates. A diffuse reflection laser limiter 3-2 is provided on one side of the plate slot 3-1.

[0028] The plastic sealing tray 4 is provided with a sample slot 4-1, a temperature sensor 4-2 is located at the bottom of the sample slot 4-1, and a heating wire 4-3 is located inside the plastic sealing tray 4.

[0029] The loading tray 3 is an automatic tray for loading disposable substrates. The sealing tray 4 is a tray for placing the sample to be ground and for sealing and curing; it has temperature control and heating functions. The coarse grinding tray 5, fine grinding tray 6, and polishing tray 7 are trays for grinding and polishing the sample using coarse sandpaper, fine sandpaper, and polishing liquid, respectively. They can rotate and can be set to different speeds from 50 to 500 RPM, controlled by the ESP32 control system. The unloading tray 8 is a tray for unloading the substrate after automatically positioning the substrate angle.

[0030] The loading and unloading mechanism 9 includes a motor mounting base, a lifting motor, a lifting screw, a displacement motor, a crossbeam, a displacement slider, a displacement screw, a displacement slide bar, a support slide bar, a positioning motor, and an electrically controlled magnetic suction head. One end of the crossbeam 9-5 is slidably connected to the upper side of the motor mounting base 9-1. A support slide bar 9-9 is located below the other end of the crossbeam 9-5. The bottom of the crossbeam 9-5 is connected to the displacement slide bar 9-8. The lower part of the motor mounting base 9-1 is connected to the base of the lifting motor 9-2. The drive end of the lifting motor 9-2 is connected to the lifting screw. One end of rod 9-3 and the other end of lifting screw 9-3 are connected to the base of displacement motor 9-4. The drive end of displacement motor 9-4 is connected to displacement screw 9-7. Displacement slider 9-6 is sleeved on displacement screw 9-7. The upper part of displacement slider 9-6 is slidably connected to displacement slide rod 9-8. The lower part of displacement slider 9-6 is connected to one end of support slide rod 9-9. The lower part of the other end of support slide rod 9-9 is connected to the base of positioning motor 9-10. The drive end of positioning motor 9-10 is connected to electric magnetic suction head 9-11.

[0031] The slide is loaded and unloaded via the loading and unloading mechanism 9. After the positioning slide aligns with the diffuse reflection laser microscope, the slide is embedded in the slide slot 3-1. The entire process requires the following automatic loading and unloading mechanism. The lifting motor 9-2 controls the rotation of the lifting screw 9-3, raising or lowering the crossbeam 9-5. The ESP32 control system controls the opening and closing of the electrically controlled magnetic suction head 9-11 to control the adsorption and release of disposable slides. The displacement motor 9-4 controls the rotation of the displacement screw 9-7, driving the displacement slider 9-6 and the support slider 9-9 to move forward and backward. This allows the electrically controlled magnetic suction head 9-11 to move back and forth between the center of the loading tray 3V and the slide placement area. The loading tray 3 contains a diffuse reflection laser limiter 3-2, which is connected to the ESP32 control system. The ESP32 control system controls the rotation and stop of the positioning motor 9-10. During the loading process, the positioning motor 9-10 rotates to control the rotation of the carrier. When the positioning piece of the disposable carrier covers the diffuse reflection laser limiter 3-2, the positioning motor 9-10 stops rotating, and the electromagnetic control head 9-11 releases the carrier.

[0032] The liquid dosing mechanism 10 includes a liquid dosing needle, a liquid dosing screw, a liquid dosing motor, a curing agent tube, a resin tube, a flow meter, and a liquid dosing mechanism support. One end of the liquid dosing mechanism support 10-7 is connected to the equipment, and the other end of the liquid dosing mechanism support 10-7 is connected to the base of the liquid dosing motor 10-3. The drive end of the liquid dosing motor 10-3 is connected to the liquid dosing screw 10-2. The liquid dosing screw 10-2 is connected to the liquid dosing tube 10-8 via a slider. One end of the liquid dosing tube 10-8 is connected to the liquid dosing needle 10-1, and the other end of the liquid dosing tube 10-8 is connected to the curing agent tube 10-4 and the resin tube 10-5, respectively. Flow meters 10-6 are respectively installed between the curing agent tube 10-4, the resin tube 10-5 and one end of the liquid dosing tube 10-8.

[0033] The sample is placed in the sample tank 4-1, with the bottom of the sample tank 4-1 at the same height as the sealing tray 4. The liquid dispensing motor 10-3 controls the rotation of the liquid dispensing screw 10-2, driving the liquid dispensing needle 10-1 forward and backward. The liquid dispensing needle 10-1 has two independent channels, one for resin and one for curing agent. The amount of resin added is controlled by its respective flow meter 10-6, which is connected to the ESP32 control system. The sealing tray 4 has a built-in temperature sensor 4-2, which is connected to the ESP32 control system. The ESP32 control system controls the heating wire 4-3 to turn on and off.

[0034] The central support 2 includes a rotary stepper motor, a rotary gear, a central column, a cantilever, a lifting arm slide bar, a lifting arm lead screw, a lifting arm stepper motor, a pressure sensor, and an adaptive clamping head. A rotating base 2-1 is connected to the middle of the frame 1. The base of the rotary stepper motor 2-2 is mounted on the rotating base 2-1. The drive end of the rotary stepper motor 2-2 is connected to the rotary gear 2-3 via a drive gear. The rotary gear 2-3 is shaft-connected to the central column 2-10. A support rod 2-6 is connected to the middle of the central column 2-10. The top outer edge of the central column 2-10 is connected to... A cantilever 2-9 is connected to one end of several cantilever 2-9 via a cantilever fulcrum, and the other end of the cantilever 2-9 is connected to an adaptive clamping head 11; a pressure sensor 2-5 is provided on a support rod 2-6 located between the central column 2-10 and the adaptive clamping head 11, and a base for a lifting arm stepper motor 2-4 is provided on the pressure sensor 2-5; the drive end of the lifting arm stepper motor 2-4 is connected to one end of a lifting arm lead screw 2-7, and the other end of the lifting arm lead screw 2-7 is connected to a lifting arm slide rod 2-8 via a sliding component 2-11, and the sliding component 2-11 is connected to the cantilever 2-9 via a connector.

[0035] The lifting arm stepper motor 2-4 controls the rotation of the lifting arm lead screw 2-7, causing the cantilever 2-9 to rotate upwards or downwards around the cantilever fulcrum. The other end of the cantilever 2-9 is connected to the adaptive clamping head 11. A pressure sensor 2-5 is located at the bottom of the lifting arm stepper motor 2-4, which monitors the pressure value of the motor bottom on the table in real time. The central support structure has the above six sets of cantilever and adaptive clamping head 11 modules, presenting a centrally symmetrical structure. In the top view, they are distributed at positions of 0°, 60°, 120°, 180°, 240°, and 300° respectively. The rotation of the entire central support structure is controlled by the rotary stepper motor 2-2 at the bottom, which drives the rotary gear 2-3. The rotary stepper motor 2-2 can provide feedback on the rotation angle of the central support structure based on the rotation step value.

[0036] The adaptive clamping head 11 includes a depth motor, a depth lead screw, a depth crossbeam, a depth slide bar, a left clamping slide rail, a right clamping slide rail, a rotation motor, a left clamping motor, a right clamping motor, a left clamping slider, a right clamping slider, a clamping ring, a universal rotating shaft, and an electromagnetic control plate. The other end of the cantilever 2-9 is connected to the base of the depth motor 11-1. The drive end of the depth motor 11-1 is connected to one end of the depth lead screw 11-4. The other end of the depth lead screw 11-4 is connected to the base of the rotation motor 11-6 via a connector. The drive end of the rotation motor 11-6 is connected to the middle of the universal rotating shaft 11-13 via a connecting rod. Both ends of the universal rotating shaft 11-13 are connected to the electromagnetic control plate 11-14 via fork-type connectors 11-15. The clamping ring 11-10 surrounds the universal rotating shaft 11-13. The left and right sides of the clamping ring 11-10 are respectively equipped with… There are left clamping sliders 11-9 and right clamping sliders 11-12. The tops of the left clamping sliders 11-9 and 11-12 are slidably connected to the left clamping slide rails 11-5 and 11-7, respectively. The left clamping slide rails 11-5 and 11-7 are connected to the connecting parts of the self-rotating motor 11-6. The middle parts of the left clamping sliders 11-9 and 11-12 are connected to the left clamping motor via lead screws. 11-8 is connected to the drive end of the right clamping motor 11-11. The bases of the left clamping motor 11-8 and the right clamping motor 11-11 are connected to the connectors of the self-rotating motor 11-6. A depth slide rod 11-3 is provided on the outside of the left clamping motor 11-8 and the right clamping motor 11-11 respectively. The top of the depth slide rod 11-3 is connected to the depth crossbeam 11-2. The depth crossbeam 11-2 is connected to the depth motor 11-1.

[0037] The electromagnetic control plate 11-14 can electromagnetically attract and release the disposable carrier, which is then cured to the sample with epoxy resin adhesive. The clamping ring 11-10 can be finely adjusted at any angle. After the angle is confirmed, the clamping motors (left clamping motor 11-8, right clamping motor 11-11) control the clamping sliders (left clamping slider 11-9, right clamping slider 11-12) to press and fix the clamping ring 11-10. The rotation motor 11-6 controls the electromagnetic control plate 11-14 and the disposable carrier to rotate and grind via the universal rotating shaft 11-13. The depth motor 11-1 controls the rotation of the depth screw 11-3, thereby adjusting the height of the bottom plane of the disposable carrier. The thickness of the delaminated layer is determined by the step value of the depth motor 11-1.

[0038] The drive components of the automatic delamination equipment are controlled by the ESP32 control system.

[0039] The software control component of this invention is an ESP32 control system. This system can control the switching and rotation speed of all motors, as well as the switching and rotation speed of all grinding and polishing discs. It can receive displacement signals from the motors, pressure sensors, temperature sensors, diffuse reflection laser limiters, and flow meters. It can control the switching of the flow meter, heating wire, electrically controlled magnetic suction head, and electromagnetic control plate. It can store various background information such as sample type, size, warpage at different temperatures, initial rotation speed information of each motor, position information of the corresponding moving module, the relationship between rotation revolutions and displacement, initial rotation speed information of the grinding disc, preset temperature and pressure information, and remaining amount of disposable carrier sheets. It can also store preset calculation formulas for resin and curing agent. Furthermore, the ESP32 control system supports quick-switch buttons for all controlled components and manual input control of temperature, pressure, flow rate, rotation speed, and displacement. It also supports manual input of sample type, required grinding thickness, and grinding pressure information.

[0040] like Figure 9 , Figure 10 As shown, a control method for an automatic delamination device for high uniformity of 3D packaged chips is described, and the specific control method flow is as follows: S1, the sample is placed in the sample slot 4-1 on the plastic sealing tray 4, and the sample model and required grinding thickness information are manually entered; The S2 and ESP32 control systems read the minimum warpage temperature value T based on the sample model and turn on the heating wire 4-3. Based on the reading value of the temperature sensor 4-2, the control system controls the switching of the heating wire 4-3 to make the temperature of the sealing disc 4 reach T. S3, the lifting motor 9-2 above the upper plate 3 rotates to raise the crossbeam 9-5, and the displacement motor 9-4 rotates to move the electronically controlled magnetic head 9-1 above the disposable carrier. According to the remaining number of disposable carriers, the lifting motor 9-2 is rotated in the opposite direction, and the electronically controlled magnetic head 9-1 is lowered to the position of the top carrier. The power of the electronically controlled magnetic head 9-1 is turned on, and a carrier is attracted. S4, the rotating lifting motor 9-2 raises the crossbeam 9-5 to a certain height, the reverse displacement motor 9-4 moves the electronically controlled magnetic suction head 9-1 with the carrier sheet to the center position of the carrier sheet slot 3-1 of the upper tray 3, the rotating positioning motor 9-10 moves the positioning piece of the carrier sheet to the diffuse reflection laser limiter 3-2 to trigger the limit, and the electronically controlled magnetic suction head 9-1 is closed to release the carrier sheet; S5, the rotary depth motor 11-1 returns to the zero position, the left clamping motor 11-8 and the right clamping motor 11-11 are rotated in the opposite direction to bring the clamping slider back to the zero position, the lifting arm stepper motor 2-4 is turned on to raise the adaptive clamping head 11 to a certain height, the rotary stepper motor 2-2 is turned on to drive the rotary gear 2-3 and the central column 2-10 to rotate 60°, so that the electromagnetic control plate 11-14 at the bottom of the adaptive clamping head 11 is directly above the plate carrier of the upper plate tray 3; S6, the reverse rotation of the lifting arm stepper motor 2-4 causes the adaptive clamping head 11 to gradually lower. When the pressure sensor 2-5 decreases by a certain value (1~10N), the switch of the electromagnetic control plate 11-14 is turned on to attract the carrier plate. S7, rotate the lifting arm stepper motor 2-4 to raise the adaptive clamping head 11 to a certain position, turn on the rotating stepper motor 2-2, drive the rotating gear 2-3 and the central column 2-10, so that the substrate position at the bottom of the adaptive clamping head 11 moves to directly above the sample slot 4-1 of the plastic sealing tray 4; S8, turn on the liquid dispensing motor 10-3, move the liquid dispensing needle 10-1 directly above the sample, calculate the required amount of resin and curing agent based on the sample size and thickness, and turn on the two flow meters 10-6 at the same time. Control the amount of resin and curing agent added by the flow rate and time. The calculated amount of addition should not overflow the edge of the sample. S9, reverse rotation of the liquid adding motor 10-3 moves the liquid adding needle 10-1 out of the sealing plate 4, reverse rotation of the lifting arm stepper motor 2-4 causes the adaptive clamping head 11 to descend, record the current maximum value F0 of the pressure sensor 2-5, when the pressure value of the pressure sensor 2-5 decreases by a certain value F1 (1~100N) compared to F0, open the left clamping motor 11-8 and the right clamping motor 11-11 of the adaptive clamping head 11, move the left clamping slider 11-9 and the right clamping slider 11-12 to squeeze the clamping ring 11-10 to fix it, and keep it for 2 hours to wait for the resin to cure; S10, turn off the switch of heating wire 4-3, wait for it to cool down to below 30℃, slowly rotate the lifting arm stepper motor 2-4 to raise the adaptive clamping head 11 to a certain position, and record the maximum value of pressure sensor 2-5 during this period as the normal pressure F2; S11, turn on the rotary stepper motor 2-2, drive the rotary gear 2-3 and the central column 2-10 to rotate 60°, then slowly rotate the lifting arm stepper motor 2-4 in the opposite direction, so that the adaptive clamping head 11 slowly falls. When the value F3 of the pressure sensor 2-5 is equal to F2-F1, stop rotating the lifting arm stepper motor 2-4 and maintain the pressure. S12, turn on the switch of coarse grinding disc 5 and the switch of self-rotating motor 11-6, keep the speed at 50~500 rpm, when the value of pressure sensor 2-5 is greater than F3, rotate the depth motor 11-1 in the forward direction to move the sample down, when the value of pressure sensor 2-5 is less than F3, rotate the depth motor 11-1 in the reverse direction to move the sample up, and ensure that the pressure value of pressure sensor 2-5 is F3; S13, when the step value of the depth motor 11-1 is 100um smaller than the required grinding thickness, stop the switch of the coarse grinding disc 5, the self-rotating motor 11-6, and the depth motor 11-1, rotate the lifting arm stepper motor 2-4 to raise the adaptive clamping head 11 to a certain position, turn on the rotating stepper motor 2-2, and drive the rotating gear 2-3 and the central column 2-10 to rotate 60°; S14, reverse the rotation of the lifting arm stepper motor 2-4 to lower the adaptive gripper head 11. When the value F4 of the pressure sensor 2-5 equals F3, stop rotating the lifting arm stepper motor 2-4 and maintain the pressure. Turn on the switch of the fine grinding disc 6 and the switch of the self-rotating motor 11-6, maintaining the speed at 50~500 rpm, and keeping the pressure value of the pressure sensor 2-5 at F4. S15, when the step value of the depth motor 11-1 is 10um smaller than the required grinding thickness, stop the switch of the fine grinding disc 6, the self-rotating motor 11-6, and the depth motor 11-1, rotate the lifting arm stepper motor 2-4 to raise the adaptive clamping head 11 to a certain position, turn on the rotating stepper motor 2-2, and drive the rotating gear 2-3 and the central column 2-10 to rotate 60°. S16, reverse the rotation of the lifting arm stepper motor 2-4 to lower the adaptive clamping head 11. When the value F5 of the pressure sensor 2-5 equals F3, stop rotating the lifting arm stepper motor 2-4 and maintain the pressure. Turn on the switch of the polishing disc 7 and the switch of the self-rotating motor 11-6, and keep the speed at 50~500 rpm, maintaining the pressure value of the pressure sensor 2-5 at F5. S17, when the step value of the depth motor 11-1 reaches the required grinding thickness, stop the switch of the polishing disk 7, the self-rotating motor 11-6, and the depth motor 11-1, rotate the lifting arm stepper motor 2-4 to raise the adaptive clamping head 11 to a certain position, turn on the rotating stepper motor 2-2, and drive the rotating gear 2-3 and the central column 2-10 to rotate 60°. S18, the depth motor 11-1 returns to zero, the lifting arm stepper motor 2-4 rotates in the opposite direction to lower the adaptive clamping head 11, and the sample reaches the position above the substrate slot of the unloading tray 8 according to the position feedback of the lifting arm stepper motor 2-4. The self-rotating motor 11-6 is slowly rotated, and the self-rotation stops when the positioning plate of the substrate triggers the diffuse reflection laser limiter. The electromagnetic control plate 11-14 is turned off to release the sample, waiting for the next sample grinding requirement.

Claims

1. A high-uniformity automatic delamination device for 3D packaged chips, comprising a frame, an outer functional disk, and a central support, characterized in that: The central support (2) is connected to the middle of the frame (1), and an external function panel is provided on the outer edge of the frame (1); The central support (2) includes a rotary stepper motor, a rotary gear, a central column, a cantilever, a lifting arm slide bar, a lifting arm lead screw, a lifting arm stepper motor, a pressure sensor, and an adaptive clamping head. A rotating base (2-1) is connected to the middle of the frame (1). A base for a rotary stepper motor (2-2) is provided on the rotating base (2-1). The driving end of the rotary stepper motor (2-2) is connected to the rotary gear (2-3) through a drive gear. The rotary gear (2-3) is shaft-connected to the central column (2-10). A support rod (2-6) is connected to the middle of the central column (2-10). The top outer edge of the central column (2-10) is connected to the support rod (2-6). The arm fulcrum connects one end of several cantilever arms (2-9), and the other end of the cantilever arms (2-9) is connected to the adaptive clamping head (11); a pressure sensor (2-5) is provided on the support rod (2-6) located between the central column (2-10) and the adaptive clamping head (11), and a base of the lifting arm stepper motor (2-4) is provided on the pressure sensor (2-5). The drive end of the lifting arm stepper motor (2-4) is connected to one end of the lifting arm lead screw (2-7), and the other end of the lifting arm lead screw (2-7) is connected to the lifting arm slide rod (2-8) through the sliding component (2-11), and the sliding component (2-11) is connected to the cantilever arm (2-9) through the connector; The adaptive clamping head (11) includes a depth motor, a depth lead screw, a depth crossbeam, a depth slide bar, a left clamping slide rail, a right clamping slide rail, a rotation motor, a left clamping motor, a right clamping motor, a left clamping slider, a right clamping slider, a clamping ring, a universal rotating shaft, and an electromagnetic control plate. The other end of the cantilever (2-9) is connected to the base of the depth motor (11-1). The drive end of the depth motor (11-1) is connected to one end of the depth lead screw (11-4), and the other end of the depth lead screw (11-4) is connected to the other end of the depth lead screw (11-4). The drive end of the self-rotating motor (11-6) is connected to the base of the self-rotating motor (11-6) via a connector. The drive end of the self-rotating motor (11-6) is connected to the middle of the universal rotating shaft (11-13) via a connecting rod. The two ends of the universal rotating shaft (11-13) are connected to the electromagnetic control plate (11-14) via fork-type connectors (11-15). The outside of the universal rotating shaft (11-13) is wrapped by a clamping ring (11-10). Left clamping sliders are respectively provided on the left and right sides of the clamping ring (11-10). (11-9), the tops of the right clamping slider (11-12), the left clamping slider (11-9), and the right clamping slider (11-12) are slidably connected to the left clamping slide rail (11-5) and the right clamping slide rail (11-7) respectively. The left clamping slide rail (11-5) and the right clamping slide rail (11-7) are connected to the connecting piece of the self-rotating motor (11-6). The middle parts of the left clamping slider (11-9) and the right clamping slider (11-12) are respectively connected to the left clamping motor (11-6) via lead screws. 8) The drive end of the right clamping motor (11-11) is connected, and the bases of the left clamping motor (11-8) and the right clamping motor (11-11) are connected to the connecting piece of the self-rotating motor (11-6); a depth slide rod (11-3) is provided on the outside of the left clamping motor (11-8) and the right clamping motor (11-11), the top of the depth slide rod (11-3) is connected to the depth crossbeam (11-2), and the depth crossbeam (11-2) is connected to the depth motor (11-1).

2. The automatic delamination device for high uniformity of 3D packaged chips according to claim 1, characterized in that: The external functional disks include a loading disk, a sealing disk, a coarse grinding disk, a fine grinding disk, a polishing disk, and a unloading disk. The loading disk (3), sealing disk (4), coarse grinding disk (5), fine grinding disk (6), polishing disk (7), and unloading disk (8) are evenly distributed on the outer edge of the frame (1). A loading and unloading mechanism (9) is provided on one side of the loading disk (3), and a liquid adding mechanism (10) is provided on one side of the sealing disk (4).

3. The automatic delamination device for high uniformity of 3D packaged chips according to claim 2, characterized in that: The upper plate (3) and the lower plate (8) have the same structure. The upper plate (3) is a circular plate structure. The upper plate (3) is provided with a plate slot (3-1) for installing disposable plates. A diffuse reflection laser limiter (3-2) is provided on one side of the plate slot (3-1).

4. The automatic delamination device for high uniformity of 3D packaged chips according to claim 2, characterized in that: The plastic sealing tray (4) is provided with a sample slot (4-1), a temperature sensor (4-2) is provided at the bottom of the sample slot (4-1), and a heating wire (4-3) is provided inside the plastic sealing tray (4).

5. The automatic delamination device for high uniformity of 3D packaged chips according to claim 2, characterized in that: The loading and unloading mechanism (9) includes a motor mounting base, a lifting motor, a lifting screw, a displacement motor, a crossbeam, a displacement slider, a displacement screw, a displacement slide bar, a support slide bar, a positioning motor, and an electrically controlled magnetic suction head. The upper side of the motor mounting base (9-1) is slidably connected to one end of the crossbeam (9-5), and a support slide bar (9-9) is located below the other end of the crossbeam (9-5). The bottom of the crossbeam (9-5) is connected to the displacement slide bar (9-8). The lower part of the motor mounting base (9-1) is connected to the base of the lifting motor (9-2), and the drive end of the lifting motor (9-2) is connected to the lifting screw (9-9). -3) One end of the lifting screw (9-3) is connected to the base of the displacement motor (9-4). The drive end of the displacement motor (9-4) is connected to the displacement screw (9-7). The displacement screw (9-7) is fitted with a displacement slider (9-6). The upper part of the displacement slider (9-6) is slidably connected to the displacement slide rod (9-8). The lower part of the displacement slider (9-6) is connected to one end of the support slide rod (9-9). The lower part of the other end of the support slide rod (9-9) is connected to the base of the positioning motor (9-10). The drive end of the positioning motor (9-10) is connected to the electrically controlled magnetic suction head (9-11).

6. The automatic delamination device for high uniformity of 3D packaged chips according to claim 2, characterized in that: The liquid addition mechanism (10) includes a liquid addition needle, a liquid addition screw, a liquid addition motor, a curing agent tube, a resin tube, a flow meter, and a liquid addition mechanism bracket. One end of the liquid addition mechanism bracket (10-7) is connected to the equipment, and the other end of the liquid addition mechanism bracket (10-7) is connected to the base of the liquid addition motor (10-3). The drive end of the liquid addition motor (10-3) is connected to the liquid addition screw (10-2). The liquid addition screw (10-2) is connected to the liquid addition tube (10-8) via a slider. One end of the liquid addition tube (10-8) is connected to the liquid addition needle (10-1), and the other end of the liquid addition tube (10-8) is connected to the curing agent tube (10-4) and the resin tube (10-5), respectively. A flow meter (10-6) is provided between one end of the curing agent tube (10-4), the resin tube (10-5), and the liquid addition tube (10-8).

7. The automatic delamination device for high uniformity of 3D packaged chips according to claim 1, characterized in that: The drive components of the automatic delamination device are controlled by the ESP32 control system.

8. A control method for an automatic delamination device for high uniformity of 3D packaged chips according to any one of claims 1 to 7, characterized in that: The specific control method and process are as follows: S1, the sample is placed in the sample slot (4-1) on the plastic sealing tray (4), and the sample model and required grinding thickness information are manually entered; S2, the ESP32 control system reads the minimum warpage temperature value T according to the sample model and turns on the heating wire (4-3). According to the reading value of the temperature sensor (4-2), it controls the switch of the heating wire (4-3) so that the temperature of the plastic sealing plate (4) reaches T; S3, the lifting motor (9-2) above the upper plate (3) rotates to raise the crossbeam (9-5), and the displacement motor (9-4) rotates to move the electric magnetic suction head (9-11) above the disposable carrier. According to the remaining number of disposable carriers, the lifting motor (9-2) is rotated in the opposite direction, and the electric magnetic suction head (9-11) descends to the position of the top carrier. The power of the electric magnetic suction head (9-11) is turned on, and a carrier is attracted. S4, the rotating lifting motor (9-2) raises the crossbeam (9-5) to a certain height, the reverse displacement motor (9-4) moves the electric magnetic suction head (9-11) with the carrier sheet to the center position of the carrier sheet slot (3-1) of the upper plate (3), the rotating positioning motor (9-10) moves the positioning piece of the carrier sheet to the diffuse reflection laser limiter (3-2) to trigger the limit, and the electric magnetic suction head (9-11) is closed to release the carrier sheet; S5, rotate the depth motor (11-1) back to zero, rotate the left clamping motor (11-8) and right clamping motor (11-11) in the opposite direction to make the clamping slider return to zero, turn on the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain height, turn on the rotating stepper motor (2-2) to drive the rotating gear (2-3) and the central column (2-10) to rotate 60°, so that the electromagnetic control plate (11-14) at the bottom of the adaptive clamping head (11) is directly above the plate carrier of the upper plate disk (3); S6, the reverse rotation of the lifting arm stepper motor (2-4) causes the adaptive clamping head (11) to gradually decrease. When the pressure sensor (2-5) decreases by a certain value, the switch of the electromagnetic control plate (11-14) is turned on to attract the carrier plate. S7, rotate the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain position, turn on the rotating stepper motor (2-2) to drive the rotating gear (2-3) and the central column (2-10) so that the substrate position at the bottom of the adaptive clamping head (11) moves to the sample slot (4-1) of the plastic sealing tray (4); S8, turn on the liquid dispensing motor (10-3), move the liquid dispensing needle (10-1) directly above the sample, calculate the required amount of resin and curing agent based on the sample size and thickness, and turn on two flow meters (10-6) at the same time. Control the amount of resin and curing agent added by the flow rate and time. The calculated amount of addition should not overflow the edge of the sample. S9, rotate the liquid adding motor (10-3) in the opposite direction to move the liquid adding needle (10-1) out of the sealing plate (4), rotate the lifting arm stepper motor (2-4) in the opposite direction to lower the adaptive clamping head (11), record the current maximum value F0 of the pressure sensor (2-5), when the pressure value of the pressure sensor (2-5) decreases by a certain value F1 compared with F0, open the left clamping motor (11-8) and right clamping motor (11-11) of the adaptive clamping head (11), move the left clamping slider (11-9) and right clamping slider (11-12) to squeeze the clamping ring (11-10) to fix it, and keep it for 2 hours to wait for the resin to cure; S10, turn off the switch of the heating wire (4-3), wait for it to cool down to below 30°C, slowly rotate the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain position, and record the maximum value of the pressure sensor (2-5) as the normal pressure F2. S11, turn on the rotary stepper motor (2-2), drive the rotary gear (2-3) and the central column (2-10) to rotate 60°, then slowly rotate the lifting arm stepper motor (2-4) in the opposite direction, so that the adaptive clamping head (11) slowly falls. When the value F3 of the pressure sensor (2-5) is equal to F2-F1, stop rotating the lifting arm stepper motor (2-4) and maintain the pressure. S12, turn on the switch of the coarse grinding disc (5) and the switch of the self-rotating motor (11-6), keep the speed at 50~500 rpm, when the value of the pressure sensor (2-5) is greater than F3, rotate the depth motor (11-1) in the forward direction to move the sample down, when the value of the pressure sensor (2-5) is less than F3, rotate the depth motor (11-1) in the reverse direction to move the sample up, and ensure that the pressure value of the pressure sensor (2-5) is F3; S13, when the step value of the depth motor (11-1) is 100um smaller than the required grinding thickness, stop the switch of the coarse grinding disc (5), the self-rotating motor (11-6), and the depth motor (11-1), rotate the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain position, turn on the rotating stepper motor (2-2) to drive the rotating gear (2-3) and the central column (2-10) to rotate 60°; S14, reverse the rotation of the lifting arm stepper motor (2-4) to make the adaptive clamping head (11) fall. When the value F4 of the pressure sensor (2-5) is equal to F3, stop rotating the lifting arm stepper motor (2-4) and maintain the pressure. Turn on the switch of the fine grinding disc (6) and the switch of the self-rotating motor (11-6). Keep the speed at 50~500 rpm and keep the pressure value of the pressure sensor (2-5) at F4. S15, when the step value of the depth motor (11-1) is 10um smaller than the required grinding thickness, stop the switch of the fine grinding disc (6), the self-rotating motor (11-6), and the depth motor (11-1), rotate the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain position, turn on the rotating stepper motor (2-2) to drive the rotating gear (2-3) and the central column (2-10) to rotate 60°; S16, reverse the rotation of the lifting arm stepper motor (2-4) to make the adaptive clamping head (11) fall. When the value F5 of the pressure sensor (2-5) is equal to F3, stop rotating the lifting arm stepper motor (2-4) and maintain the pressure. Turn on the switch of the polishing disc (7) and the switch of the self-rotating motor (11-6), and keep the speed at 50~500 rpm. Keep the pressure value of the pressure sensor (2-5) at F5. S17, when the step value of the depth motor (11-1) reaches the required grinding thickness, stop the switch of the polishing disk (7), the self-rotating motor (11-6), and the depth motor (11-1), rotate the lifting arm stepper motor (2-4) to raise the adaptive clamping head (11) to a certain position, turn on the rotating stepper motor (2-2) to drive the rotating gear (2-3) and the central column (2-10) to rotate 60°; S18, the depth motor (11-1) returns to zero, the lifting arm stepper motor (2-4) rotates in the opposite direction, causing the adaptive clamping head (11) to fall. According to the position feedback of the lifting arm stepper motor (2-4), the sample reaches the position above the substrate slot of the unloading tray (8). The self-rotating motor (11-6) is slowly rotated. When the positioning plate of the substrate triggers the diffuse reflection laser limiter, the self-rotation stops. The electromagnetic control plate (11-14) is turned off to release the sample and wait for the next sample grinding requirement.

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