一种电路板用低碳双组份聚氨酯灌封胶及其制备方法
By designing a low-carbon two-component polyurethane potting compound, which utilizes PCE and hydrophobic acrylate oligomers to form a double hydrophobic barrier, the problems of high carbon emissions and insufficient hydrophobic properties of traditional potting compounds are solved, achieving stability and long lifespan protection for circuit boards under high temperature and high humidity environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI FUMING SEALING MATERIAL
- Filing Date
- 2026-02-13
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional polyurethane circuit board potting compounds have high carbon emissions during production and insufficient hydrophobic properties, which makes circuit boards prone to moisture absorption, short circuits, performance degradation, and poor aging resistance, making it difficult to meet the long-term protection requirements of high-end electronic devices.
The low-carbon two-component polyurethane potting compound uses PCE and bio-based polyols as the main raw materials, combined with hydrophobic acrylate oligomers to form a dual hydrophobic barrier of physical and chemical properties, which improves aging resistance. By controlling the crosslinking density and molecular chain structure, the stability of the product in high temperature and high humidity environments is ensured.
It significantly reduces water absorption, increases tensile strength and elongation at break, extends the service life of circuit boards, meets the weather resistance requirements in high-temperature environments, and is suitable for mass production.
Smart Images
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