Method for extracting random vibration stress envelope of multi-demand scenario and related equipment

Abstract

The application provides a multi-demand scenario random vibration stress envelope extraction method and related equipment, which relates to component reliability detection technology, wherein the method comprises: obtaining all test scenes corresponding to a device to be tested, and determining vibration environment data corresponding to each test scene. Based on the vibration environment data, a power spectral density graph corresponding to each test scene is plotted in a double logarithmic coordinate system. Random vibration stress envelope extraction is performed on all power spectral density graphs to obtain a random vibration power spectral density graph. The device to be tested is subjected to a vibration test according to the random vibration power spectral density graph, which can avoid the occurrence of vibration stress underestimation of the test scene. At the same time, compared with the traditional method of conducting test evaluation one by one, the application can also avoid repeated evaluation, effectively reduce the cost of manpower and resources, and improve the accuracy of product reliability evaluation.

Description

Technical Field

[0001] This application relates to the field of component reliability testing technology, and in particular to a method and related equipment for extracting random vibration stress envelopes under multiple demand scenarios. Background Technology

[0002] Throughout their lifecycle, electronic products may experience mechanical environments such as vibration and constant acceleration during transportation and use. Under strong mechanical stress, electronic products with serious defects in design, materials, or processes, or with assembly problems, may suffer structural damage, decreased mechanical performance, increased wear, and electrical parameter drift, leading to structural failures such as broken or deformed external leads. Regarding the issue of maintaining stable and reliable operation of electronic products under mechanical environments, standardization organizations have established relevant testing guidelines and divided the testing levels according to the needs of actual usage scenarios. Mechanical environment testing mainly includes: sinusoidal vibration, random vibration, impact, collision, jolt, and constant acceleration. However, vibration testing of electronic products requires testing each vibration stress under various demand scenarios, which can lead to over-testing and under-testing, reducing the accuracy of electronic product reliability assessments. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a method and related equipment for extracting the stress envelope of random vibration in multiple demand scenarios, so as to solve the problems of over-testing and under-testing when conducting vibration tests on electronic products.

[0004] To achieve the above objectives, the first aspect of this application provides a method for extracting the stress envelope of random vibrations in multi-demand scenarios, comprising: Acquire all test scenarios corresponding to the device under test, and determine the vibration environment data corresponding to each test scenario; Based on the vibration environment data, the power spectral density diagram corresponding to each test scenario is plotted in a double logarithmic coordinate system; Random vibration stress envelope extraction is performed on all power spectral density maps to obtain random vibration power spectral density maps; The device under test is subjected to vibration test based on the random vibration power spectral density diagram.

[0005] Optionally, the step of performing random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps includes: Calculate the coordinates of the key points in each power spectral density plot; Based on the coordinates corresponding to the key points, a random vibration stress envelope extraction operation is performed on all power spectral density maps to obtain random vibration power spectral density maps.

[0006] Optionally, calculating the coordinates corresponding to key points in each power spectral density map includes: Determine the power spectral density function corresponding to the rising or falling spectrum in the power spectral density plot; The power spectral density function corresponding to the rising or falling spectrum is solved to obtain the coordinates of the key points in each power spectral density map.

[0007] Optionally, the step of performing random vibration stress envelope extraction on all power spectral density maps based on the coordinates corresponding to key points to obtain random vibration power spectral density maps includes: According to the type of random vibration, all power spectral density maps are divided into multiple groups of power spectral density maps; Based on the coordinates corresponding to key points, random vibration stress envelope extraction is performed on multiple sets of power spectral density maps in a preset order to obtain random vibration power spectral density maps.

[0008] Optionally, the step of extracting the random vibration stress envelope from multiple sets of power spectral density maps according to a preset order based on the coordinates corresponding to key points to obtain random vibration power spectral density maps includes: Based on the coordinates corresponding to the key points, random vibration stress envelope extraction is performed on each group of power spectral density maps in a preset order to obtain each power spectral density sub-map, and the last group of power spectral density sub-maps is used as the random vibration power spectral density map; wherein, the group of power spectral density maps for which random vibration stress envelope extraction is performed later is based on the power spectral density sub-maps obtained in the previous group.

[0009] Optionally, the multiple sets of power spectral density maps include a broadband random group, a broadband plus narrowband group, and a broadband plus fixed frequency group; Based on the coordinates corresponding to key points, random vibration stress envelope extraction is performed on each group of power spectral density maps in a preset order to obtain each power spectral density sub-map. The last group of power spectral density sub-maps obtained is used as the random vibration power spectral density map, including: Based on the coordinates of the key points, a random vibration stress envelope extraction operation is performed on the broadband random group to obtain the first power spectral density sub-map. Based on the coordinates of the key points and the first power spectral density sub-map, a random vibration stress envelope extraction operation is performed on the broadband plus narrowband group to obtain the second power spectral density sub-map. Based on the coordinates of the key points and the second power spectral density sub-map, a random vibration stress envelope extraction operation is performed on the broadband plus fixed frequency group to obtain the random vibration power spectral density map.

[0010] Optionally, the step of performing random vibration stress envelope extraction on the broadband and narrowband groups based on the coordinates corresponding to the key points and the first power spectral density sub-map to obtain the second power spectral density sub-map includes: Based on the coordinates of the key points and the first power spectral density sub-map, the envelope of the broadband portion of the power spectral density map in the broadband plus narrowband group is extracted to obtain the initial second power spectral density sub-map. The narrowband center frequency and acceleration spectral density of the power spectral density maps in the broadband and narrowband groups are combined in the initial second power spectral density subplot to obtain the second power spectral density subplot.

[0011] Optionally, the step of performing random vibration stress envelope extraction on the broadband plus fixed frequency group based on the coordinates corresponding to the key points and the second power spectral density sub-map to obtain the random vibration power spectral density map includes: Based on the coordinates of the key points and the second power spectral density sub-map, the envelope of the broadband part of the power spectral density map in the broadband plus fixed frequency group is extracted to obtain the initial third power spectral density sub-map. The fixed-frequency and acceleration spectral densities of the power spectral density maps in the broadband plus fixed-frequency group are combined in the initial third power spectral density subplot to obtain the random vibration power spectral density map.

[0012] Based on the same inventive concept, a second aspect of this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0013] Based on the same inventive concept, a third aspect of this application also provides a non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform the method described above.

[0014] As described above, this application provides a method and related equipment for extracting random vibration stress envelopes for multiple demand scenarios. The method includes: acquiring all test scenarios corresponding to the device under test, and determining the vibration environment data corresponding to each test scenario. Based on the vibration environment data, a power spectral density map corresponding to each test scenario is plotted in a double logarithmic coordinate system. A random vibration stress envelope extraction operation is performed on all power spectral density maps to ensure comprehensive coverage of different vibration stresses in each test scenario during the envelope process, resulting in a random vibration power spectral density map. Vibration testing of the device under test based on the random vibration power spectral density map avoids underestimation of vibration stress in the test scenarios. Furthermore, compared to the traditional method of conducting tests one by one, this application's method of testing the device under test based on the random vibration power spectral density map avoids the problem of repeated testing, effectively reducing manpower and material costs and improving the accuracy of product reliability assessment. Testing the device under test using the random vibration power spectral density map effectively identifies weak points in the device, supporting device design and process reliability control. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart illustrating the method for extracting the random vibration stress envelope in multiple demand scenarios according to an embodiment of this application. Figure 2 These are power spectral density diagrams corresponding to multiple test scenarios in embodiments of this application; Figure 3 This is a first power spectral density subgraph of an embodiment of this application; Figure 4 This is a second power spectral density subplot according to an embodiment of this application; Figure 5 This is a random vibration power spectral density diagram of an embodiment of this application; Figure 6 This is a summary of the random vibration power spectral density diagrams from the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the random vibration stress envelope extraction device for multiple demand scenarios according to an embodiment of this application; Figure 8 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0018] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0019] As described in the background section, electronic products may experience mechanical environments such as vibration and constant acceleration during different stages of their life cycle, including transportation and use. Under strong mechanical stress, electronic products with serious defects in design, materials, or processes, or with assembly problems, may suffer structural damage, decreased mechanical performance, increased wear, and electrical parameter drift, leading to structural failures such as broken or deformed external leads. This can result in momentary disconnection of connectors and relays, decreased plug-in performance, detachment of adhesive layers and bonding points, and noise and transient short circuits in the circuit.

[0020] Different types of component packages, materials, and processes exhibit vastly different sensitivities to mechanical forces. For example, large, heavy through-hole components without auxiliary mounting structures are prone to various problems in mechanical environments. The pins are subjected to significant forces under such conditions, and if the stress exceeds their tolerance, cracks may occur. Taking a DC / DC power converter module as an example, the module's large mass means that under the amplified effect of vibration excitation, the maximum bending moment occurs at the pin solder joints, leading to solder joint cracking or damage. Furthermore, because glass is fragile, glass-packaged components are less resistant to mechanical stress than components packaged in other materials. Finally, integrated circuits may experience electrical noise and drift or anomalies in electrical parameters under mechanical environments such as vibration and impact.

[0021] Regarding the issue of maintaining stable and reliable operation of electronic devices under mechanical conditions, many domestic and international standardization organizations have formulated relevant test guidelines and divided the test scale according to the needs of actual applications. Comparing various environmental test standards at home and abroad, the mechanical environment test mainly includes: sinusoidal vibration, random vibration, shock, collision, jolt, and constant acceleration; among them, sinusoidal vibration, shock, and constant acceleration are widely used in engineering.

[0022] Traditional testing methods, when addressing device vibration stress requirements across multiple scenarios, involve conducting tests one by one. This can lead to duplication of effort in assessing weak points, wasting human and material resources. Repeated testing of the same device may also result in over-testing, leading to inaccurate assessments of product reliability. Furthermore, the numerous scenarios present a risk of omissions in testing, also contributing to inaccurate reliability assessments.

[0023] In view of this, this application proposes a method for extracting the stress envelope of random vibration under multiple demand scenarios. Based on the characteristics of different types of vibration stress in random vibration, the method obtains the random vibration power spectral density map through stress envelope extraction, achieving comprehensive coverage of different vibration stresses under multiple demand scenarios and avoiding the problem of missed testing of devices. Furthermore, conducting tests on the device under test based on the random vibration power spectral density map can also avoid the problem of repeated testing and over-testing.

[0024] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0025] This application proposes a method for extracting the stress envelope of random vibrations in demand scenarios, referencing... Figure 1 This includes the following steps: Step 101: Obtain all test scenarios corresponding to the device under test, and determine the vibration environment data corresponding to each test scenario.

[0026] Specifically, this embodiment addresses random vibration testing, where the device under test (DUT) is the device to be subjected to random vibration testing. The test scenario is the environment in which the DUT undergoes random vibration testing, such as ground transportation scenarios, aviation and aerospace environments, ship and marine environments, and industrial and fixed equipment environments. Vibration environment data for each test scenario may include vibration time, vibration axis, low-frequency start point, high-frequency end point, and corresponding power spectral density.

[0027] Step 102: Based on the vibration environment data, plot the power spectral density diagram corresponding to each test scenario in a double logarithmic coordinate system.

[0028] Specifically, based on the vibration environment data, a power spectral density plot is plotted for each test scenario in a log-log coordinate system. In this system, the horizontal axis represents frequency f, and its range should cover the frequencies of all test scenarios, for example, from 10Hz to 2000Hz. The vertical axis represents acceleration spectral density S, and its range should cover the PSD (Power Spectral Density) values ​​of all test scenarios, for example, from 0.01 g. 2 / Hz to 1 g 2 / Hz. The plotting process includes drawing the flat and sloping spectral segments in the power spectral density plot. The flat spectral segment has a slope of zero, and the ordinate remains unchanged. The sloping spectral segment has a certain slope; when the slope is positive, the sloping spectral segment is an ascending segment, and when the slope is negative, the sloping spectral segment is a descending segment.

[0029] Step 103: Perform random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps.

[0030] The envelope extraction operation refers to the process of analyzing, calculating, and synthesizing all different test scenarios and different types of vibration stress conditions (such as broadband random, broadband plus narrowband, and broadband plus fixed frequency) for all random vibration environments that the device may experience under normal operating conditions, and finally generating a single, conservative power spectral density curve.

[0031] Furthermore, step 103 includes: Step 1031: Calculate the coordinates of the key points in each power spectral density plot.

[0032] Specifically, the random vibration stress envelope extraction operation requires calculating the coordinates of key points in each power spectral density map to determine the maximum envelope between different power spectral density maps based on the coordinates of the key points. Key points include the start point, end point, and inflection point on the power spectral density map.

[0033] Furthermore, step 1031 includes: Determine the power spectral density function corresponding to the rising or falling spectrum in the power spectral density plot; The power spectral density function corresponding to the rising or falling spectrum is solved to obtain the coordinates of the key points in each power spectral density map.

[0034] In the power spectral density plot, the starting and ending coordinates of the parallel spectral segments can be determined based on the vibration environment data. However, the coordinates of some inflection points in the parallel and oblique spectral segments are unknown and require further calculation. Let the power spectral density function of the rising or falling spectrum be S, the frequency be f, and the slope be β. Given a point on the power spectral density function with coordinates (f0, S0), then: (1), (2), (3), Formula (1) can be used to derive formulas (2) and (3). In formula (3), the power spectral density function represents the relationship between the power spectral density S and the frequency f. By substituting any frequency in the power spectral density graph into formula (3), the corresponding power spectral density can be obtained.

[0035] For example, Figure 2 Power spectral density plots for several experimental scenarios are shown. In the power spectral density plot for scenario 1, the starting coordinates of the descent spectrum are (1000Hz, 0.14 g). 2 The Hz is known, the slope of the descent spectrum is -6dB / oct, and the x-coordinate of the endpoint of the descent spectrum is 2000Hz. Substituting the above known data into the above formula (3), we can obtain: (4), The endpoint ordinate S of the descent spectrum is calculated using formula (4) and is found to be 0.035 g. 2 / Hz.

[0036] For example, in Figure 2 In the power spectral density plot corresponding to scenario 2, the coordinates of the endpoint of the rising spectrum are (100Hz, 0.16 g). 2 The Hz is known, the slope of the rising spectrum is 3dB / oct, and the starting point of the rising spectrum is 10Hz. Substituting into the above formula (3), we can get: (5), The starting ordinate S of the rising spectrum is calculated using formula (5) and is found to be 0.016 g. 2 / Hz.

[0037] Step 1032: Based on the coordinates corresponding to the key points, perform random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps.

[0038] Furthermore, step 1032 includes: Step 10321: Divide all power spectral density maps into multiple groups according to the type of random vibration.

[0039] Specifically, random vibration types include broadband random vibration, broadband plus narrowband vibration, and broadband plus fixed-frequency vibration. Broadband random vibration occurs when all frequency components are simultaneously excited within a continuous frequency range, and the PSD value is statistically continuously distributed. Broadband random vibration simulates a random and chaotic excitation environment without a dominant vibration source, where energy is uniformly distributed or follows a certain pattern within a frequency band. Because the energy distribution spans a wide frequency range, it can excite almost all the natural frequencies of the device structure. It primarily assesses the fatigue life of the device structure under long-term random stress.

[0040] For example, broadband random vibration environment data includes {10Hz~120Hz, 0.04g}. 2 / Hz; 120Hz~300Hz, +4dB / oct; 300 Hz~1000Hz, 0.14g 2 / Hz; 1000 Hz~2000Hz, -6dB / oct}. From this vibration environment data, it can be seen that it includes two flat spectral bands, namely {10Hz~120Hz, 0.04g}. 2 / Hz} and {300 Hz~1000Hz, 0.14g} 2 The spectrum includes a rising band {120Hz~300Hz, +4dB / oct} and a falling band {1000 Hz~2000Hz, -6dB / oct}, where +4dB / oct represents the slope of the rising band and -6dB / oct represents the slope of the falling band. 0.04g 2 / Hz and 0.14g 2 / Hz represents the power spectral density of the flat spectral bands at both ends.

[0041] Broadband plus narrowband vibration superimposed one or more random vibrations with narrow bandwidths, concentrated around a specific center frequency, onto a "background noise" of broadband vibration. It simulates a random background with one or more dominant, fixed-frequency vibration sources, but the intensity of these sources varies randomly, and the narrowband itself is also random. If a device's natural frequency coincides with the narrowband center frequency, it will be subjected to extremely severe excitation, and the vibration response will be drastically amplified. At the narrowband frequency, damage accumulates much faster than with pure broadband vibration. For example, broadband plus narrowband vibration environment data includes {10Hz~2000Hz, 0.02g}. 2 / Hz; 500Hz, 0.2g 2 / Hz; 1000 Hz, 0.1g 2 / Hz}. From this vibration environment data, it can be seen that it includes a wide bandwidth {10Hz~2000Hz, 0.02g}. 2 / Hz} and two narrowbands {500Hz, 0.2g} 2 / Hz; 1000 Hz, 0.1g 2 / Hz}.

[0042] Broadband plus fixed-frequency vibration superimposed one or more pure, constant-amplitude sinusoidal vibrations onto the "background noise" of broadband random vibration. It simulates one or more extremely stable vibration sources with constant intensity against a random background, generating a continuous and maximal resonant response at a fixed frequency. Broadband plus fixed-frequency vibration is particularly prone to causing faults such as loose screws, detached joints, and broken solder joints because the fixed-frequency vibration generates continuous, directional stress.

[0043] Based on broadband random vibration, broadband plus narrowband vibration, and broadband plus fixed-frequency vibration, all power spectral density maps are divided into multiple groups, each corresponding to a type of random vibration. For example... Figure 2 As shown, based on the type of random vibration, the power spectral density maps corresponding to scenarios 1 to 5 are divided into three groups. The first group consists of power spectral density maps corresponding to broadband vibration, including scenarios 1 and 2. The second group consists of power spectral density maps corresponding to broadband and narrowband vibration, including scenarios 3 and 4. The third group consists of power spectral density maps corresponding to broadband and fixed-frequency vibration, including scenario 5.

[0044] Step 10322: Based on the coordinates corresponding to the key points, perform random vibration stress envelope extraction on multiple sets of power spectral density maps in a preset order to obtain random vibration power spectral density maps.

[0045] The preset order is a pre-defined sequence for extracting stress envelopes from the power spectral density maps of different groups. For example, stress envelope extraction can be performed sequentially on the broadband random vibration group, the broadband plus narrowband vibration group, and the broadband plus fixed-frequency vibration group. Alternatively, it can be performed sequentially on the broadband plus narrowband vibration group, the broadband vibration group, and the broadband plus fixed-frequency vibration group. After completing the vibration stress envelope extraction for all groups, a random vibration power spectral density map is obtained. The random vibration power spectral density map covers the stress conditions required for all experimental scenarios.

[0046] Specifically, the step of extracting the random vibration stress envelope from multiple sets of power spectral density maps based on the coordinates of key points in a preset order to obtain random vibration power spectral density maps includes: Based on the coordinates corresponding to the key points, random vibration stress envelope extraction is performed on each group of power spectral density maps in a preset order to obtain each power spectral density sub-map, and the last group of power spectral density sub-maps is used as the random vibration power spectral density map; wherein, the group of power spectral density maps for which random vibration stress envelope extraction is performed later is based on the power spectral density sub-maps obtained in the previous group.

[0047] Specifically, based on the coordinates corresponding to the key points, a random vibration stress envelope extraction operation is first performed on all power spectral density maps included in the first group to obtain the corresponding first power spectral density sub-map. This first power spectral density sub-map covers the stress conditions included in all test scenarios in the first group. Then, based on the coordinates corresponding to the key points and the first power spectral density sub-map, a random vibration stress envelope extraction operation is performed on all power spectral density maps included in the second group to obtain the corresponding second power spectral density sub-map. The second power spectral density sub-map covers the stress conditions included in all test scenarios in both the first and second groups.

[0048] Similarly, based on the coordinates corresponding to the key points, and building upon the (N-1)th power spectral density sub-map, a random vibration stress envelope extraction operation is performed on all power spectral density maps included in the Nth group to obtain a random vibration power spectral density map. Here, N represents the number of groups of power spectral density maps. By performing the random vibration stress envelope extraction operation in groups in this embodiment, the problem of missed tests on the device under test can be effectively avoided. Each group is performed based on the power spectral density sub-map obtained from the previous group, which can effectively avoid the problem of repeated tests.

[0049] Furthermore, the multiple sets of power spectral density maps include a broadband random group, a broadband plus narrowband group, and a broadband plus fixed-frequency group; based on the coordinates corresponding to key points, the random vibration stress envelope extraction operation is performed on each set of power spectral density maps in a preset order to obtain each power spectral density sub-map, and the power spectral density sub-map obtained in the last set is used as the random vibration power spectral density map, including: Step A: Based on the coordinates corresponding to the key points, perform random vibration stress envelope extraction on the broadband random group to obtain the first power spectral density sub-map.

[0050] Specifically, Figure 3 The first power spectral density subplot is shown. According to... Figure 3 In the power spectral density plots corresponding to scenarios 1 and 2, the starting point, ending point, and inflection point are compared. The coordinates of each starting point, ending point, and inflection point are selected, and the largest envelope that can cover the stress conditions in scenarios 1 and 2 is chosen (e.g., ...). Figure 3 (As shown by the solid black line in the middle), this is the first power spectral density subplot. The vibration environment data corresponding to the first power spectral density subplot is {10Hz~25Hz, 0.04g}. 2 / Hz; 25Hz~100Hz, +3dB / oct; 100 Hz~1000Hz, 0.16g 2 / Hz; 1000 Hz~2000Hz, -6dB / oct}.

[0051] Step B: Based on the coordinates of the key points and the first power spectral density sub-map, perform random vibration stress envelope extraction on the broadband and narrowband groups to obtain the second power spectral density sub-map, including: Step B1: Based on the coordinates of the key points and the first power spectral density sub-map, extract the envelope of the broadband part of the power spectral density map in the broadband plus narrowband group to obtain the initial second power spectral density sub-map. Step B2: In the initial second power spectral density subplot, the narrowband center frequency and acceleration spectral density of the power spectral density plots in the broadband and narrowband groups are merged to obtain the second power spectral density subplot.

[0052] Figure 4 The second power spectral density subplot is shown. First, for... Figure 4 Envelope extraction was performed on the broadband portion of the power spectral density maps in the first power spectral density sub-map and the broadband plus narrowband groups (Scenes 3 and 4). The broadband portion of the power spectral density map corresponding to Scene 3 is {10Hz~2000Hz, 0.01g}. 2 / Hz}, the broadband portion of the power spectral density plot corresponding to scenario 4 is {10Hz~2000Hz, 0.02g}. 2 / Hz}. Since the broadband portions of both Scene 3 and Scene 4 are included within the coverage area of ​​the first power spectral density submap, the envelope range of the resulting initial second power spectral density submap after envelope extraction with the first power spectral density submap is still equivalent to the envelope range of the first power spectral density submap.

[0053] Next, the narrowband portions from Scene 3 and Scene 4 are merged. The narrowband portion in Scene 3 includes {125Hz, 0.24g}. 2 / Hz; 250Hz, 0.12g 2 / Hz; 500Hz, 0.06g 2 / Hz; 1000Hz, 0.03g 2 / Hz;}, the narrowband portion in scenario 4 includes {500Hz, 0.2g}. 2 / Hz; 1000Hz, 0.1g 2 / Hz}. The narrowband portions of scenes 3 and 4 are merged. If the frequencies of the narrowband portions are the same, they are merged based on the specific values ​​of the power spectral density of the narrowband portions, retaining the highest power spectral density at the same frequency. For example, at a frequency of 500 Hz, the narrowband power spectral density in scene 4 is 0.2g. 2 / Hz is greater than the narrowband power spectral density of 0.06g in scenario 3. 2 / Hz, after merging, the narrowband power spectral density value corresponding to this frequency in scenario 4 is retained as 0.2g. 2 / Hz. Then, the merged narrowband is combined with the initial second power spectral density submap to obtain the second power spectral density submap (e.g., ...). Figure 4 (As shown by the solid black line in the middle), for the narrow bands corresponding to frequencies of 250 Hz and 1000 Hz, since the corresponding power spectral density is lower than the power spectral density corresponding to the broadband range in the initial second power spectral density subplot, it is not reflected in the second power spectral density subplot. The vibration environment data corresponding to the second power spectral density subplot is {broadband part: 10Hz~25Hz, 0.04g}. 2 / Hz; 25Hz~100Hz, +3dB / oct; 100 Hz~1000Hz, 0.16g 2 / Hz; 1000 Hz~2000Hz, -6dB / oct; Narrowband portion: 125 Hz, 0.24 g 2 / Hz; 500 Hz, 0.20 g 2 / Hz}.

[0054] Step C: Based on the coordinates corresponding to the key points and the second power spectral density sub-map, perform random vibration stress envelope extraction on the broadband plus fixed frequency group to obtain the random vibration power spectral density map, including: Step C1: Based on the coordinates of the key points and the second power spectral density sub-map, the envelope of the broadband part of the power spectral density map in the broadband plus fixed frequency group is extracted to obtain the initial third power spectral density sub-map. Step C2: In the initial third power spectral density subplot, the fixed frequency and acceleration spectral density of the power spectral density plots in the broadband plus fixed frequency group are merged to obtain the random vibration power spectral density plot.

[0055] Figure 5 The power spectral density map of random vibration is shown. First, the envelope of the broadband portion of the power spectral density map in the second power spectral density sub-map and the broadband plus fixed frequency group (scenario 5) is extracted. The broadband portion of the power spectral density map corresponding to scenario 5 is {10Hz~1000Hz, 0.014g}. 2 / Hz; 2000Hz, 0.01g 2 / Hz}. Since the broadband portion of Scene 5 is all included within the coverage area of ​​the second power spectral density submap, the envelope range of the initial third power spectral density submap obtained after envelope extraction with the second power spectral density submap is still equal to the envelope range of the second power spectral density submap.

[0056] Then merge the fixed-frequency components from Scenario 5. The fixed-frequency components in Scenario 5 include {100Hz, 0.16g}. 2 / Hz; 200Hz, 0.16g 2 / Hz; 400Hz, 0.12g 2 / Hz; 800Hz, 0.09g 2 / Hz}. The fixed-frequency portion of scene 5 is merged with the initial third power spectral density sub-map to obtain the random vibration power spectral density map (e.g., ...). Figure 5 (As shown by the solid black line in the middle), the fixed frequency is retained and not merged. The vibration environment data corresponding to the random vibration power spectral density diagram is {broadband portion: 10Hz~25Hz, 0.04g}. 2 / Hz; 25Hz~100Hz, +3dB / oct; 100 Hz~1000Hz, 0.16g 2 / Hz; 1000 Hz~2000Hz, -6dB / oct; Narrowband: 125 Hz, 0.24 g 2 / Hz; 500 Hz, 0.20 g 2 / Hz; Fixed frequency: 100Hz, 0.16g 2 / Hz; 200Hz, 0.16g 2 / Hz; 400Hz, 0.12g 2 / Hz; 800Hz, 0.09g 2 / Hz}. Finally, the power spectral density diagrams of random vibrations after broadband random, broadband plus narrowband, and broadband plus fixed frequency are summarized as follows: Figure 6 As shown.

[0057] By following the execution order of steps A, B, and C in this embodiment, the broadband range of stress conditions for each test scenario can be found as quickly as possible, avoiding repeated determination of the maximum envelope and effectively reducing the number of envelope extraction operations.

[0058] Step 104: Conduct a vibration test on the device under test based on the random vibration power spectral density diagram.

[0059] Specifically, vibration tests are conducted on the device under test according to the stress conditions shown in the random vibration power spectral density diagram. The test axes are clearly defined; if testing is required along all three axes (X, Y, Z), the test is conducted along each axis according to the stress conditions shown in the vibration power spectral density diagram. The vibration time is determined; the vibration test time for the device under test should be equal to the vibration duration. During the test, the random vibration power spectral density diagram is strictly followed, and it is converted into data points (including frequency and corresponding power spectral density) that the vibration controller can recognize.

[0060] It should be noted that the method in this embodiment can be applied to the extraction of stress envelopes in functional random vibration tests. The stress envelope extraction method for durability vibration yields a similar spectrum to the method for functional vibration stress envelope extraction, except that the durability random vibration test values ​​are 1.6 times those of the functional random vibration test values, and the test time is also 1.6 times that of the functional random vibration test.

[0061] Based on steps 101 to 104, this embodiment provides a method for extracting random vibration stress envelopes for multiple demand scenarios, including: acquiring all test scenarios corresponding to the device under test, and determining the vibration environment data corresponding to each test scenario. Based on the vibration environment data, a power spectral density map corresponding to each test scenario is plotted in a double logarithmic coordinate system. Random vibration stress envelope extraction is performed on all power spectral density maps to ensure that the different vibration stresses of each test scenario are fully covered during the envelope process, resulting in a random vibration power spectral density map. Vibration testing of the device under test based on the random vibration power spectral density map can avoid under-evaluation of vibration stress in the test scenarios. Furthermore, compared to the traditional method of conducting tests one by one, this application uses the random vibration power spectral density map to test the device under test, avoiding repeated testing, effectively reducing manpower and material costs, and improving the accuracy of product reliability assessment. Testing the device under test using the random vibration power spectral density map can effectively identify weak points in the device, supporting device design and process reliability control.

[0062] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0063] It should be noted that some embodiments of this application have been described above. In some cases, the actions or steps described in the above embodiments can be performed in a different order than that shown in the above embodiments and the desired result can still be achieved. In addition, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0064] Based on the same inventive concept, corresponding to any of the above embodiments, this application also provides a random vibration stress envelope extraction device for multiple demand scenarios.

[0065] refer to Figure 7 The multi-demand scenario random vibration stress envelope extraction device includes: The acquisition module 701 is configured to acquire all test scenarios corresponding to the device under test, and to determine the vibration environment data corresponding to each test scenario; The plotting module 702 is configured to plot the power spectral density map corresponding to each test scenario in a double logarithmic coordinate system based on the vibration environment data. Extraction module 703 is configured to perform random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps. Test module 704 is configured to perform vibration tests on the device under test based on the random vibration power spectral density diagram.

[0066] In some embodiments, the extraction module 703 is configured to calculate the coordinates of key points in each power spectral density map; and based on the coordinates of the key points, perform random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps.

[0067] In some embodiments, the extraction module 703 is configured to determine the power spectral density function corresponding to the rising or falling spectrum in the power spectral density plot; The power spectral density function corresponding to the rising or falling spectrum is solved to obtain the coordinates of the key points in each power spectral density map.

[0068] In some embodiments, the extraction module 703 is configured to divide all power spectral density maps into multiple groups of power spectral density maps according to the random vibration type; and to perform random vibration stress envelope extraction operation on the multiple groups of power spectral density maps according to a preset order based on the coordinates corresponding to key points, so as to obtain random vibration power spectral density maps.

[0069] In some embodiments, the extraction module 703 is configured to perform random vibration stress envelope extraction operations on each group of power spectral density maps according to a preset order based on the coordinates corresponding to the key points, to obtain each power spectral density sub-map, and to use the last group of power spectral density sub-maps as the random vibration power spectral density map; wherein, the group of power spectral density maps for which random vibration stress envelope extraction operations are performed later is based on the power spectral density sub-maps obtained in the previous group.

[0070] In some embodiments, the multiple power spectral density maps include a broadband random group, a broadband plus narrowband group, and a broadband plus fixed-frequency group; the extraction module 703 is configured to perform a random vibration stress envelope extraction operation on the broadband random group based on the coordinates corresponding to key points to obtain a first power spectral density sub-map; perform a random vibration stress envelope extraction operation on the broadband plus narrowband group based on the coordinates corresponding to key points and the first power spectral density sub-map to obtain a second power spectral density sub-map; and perform a random vibration stress envelope extraction operation on the broadband plus fixed-frequency group based on the coordinates corresponding to key points and the second power spectral density sub-map to obtain the random vibration power spectral density map.

[0071] In some embodiments, the extraction module 703 is configured to perform envelope extraction on the broadband portion of the power spectral density map in the broadband plus narrowband group based on the coordinates corresponding to the key points and the first power spectral density sub-map to obtain an initial second power spectral density sub-map; and to merge the narrowband center frequency and acceleration spectral density of the power spectral density map in the broadband plus narrowband group into the initial second power spectral density sub-map to obtain the second power spectral density sub-map.

[0072] In some embodiments, the extraction module 703 is configured to perform envelope extraction on the broadband portion of the power spectral density map in the broadband plus fixed frequency group based on the coordinates corresponding to the key points and the second power spectral density sub-map to obtain an initial third power spectral density sub-map; and to merge the fixed frequency and acceleration spectral density of the power spectral density map in the broadband plus fixed frequency group into the initial third power spectral density sub-map to obtain the random vibration power spectral density map.

[0073] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.

[0074] The apparatus described above is used to implement the corresponding multi-demand scenario random vibration stress envelope extraction method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0075] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the multi-demand scenario random vibration stress envelope extraction method described in any of the above embodiments.

[0076] Figure 8 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0077] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0078] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0079] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0080] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0081] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0082] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0083] The electronic device described above is used to implement the corresponding multi-demand scenario random vibration stress envelope extraction method in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0084] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the multi-demand scenario random vibration stress envelope extraction method as described in any of the above embodiments.

[0085] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0086] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the multi-demand scenario random vibration stress envelope extraction method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0087] Based on the same concept, corresponding to any of the above embodiments, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0088] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0089] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0090] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0091] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A method for extracting the stress envelope of random vibrations in multi-demand scenarios, characterized in that, include: Acquire all test scenarios corresponding to the device under test, and determine the vibration environment data corresponding to each test scenario; Based on the vibration environment data, the power spectral density diagram corresponding to each test scenario is plotted in a double logarithmic coordinate system. Random vibration stress envelope extraction is performed on all power spectral density maps to obtain random vibration power spectral density maps; The device under test was subjected to vibration testing based on the random vibration power spectral density diagram. The step of performing random vibration stress envelope extraction on all power spectral density maps to obtain random vibration power spectral density maps includes: Calculate the coordinates of the key points in each power spectral density plot; Based on the coordinates of the key points, random vibration stress envelope extraction is performed on all power spectral density maps to obtain random vibration power spectral density maps. The process of extracting the random vibration stress envelope from all power spectral density maps based on the coordinates of key points yields random vibration power spectral density maps, including: According to the type of random vibration, all power spectral density maps are divided into multiple groups of power spectral density maps; Based on the coordinates of the key points, random vibration stress envelope extraction is performed on multiple power spectral density maps in a preset order to obtain random vibration power spectral density maps. The process involves extracting the random vibration stress envelope from multiple power spectral density maps based on the coordinates of key points in a preset order, resulting in random vibration power spectral density maps, including: Based on the coordinates corresponding to the key points, random vibration stress envelope extraction is performed on each group of power spectral density maps in a preset order to obtain each power spectral density sub-map, and the last group of power spectral density sub-maps obtained is used as the random vibration power spectral density map; wherein, the group of power spectral density maps for which random vibration stress envelope extraction is performed later is based on the power spectral density sub-maps obtained in the previous group. The multiple sets of power spectral density maps include a broadband random group, a broadband plus narrowband group, and a broadband plus fixed frequency group; Based on the coordinates corresponding to key points, random vibration stress envelope extraction is performed on each group of power spectral density maps in a preset order to obtain each power spectral density sub-map. The last group of power spectral density sub-maps obtained is used as the random vibration power spectral density map, including: Based on the coordinates of the key points, a random vibration stress envelope extraction operation is performed on the broadband random group to obtain the first power spectral density sub-map. Based on the coordinates of the key points and the first power spectral density sub-map, a random vibration stress envelope extraction operation is performed on the broadband plus narrowband group to obtain the second power spectral density sub-map. Based on the coordinates of the key points and the second power spectral density sub-map, a random vibration stress envelope extraction operation is performed on the broadband plus fixed frequency group to obtain the random vibration power spectral density map.

2. The method according to claim 1, characterized in that, The calculation of the coordinates corresponding to the key points in each power spectral density map includes: Determine the power spectral density function corresponding to the rising or falling spectrum in the power spectral density plot; The power spectral density function corresponding to the rising or falling spectrum is solved to obtain the coordinates of the key points in each power spectral density map.

3. The method according to claim 1, characterized in that, The second power spectral density submap is obtained by performing a random vibration stress envelope extraction operation on the broadband and narrowband groups based on the coordinates corresponding to the key points and the first power spectral density submap, including: Based on the coordinates of the key points and the first power spectral density sub-map, the envelope of the broadband portion of the power spectral density map in the broadband plus narrowband group is extracted to obtain the initial second power spectral density sub-map. The narrowband center frequency and acceleration spectral density of the power spectral density maps in the broadband and narrowband groups are combined in the initial second power spectral density subplot to obtain the second power spectral density subplot.

4. The method according to claim 1, characterized in that, The random vibration power spectral density map is obtained by performing random vibration stress envelope extraction on the broadband plus fixed frequency group based on the coordinates corresponding to the key points and the second power spectral density sub-map, including: Based on the coordinates of the key points and the second power spectral density sub-map, the envelope of the broadband part of the power spectral density map in the broadband plus fixed frequency group is extracted to obtain the initial third power spectral density sub-map. The fixed-frequency and acceleration spectral densities of the power spectral density maps in the broadband plus fixed-frequency group are combined in the initial third power spectral density subplot to obtain the random vibration power spectral density map.

5. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 4.

6. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 1 to 4.

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