Improved polymer packaging material viscoelastic constitutive model testing and fitting method
By using dynamic mechanical analysis and fitting of the generalized Maxwell model, the shift factor was optimized, which solved the problems of instability and low accuracy in existing viscoelastic tests, and realized a more accurate viscoelastic model, thereby improving the predictive ability and reliability of packaging materials.
CN121709104APending Publication Date: 2026-03-20GUILIN UNIV OF ELECTRONIC TECH
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Patent Information
- Application Number
- CN202511776365.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-03-20
AI Technical Summary
Technical Problem
Existing viscoelasticity testing methods are unstable and have low fitting accuracy, failing to accurately describe the stress state and warpage of polymers over a wide temperature range, leading to packaging reliability issues.
Method used
The storage modulus and relaxation modulus were tested at multiple temperatures using a dynamic mechanical analyzer. The curves were fitted using a generalized Maxwell model, and the shift factor was optimized by interpolation to reduce test errors and improve the accuracy of the viscoelastic model.
Benefits of technology
The accuracy of viscoelasticity testing has been improved over a wider temperature range, reducing errors, enhancing the predictive power of packaging materials, and improving product yield and reliability.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of polymer packaging material viscoelasticity constitutive model testing, in particular to an improved polymer packaging material viscoelasticity constitutive model testing and fitting method.The method includes the steps that an actual stress relaxation curve and a main curve are subjected to overlapping mean value re-fitting, and the shape and parameters of the main curve are optimized; replacing the energy storage modulus translation amount with the relaxation modulus translation amount to optimize a shift factor; an interpolation method is adopted to replace a WLF equation in numerical calculation, so that the input precision is improved; sample errors and human experience errors are reduced from multiple links of testing, fitting and numerical calculation, and fitting deviation of a WLF equation is eliminated, so that the model keeps high precision in a wider temperature range, and closed-loop verification of viscoelasticity testing is realized; a high-precision material test engineering scheme is provided for advanced electronic packaging, the production loss is reduced, the prediction capacity for packaging signals, heat transfer and stress is remarkably improved, the product yield is increased, the service life is prolonged, and the long-term reliability is improved.
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