Heat dissipation assembly, heat dissipation adjustment method thereof and electronic device

Abstract

The application provides a heat dissipation assembly, a heat dissipation adjustment method thereof and an electronic device. The heat dissipation assembly comprises a shell and a plurality of heat dissipation fins. A flow channel is formed in the shell, and the flow channel is used for circulating heat dissipation working medium. The plurality of heat dissipation fins are arranged in the flow channel at intervals. Flow circulation gaps are formed between adjacent heat dissipation fins and between the plurality of heat dissipation fins and the shell. The ratio of the flow rate of the heat dissipation working medium in any flow circulation gap to the maximum value of the flow rates of the heat dissipation working medium in the plurality of flow circulation gaps is greater than or equal to 0.8. The uniformity of the flow of the heat dissipation working medium in the entire heat dissipation assembly is ensured, and the heat dissipation efficiency of the heat dissipation assembly is improved. At the same time, the balanced flow of the heat dissipation working medium ensures the flow pressure of the heat dissipation working medium, and the flow rate of the heat dissipation liquid is prevented from being reduced due to excessive flow resistance.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology. Specifically, this application relates to a heat dissipation component, a heat dissipation adjustment method thereon, and an electronic device. Background Technology

[0002] In the field of heat dissipation technology for electronic devices, as the power density of electronic devices continues to increase, traditional air cooling methods are no longer sufficient to meet the heat dissipation needs of high-heat-generating components. Liquid cooling technology has been gradually applied due to its efficient heat conduction performance.

[0003] In related technologies, liquid cooling heat dissipation components mainly dissipate heat by introducing a heat dissipation medium into a liquid cooling plate and adding a heat-conducting structure within the liquid cooling plate. However, the heat-conducting structure in the liquid cooling plate increases the flow resistance of the working medium. When the flow resistance is too high, the water flow in the liquid path will be significantly hindered, resulting in a significant decrease in the flow rate of the heat dissipation liquid. This weakens the heat exchange efficiency between the liquid cooling plate and the heat-generating components, affecting the stability and reliability of electronic equipment under long-term high-load operation.

[0004] Therefore, how to effectively reduce the flow resistance of the liquid cooling plate while ensuring sufficient heat dissipation capacity has become a key issue that needs to be addressed in current liquid cooling technology. Summary of the Invention

[0005] One objective of this application is to provide a new technology solution for a heat dissipation component, a heat dissipation adjustment method thereof, and an electronic device.

[0006] According to a first aspect of the embodiments of this application, a heat dissipation component is provided for dissipating heat from a heat source, the heat dissipation component comprising: A housing, wherein a flow channel is formed within the housing for the flow of a heat dissipation medium; Multiple heat sinks are arranged at intervals within the flow channel, and flow gaps are formed between adjacent heat sinks and between the multiple heat sinks and the housing. The ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in the multiple flow gaps is greater than or equal to 0.8.

[0007] Optionally, the ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is greater than or equal to 0.9.

[0008] Optionally, the ratio of the gap width of any of the flow gaps to the maximum gap width among the plurality of flow gaps is greater than or equal to 0.5.

[0009] Optionally, the plurality of heat sinks have inlet ends, and each inlet end of the plurality of heat sinks has a fluid ingress angle, wherein the fluid ingress angle is less than or equal to 30°.

[0010] Optionally, the ratio of the length of any one of the heat sinks to the maximum length of the plurality of heat sinks is greater than or equal to 0.5.

[0011] Optionally, the plurality of heat sinks have outlet ends, and the plurality of outlet ends of the plurality of heat sinks are arranged flush.

[0012] Optionally, the plurality of inlet ends of the plurality of heat sinks include at least one intermediate inlet end and side inlet ends located on both sides of the intermediate inlet end, wherein the intermediate inlet end protrudes from the side inlet ends.

[0013] According to a second aspect of the embodiments of this application, a heat dissipation adjustment method for a heat dissipation component is provided, applied to the heat dissipation component described in the first aspect, the heat dissipation adjustment method comprising: Receives gap width parameters for multiple flow gaps; In response to the plurality of gap width parameters, the ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is obtained; If the ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is less than 0.8, the gap width of the flow gap corresponding to the first threshold flow velocity is increased and / or the gap width of the flow gap corresponding to the second threshold flow velocity is decreased. Wherein, the first threshold flow rate is greater than the second threshold flow rate.

[0014] Optionally, before receiving the gap width parameters of multiple flow gaps, the method further includes: Receives length parameters for multiple heat sinks; In response to the plurality of the length parameters, the fluid entry angle of any of the heat sinks is obtained; If the fluid ingress angle of any of the heat sinks is greater than 30°, adjust the length of the corresponding heat sink.

[0015] According to a third aspect of the embodiments of this application, an electronic device is provided, the electronic device including the heat dissipation component described in the first aspect.

[0016] One technical advantage of this application is: This application provides a heat dissipation assembly, which includes a housing and multiple heat sinks. A flow channel is formed within the housing for the flow of a heat dissipation medium. The multiple heat sinks are spaced apart within the flow channel, and flow gaps are formed between adjacent heat sinks and between the multiple heat sinks and the housing. The ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum flow velocity of the heat dissipation medium in all flow gaps is greater than or equal to 0.8, ensuring the uniformity of the heat dissipation medium flow throughout the entire heat dissipation assembly and improving its heat dissipation efficiency. Simultaneously, the uniform flow of the heat dissipation medium ensures its flow pressure, preventing a decrease in the flow rate of the heat dissipation fluid due to excessive flow resistance.

[0017] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0019] Figure 1 This is a schematic diagram of a heat dissipation component provided in one embodiment of this application; Figure 2 A schematic diagram of a heat sink for a heat dissipation assembly provided in one embodiment of this application; Figure 3 A top view of a heat sink of a heat dissipation assembly provided in one embodiment of this application; Figure 4 This is a flowchart illustrating a heat dissipation adjustment method for a heat dissipation component, as provided in one embodiment of this application.

[0020] The components are: 1. Shell; 11. Flow channel; 2. Heat sink; 21. Inlet end; 22. Outlet end; 3. Flow gap. Detailed Implementation

[0021] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0022] The embodiments of this application will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0024] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0027] In related technologies, liquid cooling heat dissipation components mainly dissipate heat by introducing a heat dissipation working fluid into a liquid cooling plate and adding a heat-conducting structure to the liquid cooling plate. However, the heat-conducting structure in the liquid cooling plate increases the flow resistance of the working fluid in the liquid cooling plate. When the flow resistance is too high, the water flow in the liquid path will be greatly hindered, resulting in a significant decrease in the flow rate of the heat dissipation liquid and reducing the heat exchange efficiency between the liquid cooling plate and the heat-generating element.

[0028] The heat dissipation component provided in this application embodiment has multiple heat sinks in the heat dissipation area corresponding to the heat source. Flow gaps are formed between adjacent heat sinks and between multiple heat sinks and the housing. The ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is greater than or equal to 0.8. While improving the heat dissipation capacity of the heat dissipation component, the flow resistance of the heat dissipation medium through the flow gap is reduced, ensuring the flow pressure of the heat dissipation medium.

[0029] Reference Figure 1 and Figure 2 This application provides a heat dissipation component for dissipating heat from a heat source. The heat dissipation component includes: The housing 1 has a flow channel 11 formed inside it, which is used to circulate heat dissipation working fluid. Multiple heat sinks 2 are arranged at intervals within the flow channel 11. Flow gaps 3 are formed between adjacent heat sinks 2 and between multiple heat sinks 2 and the housing 1. The ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is greater than or equal to 0.8.

[0030] In the above embodiment, the heat dissipation assembly can be connected to a device including a heat source via the housing 1. Multiple heat sinks 2 are spaced apart within the flow channel 11 and positioned opposite the heat source, with the projection of the heat source onto the housing 1 located within the area of ​​the multiple heat sinks 2. The heat generated by the heat source during operation can be transferred to the heat dissipation assembly and carried away by the heat dissipation medium inside the assembly. The flow channel 11 formed inside the housing 1 provides a path for the flow of the heat dissipation medium, allowing it to circulate within the housing 1 in a predetermined direction, thereby continuously carrying away the heat generated by the heat source and achieving the heat dissipation function.

[0031] See Figure 1 Multiple heat sinks 2 are spaced apart within the flow channel 11. These heat sinks 2 have a larger heat dissipation surface area, increasing the contact area between the heat dissipation component and the heat transfer medium. When the heat transfer medium flows through the heat sinks, the heat sinks can quickly transfer the heat they absorb to the heat transfer medium, accelerating heat dissipation and improving the heat exchange efficiency between the heat dissipation component and the heat transfer medium. The arrangement of multiple heat sinks 2 allows more heat to be transferred from the heat dissipation component to the heat transfer medium in a short time, thereby improving the overall heat dissipation capacity of the heat dissipation component, effectively reducing the temperature of the heat source, and ensuring the stable operation of electronic equipment.

[0032] The flow gap 3 provides space for the heat dissipation medium to flow in the area where multiple heat sinks 2 are set, guides the heat dissipation medium to flow orderly between the heat sinks 2, optimizes the flow path of the heat dissipation medium, enables the heat dissipation medium to fully exchange heat with the heat sinks, avoids local heat accumulation caused by poor flow, and can balance the flow resistance of the heat dissipation medium and the heat exchange efficiency.

[0033] In the above embodiments, the flow velocity of the heat dissipation medium in the flow gap can be the maximum flow velocity of the heat dissipation medium in the flow gap. For example, due to the viscosity of the heat sink 2, the flow velocity of the heat dissipation medium will decrease at the positions close to the heat sink 2 on both sides of the flow gap. That is, the flow velocity of the heat dissipation medium at the center of the flow gap will be greater than the flow velocity on both sides. In this embodiment, the maximum flow velocity of the heat dissipation medium in each flow gap is compared with the maximum value of the maximum flow velocity of the heat dissipation medium in multiple flow gaps. When the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is greater than or equal to 0.8, the uniformity of the flow of the heat dissipation medium in the entire heat dissipation component is ensured.

[0034] When the flow velocity in each flow gap is relatively uniform, the heat dissipation medium can flow through each heat sink at a relatively consistent rate. When the flow velocity of the heat dissipation medium is uniform, the flow velocity in the low-flow gap increases, which in turn increases the convective heat transfer coefficient on the surface of the heat sink 2 on both sides of the low-flow gap, thus improving the average heat dissipation capacity of each heat sink 2. Simultaneously, it avoids the formation of vortices at the outlet end of the heat sink 2 due to uneven flow velocity in multiple flow gaps, preventing vortex flow resistance and ensuring that each heat sink can fully exert its heat dissipation function.

[0035] In one embodiment, the flow channel 11 has an inlet section, a bend section, and an outlet section connected in sequence. Multiple heat sinks 2 are disposed within the outlet section. This improves the heat dissipation capacity of the heat dissipation component while reducing the flow resistance of the heat dissipation medium through the flow gap, allowing the heat dissipation medium to flow more smoothly and improving the heat dissipation efficiency of the heat dissipation component. Simultaneously, it ensures the flow pressure of the heat dissipation medium, avoiding the problem of a significant decrease in the flow rate of the heat dissipation liquid and a reduction in heat exchange efficiency due to excessive flow resistance, thus ensuring the stable and efficient operation of the heat dissipation component.

[0036] Furthermore, the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is greater than or equal to 0.9. That is, the maximum values ​​of the flow velocities of the heat dissipation medium in multiple flow gaps are close, which allows the heat dissipation medium to exchange heat with each heat sink more effectively, making the heat dissipation of the entire heat dissipation component more uniform and efficient, avoiding the problems of local overheating or insufficient heat dissipation, thereby improving the overall heat dissipation capacity of the heat dissipation component.

[0037] In some embodiments, the ratio of the gap width of any flow gap to the maximum gap width among a plurality of flow gaps is greater than or equal to 0.5.

[0038] When the width difference between the flow gaps is too large, the flow velocity of the heat dissipation medium is high in the narrow flow gap and low in the wide flow gap. This causes the heat dissipation medium in multiple flow gaps to generate vortices at the outlet end of heat sink 2 due to uneven flow velocity, which increases the flow resistance of the heat dissipation medium through the flow gaps.

[0039] In the above embodiments, the gap width of the flow gap can be... Figure 3 The lateral dimension of the flow gap, that is, the distance between adjacent heat sinks 2, is set by setting the ratio of any gap width to the maximum gap width to be greater than or equal to 0.5. For example, the ratio of the minimum gap width to the maximum gap width is set to 0.55, 0.60, 0.65, 0.70, 0.75 or 0.80, so that the gap widths of multiple flow gaps are relatively close, thereby reducing the flow resistance of the heat dissipation medium in the flow gap, allowing the heat dissipation medium to flow in the heat dissipation component with less pressure loss, and improving the heat dissipation efficiency of the heat dissipation system.

[0040] In some embodiments, see Figure 3 Multiple heat sinks 2 have inlet ends 21, and each inlet end 21 of the multiple heat sinks 2 has a fluid inlet angle, and each fluid inlet angle is less than or equal to 30°.

[0041] In the above embodiment, the inlet end 21 of the heat sink 2 is the starting point for the heat dissipation medium to enter the flow gap for heat exchange. The inlet end 21 can guide the heat dissipation medium into the flow gap, so that the heat dissipation medium can fully contact the surface of the heat sink 2, which helps to improve the heat exchange efficiency between the heat dissipation medium and the heat sink.

[0042] See Figure 2 The fluid ingress angle is the angle between the plane of the heat sink 2 at the inlet end 21 and the flow direction of the heat dissipation medium. Multiple fluid ingress angles are all less than or equal to 30°. For example, the fluid ingress angle of the inlet end 21 of each heat sink 2 is less than 25°, 20°, 15° or 10°. This can buffer the contact between the heat sink 2 and the heat dissipation medium, reduce the impact force and resistance of the heat dissipation medium when entering the heat sink, reduce the energy loss of the heat dissipation medium, make the flow of the heat dissipation medium in the flow gap smoother, and improve the overall efficiency of the heat dissipation system.

[0043] In some embodiments, the ratio of the length of any heat sink 2 to the maximum length among the plurality of heat sinks 2 is greater than or equal to 0.5.

[0044] When the lengths of multiple spaced heat sinks 2 differ too much, it can cause the flow rate of the heat dissipation medium to change from fast to slow, from slow to fast, and sometimes the flow rate to be too fast or too slow when it flows through different flow gaps.

[0045] In this embodiment, the length of the heat sink 2 can be [missing information]. Figure 3The vertical dimension of the heat sink 2 is set such that the ratio of the length of any heat sink 2 to the maximum length among multiple heat sinks 2 is greater than or equal to 0.5. For example, the ratio of the length of any heat sink 2 to the maximum length among multiple heat sinks 2 is greater than 0.55, 0.60, 0.65, 0.70, 0.75 or 0.80. This limits the multiple fluid entry angles to less than or equal to 30°, guiding the heat dissipation medium to enter the flow gap at a gentle and reasonable angle, ensuring the heat exchange efficiency between the heat dissipation medium and the heat sink.

[0046] In the above embodiment, the length of the heat sink 2 can be selected from 20mm to 300mm. Specifically, it can be set according to the setting area of ​​the heat sink 2 in the flow channel 11 and the heat dissipation requirements of the heat source. The setting area of ​​the heat sink 2 in the flow channel 11 needs to cover the projection of the heat source on the housing 1. The length of the heat sink 2 can be increased according to the increase of the heat generation of the heat source. For example, the length of the heat sink 2 can be set to 50mm, 100mm, 150mm, 200mm or 250mm.

[0047] In some embodiments, see Figure 2 and Figure 3 Multiple heat sinks 2 have outlet ends 22, and the multiple outlet ends 22 of the multiple heat sinks 2 are arranged flush.

[0048] In the above embodiments, when the outlet ends 22 of the multiple heat sinks 2 are arranged flush, the heat dissipation medium will not interfere with each other after flowing out from each flow gap, thus avoiding turbulence and eddies caused by mutual collision or mixing of the heat dissipation medium when it flows out, reducing the flow resistance of the heat dissipation medium and reducing energy loss.

[0049] In one embodiment, the flush surfaces of the multiple outlet ends 22 are perpendicular to the flow direction of the flow channel 11 where the multiple heat sinks 2 are located, so that the heat dissipation medium can flow out more smoothly from each flow gap, avoiding collision between the heat dissipation medium and the housing 1 after flowing out, improving the heat transfer efficiency of the entire heat dissipation system, and enabling the heat dissipation components to dissipate heat more quickly and effectively, meeting the heat dissipation needs of the heat source.

[0050] In some embodiments, see Figure 2 and Figure 3 The multiple inlet ends of the multiple heat sinks 2 include at least one intermediate inlet end and side inlet ends located on both sides of the intermediate inlet end, with the intermediate inlet end protruding from the side inlet end.

[0051] In the above embodiments, the intermediate inlet end may include one or more inlet ends with multiple heat sinks 2 in the middle, and one or more side inlet ends on each side of the intermediate inlet end. The intermediate inlet end can channel the heat dissipation medium into the intermediate heat dissipation area with higher heat dissipation requirements, and the intermediate inlet end protrudes from the side inlet ends, increasing the length of the intermediate heat sink 2 and improving the heat dissipation efficiency of the intermediate area of ​​the multiple heat sinks 2.

[0052] In addition, the middle inlet end protrudes from the side inlet end, which can reduce the fluid inlet angle at the middle inlet end, so that the fluid inlet angle at the middle inlet end is less than or equal to 30°. This reduces the mutual interference and mixing of the heat dissipation working fluid during the flow process, reduces the flow resistance, and improves the flow efficiency of the heat dissipation working fluid, thereby improving the heat dissipation efficiency of the entire heat dissipation system.

[0053] See Figure 4 This application provides a heat dissipation adjustment method for a heat dissipation component, applied to the aforementioned heat dissipation component. The heat dissipation adjustment method includes: S101, receives gap width parameters of multiple flow gaps; Since the gap width of the flow gap is directly related to the flow velocity of the heat dissipation medium within it, a smaller gap width increases the flow velocity, while a larger gap width decreases it. Receiving gap width parameters from multiple flow gaps allows for setting the initial gap width of each gap to be equal, for example, within the range of 2mm-2.5mm. Accurately obtaining the gap width of each flow gap facilitates analysis of the flow velocity characteristics of the heat dissipation medium within the gap, thereby enabling balanced flow velocity adjustments.

[0054] S102, in response to multiple gap width parameters, obtains the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps; By obtaining the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum flow velocity of the heat dissipation medium in multiple flow gaps, the flow velocity of the heat dissipation medium in different flow gaps is quantitatively compared to reflect the relative magnitude of the flow velocity of the heat dissipation medium in each flow gap relative to the maximum flow velocity, which is convenient for judging the uniformity of the flow of the heat dissipation medium in each flow gap.

[0055] S103, the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is less than 0.8, and the gap width of the flow gap corresponding to the first threshold flow velocity is increased and / or the gap width of the flow gap corresponding to the second threshold flow velocity is decreased. Among them, the first threshold flow rate is greater than the second threshold flow rate.

[0056] When the ratio of the flow velocity of the heat dissipation medium in any flow gap to its maximum value is less than 0.8, it indicates that the flow velocity of the heat dissipation medium in that flow gap is relatively low. When heat dissipation media with different flow velocities meet at the outlet, vortices are easily generated, increasing the flow resistance of the heat dissipation medium through the flow gap. This embodiment of the application adjusts the flow distribution of the heat dissipation medium in different flow gaps by increasing the gap width corresponding to the first threshold flow velocity and / or decreasing the gap width corresponding to the second threshold flow velocity, making the heat dissipation medium more evenly distributed in each flow gap and optimizing the flow state of the heat dissipation medium.

[0057] Specifically, increasing the gap width of the flow gap with a higher flow rate can slow down the flow rate of the heat dissipation medium, while decreasing the gap width of the flow gap with a lower flow rate can increase the flow rate of the heat dissipation medium. This makes the flow rates of the heat dissipation medium in each flow gap more similar, reduces flow rate differences, and thus enhances the heat dissipation uniformity of the heat dissipation component.

[0058] In one embodiment, the first threshold velocity can be a working fluid velocity greater than 1.1 times the average velocity, and the second threshold velocity can be a working fluid velocity less than 0.9 times the average velocity. The flow rate of the heat dissipation working fluid in each flow gap is balanced by increasing the gap width of the flow gap with the higher flow rate and decreasing the gap width of the flow gap with the lower flow rate, until the ratio of the flow rate of the heat dissipation working fluid in any flow gap to the maximum value of the flow rate of the heat dissipation working fluid in multiple flow gaps is greater than or equal to 0.8. Specifically, the flow rate parameters of the heat dissipation working fluid can be adjusted through simulation to achieve an even distribution of flow in each flow gap, thereby reducing the pressure drop at the heat sink.

[0059] In some embodiments, before receiving the gap width parameters of the plurality of flow gaps, the method further includes: S201 receives the length parameters of multiple heat sinks; The length of a heatsink directly affects parameters such as the fluid entry angle. By receiving the length parameters of multiple heatsinks, it is possible to estimate the impact force and resistance of the heat dissipation medium when entering the heatsink. To facilitate the adjustment of the fluid entry angle, the length parameters of multiple heatsinks can be received for each heatsink to be of equal length.

[0060] S202, responding to multiple length parameters, obtains the fluid entry angle of any heat sink; The fluid ingress angle is the angle between the plane of the heat sink at its inlet end and the flow direction of the heat transfer medium. The size of the fluid ingress angle affects the flow resistance and heat exchange efficiency of the heat transfer medium at the inlet end of the heat sink. When the fluid ingress angle of the heat sink is greater than 30°, it indicates that the angle at which the heat transfer medium flows into the heat sink is too large, which will result in greater inflow resistance of the heat transfer medium at the inlet end of the heat sink, thus affecting the smoothness of the heat transfer medium flow.

[0061] S203, for any heatsink with a fluid ingress angle greater than 30°, adjust the length of the corresponding heatsink.

[0062] This application embodiment can reduce the fluid ingress angle of the corresponding heat sink by adjusting the length of the heat sink until the fluid ingress angle of any heat sink is less than or equal to 30°. This can buffer the contact between the heat sink and the heat dissipation medium, reduce the impact and resistance of the heat dissipation medium when it enters the heat sink, reduce the energy loss of the heat dissipation medium, make the flow of the heat dissipation medium in the flow gap smoother, and improve the overall efficiency of the heat dissipation system.

[0063] In one specific embodiment, the simulation method for adjusting the heat dissipation of the heat dissipation component for the heat-generating chip includes the following steps: S301, Select a heat source. The heat source is a heat-generating chip with a size of 20mm*20mm. This type of chip requires separate heat dissipation measures. A heat dissipation structure is set at the projected area of ​​the flow channel corresponding to the heat source. The heat dissipation structure includes multiple heat sinks arranged at intervals. The spacing between adjacent heat sinks is 2.32mm, and the length of each heat sink is 33mm. Ensure that the area of ​​the heat dissipation structure is not less than the projected area of ​​the heat source in the flow channel.

[0064] S302, establish simulation conditions. The boundary conditions of the simulation model use parameter values ​​under extreme conditions, including the highest ambient temperature, the highest heat dissipation medium temperature, and the lowest flow rate.

[0065] S303, obtain the flow rate of the heat dissipation medium in each flow gap, such as Figure 3 The example shown consists of 11 heat sinks and 12 flow gaps. The lengths of the 11 heat sinks from left to right and the widths and initial flow velocities of the 12 flow gaps from left to right are shown in Table 1. At this time, the minimum fluid velocity (0.16 m / s) in the 12 flow gaps is 39% of the maximum velocity (0.41 m / s), the velocity distribution is uneven, and the velocity difference between each flow gap is large.

[0066] Table 1 Initial heatsink parameters and flow clearance parameters

[0067] S304, adjust the length of the heat sink according to the fluid flow direction and the fluid inlet angle of the heat sink, so that the fluid inlet angle α < 30°.

[0068] S305, Obtain the flow velocity v of the heat dissipation medium in all flow gaps and calculate the average value v. a Adjust the gap width according to Table 2 below so that the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps is greater than or equal to 0.8, thus achieving a state of uniform flow distribution.

[0069] Table 2. Adjustment rules for gap width

[0070] S306, obtain the heat sink length, gap width and heat dissipation fluid velocity in the flow gap after simulation optimization as shown in Table 3. At this time, the minimum fluid velocity in the 12 flow gaps (0.24 m / s) is 83% of the maximum value (0.29 m / s), and the heat dissipation fluid velocity distribution in multiple flow gaps is more uniform.

[0071] Table 3. Optimized heatsink length, gap width, and fluid velocity in the flow gap.

[0072] This application also provides an electronic device that includes the heat dissipation component described above.

[0073] In the above embodiments, the electronic device can be a vehicle, ship, aircraft, or robot, etc. A flow channel 11 is formed inside the housing 1 of the electronic device for the flow of heat dissipation medium. Multiple heat sinks 2 are arranged at intervals in the flow channel 11, and flow gaps 3 are formed between adjacent heat sinks 2 and between multiple heat sinks 2 and the housing 1. By keeping the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum value of the flow velocity of the heat dissipation medium in multiple flow gaps greater than or equal to 0.8, the uniformity of the flow of the heat dissipation medium in the entire heat dissipation component is ensured, the heat dissipation efficiency of the heat dissipation component is improved, and at the same time, the flow resistance of the heat sinks is reduced, ensuring the flow pressure of the heat dissipation medium.

[0074] In one embodiment, the electronic device is a vehicle, and the heat dissipation component is a device for cooling the domain controller within the vehicle. The domain controller, as a key thermal management component in the vehicle, integrates and manages the functions of multiple electronic units, achieving optimized integration of vehicle functions. The heat dissipation component effectively cools the domain controller, improving control response speed and decision accuracy, thereby enhancing the vehicle's autonomous driving performance.

[0075] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A heat dissipation component for dissipating heat from a heat source, characterized in that, include: A housing, wherein a flow channel is formed within the housing for the flow of a heat dissipation medium; Multiple heat sinks are arranged at intervals within the flow channel. Flow gaps are formed between adjacent heat sinks and between the multiple heat sinks and the housing. The ratio of the width of any flow gap to the maximum width among the multiple flow gaps is greater than or equal to 0.5, and the minimum width among the multiple flow gaps is less than the maximum width among the multiple flow gaps, such that the ratio of the flow velocity of the heat dissipation medium in any flow gap to the maximum flow velocity among the multiple flow gaps is greater than or equal to 0.

8. The minimum flow velocity of the heat dissipation medium in the plurality of flow gaps is less than the maximum flow velocity of the heat dissipation medium in the plurality of flow gaps.

2. The heat dissipation assembly according to claim 1, characterized in that, The ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is greater than or equal to 0.

9.

3. The heat dissipation assembly according to claim 1, characterized in that, The plurality of heat sinks have inlet ends, and each inlet end of the plurality of heat sinks has a fluid ingress angle. The flow channel has an inlet section, a bend section and an outlet section connected in sequence. The plurality of heat sinks are disposed in the outlet section and the inlet ends face the bend section, so that the fluid ingress angle of each heat sink is less than or equal to 30°.

4. The heat dissipation assembly according to claim 1, characterized in that, The ratio of the length of any one of the heat sinks to the maximum length of the plurality of heat sinks is greater than or equal to 0.

5.

5. The heat dissipation assembly according to claim 1, characterized in that, The plurality of heat sinks have outlet ends, and the plurality of outlet ends of the plurality of heat sinks are arranged flush.

6. The heat dissipation assembly according to claim 5, characterized in that, The plurality of inlet ends of the plurality of heat sinks include at least one intermediate inlet end and side inlet ends located on both sides of the intermediate inlet end, wherein the intermediate inlet end protrudes from the side inlet end.

7. A method for adjusting the heat dissipation of a heat dissipation component, applied to the heat dissipation component according to any one of claims 1-6, characterized in that, include: Receive gap width parameters of multiple flow gaps, wherein the initial value of the gap width parameters is that the widths of the multiple flow gaps are all equal; In response to the plurality of gap width parameters, the ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is obtained; If the ratio of the flow velocity of the heat dissipation medium in any of the flow gaps to the maximum value of the flow velocity of the heat dissipation medium in the plurality of flow gaps is less than 0.8, the gap width of the flow gap corresponding to the first threshold flow velocity is increased and / or the gap width of the flow gap corresponding to the second threshold flow velocity is decreased, so that the ratio of the gap width of any of the flow gaps to the maximum gap width among the plurality of flow gaps is greater than or equal to 0.5 and the minimum width among the plurality of flow gaps is less than the maximum width among the plurality of flow gaps; Wherein, the first threshold flow rate is greater than the second threshold flow rate.

8. The heat dissipation adjustment method according to claim 7, characterized in that, Before receiving the gap width parameters for multiple flow gaps, the following is also included: Receives length parameters for multiple heat sinks; In response to the plurality of the length parameters, the fluid entry angle of any of the heat sinks is obtained; If the fluid ingress angle of any of the heat sinks is greater than 30°, adjust the length of the corresponding heat sink.

9. An electronic device, characterized in that, Includes the heat dissipation component as described in any one of claims 1-6.

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