一种高阻隔耐热量子点UV胶及其制备方法
By combining high Tg thiol oligomers with thiol acrylic monomers and using a specific ratio of photoinitiators and heat stabilizers, a dense cross-linked network is constructed, solving the problems of insufficient water and oxygen barrier properties and heat resistance of quantum dot UV adhesives. This achieves highly efficient water and oxygen barrier properties and heat resistance, meeting the high-performance requirements of electronic display devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI JINQIANG ADHESIVE
- Filing Date
- 2026-02-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing quantum dot UV adhesives are insufficient in terms of water and oxygen barrier properties and heat resistance, making it difficult to meet the high-performance requirements of electronic display devices. Current technologies have failed to achieve synergistic optimization of water and oxygen barrier properties, heat resistance, and processing performance simultaneously.
By combining a specific amount of high Tg thiol oligomer with thiol acrylic acid monomer, a rigid framework-flexible crosslinking synergistic system is constructed. Combined with a specific ratio of photoinitiator and heat stabilizer, a dense, non-porous crosslinking network is formed, achieving a comprehensive optimization of water and oxygen barrier properties, heat resistance, and processing performance.
Significant improvements have been achieved in the water-blocking, oxygen-barrier, and heat-resistant properties of quantum dot UV adhesives. The water vapor permeability is ≤15g/m224h, the water resistance is excellent, the viscosity is moderate, which meets the needs of continuous industrial production, and the processing performance is maintained.
Smart Images

Figure CN121718308B_ABST