A bad product discharging and collecting device and method for patch inductor CCD detection

Abstract

The application discloses a kind of bad products unloading collection device and collection method for patch inductance CCD detection, applied in patch inductance bad products unloading collection device technical field, its technical solution main points are: including pedestal, the pedestal is respectively fixedly connected with the input flow line for input patch inductance and the output flow line for output good product patch inductance;The detection station of the pedestal is respectively fixedly connected with turnover positioning assembly and is used for detecting the CCD camera of patch inductance, the pedestal is also fixedly connected with the adsorption conveying assembly for realizing patch inductance conveying, the base is slidably connected with fork assembly based on the slip adjustment assembly in the turnover positioning assembly directly below, and buffer component for buffering patch inductance falling process to avoid patch inductance damage due to collision;With technical effect is: avoid patch inductance secondary damage, realize the automatic unloading collection of bad product patch inductance.

Description

Technical Field

[0001] This invention relates to the technical field of defective chip inductor unloading and collection devices, and particularly to a defective chip inductor unloading and collection device and method for CCD detection of chip inductors. Background Technology

[0002] As attached Figure 1 As an indispensable passive electronic component in electronic devices, the surface mount inductor shown is widely used in power management, signal filtering, electromagnetic interference suppression and other fields. In order to ensure the quality of surface mount inductors, it is necessary to use a CCD camera combined with a vision inspection system to perform high-precision inspection on the solder joints on both sides of the connection between the coil and the substrate (such as defects such as cold solder joints, desoldering, and incomplete solder joints) and the looseness of the coil during the production process, so as to prevent defective products from entering the market.

[0003] In existing surface mount inductor inspection production lines, when a CCD camera determines a product to be defective, the CCD inspection platform flips and throws the inductor out. The inductor falls directly from a height into a defective product collection box below. Because the coil structure of surface mount inductors is relatively fragile and the defective products in the collection box lack orderly separation, the surface mount inductors are prone to collision and compression during the fall, directly causing coil damage and secondary damage to the solder joints, making the surface mount inductors irreparable. At the same time, due to the certain probability of false judgment in CCD inspection, some surface mount inductors judged as defective are directly scrapped due to physical damage during the throwing process. This not only causes a large amount of material waste but also significantly reduces the overall product yield and increases the company's production costs. Therefore, it is necessary to design a defective surface mount inductor unloading and collection device to avoid secondary damage to surface mount inductors. Summary of the Invention

[0004] The first objective of this invention is to provide a defective product unloading and collection device for CCD detection of surface mount inductors. Its advantage is that it avoids secondary damage to surface mount inductors and realizes automatic unloading and collection of defective surface mount inductors.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a defective product unloading and collection device for CCD detection of surface mount inductors, comprising a base, wherein an input production line for inputting surface mount inductors and an output production line for outputting good surface mount inductors are respectively fixedly connected to the base; the detection station of the base is respectively fixedly connected to a flip positioning component for adsorbing and positioning surface mount inductors and realizing the flipping and unloading of defective surface mount inductors and a CCD camera for detecting surface mount inductors; an adsorption conveying component for conveying surface mount inductors is also fixedly connected to the base; directly below the flip positioning component, based on a sliding adjustment component, a fork component for positioning and storing surface mount inductors is movably connected to the base, and a buffer component for buffering the falling process of surface mount inductors to avoid damage to surface mount inductors due to collision.

[0006] The present invention is further configured such that: the flip positioning assembly includes a flip base fixedly connected to the base and a flip positioning block rotatably connected to the flip base for positioning the chip inductor; the flip positioning block has a positioning groove for positioning the chip inductor; a plurality of first vacuum chucks for adsorbing the chip inductor are uniformly fixedly connected in the positioning groove; and a flip motor for driving the flip positioning block to flip is fixedly connected to the flip base.

[0007] The present invention is further configured such that: the adsorption conveying assembly includes a screw conveying slide fixedly connected to the base in the horizontal direction and a horizontal adsorption seat slidably connected to the sliding end of the screw conveying slide in the vertical direction based on a plurality of guide rods; the sliding end of the screw conveying slide is fixedly connected to a lifting cylinder that drives the horizontal adsorption seat to rise and fall in the vertical direction; and a plurality of second vacuum chucks for adsorbing chip inductors are uniformly fixedly connected to the horizontal adsorption seat.

[0008] The present invention is further configured such that: the sliding adjustment assembly includes a first horizontal guide rail fixedly connected to the base along a direction perpendicular to the flipping center line of the flipping positioning block, and a sliding adjustment seat slidably connected to the first horizontal guide rail along a horizontal direction; a sliding cylinder for driving the sliding adjustment seat to slide is fixedly connected to the base; and two sets of the fork assembly and the buffer assembly are provided, symmetrically arranged at both ends of the sliding adjustment seat along a direction parallel to the first horizontal guide rail.

[0009] The present invention is further configured such that: the fork assembly includes a fork mounting base that is fixedly attached to the sliding adjustment seat along the horizontal direction, and a positioning fork rod that is symmetrically fixedly attached to the fork mounting base based on the positioning plug-in assembly for positioning the chip inductor. The positioning fork rod has a tapered structure away from the top of the fork mounting base to facilitate the entry of the chip inductor.

[0010] The present invention is further configured such that: the positioning plug-in assembly includes a positioning plug-in rod fixedly connected to the bottom of the positioning fork rod in the vertical direction and a blocking plate fixedly connected to the side wall of the positioning fork rod in the horizontal direction for blocking the chip inductor; the fork mounting base is provided with a positioning plug-in groove for inserting the positioning plug-in rod to achieve positioning installation and a positioning receiving groove for accommodating the blocking plate.

[0011] The present invention is further configured such that: the fork mounting base can be detachably locked and fixed to the sliding adjustment base based on the locking bolt, and different fork mounting bases can be replaced to adapt to the collection requirements of different specifications of surface mount inductors.

[0012] The invention is further configured such that: the buffer assembly includes a fixed base fixedly connected to the sliding adjustment seat along the vertical direction and a vertical adjustment seat slidably connected to the fixed base along the vertical direction based on a vertical guide rail; a lifting electric cylinder for driving the vertical adjustment seat to rise and fall is fixedly connected to the fixed base; a horizontal adjustment seat is slidably connected to the vertical adjustment seat along the horizontal direction based on a second horizontal guide rail; a telescopic adjustment cylinder for driving the horizontal adjustment seat to extend and retract is fixedly connected to the vertical adjustment seat along the horizontal direction; and an air blowing assembly for extending into the fork assembly and blowing air upwards to reduce the falling speed of the chip inductor is fixedly connected to the horizontal adjustment seat.

[0013] The present invention is further configured such that: the air blowing assembly includes a horizontal air blowing plate fixedly connected to the horizontal adjustment seat along the horizontal direction and a plurality of air blowing holes opened on the horizontal air blowing plate; the horizontal air blowing plate has a connecting cavity communicating with the air blowing holes; an air inlet pipe for air supply to the connecting cavity is fixedly connected to the horizontal air blowing plate; and the air blowing holes are narrowed.

[0014] The second objective of this invention is to provide a method for collecting and unloading defective surface mount inductors for CCD detection. Its advantage is that it avoids secondary damage to the surface mount inductors and realizes automatic collection and unloading of defective surface mount inductors.

[0015] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a method for collecting defective products for CCD inspection of surface mount inductors, employing a defective product collection device for CCD inspection of surface mount inductors as described in any of the above technical solutions, comprising: Step 1: The adsorption and conveying assembly first adsorbs the chip inductor from the input production line and conveys the chip inductor to the flip-positioning assembly located at the inspection station for positioning and adsorption. The CCD camera inspects the chip inductor. If the inspection is qualified, the adsorption and conveying assembly adsorbs and conveys the good chip inductor from the flip-positioning assembly to the output production line for output. Step 2: If the test fails, the flip positioning component drives the patch inductor to flip, and at the same time the sliding adjustment component drives the fork assembly to slide directly below the flip positioning component. Meanwhile, the buffer component moves into the fork assembly and sprays compressed air upward. Step 3: The flip positioning component releases the patch inductor, which falls into the feed fork assembly. During the fall, the patch inductor is pushed upward by the buffer component, which reduces its falling speed until it decelerates to 0. Then the buffer component leaves the feed fork assembly, and the patch inductor falls slowly to stack. When the feed fork assembly is full of patch inductors, the feed fork assembly is switched by the sliding adjustment component, and the operator replaces the empty feed fork assembly.

[0016] In summary, the present invention has the following beneficial effects: 1. By setting up a fork assembly and a buffer assembly directly below the flip positioning assembly based on the sliding adjustment assembly, when the CCD camera detects that the solder joint or coil tightness of the surface mount inductor on the flip positioning assembly is unqualified, the flip positioning assembly drives the surface mount inductor to flip, the sliding adjustment assembly drives the fork assembly to slide directly below the flip positioning assembly, and at the same time, the buffer assembly moves into the fork assembly and sprays compressed air upwards. The flip positioning assembly releases the surface mount inductor, which falls into the fork assembly. During the falling process, the surface mount inductor is pushed upwards by the buffer assembly, which reduces the falling speed until it decelerates to 0. Then the buffer assembly leaves the fork assembly, and the surface mount inductor falls slowly to achieve stacking. This achieves automatic unloading and collection of defective surface mount inductors, while avoiding coil damage or secondary solder joint damage caused by collision and squeezing during the falling process. This provides the possibility for secondary repair of the surface mount inductors, improves the overall production yield of the product, and reduces material costs. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the surface mount inductor in this embodiment; Figure 2 This is a schematic diagram of the overall structure of this embodiment; Figure 3 yes Figure 2 Enlarged schematic diagram of part A; Figure 4 yes Figure 2 Enlarged diagram of part B; Figure 5 This is an exploded view of the overall structure of this embodiment; Figure 6 yes Figure 5 Enlarged schematic diagram of part C.

[0018] Reference numerals: 1. Base; 2. Input production line; 3. Output production line; 4. Tilting and positioning assembly; 41. Tilting seat; 42. Tilting and positioning block; 43. Positioning groove; 44. First vacuum suction cup; 45. Tilting motor; 5. CCD camera; 6. Adsorption and conveying assembly; 61. Screw conveying slide; 62. Guide rod; 63. Horizontal adsorption seat; 64. Lifting cylinder; 65. Second vacuum suction cup; 7. Sliding adjustment assembly; 71. First horizontal guide rail; 72. Sliding adjustment seat; 73. Sliding cylinder; 8. Fork assembly; 81 82. Fork mount; 82. Positioning connector assembly; 821. Positioning connector rod; 822. Blocking plate; 823. Positioning connector slot; 824. Positioning receiving slot; 83. Positioning fork rod; 84. Locking bolt; 9. Buffer assembly; 91. Fixed seat; 92. Vertical guide rail; 93. Vertical adjustment seat; 94. Lifting cylinder; 95. Second horizontal guide rail; 96. Horizontal adjustment seat; 97. Telescopic adjustment cylinder; 98. Air blowing assembly; 981. Horizontal air blowing plate; 982. Air blowing hole; 983. Air inlet pipe; 10. Surface mount inductor. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the accompanying drawings.

[0020] Example 1: refer to Figures 1 to 6 A defective inductor unloading and collection device for CCD detection of surface mount inductors includes a base 1. An input production line 2 for inputting surface mount inductors 10 and an output production line 3 for outputting good surface mount inductors 10 are fixedly connected to the base 1. A flip-positioning component 4 for adsorbing and positioning surface mount inductors 10 and flipping and unloading defective surface mount inductors 10 and a CCD camera 5 for detecting surface mount inductors 10 are fixedly connected to the detection station of the base 1. The surface mount inductor to be detected is positioned and adsorbed on the flip-positioning component 4, and the coil and solder joints of the surface mount inductor are detected by the CCD camera 5. An adsorption conveying component 6 for conveying surface mount inductors 10 is also fixedly connected to the base 1. A fork component 8 for positioning and storing surface mount inductors 10 is movably connected to the base 1 directly below the flip-positioning component 4 based on a sliding adjustment component 7. A buffer component 9 is also used to buffer the falling process of surface mount inductors 10 to prevent damage to surface mount inductors 10 due to collision.

[0021] refer to Figure 2Specifically, the flip positioning assembly 4 includes a flip base 41 fixedly connected to the base 1 and a flip positioning block 42 rotatably connected to the flip base 41 for positioning the patch inductor 10. A positioning groove 43 for positioning the patch inductor 10 is opened in the flip positioning block 42. Several first vacuum suction cups 44 for adsorbing the patch inductor 10 are uniformly fixedly connected in the positioning groove 43. A flip motor 45 for driving the flip positioning block 42 to flip is fixedly connected to the flip base 41. The patch inductor is positioned and adsorbed and fixed in the positioning groove 43 by the first vacuum suction cups 44. If the test is unqualified, the flip motor 45 drives the flip positioning block 42 to flip 180 degrees, and the first vacuum suction breaks the vacuum to release the patch inductor, so that the patch inductor enters the feed fork assembly 8 to realize the feeding and collection.

[0022] refer to Figure 2 and Figure 3 Specifically, the adsorption and conveying assembly 6 includes a screw conveying slide 61 fixedly connected to the base 1 in the horizontal direction and a horizontal adsorption seat 63 slidably connected to the sliding end of the screw conveying slide 61 in the vertical direction based on several guide rods 62. A lifting cylinder 64 is fixedly connected to the sliding end of the screw conveying slide 61 in the vertical direction to drive the horizontal adsorption seat 63 to rise and fall. Several second vacuum suction cups 65 for adsorbing the patch inductor 10 are uniformly fixedly connected to the horizontal adsorption seat 63. The screw conveying slide 61 and the lifting cylinder 64 drive the horizontal adsorption seat 63 and the second vacuum suction cups 65 to rise and fall, thereby realizing the adsorption of the patch inductor 10 from the input production line 2 and the delivery of the patch inductor 10 to the flip positioning assembly 4 located at the detection station for positioning and adsorption. The good patch inductor 10 is adsorbed and delivered from the flip positioning assembly 4 to the output production line 3 for output.

[0023] refer to Figure 2 Specifically, the sliding adjustment assembly 7 includes a first horizontal guide rail 71 fixedly connected to the base 1 along the direction perpendicular to the flipping center line of the flipping positioning block 42, and a sliding adjustment seat 72 slidably connected to the first horizontal guide rail 71 along the horizontal direction. A sliding cylinder 73 for driving the sliding adjustment seat 72 to slide is fixedly connected to the base 1. Two sets of fork assemblies 8 and buffer assemblies 9 are provided, symmetrically arranged at both ends of the sliding adjustment seat 72 along the direction parallel to the first horizontal guide rail 71. The sliding adjustment seat 72 is driven to slide along the direction of the first horizontal guide rail by the sliding cylinder 73, thereby realizing the switching of the fork assembly 8. Each buffer assembly 9 corresponds to one fork assembly 8 to realize the buffering of the tablet inductor falling process.

[0024] refer to Figure 5 and Figure 6Specifically, the fork assembly 8 includes a fork mounting base 81 that is fixedly attached to the sliding adjustment seat 72 along the horizontal direction, and a positioning fork rod 83 that is symmetrically fixedly attached to the fork mounting base 81 based on the positioning plug assembly 82 for positioning the chip inductor 10. The top of the positioning fork rod 83 away from the fork mounting base 81 has a tapered structure to facilitate the entry of the chip inductor 10. The positioning of the chip inductor is achieved by inserting the two positioning fork rods 83 into the gap between the upper plate of the chip inductor. The positioning plug assembly 82 enables the positioning fork rod 83 to be quickly installed and removed. The positioning and insertion assembly 82 includes a positioning insertion rod 821 fixedly connected vertically to the bottom of the positioning fork 83 and a blocking plate 822 fixedly connected horizontally to the side wall of the positioning fork 83 for blocking the surface mount inductor 10. The fork mounting base 81 has a positioning insertion slot 823 for inserting the positioning insertion rod 821 for positioning and installation, and a positioning receiving slot 824 for accommodating the blocking plate 822. The positioning fork 83 is positioned and fixed by inserting the positioning insertion rod 821 into the positioning insertion slot 823 and by the cooperation of the blocking plate 822 and the positioning receiving slot 824. In this embodiment, the fork mounting base 81 is detachably locked to the sliding adjustment base 72 by locking bolts 84. The positions and spacing of the positioning insertion slots 823 and positioning receiving slots 824 are different on different fork mounting bases 81, allowing for the replacement of different fork mounting bases 81 to accommodate the collection requirements of surface mount inductors 10 of different specifications.

[0025] refer to Figure 2 and Figure 4Specifically, the buffer assembly 9 includes a fixed base 91 fixedly connected to the sliding adjustment base 72 along the vertical direction, and a vertical adjustment base 93 slidably connected to the fixed base 91 along the vertical direction based on the vertical guide rail 92. A lifting electric cylinder 94 for driving the vertical adjustment base 93 to rise and fall is fixedly connected to the fixed base 91. A horizontal adjustment base 96 is slidably connected to the vertical adjustment base 93 along the horizontal direction based on the second horizontal guide rail 95. A telescopic adjustment cylinder for driving the horizontal adjustment base 96 to extend and retract is fixedly connected to the vertical adjustment base 93 along the horizontal direction. 97. An air blowing component 98 is fixedly connected to the horizontal adjustment seat 96 for extending into the feed fork assembly 8 and blowing air upwards to reduce the falling speed of the chip inductor 10. The air blowing component 98 is driven into or out of the feed fork assembly 8 by the telescopic adjustment cylinder. When one chip inductor is stacked in the feed fork assembly 8, the lifting cylinder 94 drives the vertical adjustment seat 93 to rise, so that a gap of 2-5cm is maintained between the vertical adjustment seat 93 and the top surface of the stacked chip inductor, thereby greatly reducing the speed of the chip inductor falling again and avoiding damage to the chip inductor. The air blowing assembly 98 includes a horizontal air blowing plate 981 fixedly connected to the horizontal adjustment seat 96 along the horizontal direction and a plurality of air blowing holes 982 opened on the horizontal air blowing plate 981. A connecting cavity communicating with the air blowing holes 982 is opened in the horizontal air blowing plate 981. An air inlet pipe 983 for air supply to the connecting cavity is fixedly connected to the horizontal air blowing plate 981. The air blowing holes 982 are narrowed. By introducing compressed air into the air inlet pipe 983, the compressed air enters the connecting cavity and is blown upward through the air blowing plate, thereby giving an upward thrust to the falling pressing inductor and reducing the falling speed of the pressing inductor until the speed drops to 0. Then the buffer assembly 9 leaves the fork assembly 8, and the patch inductor 10 falls slowly a second time to achieve stacking and material collection.

[0026] Example 2: A method for collecting defective parts for CCD inspection of surface mount inductors, using a defective part collection device for CCD inspection of surface mount inductors as shown in the embodiment, includes: Step 1: The adsorption and conveying assembly 6 first adsorbs the chip inductor 10 from the input production line 2 and conveys the chip inductor 10 to the flip positioning assembly 4 located at the inspection station for positioning and adsorption. The CCD camera 5 inspects the chip inductor 10. If the inspection is qualified, the adsorption and conveying assembly 6 adsorbs and conveys the good chip inductor 10 from the flip positioning assembly 4 to the output production line 3 to achieve output. Step 2: If the test fails, the flip positioning component 4 drives the patch inductor 10 to flip, and at the same time, the sliding adjustment component 7 drives the fork assembly 8 to slide directly below the flip positioning component 4. Meanwhile, the buffer component 9 moves into the fork assembly 8 and sprays compressed air upward. Step 3: The flip positioning component 4 releases the patch inductor 10, which falls into the feed fork assembly 8. During the fall of the patch inductor 10, it is pushed upward by the buffer component 9, which reduces the falling speed until it decelerates to 0. Then the buffer component 9 leaves the feed fork assembly 8, and the patch inductor 10 falls slowly to achieve stacking. When the feed fork assembly 8 is full of patch inductors 10, the feed fork assembly 8 is switched by the sliding adjustment component 7, and the operator replaces the empty feed fork assembly 8.

[0027] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make inventive modifications to this embodiment as needed, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A defective product collection device for CCD detection of surface mount inductors, comprising a base (1), wherein an input pipeline (2) for inputting surface mount inductors (10) and an output pipeline (3) for outputting good surface mount inductors (10) are respectively fixedly connected to the base (1); characterized in that, The detection station of the base (1) is fixedly connected to a flip positioning component (4) for adsorbing and positioning the patch inductor (10) and realizing the flipping and unloading of defective patch inductors (10), and a CCD camera (5) for detecting the patch inductor (10). The base (1) is also fixedly connected to an adsorption conveying component (6) for conveying the patch inductor (10). The base (1) is movably connected to a fork component (8) for positioning and storing the patch inductor (10) based on a sliding adjustment component (7) directly below the flip positioning component (4), and a buffer component (9) for buffering the patch inductor (10) during its falling process to prevent the patch inductor (10) from being damaged by collision. The flip positioning assembly (4) includes a flip base (41) fixedly connected to the base (1) and a flip positioning block (42) rotatably connected to the flip base (41) for positioning the patch inductor (10). The flip positioning block (42) has a positioning groove (43) for positioning the patch inductor (10). A plurality of first vacuum suction cups (44) for adsorbing the patch inductor (10) are uniformly fixedly connected in the positioning groove (43). A flip motor (45) for driving the flip positioning block (42) to flip is fixedly connected to the flip base (41). The sliding adjustment assembly (7) includes a first horizontal guide rail (71) fixedly connected to the base (1) along the direction perpendicular to the flipping center line of the flipping positioning block (42) and a sliding adjustment seat (72) slidably connected to the first horizontal guide rail (71) along the horizontal direction. A sliding cylinder (73) for driving the sliding adjustment seat (72) to slide is fixedly connected to the base (1). The fork assembly (8) and the buffer assembly (9) are provided in two sets, symmetrically arranged at both ends of the sliding adjustment seat (72) along the direction parallel to the first horizontal guide rail (71). The buffer assembly (9) includes a fixed seat (91) fixedly connected to the sliding adjustment seat (72) in the vertical direction and a vertical adjustment seat (93) slidably connected to the fixed seat (91) in the vertical direction based on the vertical guide rail (92). A lifting electric cylinder (94) for driving the vertical adjustment seat (93) to rise and fall is fixedly connected to the fixed seat (91). A horizontal adjustment seat (96) is slidably connected to the vertical adjustment seat (93) in the horizontal direction based on the second horizontal guide rail (95). A telescopic adjustment cylinder (97) for driving the horizontal adjustment seat (96) to extend and retract is fixedly connected to the vertical adjustment seat (93) in the horizontal direction. An air blowing assembly (98) for extending into the fork assembly (8) and blowing air upward to reduce the falling speed of the patch inductor (10) is fixedly connected to the horizontal adjustment seat (96).

2. The defective product collection device for CCD detection of surface mount inductors according to claim 1, characterized in that, The adsorption and conveying assembly (6) includes a screw conveying slide (61) fixedly connected to the base (1) in the horizontal direction and a horizontal adsorption seat (63) slidably connected to the sliding end of the screw conveying slide (61) in the vertical direction based on a plurality of guide rods (62). The sliding end of the screw conveying slide (61) is fixedly connected to a lifting cylinder (64) that drives the horizontal adsorption seat (63) to rise and fall in the vertical direction. A plurality of second vacuum chucks (65) for adsorbing the chip inductor (10) are uniformly fixedly connected on the horizontal adsorption seat (63).

3. The defective product collection device for CCD detection of surface mount inductors according to claim 1, characterized in that, The fork assembly (8) includes a fork mounting base (81) that is fixedly attached to the sliding adjustment seat (72) along the horizontal direction and a positioning fork rod (83) that is symmetrically fixedly attached to the fork mounting base (81) based on the positioning plug assembly (82) for positioning the patch inductor (10). The top of the positioning fork rod (83) away from the fork mounting base (81) is tapered to facilitate the entry of the patch inductor (10).

4. A defective product collection device for CCD detection of surface mount inductors according to claim 3, characterized in that, The positioning plug-in assembly (82) includes a positioning plug-in rod (821) fixedly connected to the bottom of the positioning fork rod (83) in the vertical direction and a blocking plate (822) fixedly connected to the side wall of the positioning fork rod (83) in the horizontal direction for blocking the chip inductor (10). The fork mounting base (81) is provided with a positioning plug-in groove (823) for the positioning plug-in rod (821) to be inserted for positioning and installation, and a positioning receiving groove (824) for accommodating the blocking plate (822).

5. A defective product collection device for CCD detection of surface mount inductors according to claim 4, characterized in that, The fork mount (81) can be detachably locked onto the sliding adjustment seat (72) based on the locking bolt (84), and different fork mounts (81) can be replaced to accommodate the collection requirements of different specifications of surface mount inductors (10).

6. A defective product collection device for CCD detection of surface mount inductors according to claim 1, characterized in that, The air blowing assembly (98) includes a horizontal air blowing plate (981) fixedly connected to the horizontal adjustment seat (96) along the horizontal direction and a plurality of air blowing holes (982) opened on the horizontal air blowing plate (981). A connecting cavity communicating with the air blowing holes (982) is opened in the horizontal air blowing plate (981). An air inlet pipe (983) for breathing into the connecting cavity is fixedly connected to the horizontal air blowing plate (981). The air blowing holes (982) are narrowed.

7. A method for collecting defective products for CCD inspection of surface mount inductors, comprising using a defective product collection device for CCD inspection of surface mount inductors as described in any one of claims 1-6; characterized in that, include: Step 1: The adsorption and conveying assembly (6) first adsorbs the chip inductor (10) from the input production line (2) and conveys the chip inductor (10) to the flip positioning assembly (4) located at the inspection station for positioning and adsorption. The CCD camera (5) inspects the chip inductor (10). If the inspection is qualified, the adsorption and conveying assembly (6) adsorbs and conveys the good chip inductor (10) from the flip positioning assembly (4) to the output production line (3) to achieve output. Step 2: If the test fails, the flip positioning component (4) drives the patch inductor (10) to flip, and at the same time the sliding adjustment component (7) drives the fork assembly (8) to slide directly below the flip positioning component (4), and at the same time the buffer component (9) moves into the fork assembly (8) and sprays compressed air upward. Step 3: The flip positioning component (4) releases the patch inductor (10), and the patch inductor (10) falls into the fork assembly (8). During the fall of the patch inductor (10), it is pushed upward by the buffer component (9) to reduce the falling speed until it decelerates to 0. Then the buffer component (9) leaves the fork assembly (8), and the patch inductor (10) falls slowly to achieve stacking. When the fork assembly (8) is full of patch inductors (10), the fork assembly (8) is switched by the sliding adjustment component (7), and the staff replaces the empty fork assembly (8).

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