Local stamping regulation method suitable for high-power TPAK module production
CN121733861BActive Publication Date: 2026-06-09NINGBO YONGHE ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NINGBO YONGHE ELECTRONICS CO LTD
- Filing Date
- 2026-02-14
- Publication Date
- 2026-06-09
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Figure CN121733861B_ABST
Abstract
The present application relates to the technical field of stamping die, in particular to a local stamping regulation method suitable for high-power TPAK module production. The present application determines real-time yield strength based on effective plastic deformation generated in the stamping operation before the current stamping operation of the position to be processed; obtains theoretical target stroke based on the deviation of the measured surface height of the position to be processed before the current stamping operation from the theoretical design height and the real-time yield strength; determines the execution down pressure by using the structural critical buckling displacement to constrain the theoretical target stroke; controls the press to perform stamping on the position to be processed according to the execution down pressure, and obtains the ratio of the loading input work to the plastic work of the position to be processed in the current stamping operation based on the energy applied to the position to be processed in the current stamping operation and the proportion of the energy used for material plastic deformation. The present application effectively solves the contradiction between the dynamic increase of yield strength caused by work hardening and the inherent buckling risk of pin-fin microstructure.
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Citation Information
Patent Citations
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