一种基于混合空间交互的陶瓷封装基板图像超分辨率方法
By constructing a hybrid spatial interaction network, the problems of feature loss and detail blurring in ceramic packaging substrate image super-resolution were solved, thereby improving image resolution and clarity and enhancing the accuracy and reliability of defect detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NORTHEASTERN UNIV CHINA
- Filing Date
- 2026-02-28
- Publication Date
- 2026-07-17
AI Technical Summary
Existing super-resolution technologies suffer from the loss of key microscopic features and blurring of detailed information when processing images of ceramic packaging substrates, failing to meet the needs of highly specialized industrial inspection.
A hybrid spatial interaction-based approach is adopted to construct a hybrid spatial interaction network, which includes a shallow feature extraction subnetwork, a main feature extraction subnetwork, and an upsampling reconstruction subnetwork. Feature extraction and reconstruction are enhanced through a hybrid multi-channel interaction module and a bidirectional supervision submodule, ensuring the preservation of image details and improving resolution.
It effectively enhances the overall resolution and clarity of images, captures fine details and a wider range of structures in images, prevents high-frequency information degradation, and improves the accuracy and reliability of defect detection in ceramic packaging substrates.
Smart Images
Figure CN121746185B_ABST