一种高柔韧性膜包绞合线及绞合成型工艺

By employing a double-layer thin film overlap area circumferentially staggered design and overall winding layer restraint in the membrane-wrapped stranded wire, combined with guide hole guidance and adjustable damping torque control stranding process, the stress concentration and wear problems of membrane-wrapped stranded wire under high dynamic scenarios are solved, achieving higher structural stability and insulation reliability.

CN121748052BActive Publication Date: 2026-07-17GUANGDONG SUNTEK WIRE CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGDONG SUNTEK WIRE CO LTD
Filing Date
2026-01-19
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing membrane-wrapped stranded wires are prone to stress concentration in the overlap area, wear or displacement at the overlap in high-dynamic application scenarios, which leads to a decrease in the stability of the stranded structure and the reliability of insulation.

Method used

The double-layer film overlap area is circumferentially staggered, and the combination structure of inner and outer stranded layers and overall winding layer is combined. The stranding forming process, which limits the wire feeding sequence through guide holes, adjusts tension, rotates and presses, and controls adjustable damping torque, ensures that the film overlap area is distributed in the cross section and that the outer layer is stably bound.

Benefits of technology

It improves the geometric stability and insulation reliability of stranded wires under repeated bending and torsion conditions, reduces the risk of wear and displacement of the cladding, and enhances the long service life and outer diameter consistency of the cable.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明涉及一种高柔韧性膜包绞合线及绞合成型工艺,属于膜包绞合线技术领域,通过在每根膜包单线外形成第一薄膜层与第二薄膜层并使两层的搭接区周向错开,同时进一步限定同一绞合层内相邻膜包单线的搭接区在截面上分散分布,从源头降低搭接边缘集中叠加的几率;再配合外侧的总体缠绕层对外绞合层进行束缚,使绞合层在反复弯折或扭转条件下的结构形态更稳定,以此解决了膜包搭接区易集中导致的应力集中,以及成型过程中搭接区易磨损或位移并引发绞合回松、外径与绝缘可靠性下降的问题。
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