A Dynamic Optimization Method for Relay Temperature Measuring Points Based on Thermal Networks and Finite Element Method

By constructing a thermal network and a finite element model, and combining a dynamic adaptation algorithm, the relay temperature measurement points are dynamically adjusted, solving the problems of inaccurate temperature measurement point selection and response lag, and realizing efficient temperature monitoring under different operating conditions.

CN121766023BActive Publication Date: 2026-07-17HARBIN INST OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HARBIN INST OF TECH
Filing Date
2025-12-22
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In existing technologies, the selection of relay temperature measurement points is inaccurate, the response is lagging, it cannot meet the monitoring needs under different load types, and it lacks dynamic adaptability.

Method used

A multi-node equivalent thermal network model and a three-dimensional finite element thermal analysis model are constructed using a thermal network and finite element method. Combined with a dynamic adaptation algorithm, the temperature measurement points are dynamically adjusted to adapt to different working conditions. The selection of temperature measurement points is optimized through a comprehensive evaluation of steady-state sensitivity and transient thermal hysteresis time.

Benefits of technology

It achieves real-time and accurate temperature measurement, can flexibly adapt to different load conditions, improves the response speed and accuracy of temperature monitoring, avoids damage caused by sensor response lag, reduces the blindness of experience-based selection, and overcomes the blindness of experience-based point selection.

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Abstract

This invention discloses a dynamic optimization method for relay temperature measurement points based on thermal networks and finite element analysis. The method includes the following steps: Step S1, constructing a multi-node equivalent thermal network model; Step S2, constructing a three-dimensional finite element thermal analysis model; Step S3, model parameter identification and correction; Step S4, dynamic weighted optimization; Step S5, selecting the optimal temperature measurement point with the highest priority index. This invention overcomes the limitations of traditional temperature measurement point selection, which relies on no basis, by integrating the spatial steady-state advantages of thermal networks with the temporal transient advantages of finite element analysis. It achieves automatic locking of the optimal monitoring position between the inside (e.g., contacts, iron core) and outside of the relay according to operating conditions, significantly improving the response speed and steady-state accuracy of the temperature monitoring system. It also solves the problems of traditional relay temperature measurement point selection relying on experience, ignoring transient thermal hysteresis characteristics, and failing to meet the monitoring needs of multiple operating conditions.
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Citation Information

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