Refrigeration fan based on semiconductor refrigeration heat dissipation structure

Abstract

This invention relates to a cooling fan based on a semiconductor cooling and heat dissipation structure, comprising: a fan, a semiconductor cooling and heat dissipation structure, and an air distribution structure. The fan has an air outlet; the semiconductor cooling and heat dissipation structure includes a semiconductor cooling chip and cooling fins and heat dissipation fins located on both sides of the semiconductor cooling chip; the air distribution structure includes air dividers that separate the outflow channel of the fan outlet into a first channel and a second channel. The first channel is connected to a cooling heat exchange channel, and the second channel is connected to a heat dissipation channel. The airflow into the cooling heat exchange channel is greater than the airflow into the heat dissipation channel. The cooling fins are made of copper or aluminum. This allows most of the airflow output by the fan to act on the copper or aluminum cooling fins, fully exchanging heat and maximizing the removal of cold air from the surface of the cooling fins. This results in lower output air temperature, more stable airflow, improved cooling effect, and efficient cold air output, meeting the user's need for rapid and continuous cooling.

Description

Technical Field

[0001] This application relates to the field of fan technology, and in particular to a cooling fan based on a semiconductor cooling and heat dissipation structure. Background Technology

[0002] Handheld fans are commonly used portable cooling devices. Traditional products mostly use a single cooling method of direct airflow from physical fan blades. This method can only achieve a feeling of cooling by accelerating airflow and promoting the evaporation of sweat from the skin. It cannot fundamentally reduce the air temperature. In high-temperature environments (such as outdoor areas in summer or enclosed spaces), the cooling effect is limited and cannot meet users' needs for efficient and continuous cooling.

[0003] Semiconductor cooling chips (TECs), as a type of solid-state cooling device, are widely used in small-scale cooling and heat dissipation applications due to their advantages such as having no moving mechanical parts, small size, precise cooling and temperature reduction, fast response speed, and being environmentally friendly and pollution-free.

[0004] To improve the cooling performance of handheld fans, existing technologies attempt to combine semiconductor cooling technology with fans, but existing handheld fans still suffer from poor cooling performance. Summary of the Invention

[0005] Therefore, it is necessary to provide a cooling fan based on a semiconductor cooling and heat dissipation structure that can blow out cold air and has a good cooling effect.

[0006] This application provides a cooling fan based on a semiconductor cooling and heat dissipation structure, comprising:

[0007] The fan has an air outlet;

[0008] A semiconductor cooling and heat dissipation structure includes a semiconductor cooling chip and cooling fins and heat dissipation fins located on both sides of the semiconductor cooling chip. The semiconductor cooling and heat dissipation structure forms a cooling heat exchange channel on one side of the cooling fins, and the semiconductor cooling chip forms a heat dissipation channel on one side of the heat dissipation fins.

[0009] The air distribution structure includes an air distribution plate located between the fan and the semiconductor cooling and heat dissipation structure. The air distribution plate divides the outflow channel of the fan outlet into a first channel and a second channel. The first channel is connected to the cooling heat exchange channel, and the second channel is connected to the heat dissipation channel. The airflow rate flowing into the cooling heat exchange channel is greater than the airflow rate flowing into the heat dissipation channel. The cooling fins are made of copper or aluminum.

[0010] In one embodiment, the air inlet and outlet directions of the fan are perpendicular, the fan is a volute fan, and the air outlet volume of the fan is 0.2-0.5 m³ / s. 3 / min;

[0011] And / or, the cooling fins and / or the heat dissipation fins are welded to the semiconductor cooling chip;

[0012] And / or, the cooling fins are composed of a continuous metal plate folded multiple times to form a paper-like structure. The folds are arranged at an angle to each other to form trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip to the free end. The gaps between them form the cooling heat exchange channels.

[0013] And / or, the heat dissipation fins are formed by a continuous metal plate through multiple folds to form a paper-like structure. The folds are arranged at an angle to each other to form trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip to the free end. The gaps between them form the heat dissipation channels.

[0014] And / or, the insulating substrate of the semiconductor cooling chip is a 96% alumina ceramic substrate;

[0015] And / or, in a vacuum environment, the maximum cooling capacity of the semiconductor refrigeration chip is 80 watts to 100 watts; the maximum temperature difference ΔT max The temperature ranges from 67°C to 84°C.

[0016] In one embodiment, the cooling fins and / or the heat dissipation fins are soldered to the semiconductor cooling chip using a low-temperature solder, the low-temperature solder comprising the following components by weight percentage: Sn 64%, Bi 35%, Ag 1%;

[0017] And / or, the semiconductor cooling heat dissipation structure further includes thermal insulation foam, the thermal insulation foam being a hollow rectangular frame structure, the semiconductor cooling chip, the cooling fins and the heat dissipation fins being located entirely within the rectangular frame structure, and the cooling fins and the heat dissipation fins being connected to the thermal insulation foam, the extension direction of the thermal insulation foam being consistent with the extension direction of the heat dissipation channel or the cooling heat exchange channel.

[0018] In one embodiment, the cooling fan further includes a fan housing, in which the fan, the semiconductor cooling and heat dissipation structure, and the air distribution structure are all installed. The fan housing has opposing air inlet areas, cold air outlet areas, and hot air outlet areas. The fan housing has multiple air inlet holes in the air inlet areas, multiple cold air outlet holes in the cold air outlet areas, and multiple hot air outlet holes in the hot air outlet areas. The air inlet holes correspond to the air inlet of the fan, the cold air outlet holes correspond to the cooling heat exchange channel, and the hot air outlet holes correspond to the heat dissipation channel.

[0019] The air distribution structure includes an air distribution plate and mounting portions located at both ends of the air distribution plate. The fan housing has mounting grooves in the area corresponding to the mounting portions inside it. Each mounting portion is installed in the mounting groove. The air distribution plate has an arc-shaped structure. One end of the arc-shaped structure abuts against the hot end of the semiconductor cooling chip. The other end of the arc-shaped structure is adjacent to the air outlet of the fan. The arc-shaped structure gradually moves away from the hot end of the semiconductor cooling chip from the direction adjacent to the air outlet.

[0020] In one embodiment, the cooling fan further includes a battery assembly, which includes a battery housing and a battery located within the battery housing. The battery housing is rotatably connected to the fan housing, and both the battery housing and the fan housing have an approximately rectangular outline.

[0021] In one embodiment, the battery housing can rotate 180 degrees relative to the fan housing, and the fan housing has a stacked position and a flat position when rotating relative to the battery housing; when in the stacked position, the fan housing and the battery housing are stacked together, and the whole is in an upright state; when in the flat position, the fan housing and the battery housing are unfolded, and the whole is in a flat position; the fan housing has a stacked surface and a back surface, the air inlet area and the cold air outlet area are both located on the back surface, the hot air outlet area is located on the stacked surface, and when the fan housing and the battery housing are in the stacked position, there is a gap between the hot air outlet area and the battery housing that communicates with the outside.

[0022] In one embodiment, the opening area of ​​the cold air outlet is located at one end of the fan housing away from the rotation axis where the battery housing is mounted.

[0023] In one embodiment, the cooling fan further includes an air guide structure located inside the fan housing. The air guide structure includes a connected cold air guide vane and a hot air guide vane. The air guide structure has an approximately V-shaped structure. The apex region of the approximately V-shaped structure is connected to the semiconductor cooling chip. The cold air guide vane and the cooling fins are located on the same side, and the hot air guide vane and the heat dissipation fins are located on the same side. The airflow direction of the cold air guide vane is towards the cold air outlet, and the airflow direction of the hot air guide vane is towards the hot air outlet.

[0024] In one embodiment, the fan housing includes an upper housing and a lower housing connected to each other. The lower housing has a stacking surface of the fan housing, and the upper housing has a back surface of the fan housing. The upper housing has a receiving groove on the back surface, and the upper housing has a slot hole on the bottom wall of the receiving groove to expose the air inlet of the volute fan. An air inlet cover is snapped onto the receiving groove, and the air inlet cover has a plurality of air inlet holes.

[0025] In one embodiment, the air divider separates the outflow channel of the fan outlet into a first channel and a second channel. The airflow in the first channel accounts for 60%-80% of the total airflow from the fan outlet and is guided to the cooling fins. The airflow in the second channel accounts for 20%-40% of the total airflow from the fan outlet and is guided to the heat dissipation fins.

[0026] In one embodiment, the air distribution angle of the air distribution plate is adjustable, so that the air volume of the guide cooling fins is positively correlated with the cooling capacity of the semiconductor cooling chip. When the cooling capacity increases, the proportion of air volume of the guide cooling fins increases accordingly.

[0027] In one embodiment, the air distribution vane is inclined, with an angle of 30°-60° between it and the air outlet direction of the vortex fan, so as to guide most of the airflow to the cooling fins.

[0028] In one embodiment, the first airflow blows perpendicularly along the fin gaps of the cooling fins, and the second airflow blows parallel along the fin gaps of the heat dissipation fins.

[0029] In one embodiment, the cooling fan further includes an airflow adjustment mechanism, which adjusts the angle of the air distribution vanes according to the real-time temperature of the cooling fins and heat dissipation fins to adjust the airflow distribution ratio.

[0030] The aforementioned cooling fan based on a semiconductor cooling and heat dissipation structure employs a split-flow structure and a semiconductor cooling and heat dissipation structure to solve the technical problems of insufficient cold air output, low heat dissipation efficiency, and poor synergy between cooling and heat dissipation in traditional cooling fans. The split-flow vane divides the airflow channel at the fan outlet into a first channel and a second channel, controlling the airflow into the cooling heat exchange channel to be greater than the airflow into the heat dissipation channel. This allows most of the airflow output by the fan to act on the copper or aluminum cooling fins, fully exchanging heat with the cooling fins at the cooling end of the semiconductor cooling chip. This maximizes the removal of cold air from the surface of the cooling fins, resulting in lower output cold air temperature and more stable airflow, improving the cooling effect and ensuring efficient cold air output to meet users' needs for rapid and continuous cooling. At the same time, a small portion of the airflow distributed by the split-flow vane enters the heat dissipation channel through the second channel, acting on the heat dissipation fins to quickly remove the heat generated at the heat dissipation end of the semiconductor cooling chip. This prevents heat accumulation at the heat dissipation end from causing a decrease in the cooling efficiency of the semiconductor cooling chip, ensuring that the semiconductor cooling chip remains in a stable and efficient cooling state for a long time. This achieves a combination of efficient cold air output and rapid hot air dissipation, further enhancing the overall cooling performance. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of a cooling fan based on a semiconductor cooling and heat dissipation structure according to an embodiment;

[0032] Figure 2This is a structural schematic diagram of a cooling fan from another angle, representing one embodiment.

[0033] Figure 3 This is a partial exploded view of a cooling fan according to one embodiment;

[0034] Figure 4 This is a schematic diagram of the connection structure of a cooling fan, including the fan, semiconductor cooling and heat dissipation structure, air distribution structure, and air guiding structure, according to one embodiment.

[0035] Figure 5 An exploded view of the fan, semiconductor cooling and heat dissipation structure, air distribution structure, and air guiding structure of a cooling fan according to one embodiment;

[0036] Figure 6 This is a schematic diagram of the fan, semiconductor cooling and heat dissipation structure, air distribution structure, and air guiding structure of a cooling fan according to one embodiment;

[0037] Figure 7 for Figure 6 Cross-sectional view along line AA;

[0038] Figure 8 This is an example of a semiconductor cooling and heat dissipation structure for a cooling fan. Detailed Implementation

[0039] To facilitate understanding of this application and to make the aforementioned objectives, features, and advantages of this application more apparent, a detailed description of specific embodiments of this application is provided below in conjunction with the accompanying drawings. Numerous specific details are set forth in the following description to provide a thorough understanding of this application, and preferred embodiments are shown in the accompanying drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application. This application can be implemented in many other ways than those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0040] This application provides a cooling fan based on a semiconductor cooling and heat dissipation structure. Please refer to [link / reference]. Figures 1 to 8The cooling fan includes a fan housing 100, a battery housing 200, a fan 300, a semiconductor cooling and heat dissipation structure 400, an air distribution structure 500, and an air guide structure 600. The fan housing 100 is connected to the battery housing 200, providing overall housing and support. The fan 300, semiconductor cooling and heat dissipation structure 400, air distribution structure 500, and air guide structure 600 are all installed inside the fan housing 100, providing the cooling fan function. A battery 230 is installed inside the battery housing 200, providing power to the fan. Of course, in practical applications, the battery housing and battery can be omitted, and an external power source or AC mains power can be used.

[0041] In one embodiment, the cooling fan includes a fan 300, a semiconductor cooling and heat dissipation structure 400, and an air distribution structure 500, which together function as a fan to deliver cool air. The fan 300 is used to deliver the overall airflow and has opposing air inlets 310 and outlets 320. For example, the fan 300 is a volute fan; however, it can also be an axial flow fan, a high-speed fan, or other conventional fans. For instance, the air inlet and outlet directions of the fan 300 are perpendicular, and the fan is a volute fan. This ensures that the cooling fan, especially when handheld, is miniaturized and easy to carry. For example, the airflow from the fan outlet is 0.2-0.5 m³ / s. 3 / min, thus, for miniaturization, especially when battery powered, combined with ease of use and practical scenarios, it can increase the fan's lifespan and thus improve the user experience. By using a volute fan with the air intake and exhaust directions perpendicular, the exhaust airflow is limited to 0.2-0.5 m³ / min. 3 / min, which can match the heat exchange air volume requirements of semiconductor cooling chips, avoids excessive air volume leading to excessively high air velocity and insufficient heat exchange, or insufficient air volume leading to insufficient cooling output. At the same time, the structural design of the volute fan can reduce airflow turbulence and noise, and improve air outlet stability.

[0042] The semiconductor cooling and heat dissipation structure 400 is used to cool the air delivered by the fan 300, thereby achieving the function of delivering cold air. The semiconductor cooling and heat dissipation structure 400 includes a semiconductor cooling chip 410 and cooling fins 420 and heat dissipation fins 430 located on both sides of the semiconductor cooling chip. A cooling heat exchange channel is formed on one side of the cooling fins 420, typically through the gaps between the cooling fins 420, facilitating heat exchange between the air delivered by the fan 300 and the cooling fins 420 as it passes through the cooling heat exchange channel, thus achieving a cooling effect. A heat dissipation channel is formed on one side of the cooling fins 430 of the semiconductor cooling chip 410, facilitating heat dissipation. For example, the cooling fins are made of copper or aluminum; or both the cooling fins and heat dissipation fins are made of copper, resulting in high heat exchange efficiency and ensuring effective cooling.

[0043] The air distribution structure 500 is used to distribute the airflow from the outlet of the fan 300. A portion of the airflow flows through the cooling and heat exchange channel for cold air output, while the other portion flows through the heat dissipation channel for hot air output. When using the cooling fan, the user can direct the cold air output towards their desired environment to achieve a cooling effect similar to that of an air conditioner. The air distribution structure 500 includes a distribution vane 510 located between the fan 300 and the semiconductor cooling and heat dissipation structure 400. The distribution vane 510 divides the flow channel of the fan 300's outlet 110 into a first flow channel and a second flow channel. The first flow channel is connected to the cooling and heat exchange channel, and the second flow channel is connected to the heat dissipation channel. The airflow rate flowing into the cooling and heat exchange channel is greater than the airflow rate flowing into the heat dissipation channel.

[0044] The aforementioned cooling fan based on a semiconductor cooling and heat dissipation structure employs a split-flow structure and a semiconductor cooling and heat dissipation structure to solve the technical problems of insufficient cold air output, low heat dissipation efficiency, and poor coordination between cooling and heat dissipation in traditional cooling fans. The split-flow vane divides the air outlet of the fan into a first flow channel and a second flow channel, controlling the airflow into the cooling heat exchange channel to be greater than the airflow into the heat dissipation channel. This allows most of the airflow output by the fan to act on the copper or aluminum cooling fins, fully exchanging heat with the cooling fins at the cooling end of the semiconductor cooling chip. This maximizes the removal of cold air from the surface of the cooling fins, resulting in lower output cold air temperature and more stable airflow, improving the cooling effect and ensuring efficient cold air output to meet users' needs for rapid and continuous cooling. At the same time, a small portion of the airflow distributed by the split-flow vane enters the heat dissipation channel through the second flow channel, acting on the heat dissipation fins to quickly remove the heat generated at the heat dissipation end of the semiconductor cooling chip. This prevents heat accumulation at the heat dissipation end from causing a decrease in the cooling efficiency of the semiconductor cooling chip, ensuring that the semiconductor cooling chip is in a stable and efficient cooling state for a long time. This achieves a combination of efficient cold air output and rapid hot air dissipation, further enhancing the overall cooling performance.

[0045] Compared to traditional non-splitter structures or single-channel designs, this application focuses on the inherent characteristics of the thermoelectric cooler and, based on the fan's usage scenario, achieves a low-cost airflow cooling effect. A single fan delivers airflow through a split-flow structure design, simultaneously achieving both airflow cooling and heat dissipation, ensuring the effective cooling of the thermoelectric cooler. While ensuring stable operation of the thermoelectric cooler, it significantly increases the cold air output and heat exchange efficiency. Simultaneously, a reasonable airflow distribution ratio avoids heat accumulation at the hot end due to insufficient airflow in the heat dissipation channel, or energy waste due to excessive airflow in the cooling channel, thus achieving a dual improvement in the overall cooling performance and energy efficiency of the cooling fan.

[0046] In one embodiment, the cooling fins 420 and / or the heat dissipation fins 430 are welded to the thermoelectric cooler 410. Thus, welding the cooling fins and / or heat dissipation fins to the thermoelectric cooler reduces contact thermal resistance compared to traditional bonding methods, ensuring efficient heat / cold transfer and avoiding cooling efficiency degradation caused by excessive contact interface thermal resistance. For example, please refer to... Figure 8The cooling fins 420 are composed of a continuous metal sheet folded multiple times to form a paper-like structure. The folded pieces are arranged at an angle to each other, forming trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip towards the free end. The gaps between them form the cooling heat exchange channels. The heat dissipation fins are also composed of a continuous metal sheet folded multiple times to form a paper-like structure. The folded pieces are arranged at an angle to each other, forming trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip towards the free end. The gaps between them form the heat dissipation channels. Thus, the paper-like structure of the cooling / heat dissipation fins, with its multiple folds and angled arrangement, forms trapezoidal / conical fins that are wide at the root and narrow at the free end. Compared to conventional straight fin structures, the paper-like structure increases the contact area between the airflow and the fins, extends the airflow path, and increases turbulence, thereby enhancing the heat exchange effect. Furthermore, the heat exchange channels formed by the gaps guide the airflow evenly through the fins, avoiding uneven local airflow. In one embodiment, the cooling fins 420 and / or the heat dissipation fins 430 are soldered to the semiconductor refrigeration chip using a low-temperature solder. The low-temperature solder comprises the following components in the following mass percentages: Sn 64%, Bi 35%, and Ag 1%. Thus, using a low-temperature solder containing Sn 64%, Bi 35%, and Ag 1% to solder the cooling / heat dissipation fins to the semiconductor refrigeration chip reduces the soldering temperature compared to conventional high-temperature solder, avoiding damage to the thermoelectric materials inside the semiconductor refrigeration chip caused by high temperatures. At the same time, the silver component can improve the thermal conductivity and connection strength of the solder joint, reducing the increase in contact thermal resistance caused by solder joint aging.

[0047] In one embodiment, please refer to Figures 3 to 8 The semiconductor cooling and heat dissipation structure 400 further includes a heat-insulating foam 440. The heat-insulating foam 440 has a hollow rectangular frame structure. The semiconductor cooling chip 410, the cooling fins 420, and the heat dissipation fins 430 are all located within the rectangular frame structure. The cooling fins 420 and the heat dissipation fins 430 are all connected to the heat-insulating foam 440. The extending direction of the heat-insulating foam 440 is consistent with the extending direction of the heat dissipation channel or the cooling heat exchange channel. Thus, by adding hollow rectangular frame-shaped thermal insulation foam to completely enclose the semiconductor cooling chip, cooling fins, and heat dissipation fins, and with the insulation foam extending in the same direction as the cooling heat exchange channel, an effective thermal insulation barrier can be formed. This blocks heat conduction and radiation from the hot end to the cold end, reduces heat loss, and avoids a decrease in cooling efficiency caused by cross-flow of hot and cold air. In addition, the insulation foam can fix and buffer the components, improve the overall integrity and shock resistance of the semiconductor cooling heat dissipation structure, further ensure the effective cooling capacity of the semiconductor cooling chip, reduce operating energy consumption, and enhance the long-term operating stability and reliability of the cooling fan.

[0048] In one embodiment, the insulating substrate of the thermoelectric cooler 410 is a 96% alumina ceramic substrate; this can improve the insulation performance and thermal conductivity of the thermoelectric cooler, and reduce the risk of leakage. For example, in a vacuum environment, the maximum cooling capacity of the thermoelectric cooler 410 is 80 watts to 100 watts; the maximum temperature difference ΔT max The temperature range is 67℃ to 84℃, which ensures that the product has a stable upper limit for cooling output in practical applications, meeting the cooling needs of different scenarios and comprehensively improving the heat exchange efficiency, operational stability, and adaptability of the cooling fan. For example, along the extension direction of the cooling heat exchange channel, the length of the semiconductor cooling chip is 20mm or more, preferably 26mm or more, and more preferably 28mm or more, thus ensuring the cooling requirements for miniaturized fans.

[0049] In one embodiment, please refer to Figures 1 to 8 The cooling fan also includes a fan housing 100. The fan 300, the semiconductor cooling and heat dissipation structure 400, and the air distribution structure 500 are all installed inside the fan housing 100. The fan housing 100 has opposing air inlet areas, cold air outlet areas, and hot air outlet areas. The fan housing 100 has multiple air inlet holes 111 in the air inlet area, multiple cold air outlet holes 112 in the cold air outlet area, and multiple... The hot air outlet 121 corresponds to the air inlet 111, which corresponds to the air inlet 310 of the fan 300; the cold air outlet 112 corresponds to the refrigeration heat exchange channel; and the hot air outlet 121 corresponds to the heat dissipation channel. In this way, the air inlet area, the cold air outlet area, and the hot air outlet area are respectively provided with air inlet holes, cold air outlet holes, and hot air outlet holes, and each hole position corresponds precisely to the corresponding air duct. This can realize the directional introduction and output of airflow, avoid the mixing of airflows from different temperature zones, and improve the purity of cold air and the efficiency of hot air discharge.

[0050] For example, the air distribution structure 500 includes an air distribution plate 510 and mounting portions 520 located at both ends of the air distribution plate 510. The fan housing 100 has mounting grooves in its interior corresponding to the mounting portions 520. Each mounting portion 520 is installed in the mounting groove. In this way, the air distribution structure can quickly assemble and position the air distribution plate by cooperating with the mounting portion and the mounting groove inside the fan housing, ensuring the stability of the air distribution plate position and avoiding air distribution failure caused by air distribution plate displacement during operation. For example, the air distributor 510 has an arc-shaped structure. One end of the arc-shaped structure is pressed against the hot end of the semiconductor cooling chip 410, and the other end of the arc-shaped structure is adjacent to the air outlet 320 of the fan 300. The arc-shaped structure gradually moves away from the hot end of the semiconductor cooling chip from the direction adjacent to the air outlet. In this way, one end of the arc-shaped air distributor is pressed against the hot end of the semiconductor cooling chip, and the other end is adjacent to the air outlet of the fan and gradually moves away from the hot end from the air outlet. This can smoothly guide the airflow at the air outlet of the fan, efficiently directing most of the airflow to the cooling heat exchange channel, while diverting a small portion of the airflow to the heat dissipation channel. Compared with a straight air distributor, the arc-shaped structure can reduce airflow impact and turbulence loss, improve the diversion efficiency and airflow uniformity, and ultimately improve the controllability, separation degree and overall heat exchange efficiency of the cooling fan.

[0051] In one embodiment, the cooling fan further includes a battery assembly, which includes a battery housing 200 and a battery 230 located inside the battery housing 200. The battery housing 200 is rotatably connected to the fan housing 100, and the outlines of the battery housing 200 and the fan housing 100 are both approximately rectangular. For example, the battery housing 200 can rotate 180 degrees relative to the fan housing 100. When rotating relative to the battery housing 200, the fan housing 100 has a stacked position and a lying position. When in the stacked position, the fan housing 100 and the battery housing 200 are stacked together, forming an upright state. When in the lying position, the fan housing 100 and the battery housing 200 are unfolded, forming a flat position. The fan housing 100 has a stacking surface and a back surface. The air inlet area and the cold air outlet area are both located on the back surface, and the hot air outlet area is located on the stacking surface. When the fan housing and the battery housing are in the stacked position, there is a gap between the hot air outlet area and the battery housing that connects to the outside. Thus, the battery housing and the fan housing are connected by a rotating mechanism, and both the battery housing and the fan housing have an approximately rectangular structure. Compared with traditional fixed battery or separate power supply designs, this application can improve the structural compactness of the cooling fan, making the product easier to store and carry. It also improves the flexibility of use, allowing the rotation angle to be adjusted as needed. The battery assembly provides independent power to the cooling fan, can accommodate larger capacity batteries, eliminates dependence on external power sources, expands product application scenarios, and its rotating connection structure can adapt to different placement angles, meeting diverse user needs, improving product portability and applicability, and enhancing the cooling fan's market adaptability. When the fan housing and battery housing are stacked, a gap exists between the hot air outlet area and the battery housing, facilitating hot air exhaust and avoiding the impact of stacking. For example, the cold air outlet area is located at the end of the fan housing away from the rotation axis where the battery housing is mounted, thus improving the cooling fan's ease of use and allowing for more flexible adjustment of the cold air outlet position to suit diverse user needs. For example, the battery housing 200 includes a snap-fit ​​upper battery housing 210 and a lower battery housing 220, with a fan switch 211 mounted on the upper battery housing 210. For example, the battery is electrically connected to the fan switch, a thermoelectric cooler, and the fan. Furthermore, the cooling fan also includes a controller, which is electrically connected to the battery, fan switch, thermoelectric cooler, and fan.

[0052] In one embodiment, the cooling fan further includes an air guide structure 600 located within the fan housing 100. The air guide structure includes a connected cold air guide vane 610 and a hot air guide vane 620. The air guide structure 600 has an overall approximately V-shaped structure. The apex of the approximately V-shaped structure is connected to the semiconductor cooling chip 410. The cold air guide vane 610 and the cooling fin 420 are located on the same side, and the hot air guide vane 620 and the heat dissipation fin 430 are located on the same side. The airflow direction of the cold air guide vane 610 is towards the cold air outlet 112, and the airflow direction of the hot air guide vane 620 is towards the hot air outlet 121. Thus, compared to a direct-blowing design without a guide structure, the V-shaped guide structure can divert and guide hot and cold airflow, improving space utilization, shortening the airflow path, reducing duct resistance and airflow interference, improving cold air output efficiency, accelerating hot air exhaust speed, and preventing hot air backflow. At the same time, the guide structure can evenly distribute airflow, ensuring that airflow passes evenly through the cooling / heat dissipation fins, avoiding a decrease in heat exchange efficiency caused by insufficient local airflow or excessive flow velocity, further improving the cooling performance and heat dissipation effect of the cooling fan, and enhancing overall operational stability.

[0053] In one embodiment, the fan housing 100 includes an upper housing 110 and a lower housing 120 connected to each other. The lower housing 120 has a stacking surface of the fan housing, and the upper housing 110 has a back surface of the fan housing. The upper housing 110 has a receiving groove 113 on the back surface, and the upper housing 110 has a slot 1131 on the bottom wall of the receiving groove 113 that exposes the air inlet 310 of the volute fan 300. An air inlet cover 114 is snapped onto the receiving groove 113, and the air inlet cover 114 has a plurality of air inlet holes 111. Thus, compared to a one-piece housing design, the split structure facilitates the assembly, maintenance, and replacement of internal components such as the fan and semiconductor cooling structure; the snap-fit ​​connection of the air inlet cover allows for quick assembly and disassembly, improving production assembly efficiency, while the structure design of the receiving slot can position and limit the air inlet cover, preventing it from loosening or shifting; the air inlet holes are evenly distributed on the air inlet cover, ensuring uniform and smooth air intake for the fan, reducing air intake resistance, reducing fan operating noise, improving fan efficiency, and thus ensuring the overall cooling performance and operational stability of the cooling fan.

[0054] In one embodiment, the air distribution plate 510 divides the outflow channel of the air outlet 320 of the fan 300 into a first channel and a second channel. The airflow in the first channel accounts for 60%-80% of the total airflow of the fan and is guided to the cooling fins 420. The airflow in the second channel accounts for 20%-40% of the total airflow of the fan and is guided to the heat dissipation fins 430. Thus, compared with conventional equal flow distribution or directional ratio design, this ratio can fully match the cooling and heat dissipation requirements of the thermoelectric cooler. The large flow rate of 60%-80% can quickly remove the cold air from the cooling fins, improve the cold air output and cooling response speed, and avoid cold air accumulation. The small flow rate of 20%-40% can meet the basic heat dissipation requirements of the heat dissipation channel, prevent the thermoelectric cooler from becoming too hot and causing the cooling efficiency to decrease or even stop. At the same time, it can avoid the increase in fan energy consumption caused by excessive airflow in the cooling channel, achieve a balance between cooling efficiency and energy efficiency, and significantly improve the overall performance of the cooling fan.

[0055] In one embodiment, the air distribution angle of the air distributor 510 is adjustable, making the airflow of the guiding cooling fins positively correlated with the cooling capacity of the thermoelectric cooler. When the cooling capacity increases, the proportion of airflow to the guiding cooling fins increases accordingly. Thus, the air distribution angle of the air distributor is adjustable, and the proportion of airflow on the cooling side increases accordingly when the cooling capacity increases. The airflow distribution can be dynamically adjusted according to the actual cooling conditions of the thermoelectric cooler. Compared to a fixed air distribution structure, this design can adapt to different cooling needs (such as high cooling capacity, low cooling capacity), ensuring that the cooling efficiency is always within the optimal range. In specific applications, a micro-motor adjustment method or a manual adjustment method can be used.

[0056] In one embodiment, the air distributor is inclined, with an angle of 30°-60° to the air outlet direction of the vortex fan, to guide most of the airflow to the cooling fins. Thus, the 30°-60° inclined air distributor efficiently guides most of the airflow to the cooling fins while reducing the impact resistance between the airflow and the air distributor, thereby minimizing energy loss. Alternatively, it can be configured as an arc-shaped plate based on the inclined design. In this case, the 30°-60° inclined air distributor can efficiently guide most of the airflow to the cooling fins while reducing the impact resistance between the airflow and the air distributor, thereby minimizing energy loss.

[0057] In one embodiment, the first airflow blows perpendicularly across the gaps between the cooling fins, and the second airflow blows parallel across the gaps between the heat dissipation fins. Thus, the first airflow blowing perpendicularly across the gaps between the cooling fins increases the contact area and heat exchange time between the airflow and the fins, thereby enhancing the cooling and heat exchange effect. The second airflow blowing parallel across the gaps between the heat dissipation fins balances heat dissipation efficiency and airflow resistance.

[0058] In one embodiment, the cooling fan further includes an airflow adjustment mechanism. This mechanism adjusts the angle of the air distribution vanes based on the real-time temperatures of the cooling fins and heat sink fins to adjust the airflow distribution ratio. Thus, by adjusting the airflow angle according to the real-time temperatures of the cooling / heat sink fins, the airflow adjustment mechanism achieves closed-loop control, promptly responding to changes in hot / cold end temperatures, preventing overheating at the hot end or waste of cooling capacity at the cold end, and further enhancing the cooling fan's adaptability, operational stability, and overall energy efficiency.

[0059] The aforementioned cooling fan based on a semiconductor cooling and heat dissipation structure employs a split-flow structure and a semiconductor cooling and heat dissipation structure to solve the technical problems of insufficient cold air output, low heat dissipation efficiency, and poor synergy between cooling and heat dissipation in traditional cooling fans. The split-flow vane divides the airflow channel at the fan outlet into a first channel and a second channel, controlling the airflow into the cooling heat exchange channel to be greater than the airflow into the heat dissipation channel. This allows most of the airflow output by the fan to act on the copper or aluminum cooling fins, fully exchanging heat with the cooling fins at the cooling end of the semiconductor cooling chip. This maximizes the removal of cold air from the surface of the cooling fins, resulting in lower output cold air temperature and more stable airflow, improving the cooling effect and ensuring efficient cold air output to meet users' needs for rapid and continuous cooling. At the same time, a small portion of the airflow distributed by the split-flow vane enters the heat dissipation channel through the second channel, acting on the heat dissipation fins to quickly remove the heat generated at the heat dissipation end of the semiconductor cooling chip. This prevents heat accumulation at the heat dissipation end from causing a decrease in the cooling efficiency of the semiconductor cooling chip, ensuring that the semiconductor cooling chip remains in a stable and efficient cooling state for a long time. This achieves a combination of efficient cold air output and rapid hot air dissipation, further enhancing the overall cooling performance.

[0060] It's important to note that the cooling performance of a thermoelectric cooler is highly dependent on the dynamic balance between heat exchange at the cold end and heat dissipation at the hot end. Essentially, it involves transferring heat from the cold end to the hot end, rather than generating cooling from nothing. If the airflow distribution between the cold and hot ends is improper, the thermoelectric cooler will not operate at its optimal condition, potentially leading to a sharp drop in cooling efficiency, overheating protection at the hot end, frost formation at the cold end, and a significant increase in energy consumption. Therefore, the airflow distribution ratio between the cold and hot ends is one of the core parameters determining the overall performance of a cooling fan. The cold end needs a sufficiently large airflow to quickly remove the cooling energy, preventing it from accumulating inside the cooling fins and being unable to be output to the external environment. It also prevents the cold end temperature from becoming too low, causing frost and ice buildup, blocking the airflow duct, and further reducing heat exchange efficiency. Only by ensuring sufficient and stable airflow at the cold end can the cooling energy generated by the thermoelectric cooler be efficiently and continuously converted into a user-perceptible cool air output, improving the cooling experience and the uniformity of the outlet air temperature. The hot end only needs sufficient airflow for basic heat dissipation. Its core function is to promptly dissipate the heat transferred from the thermoelectric cooler, preventing the hot end temperature from continuously rising. Once the hot end temperature exceeds a critical value, the coefficient of performance (COP) of the thermoelectric cooler will rapidly decrease, and the cooling capacity of the cold end will drop significantly, creating a vicious cycle where the hotter the end gets, the worse the cooling becomes, and the hotter the end gets even hotter. However, allocating too much airflow to the hot end will cause two drawbacks: first, it will crowd out the airflow to the cold end, resulting in insufficient cold air output and a significant reduction in cooling effect; second, it will increase the fan load and overall energy consumption, causing energy waste, while also increasing exhaust noise and reducing user comfort. Therefore, the airflow between the cold and hot ends must maintain a reasonable and asymmetrical distribution: the airflow to the cold end should be significantly greater than that to prioritize cooling effect and cold air output; the airflow to the hot end only needs to be maintained within a range that allows for stable heat dissipation and prevents heat accumulation, and should not be too large. This application controls the airflow at the cold end to 60%-80% and the airflow at the hot end to 20%-40% through a split-air structure. This optimized design is based on the above mechanism: it can ensure that the cold end has sufficient airflow to achieve efficient cooling and heat exchange, and provide a moderate airflow to the hot end to maintain reliable heat dissipation. It avoids mutual interference, crossflow, or airflow imbalance between the cold and hot ends, so that the semiconductor cooling chip can work in the most efficient, stable, and energy-saving range for a long time, significantly improving the cooling performance, energy efficiency ratio, and operational reliability of the cooling fan.

[0061] In one embodiment, the air distribution ratio of the air distributor is set by the following optimized calculation formula to maximize the overall energy efficiency of the cooling fan system:

[0062]

[0063] in, The airflow directed to the cooling fins accounts for a certain percentage of the total airflow. proportion, The energy efficiency ratio of a semiconductor refrigeration chip. For the heat exchange efficiency of the cooling end, The value range is 0.6 to 0.8.

[0064] In this way, the air distribution ratio ensures optimal energy efficiency of the cooling fan, balancing user battery life and cooling needs. Once determined, the angle of the air distributor can be adjusted according to actual usage requirements. For example, the adjustment angle and coefficient relationship can be preset on the fan housing, or it can be automatically adjusted using a micro motor.

[0065] In one embodiment, the heat exchange efficiency of the cooling end is... Heat exchange efficiency at the heat dissipation end The airflow of each fin increases progressively, satisfying the following calculation formula:

[0066]

[0067]

[0068] in, , These are the heat transfer coefficients of the cooling fins and the heat dissipation fins, respectively. The specific values ​​can be obtained through experiments. The calculation formula means that the larger the air volume, the slower the rate of increase in heat transfer efficiency, and eventually it tends to stabilize.

[0069] In one embodiment, the air distribution ratio of the air distribution plate To ensure heat exchange matching between the cooling and heat dissipation ends, the following energy balance calculation formula must be satisfied:

[0070]

[0071] In the formula, Input power (W) of the thermoelectric cooler. The proportion of airflow distributed from the air distribution vanes to the heat dissipation fins; Specific heat capacity of air Air density, all of which are known constants; : Air temperature rise at the cooling end The air temperature rises at the heat dissipation end. Thus, the total heat absorbed by the cooling end through the airflow equals the total heat dissipated by the hot end through the airflow, minus the heat generated by the thermoelectric cooler itself, preventing heat buildup at the hot end from reducing cooling efficiency. By calculating and constraining the airflow ratio, a balance is ensured between the heat absorbed by the cold end and the heat dissipated by the hot end (including Joule heat), guaranteeing stable cooling performance.

[0072] In one embodiment, when the target cooling capacity needs to be achieved At that time, the air distribution ratio of the air distribution plate Satisfy the following calculation formula:

[0073]

[0074] in, This is the heat dissipation coefficient for hot-end redundancy, with a value ranging from 1.1 to 1.3, used to reserve heat dissipation redundancy; The overall heat transfer coefficient of the system can be measured experimentally. In practical applications, the target cooling capacity can be determined based on the user-input cold air temperature, and then calculated and converted accordingly. Based on the set target cooling capacity, the air distribution ratio is calculated backward to achieve dynamic and precise control, adapting to intelligent solutions with sensors.

[0075] In one embodiment, under rated operating conditions, the air distribution ratio of the air distribution vane is... The following simplified calculation formula is used:

[0076]

[0077] in, This is the proportional adjustment coefficient (range: 0.2~0.4). This represents the actual cooling capacity. This represents the theoretical maximum cooling capacity; the higher the actual cooling capacity, the greater the proportion of airflow directed to the cooling fins, and vice versa. The simplified calculation formula above facilitates engineering applications.

[0078] The aforementioned cooling fan based on a semiconductor cooling and heat dissipation structure employs a split-flow structure and a semiconductor cooling and heat dissipation structure to solve the technical problems of insufficient cold air output, low heat dissipation efficiency, and poor synergy between cooling and heat dissipation in traditional cooling fans. The split-flow vane divides the airflow channel at the fan outlet into a first channel and a second channel, controlling the airflow into the cooling heat exchange channel to be greater than the airflow into the heat dissipation channel. This allows most of the airflow output by the fan to act on the copper or aluminum cooling fins, fully exchanging heat with the cooling fins at the cooling end of the semiconductor cooling chip. This maximizes the removal of cold air from the surface of the cooling fins, resulting in lower output cold air temperature and more stable airflow, improving the cooling effect and ensuring efficient cold air output to meet users' needs for rapid and continuous cooling. At the same time, a small portion of the airflow distributed by the split-flow vane enters the heat dissipation channel through the second channel, acting on the heat dissipation fins to quickly remove the heat generated at the heat dissipation end of the semiconductor cooling chip. This prevents heat accumulation at the heat dissipation end from causing a decrease in the cooling efficiency of the semiconductor cooling chip, ensuring that the semiconductor cooling chip remains in a stable and efficient cooling state for a long time. This achieves a combination of efficient cold air output and rapid hot air dissipation, further enhancing the overall cooling performance.

[0079] The technical features of the embodiments described above can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification. It should be noted that the terms "in one embodiment," "for example," and "again," etc., in this application are intended to illustrate the application and not to limit it. The embodiments described above only illustrate several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A cooling fan based on a semiconductor cooling and heat dissipation structure, characterized in that, include: The fan has an air outlet; A semiconductor cooling and heat dissipation structure includes a semiconductor cooling chip and cooling fins and heat dissipation fins located on both sides of the semiconductor cooling chip. The semiconductor cooling and heat dissipation structure forms a cooling heat exchange channel on one side of the cooling fins, and the semiconductor cooling chip forms a heat dissipation channel on one side of the heat dissipation fins. The air distribution structure includes an air distribution vane located between the fan and the semiconductor cooling and heat dissipation structure. The air distribution vane divides the outflow channel of the fan outlet into a first channel and a second channel. The first channel is connected to the cooling heat exchange channel, and the second channel is connected to the heat dissipation channel. The airflow rate flowing into the cooling heat exchange channel is greater than the airflow rate flowing into the heat dissipation channel. The airflow rate in the first channel accounts for 60%-80% of the total airflow rate of the fan outlet and is guided to the cooling fins. The airflow rate in the second channel accounts for 20%-40% of the total airflow rate of the fan outlet and is guided to the heat dissipation fins. The cooling fins are made of copper or aluminum. The cooling fan also includes a fan housing. The fan, the semiconductor cooling and heat dissipation structure, and the air distribution structure are all installed inside the fan housing. The fan housing has corresponding air inlet area, cold air outlet area, and hot air outlet area. The fan housing has multiple air inlet holes in the air inlet area, multiple cold air outlet holes in the cold air outlet area, and multiple hot air outlet holes in the hot air outlet area. The air inlet holes correspond to the air inlet of the fan, the cold air outlet holes correspond to the cooling heat exchange channel, and the hot air outlet holes correspond to the heat dissipation channel. The air distribution structure includes an air distribution plate and mounting portions located at both ends of the air distribution plate. The fan housing has mounting grooves in the area corresponding to the mounting portions inside it. Each mounting portion is installed in the mounting groove. The air distribution plate has an arc-shaped structure. One end of the arc-shaped structure abuts against the hot end of the semiconductor cooling chip. The other end of the arc-shaped structure is adjacent to the air outlet of the fan. The arc-shaped structure gradually moves away from the hot end of the semiconductor cooling chip from the direction adjacent to the air outlet. The cooling fan also includes a battery assembly, which includes a battery housing and a battery located inside the battery housing. The battery housing is rotatably connected to the fan housing, and both the battery housing and the fan housing have an approximately rectangular structure. The battery housing can rotate 180 degrees relative to the fan housing, and the fan housing has a relative stacked position and a flat position when rotating relative to the battery housing; When stacked, the fan housing and the battery housing overlap, forming an upright position. When in a flat position, the fan housing and the battery housing unfold, forming a flat position. The fan housing has opposing stacking surfaces and opposing surfaces. The air inlet area and the cold air outlet area are both located on the opposing surface, while the hot air outlet area is located on the stacking surface. When the fan housing and the battery housing are stacked, there is a gap between the hot air outlet area and the battery housing that connects to the outside.

2. The cooling fan according to claim 1, characterized in that, The air inlet and outlet directions of the fan are perpendicular. The fan is a volute fan, and the outlet air volume is 0.2-0.5 m³ / s. 3 / min; And / or, the cooling fins and / or the heat dissipation fins are welded to the semiconductor cooling chip; And / or, the cooling fins are composed of a continuous metal plate folded multiple times to form a paper-like structure. The folds are arranged at an angle to each other to form trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip to the free end. The gaps between them form the cooling heat exchange channels. And / or, the heat dissipation fins are formed by a continuous metal plate through multiple folds to form a paper-like structure. The folds are arranged at an angle to each other to form trapezoidal or conical fins that gradually narrow from the root connected to the semiconductor cooling chip to the free end. The gaps between them form the heat dissipation channels. And / or, the insulating substrate of the semiconductor cooling chip is a 96% alumina ceramic substrate; And / or, in a vacuum environment, the maximum cooling capacity of the semiconductor refrigeration chip is 80 watts to 100 watts; the maximum temperature difference ΔT max The temperature ranges from 67°C to 84°C.

3. The cooling fan according to claim 2, characterized in that, The cooling fins and / or the heat dissipation fins are soldered onto the semiconductor cooling chip using low-temperature solder, wherein the low-temperature solder comprises the following components by mass percentage: Sn 64%, Bi 35%, Ag 1%; And / or, the semiconductor cooling heat dissipation structure further includes thermal insulation foam, the thermal insulation foam being a hollow rectangular frame structure, the semiconductor cooling chip, the cooling fins and the heat dissipation fins being located entirely within the rectangular frame structure, and the cooling fins and the heat dissipation fins being connected to the thermal insulation foam, the extension direction of the thermal insulation foam being consistent with the extension direction of the heat dissipation channel or the cooling heat exchange channel.

4. The cooling fan according to claim 2, characterized in that, The area where the cold air outlet is located is at one end of the fan housing away from the rotation axis where the battery housing is mounted.

5. The cooling fan according to claim 2, characterized in that, The cooling fan also includes an air guide structure located inside the fan housing. The air guide structure includes a connected cold air guide vane and a hot air guide vane. The air guide structure has an approximately V-shaped structure. The apex of the approximately V-shaped structure is connected to the semiconductor cooling chip. The cold air guide vane and the cooling fins are located on the same side, and the hot air guide vane and the heat dissipation fins are located on the same side. The airflow direction of the cold air guide vane is towards the cold air outlet, and the airflow direction of the hot air guide vane is towards the hot air outlet.

6. The cooling fan according to claim 2, characterized in that, The fan housing includes an upper shell and a lower shell connected to each other. The lower shell has a stacking surface of the fan housing, and the upper shell has a back surface of the fan housing. The upper shell has a receiving groove on the back surface, and the upper shell has a slot hole on the bottom wall of the receiving groove to expose the air inlet of the volute fan. An air inlet cover is snapped onto the receiving groove, and the air inlet cover has multiple air inlet holes.

7. The cooling fan according to claim 2, characterized in that, The air distribution angle of the air distribution plate is adjustable, so that the air volume of the guide cooling fins is positively correlated with the cooling capacity of the semiconductor cooling chip. When the cooling capacity increases, the proportion of air volume of the guide cooling fins increases accordingly. And / or, the air distribution vane is inclined, with an angle of 30°-60° with the air outlet direction of the vortex fan, so as to guide most of the airflow to the cooling fins; And / or, the cooling fan further includes an airflow adjustment mechanism, which adjusts the angle of the air distribution vanes according to the real-time temperature of the cooling fins and heat dissipation fins to adjust the airflow distribution ratio.

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