MEMS chip test method, device and equipment and storage medium
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-03
- Publication Date
- 2026-04-03
AI Technical Summary
Existing MEMS chip testing is inefficient and costly. Traditional full-wafer, full-parameter testing is time-consuming, which severely restricts production efficiency and cost.
Multiple regions on the surface of the MEMS chip are selected for capacitance testing. The average pull-in voltage of each region is calculated. If the average voltage is within a preset range, the entire chip is tested for capacitance. Otherwise, subsequent tests are stopped. This multi-region VP value pre-screening improves production efficiency.
By conducting multi-zone VP value pre-testing, qualified chips can be quickly identified, improving production efficiency, reducing production costs, and ensuring chip quality.
Smart Images

Figure CN121784512A_ABST