MEMS chip test method, device and equipment and storage medium

CN121784512APending Publication Date: 2026-04-03GOERTEK MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-03
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing MEMS chip testing is inefficient and costly. Traditional full-wafer, full-parameter testing is time-consuming, which severely restricts production efficiency and cost.

Method used

Multiple regions on the surface of the MEMS chip are selected for capacitance testing. The average pull-in voltage of each region is calculated. If the average voltage is within a preset range, the entire chip is tested for capacitance. Otherwise, subsequent tests are stopped. This multi-region VP value pre-screening improves production efficiency.

Benefits of technology

By conducting multi-zone VP value pre-testing, qualified chips can be quickly identified, improving production efficiency, reducing production costs, and ensuring chip quality.

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Abstract

The invention provides an MEMS chip testing method, device and equipment and a storage medium, and the method comprises the steps: selecting a plurality of regions on the surface of each to-be-tested MEMS chip, carrying out the capacitance testing of the plurality of regions, and obtaining a pull-in voltage VP value corresponding to each region; carrying out average value calculation on the VP values of the plurality of regions to obtain a multi-region VP average value of the MEMS chip; if the multi-region VP mean value is within a preset range, determining that the MEMS chip preliminarily meets the design requirement, and performing a whole capacitance test on the MEMS chip; on the contrary, the follow-up test on the MEMS chip is stopped. According to the invention, preliminary screening is carried out through the multi-region VP value pre-test, the whole capacitance test is carried out on the MEMS chip which preliminarily meets the design requirement, and the subsequent test is stopped if the MEMS chip is unqualified through preliminary screening, so that the core pain points of low efficiency and high cost in the traditional MEMS chip test are effectively solved, the production efficiency of the MEMS chip can be improved, and the production cost is reduced.
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