A multi-pin electrode LTCC product with an embedded electrode design and a preparation method thereof

Abstract

The application discloses a multi-pin electrode LTCC product with an electrode embedded design and a preparation method, belongs to the technical field of LTCC low-temperature co-fired ceramic, and solves the problem that the plating thickness of non-conducting pins is lower than that of conducting pins due to small current passing amount during electroplating; the method comprises the following steps: punching and filling silver paste at positions corresponding to non-conducting pins on a first layer of mosite ceramic tape to obtain a thickened layer; laying a second layer of mosite ceramic tape on the thickened layer to obtain an insulating layer; and preparing a main body electric layer on the insulating layer. In the application, the positions corresponding to non-conducting pins on the first layer of mosite ceramic tape are punched and filled with metal silver paste, and by using the material sintering shrinkage principle, the metal silver paste filled in the holes is pressed out after subsequent sintering of the product, so that the thickness of the non-conducting pins is increased; therefore, the non-conducting pins are thicker than the conducting pins after sintering, the difference in electrode thickness of 7um-30um after electroplating can be compensated, and the problem of high and low pins is avoided.

Description

Technical Field

[0001] This invention relates to the field of LTCC (Low Temperature Co-fired Ceramic) technology, and particularly to a multi-pin electrode LTCC product with an embedded electrode design and its preparation method. Background Technology

[0002] The LTCC design employs a three-dimensional structure, combining capacitors and inductors with the circuit design of each layer and the conductivity requirements of the via electrodes. Subsequent processing relies on traditional multilayer ceramic technology. A rolled green ceramic tape is cut into sheets, then laser-drilled, silver paste is injected into the micro-holes, and precision printing is used to create circuit patterns. After heating and drying, the circuit patterns are used to obtain green ceramic tapes covered with metal electrodes. Multiple green ceramic tapes with metal electrodes are heated, dried, stacked, cut into granules, and then debinded and sintered. Subsequent processes include edge rolling, end silvering, sintering, electroplating, external inspection, and packaging to produce multi-pin electrode LTCC filter products. LTCC filter products, because their internal design includes capacitors and inductors, all feature a multi-pin electrode design, including both conducting and non-conducting pins. For example... Figure 4 As shown, pins B, D, and F are non-conductive pins, while pins A, C, and E are conductive pins. During electroplating, because the current flows less through the non-conductive pins, the plating thickness on the non-conductive pins is 7µm to 30µm less than that on the conductive pins. Figure 5 As shown, Figure 5 Figures a and b in the diagram show the plating thickness of the non-conductive and conductive pins, respectively. Therefore, during electrical measurements, the difference in electrode height between the pins can easily lead to poor contact, thus affecting the measurement, or it can easily cause cold solder joints during welding. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a multi-pin electrode LTCC product with an embedded electrode design and its preparation method, which solves the problem that the plating thickness of the non-conductive pins is lower than that of the conductive pins due to insufficient current flow during electroplating.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A method for fabricating a multi-pin electrode LTCC product with an in-electrode design includes the following steps: S1: Take the first layer of raw ceramic tape, drill holes at the corresponding non-conductive pin positions and fill them with silver paste to obtain the thickened layer; S2: Take the second layer of ceramic tape and lay it on the thickened layer to obtain the insulation layer; S3: Prepare the main electrical layer on the insulating layer; S4: The thickening layer, the insulating layer and the main electrical layer are stacked and pressed together to obtain a multi-layered sheet-like green preform; S5: Cut the multi-layered sheet-like green body into granules, then remove the glue, sinter, and roll the edges to obtain the cooked ceramic body structure. S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode on the side of the cooked ceramic body structure. S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

[0005] In this solution, holes are drilled and filled with metallic silver paste at the positions corresponding to the non-conductive pins on the first layer of the green ceramic tape. After the product is sintered, the metallic silver paste is pressed out from the holes using the principle of material shrinkage during sintering, increasing the thickness of the non-conductive pins. Figure 6 As shown; therefore, after sintering, the non-conductive pins will be thicker than the conductive pins, which can compensate for the difference in electrode thickness from 7um to 30um after electroplating and avoid the problem of high and low pins.

[0006] Furthermore, S1 includes the following steps: S101: Take the first layer of green ceramic tape with a thickness of 80um~120um, and drill holes at the corresponding non-conductive pin positions with a hole diameter of 80um~120um; S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape into an oven and bake for 5-15 minutes at a temperature of 40℃-100℃ to obtain a thickened layer with embedded electrodes.

[0007] In this solution, a thickening layer is added, and holes are drilled inside the thickening layer to fill it with silver paste, realizing the design of the electrode embedded in the non-conductive pin. This increases the thickness of the non-conductive pin and overcomes the problem that the plating thickness of the non-conductive pin is lower than that of the conductive pin after electroplating due to the small amount of current passing through it.

[0008] Furthermore, in S2, a second layer of bismuth ceramic tape with a thickness of 60um to 120um is laid on the first layer of bismuth ceramic tape to serve as a blank insulating layer.

[0009] Furthermore, S3 includes the following steps: S301: Take the third layer of raw ceramic tape, make holes, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 5~15 minutes at a temperature of 40℃~100℃. S302: Print electrode patterns on the third layer of raw ceramic tape; after printing, place it in an oven for baking for 5-15 minutes at a temperature of 40℃-100℃. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer is completed, then proceed to S4.

[0010] Furthermore, in S5, after the multi-layered sheet-like green preform is cut into granules, it is debonded at 250~450℃ and sintered at 850~950℃.

[0011] Furthermore, in S301, the aperture of the perforated pores on the third layer of green ceramic tape is 30um~120um.

[0012] In a second aspect, the present invention provides a multi-pin electrode LTCC product with an in-situ electrode design prepared by the preparation method of the first aspect, comprising a thickening layer, an insulating layer, and a main electrical layer, wherein the thickening layer, the insulating layer, and the main electrical layer are stacked sequentially from bottom to top; multi-pin electrodes are arranged on both sides of the thickening layer, the insulating layer, and the main electrical layer, and the top of the multi-pin electrodes is connected to the corresponding pad in the main electrical layer; an in-situ electrode is provided inside the thickening layer at the corresponding non-conductive pin, and the in-situ electrode is connected to the multi-pin electrode at the non-conductive pin.

[0013] The beneficial effects of this invention are: This invention provides a method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design. A thickening layer is formed, and holes are drilled and filled with silver paste at the non-conductive pins of the thickening layer to create an embedded electrode structure. During product sintering, the non-conductive pins are pressed out after sintering, utilizing the principle of material shrinkage, thus increasing the thickness of the non-conductive pins. Figure 6 As shown; therefore, after sintering, the non-conductive pins will be thicker than the conductive pins, which can compensate for the 7um~30um thickness difference after electroplating. This avoids the phenomenon that the plating thickness of the non-conductive pins is lower than that of the conductive pins due to insufficient current flow during electroplating, thus solving the problem of electrode height difference. Consequently, poor contact will not occur due to electrode height difference during electrical measurement, and cold solder joints will not occur during welding. Attached Figure Description

[0014] Figure 1 This is a flowchart illustrating a method for preparing a multi-pin electrode LTCC product with an embedded electrode design according to the present invention. Figure 2 This is a schematic diagram of the structure of a multi-pin electrode LTCC product with an embedded electrode design according to the present invention; Figure 3 This is an exploded view of a multi-pin electrode LTCC product with an embedded electrode design according to the present invention. Figure 4 This is a schematic diagram showing the distribution of conductive and non-conductive pins in this invention; Figure 5This is a schematic diagram showing the high and low positions of the conducting and non-conducting pins in an LTCC filter product manufactured using traditional methods. Figure 6 This is a schematic diagram of the non-conducting pin in an LTCC filter product prepared using the method of the present invention.

[0015] Figure label: 1. Thickening layer; 2. Insulating layer; 3. Main electrical layer; 4. Embedded electrode; 5. Multi-pin electrode; Detailed Implementation The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Specific embodiments of the present invention are described below to facilitate understanding by those skilled in the art. However, it should be understood that the present invention is not limited to the scope of the specific embodiments. For those skilled in the art, various modifications are obvious as long as they fall within the spirit and scope of the present invention as defined and determined by the appended claims. All inventions utilizing the concept of the present invention are protected.

[0016] Example 1 like Figure 1 and Figure 2 As shown, this embodiment provides a method for fabricating a multi-pin electrode LTCC product with an embedded electrode design. This method adds an embedded electrode to the bottom layer of the multi-pin electrode LTCC filter, which can avoid a 7um~30um thickness difference between the non-conductive pins and the conductive pins caused by electroplating. The method includes the following steps: S1: Prepare thickening layer 1 by taking the first layer of raw ceramic tape; Specific steps: S101: Take the first layer of green ceramic tape with a thickness of 80um, and drill holes as needed at the corresponding non-conductive pin positions, such as... Figure 4 The positions of pins B, D, and F; the aperture is 80µm; S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape in an oven and bake for 15 minutes at a temperature of 85℃ to obtain a thickened layer 1 with embedded electrodes 4, as shown. Figure 3 As shown.

[0017] S2: Prepare insulating layer 2 using the second layer of raw ceramic tape; Specific steps: Take a second layer of 60um thick ceramic tape and lay it on the first layer of 60um thick ceramic tape to serve as a blank insulating layer 2.

[0018] S3: Prepare the main electrical layer 3 on the insulating layer 2; Specific steps: S301: Take the third layer of raw ceramic tape and drill holes with a diameter of 80um, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 15 minutes at a temperature of 85℃. S302: Replace the corresponding screen and silver paste, and print the electrode pattern on the third layer of green ceramic tape; after printing, place it in an oven to bake for 15 minutes at a temperature of 85°C. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer 3 is completed, then proceed to S4.

[0019] S4: The thickening layer 1, the insulating layer 2 and the main electrical layer 3 are stacked and pressed together to obtain a multi-layered sheet-like green preform; S5: The multi-layered sheet-like green body is cut into granules, then debinded at 350°C and sintered at 885°C. The subsequent process involves rolling the edges to obtain the cooked ceramic body structure.

[0020] S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode 5 on the side of the cooked ceramic body structure.

[0021] S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

[0022] Example 2 like Figure 1 As shown, this embodiment provides a method for fabricating a multi-pin electrode LTCC product with an in-electrode design, including the following steps: S1: Prepare thickening layer 1 by taking the first layer of raw ceramic tape; Specific steps: S101: Take the first layer of green ceramic tape with a thickness of 80um, and drill holes as needed at the corresponding non-conductive pin positions, such as... Figure 4 The positions of pins B, D, and F are specified; the aperture is 120µm. S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape into an oven and bake for 15 minutes at a temperature of 85°C to obtain a thickened layer 1 with embedded electrodes 4.

[0023] S2: Prepare insulating layer 2 using the second layer of raw ceramic tape; Specific steps: Take a second layer of 60um thick ceramic tape and lay it on the first layer of 60um thick ceramic tape to serve as a blank insulating layer 2.

[0024] S3: Prepare the main electrical layer 3 on the insulating layer 2; Specific steps: S301: Take the third layer of raw ceramic tape and drill holes with a diameter of 80um, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 15 minutes at a temperature of 85℃. S302: Replace the corresponding screen and silver paste, and print the electrode pattern on the third layer of green ceramic tape; after printing, place it in an oven to bake for 15 minutes at a temperature of 85°C. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer 3 is completed, then proceed to S4.

[0025] S4: The thickening layer 1, the insulating layer 2 and the main electrical layer 3 are stacked and pressed together to obtain a multi-layered sheet-like green preform; S5: The multi-layered sheet-like green body is cut into granules, then debinded at 350°C and sintered at 885°C. The subsequent process involves rolling the edges to obtain the cooked ceramic body structure.

[0026] S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode 5 on the side of the cooked ceramic body structure.

[0027] S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

[0028] Example 3 like Figure 1 As shown, this embodiment provides a method for fabricating a multi-pin electrode LTCC product with an in-electrode design, including the following steps: S1: Prepare thickening layer 1 by taking the first layer of raw ceramic tape; Specific steps: S101: Take the first layer of green ceramic tape with a thickness of 120um, and drill holes as needed at the corresponding non-conductive pin positions, such as... Figure 4 The positions of pins B, D, and F; the aperture is 80µm; S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape into an oven and bake for 15 minutes at a temperature of 85°C to obtain a thickened layer 1 with embedded electrodes 4.

[0029] S2: Prepare insulating layer 2 using the second layer of raw ceramic tape; Specific steps: Take a second layer of 60um thick ceramic tape and lay it on the first layer of 60um thick ceramic tape to serve as a blank insulating layer 2.

[0030] S3: Prepare the main electrical layer 3 on the insulating layer 2; Specific steps: S301: Take the third layer of raw ceramic tape and drill holes with a diameter of 80um, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 15 minutes at a temperature of 85℃. S302: Replace the corresponding screen and silver paste, and print the electrode pattern on the third layer of green ceramic tape; after printing, place it in an oven to bake for 15 minutes at a temperature of 85°C. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer 3 is completed, then proceed to S4.

[0031] S4: The thickening layer 1, the insulating layer 2 and the main electrical layer 3 are stacked and pressed together to obtain a multi-layered sheet-like green preform; S5: The multi-layered sheet-like green body is cut into granules, then debinded at 350°C and sintered at 885°C. The subsequent process involves rolling the edges to obtain the cooked ceramic body structure.

[0032] S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode 5 on the side of the cooked ceramic body structure.

[0033] S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

[0034] Example 4 like Figure 1 As shown, this embodiment provides a method for fabricating a multi-pin electrode LTCC product with an in-electrode design, including the following steps: S1: Prepare thickening layer 1 by taking the first layer of raw ceramic tape; Specific steps: S101: Take the first layer of green ceramic tape with a thickness of 120um, and drill holes as needed at the corresponding non-conductive pin positions, such as... Figure 4 The positions of pins B, D, and F are specified; the aperture is 120µm. S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape into an oven and bake for 15 minutes at a temperature of 85°C to obtain a thickened layer 1 with embedded electrodes 4.

[0035] S2: Prepare insulating layer 2 using the second layer of raw ceramic tape; Specific steps: Take a second layer of 60um thick ceramic tape and lay it on the first layer of 60um thick ceramic tape to serve as a blank insulating layer 2.

[0036] S3: Prepare the main electrical layer 3 on the insulating layer 2; Specific steps: S301: Take the third layer of raw ceramic tape and drill holes with a diameter of 80um, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 15 minutes at a temperature of 85℃. S302: Replace the corresponding screen and silver paste, and print the electrode pattern on the third layer of green ceramic tape; after printing, place it in an oven to bake for 15 minutes at a temperature of 85°C. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer 3 is completed, then proceed to S4.

[0037] S4: The thickening layer 1, the insulating layer 2 and the main electrical layer 3 are stacked and pressed together to obtain a multi-layered sheet-like green preform; S5: The multi-layered sheet-like green body is cut into granules, then debinded at 350°C and sintered at 885°C. The subsequent process involves rolling the edges to obtain the cooked ceramic body structure.

[0038] S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode 5 on the side of the cooked ceramic body structure.

[0039] S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

[0040] Comparative Example 1 This comparative example provides a method for preparing a multi-pin electrode LTCC product, including the following steps: S1: Take the first layer of raw ceramic tape with a thickness of 200um as the bottom layer.

[0041] S2: Take the second layer of raw ceramic tape and drill holes according to the design, with a hole diameter of 80um; after drilling, fill the holes with metallic silver paste, and after filling with silver paste, put the second layer of raw ceramic tape into the oven and bake for 15 minutes at a baking temperature of 85℃.

[0042] S3: Replace the corresponding screen and silver paste, and print the electrode pattern on the second layer of green ceramic tape; after printing, place it in an oven to bake for 15 minutes at a temperature of 85°C.

[0043] S4: Repeat S2~S3 to prepare the third and higher layers of green ceramic tape until the last layer is completed; after completion, the layers are stacked and pressed to obtain the multi-layered sheet-like green body finished product. S5: The multi-layered sheet-like green preform is cut into granules, then debinded at 350℃ and sintered at 885℃. The subsequent edge-rolling process yields a finished ceramic body structure. This structure is then subjected to silvering, sintering, and electroplating to create multi-pin electrodes 5 on the sides. Finally, after external inspection and packaging, a multi-pin electrode LTCC filter product is produced.

[0044] The multi-pin electrode LTCC products with in-electrode design prepared using the methods of Examples 1-4 and the multi-pin electrode LTCC filter products prepared in Comparative Example 1 were characterized respectively. The experimental results are shown in Table 1: Table 1. Performance characterization of products prepared by the preparation methods of Examples 1-4 and Comparative Example 1.

[0045] As shown in Table 1, the multi-pin electrode LTCC products of Embodiments 1-4 of the present invention, which employ an embedded electrode design, can effectively avoid the problem of high and low electrode pin positions, and will not crack or break during the sintering process. Figure 6 As shown. However, the electrode height and low pin position difference phenomenon of the multi-pin electrode LTCC product prepared by the conventional method in Comparative Example 1 is significantly higher than that in the embodiments of the present invention, such as... Figure 5 As shown. In Example 3, the internal retaining wall design significantly reduces the difference in electrode height to almost nothing, as... Figure 6 As shown. The preparation method of this invention does not require the use of high-end precision instruments, effectively avoiding the problem of high and low pin positions of electrodes in multi-pin electrode LTCC products.

[0046] Example 5 like Figure 2 and Figure 3 As shown, this embodiment provides a multi-pin electrode LTCC product with an in-line electrode design, including a thickening layer 1, an insulating layer 2, and a main electrical layer 3. The thickening layer 1, insulating layer 2, and main electrical layer 3 are stacked sequentially from bottom to top. Multi-pin electrodes 5 are arranged on both sides of the thickening layer 1, insulating layer 2, and main electrical layer 3, and the top of the multi-pin electrodes 5 is connected to the corresponding pad in the main electrical layer 3. The thickening layer 1 contains non-conductive pins (…). Figure 4 The B, D, and F pins are non-conductive pins, while the A, C, and E pins are conductive pins. An embedded electrode 4 is provided, which is connected to the multi-pin electrode 5 at the non-conductive pin.

[0047] Those skilled in the art will recognize that the embodiments described herein are intended to help the reader understand the principles of the invention and should be understood as not limiting the scope of protection of the invention to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the technical teachings disclosed herein without departing from the spirit of the invention, and these modifications and combinations are still within the scope of protection of the invention.

Claims

1. A method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design, characterized in that, Includes the following steps: S1: Take the first layer of raw ceramic tape, drill holes at the corresponding non-conductive pin positions and fill them with silver paste to obtain the thickened layer (1). S2: Take the second layer of ceramic tape and lay it on the thickened layer (1) to obtain the insulating layer (2); S3: Prepare the main electrical layer (3) on the insulating layer (2); S3 includes the following steps: S301: Take the third layer of raw ceramic tape, make holes, and fill the holes with metallic silver paste; after filling with silver paste, put it in an oven and bake for 5~15 minutes at a temperature of 40℃~100℃. S302: Print electrode patterns on the third layer of raw ceramic tape; after printing, place it in an oven for baking for 5-15 minutes at a temperature of 40℃-100℃. S303: Repeat S301~S302 until the preparation of other layers of green ceramic tape in the main electrical layer (3) is completed, and proceed to S4; S4: The thickened layer (1), the insulating layer (2) and the main electrical layer (3) are stacked and pressed together to obtain a multi-layered sheet-like green preform product; S5: Cut the multi-layered sheet-like green body into granules, then remove the glue, sinter, and roll the edges to obtain the cooked ceramic body structure. S6: The cooked ceramic body structure is silvered, sintered and electroplated to form a multi-pin electrode (5) on the side of the cooked ceramic body structure. S7: Finally, after external inspection and packaging, multi-pin electrode LTCC filter products are manufactured.

2. The method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design according to claim 1, characterized in that, S1 includes the following steps: S101: Take the first layer of green ceramic tape with a thickness of 80um~120um, and drill holes at the corresponding non-conductive pin positions with a hole diameter of 80um~120um; S102: Fill the holes drilled in the first layer of ceramic strip with metallic silver paste; S103: Place the first layer of raw ceramic tape into an oven and bake for 5~15 minutes at a temperature of 40℃~100℃ to obtain a thickened layer (1) with embedded electrodes (4).

3. The method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design according to claim 2, characterized in that: In S2, a second layer of bismuth ceramic tape with a thickness of 60um~120um is taken and laid on the first layer of bismuth ceramic tape to serve as a blank insulating layer (2).

4. The method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design according to claim 1, characterized in that: In step S5, the multi-layered sheet-like green preform is cut into granules, then debonded at 250-450°C, and sintered at 850-950°C.

5. The method for manufacturing a multi-pin electrode LTCC product with an embedded electrode design according to claim 1, characterized in that: In S301, the diameter of the holes drilled on the third layer of green ceramic tape is 30um~120um.

6. A multi-pin electrode LTCC product with an in-electrode design, prepared using the method for preparing an in-electrode design according to any one of claims 1 to 5, characterized in that: The material includes a thickening layer (1), an insulating layer (2), and a main electrical layer (3), which are stacked sequentially from bottom to top. Multi-pin electrodes (5) are arranged on both sides of the thickening layer (1), the insulating layer (2), and the main electrical layer (3), and the top of the multi-pin electrodes (5) is connected to the corresponding pad in the main electrical layer (3). An embedded electrode (4) is provided inside the thickening layer (1) at the corresponding non-conductive pin, and the embedded electrode (4) is connected to the multi-pin electrode (5) at the non-conductive pin.

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