一种抗CAF的电路板及其加工方法
By setting microporous isolation rings, interface reinforcement layers and sheet-like inorganic fillers on the circuit board, the problem of high CAF occurrence under high temperature and high humidity conditions is solved, and the insulation reliability and long-term stability of the circuit board are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGXI YIDONG ELECTRONIC TECH CO LTD
- Filing Date
- 2026-01-23
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, simply using high-performance substrates cannot completely suppress ion migration along the CAF (Conductivity, Energy, and Fragrance) pathway at the glass fiber bundle and resin interface under high temperature and humidity conditions.
By employing the synergistic effect of microporous isolation rings, interface reinforcement layers, and sheet-like inorganic fillers, a three-dimensional barrier network is formed by setting microporous isolation rings on the conductive layer, enhancing the interface reinforcement layer of the insulating layer, and dispersing sheet-like inorganic fillers in the resin matrix, thereby blocking the physical channels of CAF.
It effectively inhibits the occurrence and spread of CAF, improves the insulation reliability of circuit boards in high temperature and high humidity environments, enhances interfacial bonding and migration path resistance, and prevents ion migration.
Smart Images
Figure CN121793233B_ABST