Manufacturing method of photovoltaic module and photovoltaic module

By setting an extension of the first adhesive film on the main body of the solder strip and forming a fixed part in the pretreatment to contact the solar cell, the problem of unstable positioning of the solder strip during the low-temperature lamination process is solved, thereby improving the manufacturing yield and reliability of photovoltaic modules.

CN121793499APending Publication Date: 2026-04-03JINKO SOLAR (HAINING) CO LTS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-05
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

During the low-temperature lamination welding process, the solder strip is susceptible to displacement due to insufficient positioning stability and is easily affected by external forces, which can cause local short circuits and affect the electrical performance and long-term reliability of photovoltaic modules.

Method used

An extension of the first adhesive film is provided on the main body of the solder ribbon. Through pretreatment, it is pre-crosslinked to form a fixing part that contacts the battery cell, fixing the main body of the solder ribbon on the battery cell and preventing the solder ribbon from shifting due to force or adhesive film flow during the lamination process.

Benefits of technology

This improved the positioning accuracy and welding reliability of the solder strip, thereby increasing the manufacturing yield and reliability of photovoltaic modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the photovoltaic field, in particular to a manufacturing method of a photovoltaic module and the photovoltaic module, and the manufacturing method comprises the steps: providing a composite welding strip which comprises a welding strip main body and a first adhesive film arranged on the welding strip main body, and the first adhesive film comprises an extension part which protrudes out of the welding strip main body and extends along a first direction, the first direction is the width direction of the welding strip main body; a plurality of battery pieces are provided, the composite welding strip is laid on the battery pieces, and a welding strip body faces the battery pieces; pre-processing is carried out, so that the extension part is subjected to pre-crosslinking and converted into a fixed part, and the fixed part is in contact with the battery piece, so that the welding strip main body is fixed on the battery piece; the first substrate, the second adhesive film, the battery string and the second substrate are stacked in sequence to form a stacked piece, and the second adhesive film is located between the first substrate and the second substrate; and laminating the laminated piece to obtain the photovoltaic module. According to the invention, the manufacturing yield and reliability of the photovoltaic module can be improved at least.
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Description

Technical Field

[0001] This disclosure relates to the photovoltaic field, and in particular to a method for manufacturing a photovoltaic module and a photovoltaic module. Background Technology

[0002] With the rapid development of solar photovoltaic technology, low-temperature lamination welding technology has been widely used in temperature-sensitive new photovoltaic technologies such as heterojunction, perovskite, and tandem cells due to its ability to reduce thermal stress and the risk of microcracks in cells. This process typically completes the welding of the solder strips and module lamination simultaneously at a relatively low temperature, achieving integrated electrical connection and encapsulation.

[0003] However, during the low-temperature lamination welding process, due to the low process temperature, the positioning stability of the solder strip before curing is insufficient. It is easily affected by external forces and may shift in position, which can easily cause local short circuits and affect the electrical performance and long-term reliability of the components. Summary of the Invention

[0004] This disclosure provides a method for manufacturing a photovoltaic module and a photovoltaic module, which can at least improve the manufacturing yield and reliability of photovoltaic modules.

[0005] This disclosure provides a method for manufacturing a photovoltaic module. The method includes: providing a composite solder ribbon, the composite solder ribbon including a solder ribbon body and a first adhesive film disposed on the solder ribbon body, the first adhesive film including an extension portion protruding from the solder ribbon body and extending along a first direction, the first direction being the width direction of the solder ribbon body; providing a plurality of solar cells, laying the composite solder ribbon on the plurality of solar cells, the solder ribbon body facing the solar cells; performing pretreatment to pre-crosslink the extension portion into a fixing portion, the fixing portion contacting the solar cells to fix the solder ribbon body onto the solar cells; sequentially stacking a first substrate, a second adhesive film, the solar cell string, and a second substrate to form a laminate, the second adhesive film being located between the first substrate and the second substrate; and laminating the laminate to obtain a photovoltaic module.

[0006] Optionally, the extension portion is provided on both opposite sides of the welding strip body, and the extension portion extends along a second direction, which is the length direction of the welding strip body.

[0007] Optionally, the extension includes a plurality of protrusions spaced apart along the second direction.

[0008] Optionally, the plurality of protrusions located on opposite sides of the welding strip body are staggered in the second direction.

[0009] Optionally, the first adhesive film includes an adhesive film body, and the adhesive film body is laid on the side of the welding strip body.

[0010] Optionally, the solder strip body includes two end regions spaced apart along the second direction and a central region located between the two end regions; the first adhesive film includes a first film segment corresponding to the end regions and a second film segment corresponding to the central region; in the first direction, the width of the first film segment is greater than the width of the second film segment.

[0011] Optionally, the welding strip body is a flat welding strip, and the first surface of the welding strip body facing the first adhesive film has a groove, and the first adhesive film fills the groove.

[0012] Optionally, the pretreatment includes: heating the battery cell; wherein the process parameters of the heating treatment include: a process temperature of 100℃~130℃ and a process duration of 0.5S~3S.

[0013] Optionally, the lamination of the laminated components includes: performing a first-stage lamination in a first preset environment; and performing a second-stage lamination in a second preset environment; wherein the first temperature of the first preset environment is lower than the second temperature of the second preset environment.

[0014] This disclosure also provides a photovoltaic module, which is manufactured by the method for manufacturing a photovoltaic module as described in any of the preceding claims.

[0015] The technical solution provided in this disclosure has at least the following advantages: This disclosure provides a first adhesive film on the solder ribbon body. The first adhesive film has an extension portion that extends along the width direction of the solder ribbon body and protrudes from the solder ribbon body. By pre-crosslinking the extension portion during the pretreatment process to form a fixing portion and contacting the solar cell, the solder ribbon body is fixed to the solar cell before lamination. This prevents the solder ribbon body from shifting due to force or adhesive film flow during subsequent lamination and stacking, thereby improving the positioning accuracy and welding reliability of the solder ribbon body, and thus improving the manufacturing yield and reliability of photovoltaic modules. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 A schematic flowchart illustrating a method for manufacturing a photovoltaic module according to an embodiment of this disclosure; Figure 2 A top view of the composite solder strip provided in an embodiment of this disclosure; Figure 3 This is a cross-sectional view of the composite welding strip provided in an embodiment of this disclosure; Figure 4 This is a top view of the structure after the composite welding strip is laid on the battery cell; Figure 5 This is a cross-sectional view of the structure after the composite welding strip is laid on the battery cell; Figure 6 Another top view of the composite solder strip provided in this embodiment of the present disclosure; Figure 7 Another top view of the composite solder strip provided in the embodiments of this disclosure; Figure 8 Another top view of the composite solder strip provided in the embodiments of this disclosure; Figure 9 This is another top view of the composite solder strip provided in the embodiments of this disclosure.

[0018] Explanation of reference numerals in the attached figures: Composite welding strip 10, welding strip body 11, first adhesive film 12, extension 121, battery cell 20, protrusion 1211, adhesive film body 122, end region I, middle region II, first film segment 123, and second film segment 124. Detailed Implementation

[0019] Currently, in the low-temperature lamination welding process of photovoltaic modules, solder ribbons are typically laid on the solar cells, and welding and encapsulation are completed simultaneously through lamination. However, due to the poor wettability and slow curing of the solder at low temperatures, the solder ribbons are prone to displacement during lamination due to film flow or pressure, leading to contact with adjacent electrodes and short circuits.

[0020] Based on an in-depth analysis of the aforementioned technical problems, this disclosure provides a method for manufacturing a photovoltaic module. A first adhesive film with an extension is provided on the main body of the solder ribbon. The extension protrudes along the width direction of the solder ribbon and can be pre-crosslinked during the pretreatment stage to form a fixing part that contacts the solar cell. This fixes the main body of the solder ribbon onto the solar cell before lamination, thereby preventing the solder ribbon from shifting due to force or adhesive film flow during subsequent lamination and stacking. This improves the positioning accuracy of the solder ribbon and the welding reliability, thereby improving the manufacturing yield and reliability of the photovoltaic module.

[0021] In the description of the embodiments of this disclosure, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary or secondary relationship of the indicated technical features. In the description of the embodiments of this disclosure, "multiple" means two or more, unless otherwise explicitly defined. Similarly, "multiple sets" refers to two or more sets (including two sets), and "multiple pieces" refers to two or more pieces (including two pieces).

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] In the description of the embodiments of this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0024] In the description of the embodiments of this disclosure, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of this disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this disclosure. For example, if the device or element in the illustration is inverted, then the element described as "below," "under," "below," or "bottom" of other elements or features will be oriented "above" or "top" of said other elements or features. Therefore, the term "below" may, depending on the context in which the term is used, encompass both above and below orientations, which will be obvious to those skilled in the art. Materials may be oriented in other ways (e.g., rotated 90 degrees, inverted, flipped), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0025] In the description of the embodiments of this disclosure, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0026] In the accompanying drawings corresponding to the embodiments of this disclosure, the thickness and / or area of ​​layers, films, panels, regions, etc., are enlarged for better understanding and ease of description. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be an intermediate component between the two components. Conversely, when describing a component on the surface of another component, or a component "directly" on another component, or a component surface on which another component is formed or disposed, it indicates that there is no intermediate component between the two components. Furthermore, when describing a component as "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0027] In the description of the embodiments of this disclosure, when a component "includes" another component, other components are not excluded unless otherwise stated, and may be further included. The formation or placement of a second component above or on a first component, or on the surface of a first component, or on one side of a first component, may include embodiments where the first and second components are in direct contact, and may also include embodiments where an additional component may be placed between the first and second components, thereby preventing direct contact between the first and second components. For simplicity and clarity, various components may be drawn at different scales. In the drawings, some layers / components may be omitted for simplicity. Unless otherwise specified, the formation or placement of a second component on the surface of a first component refers to direct contact between the first and second components. The term "component" can refer to a layer, film, region, portion, structure, etc.

[0028] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description of the various embodiments and the appended claims, the term "component" is also intended to include the plural form unless the context clearly indicates otherwise. Components include layers, films, regions, or plates, etc.

[0029] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0030] Figure 1This is a schematic flowchart illustrating a method for manufacturing a photovoltaic module according to an embodiment of the present disclosure.

[0031] refer to Figure 1 The manufacturing methods for photovoltaic modules include: S1: Provide a composite solder strip, the composite solder strip including a solder strip body and a first adhesive film disposed on the solder strip body, the first adhesive film including an extension portion protruding from the solder strip body and extending along a first direction, the first direction being the width direction of the solder strip body.

[0032] refer to Figures 2 to 3 The composite welding ribbon 10 includes a welding ribbon body 11 and a first adhesive film 12 disposed on the welding ribbon body 11. The first adhesive film 12 includes an extension portion 121 that protrudes from the welding ribbon body 11 and extends along a first direction X, where the first direction X is the width direction of the welding ribbon body 11.

[0033] The extension 121 protrudes outward from both sides of the ribbon body 11 along the first direction X, so that after it is laid, it can cover the battery cell area outside the edge of the ribbon body 11. This allows the extension 121 to directly contact the surface of the battery cell after stacking, while ensuring that the fixing effect is distributed on both sides of the ribbon body 11, thus improving positioning stability.

[0034] S2: Provides multiple battery cells, and lays composite welding ribbons on the multiple battery cells with the main body of the welding ribbons facing the battery cells.

[0035] refer to Figures 4 to 5 The composite welding ribbon 10 is laid on multiple battery cells 20, with the main body 11 of the welding ribbon facing the battery cell 20, so as to achieve electrical connection.

[0036] It should be noted that when the composite welding ribbon 10 is laid on multiple battery cells 20, the extension 121 hangs down naturally under the action of gravity and comes into contact with the surface of the battery cell 20.

[0037] It should be noted that the electrical connection between the two actually means that both are made of conductive materials and are directly connected or connected through other conductive materials. Therefore, when the photovoltaic cell is generating electricity, there is an electrical connection between the two.

[0038] S3: Perform pretreatment to transform the extension into a fixed part through pre-crosslinking. The fixed part contacts the battery cell to fix the main body of the welding ribbon onto the battery cell.

[0039] The pretreatment can be carried out by low-temperature heat treatment or ultraviolet irradiation, which promotes partial cross-linking of the adhesive film material in the extension, forming a fixed part with certain strength and adhesion. Since the fixed part is in direct contact and bonded to the surface of the battery cell, the solder ribbon body can be firmly locked in the predetermined position before lamination, effectively preventing the solder ribbon body from shifting laterally or longitudinally due to film flow, pressure or vibration during subsequent stacking or lamination.

[0040] S4: The first substrate, the second adhesive film, the battery string and the second substrate are stacked in sequence to form a laminate, with the second adhesive film located between the first substrate and the second substrate.

[0041] It should be noted that since the main body of the solder strip has been fixed in the previous step, there is no need to worry about the displacement of the main body of the solder strip in this stacking process, which improves the assembly accuracy and process tolerance.

[0042] S5: Lamination of the laminated components yields a photovoltaic module.

[0043] During the lamination process, although the second adhesive film melts and flows and is subjected to pressure, the position of the solder ribbon body remains stable because it has been pre-anchored by the pre-crosslinked fixing part, thus avoiding the risk of short circuits caused by the solder ribbon body shifting to adjacent gate lines or edge conductive areas.

[0044] It should be noted that after lamination, the first and second adhesive films are fully fused under hot pressing, and there is usually no longer a clear physical boundary between them, forming an integrated encapsulation structure.

[0045] This disclosure provides a first adhesive film on the solder ribbon body. The first adhesive film has an extension portion that extends along the width direction of the solder ribbon body and protrudes from the solder ribbon body. By pre-crosslinking the extension portion during the pretreatment process to form a fixing portion and contacting the solar cell, the solder ribbon body is fixed to the solar cell before lamination. This prevents the solder ribbon body from shifting due to force or adhesive film flow during subsequent lamination and stacking, thereby improving the positioning accuracy and welding reliability of the solder ribbon body, and thus improving the manufacturing yield and reliability of photovoltaic modules.

[0046] The embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings.

[0047] refer to Figure 2 In some embodiments, extension portions 121 are provided on both opposite sides of the welding strip body 11, and the extension portions 121 extend along the second direction Y, which is the length direction of the welding strip body 11.

[0048] For example, the extension 121 is not only present in the form of a dot or a short segment, but is continuously distributed on both sides of the welding strip body 11 along the entire length or main section of the welding strip body 11.

[0049] On the one hand, the double-sided setting ensures that the welding strip body 11 is subjected to symmetrical force in the width direction, avoiding warping or deflection caused by unilateral fixation; on the other hand, the continuous extension along the length direction allows the fixing effect to cover the entire contact area between the welding strip body 11 and the battery cell 20, rather than local points, so that after the fixing part is formed in the pretreatment, a more uniform and stable anchoring effect can be provided, effectively suppressing the longitudinal slippage or lateral sway of the welding strip body 11 caused by film flow or pressure fluctuation during the lamination process.

[0050] Furthermore, since the extension 121 extends along the length of the ribbon body 11, its contact area with the surface of the cell 20 is significantly increased. The fixing part formed after pre-crosslinking can provide stronger adhesion and shear resistance, further improving the positioning accuracy of the ribbon body 11.

[0051] In other embodiments, the extension 121 may be provided only on one side of the solder strip body 11 to ensure basic anti-displacement function while also taking cost control into account.

[0052] refer to Figure 6 In some embodiments, the extension 121 includes a plurality of protrusions 1211 spaced apart along the second direction Y.

[0053] First, the spaced protrusions 1211 can provide local anchoring points at key locations, such as the starting end, end, or high-stress area of ​​the solder strip body 11, effectively limiting the longitudinal slippage and lateral sway of the solder strip body 11 during the lamination process, while avoiding material waste or film accumulation problems that may be caused by the continuous extension 121.

[0054] Secondly, the gaps between the protrusions 1211 facilitate the flow and venting of the encapsulating film on the surface of the cell 20 during the lamination process, reducing the formation of bubbles or voids and improving the sealing density.

[0055] In addition, the discrete structure can reduce the internal stress concentration caused by film shrinkage during the pre-crosslinking process and improve the bonding stability of the interface between the fixing part and the battery cell 20.

[0056] It is worth noting that the number, size and spacing of the protrusions 1211 can be flexibly adjusted according to the layout of the main busbars of the cell 20, the length of the solder ribbon body 11 and the process conditions. For example, the density of the protrusions 1211 can be increased in the dense area of ​​the main busbars to enhance fixation, while the number can be reduced in the edge or low-risk area to save materials.

[0057] It should be noted that multiple protrusions 1211 are distributed at a certain interval on one or both sides of the welding strip body 11. The interval can be fixed or irregular.

[0058] refer to Figure 7In some embodiments, a plurality of protrusions 1211 located on opposite sides of the solder strip body 11 are staggered in the second direction Y.

[0059] On the one hand, compared with the symmetrical alignment of the two protrusions 1211, the staggered arrangement can avoid the formation of excessive film accumulation or thickness abrupt changes in local areas, which is conducive to the uniform flow and venting of the encapsulating film during the lamination process, and reduces the generation of bubbles, voids or stress concentration points.

[0060] On the other hand, the staggered distribution makes the fixing points more dense and more evenly distributed along the length of the weld strip body 11, which improves the overall anchoring continuity without increasing the total number of protrusions 1211 and effectively suppresses the twisting, warping or local slippage of the weld strip body 11 during the lamination process.

[0061] In addition, this arrangement can also disperse the internal stress caused by material shrinkage during the pre-crosslinking process, reducing the risk of debonding between the fixing part and the battery cell 20 interface.

[0062] refer to Figure 8 In some embodiments, the first adhesive film 12 includes an adhesive film body 122, and the adhesive film body 122 is laid on the side of the solder ribbon body 11.

[0063] In this embodiment, the adhesive film body 122 is attached to the side of the solder ribbon body 11, and an extension portion 121 extends further from the adhesive film body 122 along the width direction of the solder ribbon body 11.

[0064] For example, in the thickness direction of the solder strip body 11, the thickness of the adhesive film body 122 is greater than or equal to the thickness of the extension 121.

[0065] Since the adhesive film body 122 no longer covers the upper surface of the solder ribbon body 11, the second adhesive film can directly contact the top of the solder ribbon body 11 during subsequent lamination, which is beneficial to improving the interfacial bonding strength. At the same time, setting the adhesive film body 122 on the side of the solder ribbon body 11 can integrate the fixing function without increasing the overall stacking height, and reduce material usage, thus saving costs.

[0066] refer to Figure 9 In some embodiments, the solder strip body 11 includes two end regions I arranged at intervals along the second direction Y and a middle region II located between the two end regions I; the first adhesive film 12 includes a first film segment 123 corresponding to the end regions I and a second film segment 124 corresponding to the middle region II; in the first direction X, the width of the first film segment 123 is greater than the width of the second film segment 124.

[0067] It should be noted that during the lamination process, the beginning and end of the solder ribbon body 11 are prone to adhesive seepage due to the melting and flow of the second adhesive film, resulting in a poor solder joint between the solder ribbon body 11 and the battery main grid line. To address this, the extension 121 in the end region I is widened, which can effectively cover the edge of the solder ribbon body 11 and form a physical barrier to prevent the molten second adhesive film from seeping under the solder ribbon and avoid poor solder joints.

[0068] Since the extension 121 has undergone pre-crosslinking to form a fixing part during the pretreatment stage, its fluidity after melting is much lower than that of the second adhesive film. It will not cause a severe impact on the solder ribbon body 11 similar to that of the second adhesive film, thus it can stably perform the functions of shielding and fixing. In the middle region II, a narrower extension 121 is used, which can meet the basic positioning requirements, avoid material redundancy and adhesive film accumulation, and take into account both process economy and packaging uniformity.

[0069] In addition, the wider first membrane segment 123 can also cover the busbar connection point or welding transition area that may exist near the end area I, providing additional structural support and insulation protection, and further improving the reliability of the component edge area.

[0070] In some embodiments, the width of the first membrane segment in the first direction is 2.5cm to 5cm, for example, it can be 2.5cm to 3cm, 3cm to 4cm, or 4cm to 5cm, etc.

[0071] In some examples, the width of the first membrane segment in the first direction can be 2.5cm, 2.6cm, 2.7cm, 2.8cm, 2.9cm, 3cm, 3.1cm, 3.2cm, 3.3cm, 3.4cm, 3.5cm, 3.6cm, 3.7cm, 3.8cm, 3.9cm, 4cm, 4.1cm, 4.2cm, 4.3cm, 4.4cm, 4.5cm, 4.6cm, 4.7cm, 4.8cm, 4.9cm, or 5cm.

[0072] In some embodiments, the width of the second membrane segment in the first direction is 0.7cm to 2cm, for example, it can be 0.7cm to 1cm, 1cm to 1.5cm or 1.5cm to 2cm, etc.

[0073] In some examples, the width of the second membrane segment in the first direction can be 0.7cm, 0.8cm, 0.9cm, 1cm, 1.1cm, 1.2cm, 1.3cm, 1.4cm, 1.5cm, 1.6cm, 1.7cm, 1.8cm, 1.9cm, or 2cm.

[0074] In some embodiments, in the first direction, the ratio of the width of the first adhesive film to the width of the solder strip body is 1.33 to 1.4.

[0075] At this ratio, the width of the extensions of the first adhesive film extending outward from both sides of the solder ribbon body is sufficient to ensure that the extensions can effectively cover the surface area of ​​the battery cell outside the solder ribbon body after the composite solder ribbon is laid on the battery cell. After pre-treatment and cross-linking, the extensions can form a stable and reliable fixing part, providing sufficient adhesion to resist the lateral thrust caused by the flow or pressure of the second adhesive film during lamination, thereby preventing the solder ribbon body from shifting.

[0076] In some embodiments, the width of the welding strip body in the first direction is 0.5cm to 1.5cm, for example, it can be 0.5cm to 1cm or 1cm to 1.5cm, etc.

[0077] For example, in the first direction, the width of the main body of the welding strip can be 0.5cm, 0.6cm, 0.7cm, 0.8cm, 0.9cm, 1cm, 1.1cm, 1.2cm, 1.3cm, 1.4cm or 1.5cm.

[0078] In some embodiments, the solder strip body is a flat solder strip, and a groove is provided on the first surface of the solder strip body facing the first adhesive film, and the first adhesive film fills the groove.

[0079] On the one hand, the grooves limit and accommodate the first adhesive film. The first adhesive film filled in the grooves can form a larger contact interface with the side walls and bottom of the grooves, and bond more firmly with the main body of the welding strip. This can prevent the first adhesive film from sliding or falling off laterally during transportation, laying or pretreatment, and improve the structural stability of the composite welding strip.

[0080] On the other hand, since the first adhesive film is partially embedded in the groove, the overall thickness of the composite welding strip increases only slightly or can even remain comparable to that of the traditional welding strip, thus avoiding uneven lamination pressure caused by local protrusions.

[0081] The groove can be shaped like a rectangle, trapezoid, or arc.

[0082] In some embodiments, pretreatment includes heating the solar cells; wherein the process parameters for the heating treatment include a process temperature of 100°C to 130°C, for example, 100°C to 110°C, 110°C to 120°C, or 120°C to 130°C. In some embodiments, the process temperature may be 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, or 130°C.

[0083] The process duration is 0.5S to 3S, for example, it can be 0.5S to 1S, 1S to 2S, or 2S to 3S. In some embodiments, the process duration can be 0.5S, 1S, 1.5S, 2S, 2.5S, or 3S.

[0084] In some embodiments, laminating the laminated components includes: performing a first-stage lamination in a first preset environment; and performing a second-stage lamination in a second preset environment; wherein the first temperature of the first preset environment is lower than the second temperature of the second preset environment.

[0085] This embodiment adopts a staged heating lamination process, dividing the entire lamination process into two stages with increasing temperatures: the first stage is carried out at a lower temperature, and the second stage is completed at a higher temperature.

[0086] In the first stage of lamination, the lower temperature environment allows the second adhesive film to soften initially and begin to flow, while preventing premature and violent melting that could impact or displace the pre-crosslinked solder ribbon substrate. At this stage, the fixing portion on the composite solder ribbon, having undergone partial crosslinking in the pretreatment stage, possesses sufficient thermal stability to maintain the position of the solder ribbon substrate under mild conditions. This stage primarily completes the removal of internal air from the component and initial bonding, laying the foundation for subsequent high-temperature curing.

[0087] In the second stage, the temperature rises to the complete cross-linking temperature of the second adhesive film, causing it to fully melt, wet, and eventually solidify, forming a dense and stable encapsulation structure. Since the solder ribbon body has been effectively fixed in the first stage, its position remains stable even under high temperature and high fluidity conditions, significantly reducing the risk of misalignment or short circuits.

[0088] In addition, phased heating helps alleviate the thermal stress differences between different materials and reduces defects such as microcracks, encapsulated bubbles, or edge delamination in the battery cells.

[0089] In some embodiments, the first temperature is 110℃~125℃, for example, it can be 110℃, 111℃, 112℃, 113℃, 114℃, 115℃, 116℃, 117℃, 118℃, 119℃, 120℃, 121℃, 122℃, 123℃, 124℃ or 125℃; the second temperature is 148℃~160℃, for example, it can be 148℃, 149℃, 150℃, 151℃, 152℃, 153℃, 154℃, 155℃, 156℃, 157℃, 158℃, 159℃ or 160℃.

[0090] In some embodiments, the basis weight of the first adhesive film is 80 g / m³. 2 ~150g / m 2 For example, it can be 80g / m 2 ~100g / m 2 100g / m 2 ~130g / m 2 Or 130g / m 2 ~150g / m 2 wait.

[0091] In some embodiments, the basis weight of the first adhesive film may be 80 g / m³. 2 90g / m 2 100g / m 2 110g / m 2 120g / m 2 130g / m 2 140g / m 2 Or 150g / m 2 .

[0092] In some embodiments, the first film includes at least one of EVA film (ethylene-vinyl acetate copolymer), EPE film (EVA / POE composite encapsulant), and POE film (polyolefin elastomer).

[0093] This disclosure involves setting a first adhesive film on the solder ribbon body. This first adhesive film has an extension portion extending along the width direction of the solder ribbon body and protruding from it. By pre-crosslinking this extension portion during pretreatment to form a fixing portion that contacts the solar cell, the solder ribbon body is fixed to the solar cell before lamination. This prevents the solder ribbon body from shifting due to stress or adhesive film flow during subsequent lamination and stacking processes, improving the positioning accuracy and welding reliability of the solder ribbon body, thereby increasing the manufacturing yield and reliability of photovoltaic modules. Furthermore, by rationally designing the shape, arrangement, and size of the extension portion, material usage can be optimized, adhesive film accumulation reduced, lamination flow improved, and process stability and cost control balanced, all while ensuring anti-shifting functionality.

[0094] Accordingly, another embodiment of this disclosure also provides a photovoltaic module, which is manufactured by the photovoltaic module manufacturing method described in the above embodiments. For parts that are the same as or corresponding to the previous embodiment, please refer to the corresponding descriptions of the foregoing embodiments, which will not be repeated in detail below.

[0095] It should be noted that in the photovoltaic module provided in this embodiment, the first encapsulant film and the second encapsulant film are fully fused during the lamination process, and there is usually no clear physical boundary between them, forming an integrated encapsulation structure.

[0096] Furthermore, since the main body of the solder ribbon is effectively anchored by the pre-crosslinked fixing part before lamination, no displacement occurs in the final photovoltaic module, ensuring the reliability of electrical connection and the overall yield of the module.

[0097] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of this disclosure. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A method for manufacturing a photovoltaic module, characterized in that, The manufacturing method includes: A composite solder ribbon is provided, the composite solder ribbon including a solder ribbon body and a first adhesive film disposed on the solder ribbon body, the first adhesive film including an extension portion protruding from the solder ribbon body and extending along a first direction, the first direction being the width direction of the solder ribbon body; A plurality of battery cells are provided, and the composite welding ribbon is laid on the plurality of battery cells, with the main body of the welding ribbon facing the battery cells; Pre-treatment is performed to pre-crosslink the extension and transform it into a fixing part. The fixing part contacts the battery cell to fix the welding ribbon body onto the battery cell. The first substrate, the second adhesive film, the battery string and the second substrate are sequentially stacked to form a laminate, wherein the second adhesive film is located between the first substrate and the second substrate. The laminated components are laminated to obtain a photovoltaic module.

2. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The extension portion is provided on both sides of the main body of the welding strip, and the extension portion extends along a second direction, which is the length direction of the main body of the welding strip.

3. The method for manufacturing a photovoltaic module according to claim 2, characterized in that, The extension includes a plurality of protrusions spaced apart along the second direction.

4. The method for manufacturing a photovoltaic module according to claim 3, characterized in that, The protrusions located on opposite sides of the main body of the welding strip are staggered in the second direction.

5. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The first adhesive film includes an adhesive film body, and the adhesive film body is laid on the side of the welding strip body.

6. The method for manufacturing a photovoltaic module according to claim 2, characterized in that, The welding strip body includes two end regions spaced apart along the second direction and a middle region located between the two end regions; The first film includes a first film segment corresponding to the end region and a second film segment corresponding to the middle region; In the first direction, the width of the first membrane segment is greater than the width of the second membrane segment.

7. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The main body of the welding strip is a flat welding strip, and the first surface of the main body of the welding strip facing the first adhesive film has a groove, and the first adhesive film fills the groove.

8. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The preprocessing includes: The battery cells are subjected to heat treatment; The process parameters for the heat treatment include: a process temperature of 100℃~130℃ and a process duration of 0.5S~3S.

9. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The lamination of the laminated components includes: The first stage of lamination is performed under the first preset environment; The second stage of lamination is performed under the second preset environment; Wherein, the first temperature of the first preset environment is less than the second temperature of the second preset environment.

10. A photovoltaic module, characterized in that, The photovoltaic module is manufactured by the method of manufacturing a photovoltaic module according to any one of claims 1 to 9.

Citation Information

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