适于曲面的柔性阵列压力传感器及具有其的盆腔压力检测装置
By integrating electrode layers and pressure-sensitive layers on flexible substrates through a winding design and a combined sensing layer structure, the alignment and bonding problems of flexible array pressure sensors on cylindrical and hemispherical surfaces are solved, achieving high-sensitivity and low-cost pressure detection, which is suitable for fields such as medical and robotics.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
- Filing Date
- 2025-12-26
- Publication Date
- 2026-07-17
AI Technical Summary
Existing flexible array pressure sensors suffer from problems such as low interlayer alignment accuracy, unavoidable gaps, poor bonding flatness, and difficulty in packaging with small curvature radii on cylindrical curved surfaces, resulting in decreased low-pressure detection accuracy and insufficient long-term reliability.
The design adopts a single-layer flexible substrate with pre-integrated electrode layer and pressure-sensitive layer. It is installed on the cylindrical curved surface by winding to ensure the absolute correspondence between the electrode layer and the pressure-sensitive layer. On the hemispherical curved surface, a combination structure of planar sensing layer and multiple fan-shaped sensing layers is adopted. Combined with buffer layer and encapsulation layer, the fit and stability of the sensor are optimized.
It achieves seamless pressure sensing, improves the sensitivity and accuracy of low-pressure signal detection, simplifies the packaging process, reduces costs, improves the initial stability and long-term reliability of the sensor, and adapts to the pressure monitoring needs of complex curved surfaces.
Smart Images
Figure CN121804724B_ABST
Abstract
Citation Information
Patent Citations
Pressure sensor
JP2016176790A
Curved sensor device and method of manufacture
US20190302918A1