Multi-layer circuit board auxiliary production device

Abstract

The invention relates to the technical field of multi-layer circuit boards, and discloses a multi-layer circuit board auxiliary production device which comprises a base, a supporting beam is arranged at the top of the base, two supporting frames are arranged on one side of the supporting beam, the connecting position of the supporting beam and the base is fixedly connected through the supporting frames, an upper pressing plate is arranged at the bottom of the supporting beam, and a lower pressing plate is arranged at the bottom of the upper pressing plate. A hydraulic cylinder for controlling the upper pressing plate to move is fixedly mounted at the top of the supporting beam; by arranging the air cooling mechanism, after plate pressing is completed, a hydraulic cylinder is started to drive an upper pressing plate and a hot pressing plate to move upwards, meanwhile, a motor is started, the motor drives a first double-groove belt wheel to rotate, the first double-groove belt wheel drives a second double-groove belt wheel to rotate through a belt, and when the second double-groove belt wheel rotates, the second double-groove belt wheel drives the hot pressing plate to move upwards; and when materials are taken out, the rotating rod, the rotating block and the fan blades are driven to rotate, so that wind power is generated and blown to the plates, the plates are cooled in an auxiliary mode, the cooling time is shortened, and the material taking speed is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of multilayer circuit board, in particular to a kind of multilayer circuit board auxiliary production device. BACKGROUND

[0002] Multilayer circuit board is printed circuit board formed by three or more conductive pattern layers and insulating material alternately laminated and interconnected, and is the product of electronic information technology developing towards high speed and multi-function. The core role of hot press (also known as laminator) used in multilayer circuit board (PCB) production is to press the multilayer copper foil, prepreg (PP sheet) and core board into a whole structure through the synergistic effect of heating and pressing, to ensure firm interlayer bonding and reliable insulation.

[0003] After the multilayer circuit board is pressed, the board temperature is high, to avoid worker scalding, only after the board temperature drops can the material be taken, which leads to slow material taking speed and affects production efficiency. In the prior art, the board temperature is mainly reduced by natural cooling, and the cooling effect is limited, so the material taking speed is not obviously improved.

[0004] To solve the problem, we propose a kind of multilayer circuit board auxiliary production device. SUMMARY

[0005] The purpose of the present application is to provide a kind of multilayer circuit board auxiliary production device to solve the problems raised in the background art.

[0006] To achieve the above purpose, the present application provides the following technical scheme: a kind of multilayer circuit board auxiliary production device, including base, the top of the base is provided with support beam, the side of the support beam is provided with two support frames, the support beam is fixedly connected with the base through support frame, the bottom of the support beam is provided with upper pressing plate, the top of the support beam is fixedly installed with hydraulic cylinder for controlling the movement of the upper pressing plate, the bottom of the upper pressing plate is fixedly connected with hot pressing plate, the top of the base is fixedly connected with lower pressing plate, the top of the lower pressing plate is provided with embedded groove for preventing multilayer circuit board from running, the inside of the lower pressing plate is provided with cavity, the top of the inner wall of the cavity is provided with a plurality of communication holes, the top of the communication hole is provided with receiving groove, the inside of the receiving groove is provided with jacking plate, the bottom of the jacking plate is fixedly connected with jacking column, the bottom of the jacking column penetrates into the inside of the communication hole, the surface of the jacking column is fixedly connected with sealing ring, the connecting plate is arranged between the two support frames, and the two support frames are fixedly connected through the connecting plate; Air cooling mechanism, the air cooling mechanism is fixedly arranged on the base, and can generate wind force to blow to the board after hot pressing is completed; The pressurizing mechanism is fixedly arranged on the base, and when the air cooling mechanism operates, the pressurizing mechanism controls the lifting plate to move upward to lift the plate; The spraying mechanism is fixedly arranged on the pressurizing mechanism.

[0007] Preferably, the air cooling mechanism comprises a motor fixedly installed on the top of the base, a first double-groove belt pulley fixedly installed on the output end of the motor, two second double-groove belt pulleys connected by a belt on the top of the first double-groove belt pulley, a rotating rod fixedly connected to one side of the second double-groove belt pulley, and a rotating block fixedly connected to one end of the rotating rod and penetrating through one side of the connecting plate.

[0008] Preferably, the pressurizing mechanism comprises a pressurizing box fixedly connected to the top of the base, an air inlet pipe fixedly communicated with the top of the pressurizing box through a first one-way valve, a transmission pipe fixedly communicated with one side of the pressurizing box through a second one-way valve, and one end of the transmission pipe fixedly communicated with one side of the lower pressing plate. The inside of the pressurizing box is provided with a piston plate, one side of the piston plate is fixedly connected with a pushing block, one side of the first double-groove belt pulley is fixedly connected with a lead screw, the surface of the lead screw is drivingly connected with a transmission block, one side of the transmission block is fixedly connected with a transmission rod, one end of the transmission rod penetrates into the inside of the pressurizing box and is fixedly connected with one side of the pushing block.

[0009] Preferably, the spraying mechanism comprises a conducting cavity opened in the bottom of the lifting column, the surface of the lifting column is fixedly communicated with a plurality of air injection pipes, the air injection pipes are communicated with the conducting cavity, and the surface of the air injection pipe is fixedly installed with a one-way pressure valve.

[0010] Preferably, the buffer mechanism is fixedly arranged on the upper pressing plate. The buffer mechanism comprises a buffer plate arranged on the top of the upper pressing plate, the top of the buffer plate is fixedly connected with the output end of the hydraulic cylinder, the top of the upper pressing plate is fixedly connected with four guide rods, the top of the buffer plate is provided with guide holes matched with the guide rods, the surface of the guide rod is sleeved with a buffer spring, the top of the buffer spring is fixedly connected with the bottom of the buffer plate, and the bottom of the buffer spring is fixedly connected with the top of the upper pressing plate.

[0011] Preferably, the top of the buffer plate is fixedly connected with a sliding rod, and the top of the supporting beam is fixedly installed with a sliding sleeve matched with the sliding rod.

[0012] Preferably, one side of the lower pressing plate is fixedly communicated with a pressure relief pipe, and the surface of the pressure relief pipe is fixedly installed with a solenoid valve.

[0013] Preferably, the surface of the jacking column is sleeved with a reset spring, the bottom of the reset spring is fixedly connected with the top of the sealing ring, and the top of the reset spring is fixedly connected with the inner wall of the communication hole.

[0014] Preferably, the number of the air injection pipes is several, and one end is designed to be inclined upward by 35°.

[0015] Preferably, the surface of the rotating rod is sleeved with a bearing, and one side of the rotating block is rotatably connected with the connecting plate through the bearing.

[0016] Compared with the prior art, the present application has the following beneficial effects: 1、The present application sets up air cooling mechanism, when the plate is pressed and finished, the hydraulic cylinder drives the upper pressing plate and the hot pressing plate to move upward, at the same time, the motor is started, the motor drives the first double-groove pulley to rotate, the first double-groove pulley drives the second double-groove pulley to rotate through the belt, the second double-groove pulley drives the rotating rod, the rotating block and the fan blade to rotate, so that the wind blows to the plate, which cools the plate, reduces the cooling time, and improves the speed of taking the material. 2、The present application sets up air pressure increasing mechanism, when the first double-groove pulley rotates, the screw rod rotates, the screw rod drives the transmission block to move back and forth, when the transmission block moves forward, the transmission rod, the pushing block and the piston plate move forward, the piston plate moves, which extrudes the gas in the air pressure increasing box, so that the gas enters the cavity through the transmission pipe, when the pushing block moves backward, the transmission rod, the pushing block and the piston plate move backward, at this time, the air pressure increasing box is under negative pressure, at this time, the gas enters the air pressure increasing box through the air inlet pipe, which is circulated in sequence, and the gas is intermittently injected into the cavity, under the air pressure, the sealing ring, the jacking column and the jacking plate gradually move upward, the jacking plate pushes the multi-layer circuit board upward, which avoids the adhesion of the overflowed glue to the embedded groove, and the air can blow to the bottom of the plate from the side after the plate is jacked up, which further improves the cooling effect. 3、The present application sets up air injection mechanism, when the sealing ring, the jacking column and the jacking plate rise to the limit, and the air pressure in the cavity reaches the limit of the one-way pressure valve, the gas is injected out of the air injection pipe, which is inclined upward by 35°, and can just pass over the jacking plate and be injected on the bottom of the plate, which further improves the cooling effect. 4、The present application sets up buffer mechanism, when the hydraulic cylinder drives the upper pressing plate and the hot pressing plate to move downward and contact with the multi-layer circuit board, the pressure applied by the buffer plate compresses the buffer spring, the reaction force generated by the buffer spring realizes the buffering effect, which avoids the hard contact of the upper pressing plate and the hot pressing plate with the plate, and reduces the probability of damaging the plate. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic view of the stereoscopic structure in the present application; Figure 2 is a schematic view of the side section of the present application; Figure 3 is a schematic view of the stereoscopic structure in the present application; Figure 2 is a partial enlarged view of A in the present application; Figure 4 is a bottom view of the spraying mechanism in the present application; Figure 5 is a stereoscopic view of the side section of the buffer plate in the present application; Figure 6 is a partial enlarged view of B in the present application; Figure 5 Figure 7 is a stereoscopic view of the down-pressing plate in the present application; Figure 8 is a stereoscopic view of the rotating block in the present application; Figure 9 is a stereoscopic view of the side section of the down-pressing plate in the present application; Figure 10 is a stereoscopic view of the partial structure of the pressure-increasing mechanism in the present application.

[0018] In the figure: 1, base; 2, support beam; 3, support frame; 4, upper pressing plate; 5, hydraulic cylinder; 6, hot pressing plate; 7, down-pressing plate; 8, embedded groove; 9, cavity; 10, communication hole; 11, receiving groove; 12, jacking plate; 13, jacking column; 14, sealing ring; 15, connecting plate; 16, motor; 17, first double-groove pulley; 18, second double-groove pulley; 19, rotating rod; 20, rotating block; 21, fan blade; 22, pressure-increasing tank; 23, air inlet pipe; 24, transmission pipe; 25, piston plate; 26, pushing block; 27, screw rod; 28, transmission block; 29, transmission rod; 30, transmission cavity; 31, air jet pipe; 32, one-way pressure valve; 33, buffer plate; 34, guide rod; 35, guide hole; 36, buffer spring; 37, sliding rod; 38, sliding sleeve; 39, pressure relief pipe; 40, electromagnetic valve; 41, reset spring; 42, bearing. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] Please refer to Figure 1 - Figure 10 shown, Embodiment one:​ The utility model provides a multilayer circuit board auxiliary production device, including base 1, the top of base 1 is provided with support beam 2, one side of support beam 2 is provided with two support frames 3, support beam 2 is fixedly connected through support frame 3 at the place of being connected with base 1, the bottom of support beam 2 is provided with upper pressing plate 4, the top of support beam 2 is fixedly installed with the hydraulic cylinder 5 of controlling upper pressing plate 4 moves, the bottom of upper pressing plate 4 is fixedly connected with hot pressing plate 6, the top of base 1 is fixedly connected with lower pressing plate 7, the top of lower pressing plate 7 is provided with the embedding groove 8 of preventing multilayer circuit board from running position, the inside of lower pressing plate 7 is provided with cavity 9, the top of cavity 9 inner wall is provided with a plurality of communication holes 10, the top of communication hole 10 is provided with the accommodation groove 11, the inside of accommodation groove 11 is provided with jacking plate 12, the bottom of jacking plate 12 is fixedly connected with jacking column 13, and jacking column 13 bottom penetrates to the inside of communication hole 10, the surface of jacking column 13 is fixedly connected with sealing ring 14, and the connecting plate 15 is arranged between the two support frames 3, and the connecting plate 15 is fixedly connected at the place of being connected with the two support frames 3; The air cooling mechanism is fixedly arranged on the base 1 and can generate wind force to blow the plate after hot pressing is completed. The booster mechanism is fixedly arranged on the base 1, and when the air cooling mechanism operates, the booster mechanism will control the jacking plate 12 to move upward to lift the plate. The spraying mechanism is fixedly arranged on the booster mechanism.

[0021] The air cooling mechanism includes a motor 16 fixedly installed on the top of the base 1, a first double-groove pulley 17 fixedly installed on the output end of the motor 16, two second double-groove pulleys 18 connected by a belt drive on the top of the first double-groove pulley 17, a rotating rod 19 fixedly connected to one side of the second double-groove pulley 18, the rotating rod 19 penetrating through one side of the connecting plate 15 at one end, and a rotating block 20 fixedly connected to the rotating rod 19, four fan leaves 21 fixedly connected to the circumferential side of the rotating block 20.

[0022] In this embodiment, considering that the multi-layer circuit board is pressed after being combined, the board material is high in temperature, and only the board material can be taken out after the temperature of the board material is reduced to avoid scalding of workers, so that the taking speed is slow and the production efficiency is affected; in the prior art, the temperature of the board material is mainly reduced in a natural cooling mode, the cooling effect is limited, and the taking speed is not obviously improved, and by arranging the air cooling mechanism, the user can place the board material of the multi-layer circuit board in the embedding groove 8, then drive the upper pressing plate 4 and the hot pressing plate 6 to move downward by starting the hydraulic cylinder 5, and the hot pressing plate 6 also heats the board material, so that hot pressing is realized; when the board material is pressed and combined, the upper pressing plate 4 and the hot pressing plate 6 are driven to move upward by starting the hydraulic cylinder 5, and at the same time, the motor 16 is started, the first double-groove pulley 17 is driven to rotate by the motor 16, the second double-groove pulley 18 is driven to rotate by the belt, and the rotating rod 19, the rotating block 20 and the fan blade 21 are driven to rotate by the second double-groove pulley 18, so that air is generated and blown to the board material, the board material is cooled, the cooling time is reduced, and the taking speed is improved.

[0023] The surface of the rotating rod 19 is sleeved with the bearing 42, and one side of the rotating block 20 is rotatably connected with the connecting plate 15 through the bearing 42.

[0024] In this embodiment, the bearing 42 is arranged, so as to support the rotating rod 19, the rotating block 20 and the fan blade 21, and improve the smoothness and stability during rotation.

[0025] Embodiment two: On the basis of embodiment one, the air cooling mechanism can blow air to the hot-pressed board material in this embodiment, so as to reduce the cooling time of the board material. Considering that the board material is located inside the embedding groove 8, the position of the bottom of the board material cannot be effectively blown by the air, and the glue overflowed during the hot pressing process is also easy to cause the board material to be adhered to the inside of the embedding groove 8 during the cooling process. The supercharging mechanism in this application comprises a supercharging box 22 fixedly connected to the top of the base 1, a gas inlet pipe 23 fixedly communicated with the top of the supercharging box 22 through a first one-way valve, a transmission pipe 24 fixedly communicated with one side of the supercharging box 22 through a second one-way valve, and one end of the transmission pipe 24 is fixedly communicated with one side of the lower pressing plate 7. The inside of the supercharging box 22 is provided with a piston plate 25, the piston plate 25 is fixedly connected with a pushing block 26 on one side, one side of the first double-groove pulley 17 is fixedly connected with a lead screw 27, the surface of the lead screw 27 is drivingly connected with a transmission block 28, one side of the transmission block 28 is fixedly connected with a transmission rod 29, one end of the transmission rod 29 penetrates into the inside of the supercharging box 22 and is fixedly connected with one side of the pushing block 26.

[0026] In this embodiment, by setting the supercharging mechanism, when the first double-groove pulley 17 rotates, the lead screw 27 will rotate, and the lead screw 27 will drive the transmission block 28, as shown in Figure 9 When the transmission block 28 moves forward, it will drive the transmission rod 29, the push block 26 and the piston plate 25 to move forward. During the movement of the piston plate 25, the gas in the supercharging box 22 will be squeezed, so that the gas enters the cavity 9 through the transmission pipe 24. When the push block 26 moves backward, it will drive the transmission rod 29, the push block 26 and the piston plate 25 to move backward. At this time, the supercharging box 22 is under negative pressure, and the gas will enter the supercharging box 22 through the air inlet pipe 23. The cycle is repeated, and the gas is intermittently injected into the cavity. Under the action of the gas pressure, the sealing ring 14, the lifting column 13 and the lifting plate 12 will gradually move upward. The lifting plate 12 will push the multi-layer circuit board upwards to prevent the glue from overflowing and causing the board to be stuck in the embedded groove 8. At the same time, after the board is lifted, the wind can blow from the side to the bottom of the board, further improving the cooling effect. It should be noted that the first one-way valve is a valve that can only intake air into the supercharging box 22, and the second one-way valve is a valve that can only exhaust air from the supercharging box 22.

[0027] Embodiment three: The spraying mechanism includes a conduction cavity 30 opened at the bottom of the lifting column 13. The surface of the lifting column 13 is fixedly connected with a gas jet pipe 31, and the gas jet pipe 31 is in communication with the conduction cavity 30. The surface of the gas jet pipe 31 is fixedly installed with a one-way pressure valve 32.

[0028] In this embodiment, when the sealing ring 14, the lifting column 13 and the lifting plate 12 rise to the limit, and the air pressure in the cavity 9 reaches the limit of the one-way pressure valve 32, the gas will be sprayed out of the gas jet pipe 31. The 35° inclined spray can just pass over the lifting plate 12 and be sprayed on the bottom of the board, further improving the cooling effect. It should be noted that after the sealing ring 14, the lifting column 13 and the lifting plate 12 rise to the limit, the air pressure needs to increase again to reach the limit of the one-way pressure valve 32.

[0029] One side of the lower pressing plate 7 is fixedly connected with a pressure relief pipe 39, and the surface of the pressure relief pipe 39 is fixedly installed with an electromagnetic valve 40.

[0030] In this embodiment, by setting the pressure relief pipe 39 and the electromagnetic valve 40, when the board is removed from the lifting plate 12, the electromagnetic valve 40 can be started, and the gas in the cavity 9 will be discharged through the pressure relief pipe 39, achieving the effect of pressure relief.

[0031] The surface of the jacking column 13 is sleeved with a reset spring 41, the bottom of the reset spring 41 is fixedly connected with the top of the sealing ring 14, and the top of the reset spring 41 is fixedly connected with the inner wall of the communication hole 10.

[0032] In the embodiment, the reset spring 41 is arranged, when the gas in the cavity 9 is discharged, the elastic force generated by the reset spring 41 pushes the sealing ring 14, the jacking column 13 and the jacking plate 12 to move downward, so that the jacking plate 12 enters the storage groove 11, and the reset function is realized.

[0033] The number of the air injection pipes 31 is several, and one end is designed to be inclined upward by 35°.

[0034] In the embodiment, the air injection pipes 31 are arranged, when the gas is injected from the air injection pipes 31, the gas is injected at 35°, which can just pass over the jacking plate 12 and be sprayed at the bottom of the plate, thereby improving the cooling effect.

[0035] Embodiment four: The buffer mechanism is fixedly arranged on the upper pressing plate 4. The buffer mechanism includes a buffer plate 33 arranged on the top of the upper pressing plate 4, the top of the buffer plate 33 is fixedly connected with the output end of the hydraulic cylinder 5, the top of the upper pressing plate 4 is fixedly connected with four guide rods 34, the top of the buffer plate 33 is provided with guide holes 35 matched with the guide rods 34, the surface of the guide rods 34 is sleeved with buffer springs 36, the top of the buffer springs 36 is fixedly connected with the bottom of the buffer plate 33, and the bottom of the buffer springs 36 is fixedly connected with the top of the upper pressing plate 4.

[0036] In the embodiment, the buffer mechanism is arranged, when the upper pressing plate 4 and the hot pressing plate 6 are driven by the hydraulic cylinder 5 to move downward and contact the multi-layer circuit board, the buffer plate 33 applies pressure to compress the buffer springs 36, the buffer effect is realized through the reaction force generated by the buffer springs 36, the upper pressing plate 4 and the hot pressing plate 6 are prevented from being hard contacted with the board, and the probability of damaging the board is reduced.

[0037] The top of the buffer plate 33 is fixedly connected with a sliding rod 37, and the top of the supporting beam 2 is fixedly installed with a sliding sleeve 38 matched with the sliding rod 37.

[0038] In the embodiment, the sliding rod 37 and the sliding sleeve 38 are arranged, so that the movement track of the buffer plate 33 and other structures is limited, and the buffer plate 33 and other structures can only move vertically along the track of the sliding rod 37 and the sliding sleeve 38.

[0039] The working principle and use process of the present application: the user can put the board material of the multi-layer circuit board into the embedded groove 8, then start the hydraulic cylinder 5 to drive the upper pressing plate 4 and the hot pressing plate 6 to move downward, when the hydraulic cylinder 5 drives the upper pressing plate 4 and the hot pressing plate 6 to move downward and contact with the multi-layer circuit board, the pressure applied by the buffer plate 33 will compress the buffer spring 36, and the reaction force generated by the buffer spring 36 will realize the buffering effect, avoiding the hard contact of the upper pressing plate 4 and the hot pressing plate 6 with the board material, reducing the probability of damage to the board material, at the same time, the hot pressing plate 6 will also heat the board material, realizing hot pressing, when the board material is pressed completely, start the hydraulic cylinder 5 to drive the upper pressing plate 4 and the hot pressing plate 6 to move upward, at the same time, start the motor 16, the motor 16 will drive the first double-groove pulley 17 to rotate, the first double-groove pulley 17 will drive the second double-groove pulley 18 to rotate through the belt, the second double-groove pulley 18 rotates at the same time, drives the rotating rod 19, the rotating block 20 and the fan blade 21 to rotate, thereby generating wind force blowing to the board material, assisting in cooling the board material, reducing the cooling time, and thereby improving the speed of taking out the material; When the first double-groove pulley 17 rotates, the lead screw 27 will rotate, the lead screw 27 will drive the transmission block 28, as shown in Figure 9 When the transmission block 28 moves forward, it will drive the transmission rod 29, the push block 26 and the piston plate 25 to move forward, the piston plate 25 moves in the process, extruding the gas in the booster tank 22, so that the gas enters the cavity 9 inside through the transmission pipe 24, when the push block 26 moves backward, it will drive the transmission rod 29, the push block 26 and the piston plate 25 to move backward, at this time, the booster tank 22 is under negative pressure, at this time, the gas will enter the booster tank 22 inside through the air inlet pipe 23, and the cycle is repeated, the gas is injected into the cavity intermittently, under the push of the air pressure, the sealing ring 14, the jacking column 13 and the jacking plate 12 will gradually move upward, the jacking plate 12 will push the multi-layer circuit board upward, avoiding the overflow of glue to cause the board to be adhered together with the embedded groove 8, at the same time, after the board is jacked up, the wind can blow from the side to the bottom of the board, further improving the cooling effect; When the sealing ring 14, the jacking column 13 and the jacking plate 12 rise to the limit, and the air pressure in the cavity 9 reaches the limit of the one-way pressure valve 32, the gas will be sprayed out of the air jet pipe 31, which is inclined at 35°, just over the jacking plate 12, and sprayed on the bottom of the board, further improving the cooling effect.

[0040] It should be noted that the hydraulic cylinder 5, the hot pressing plate 6, the motor 16 and the electromagnetic valve 40 are devices or equipment existing in the prior art, or devices or equipment that can be realized in the prior art, and the power supply specific composition and principle of the hydraulic cylinder 5, the hot pressing plate 6, the motor 16 and the electromagnetic valve 40 are clear to those skilled in the art, so they will not be described in detail.

[0041] It has to be noted that, in the present document, the terms "first", "second", etc. merely serve to identify a subject or action, without necessarily requiring or implying any actual such relationship or order between such subjects or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0042] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to the details of the embodiments described, since numerous further modifications and changes can be apparent to one skilled in the art without departing from the spirit and scope of the application as defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board auxiliary production device, characterized in that: The system includes a base (1), a support beam (2) on the top of the base (1), two support frames (3) on one side of the support beam (2), the support beam (2) and the base (1) are fixedly connected by the support frames (3), an upper pressure plate (4) is provided at the bottom of the support beam (2), a hydraulic cylinder (5) for controlling the movement of the upper pressure plate (4) is fixedly installed on the top of the support beam (2), a hot pressure plate (6) is fixedly connected to the bottom of the upper pressure plate (4), a lower pressure plate (7) is fixedly connected to the top of the base (1), and an embedding groove (8) for preventing the multilayer circuit board from shifting is provided on the top of the lower pressure plate (7). The lower pressure plate (7) has a cavity (9) inside. The top of the inner wall of the cavity (9) has several connecting holes (10). The top of the connecting holes (10) has a storage groove (11). The storage groove (11) has a lifting plate (12) inside. The bottom of the lifting plate (12) is fixedly connected to a lifting column (13). The bottom of the lifting column (13) extends into the interior of the connecting hole (10). A sealing ring (14) is fixedly connected to the surface of the lifting column (13). A connecting plate (15) is provided between the two support frames (3). The two support frames (3) are fixedly connected by the connecting plate (15). The air-cooling mechanism is fixedly mounted on the base (1) and can generate airflow to blow onto the plate after hot pressing. The pressurizing mechanism is fixedly installed on the base (1). When the air-cooling mechanism is running, the pressurizing mechanism will control the lifting plate (12) to move upward and lift the plate. A jetting mechanism is fixedly mounted on a pressurizing mechanism.

2. The multilayer circuit board auxiliary production device according to claim 1, characterized in that: The air-cooling mechanism includes a motor (16) fixedly installed on the top of the base (1). The output end of the motor (16) is fixedly installed with a first double-groove pulley (17). The top of the first double-groove pulley (17) is connected to two second double-groove pulleys (18) via belt drive. A rotating rod (19) is fixedly connected to one side of the second double-groove pulley (18). One end of the rotating rod (19) extends through to one side of the connecting plate (15) and is fixedly connected to a rotating block (20). Four fan blades (21) are fixedly connected to the circumferential side of the rotating block (20).

3. The multilayer circuit board auxiliary production device according to claim 2, characterized in that: The pressurization mechanism includes a pressurization box (22) fixedly connected to the top of the base (1). The top of the pressurization box (22) is fixedly connected to an air intake pipe (23) through a first one-way valve. One side of the pressurization box (22) is fixedly connected to a transmission pipe (24) through a second one-way valve. One end of the transmission pipe (24) is fixedly connected to one side of the lower pressure plate (7). The booster box (22) is equipped with a piston plate (25) inside. A push block (26) is fixedly connected to one side of the piston plate (25). A lead screw (27) is fixedly connected to one side of the first double groove pulley (17). A transmission block (28) is connected to the surface of the lead screw (27). A transmission rod (29) is fixedly connected to one side of the transmission block (28). One end of the transmission rod (29) passes through the interior of the booster box (22) and is fixedly connected to one side of the push block (26).

4. The multilayer circuit board auxiliary production device according to claim 3, characterized in that: The jetting mechanism includes a transmission cavity (30) at the bottom of the lifting column (13). The surface of the lifting column (13) is fixedly connected to a jet pipe (31). The jet pipe (31) is connected to the transmission cavity (30). A one-way pressure valve (32) is fixedly installed on the surface of the jet pipe (31).

5. The multilayer circuit board auxiliary production device according to claim 4, characterized in that: It also includes a buffer mechanism, which is fixedly mounted on the upper pressure plate (4); The buffer mechanism includes a buffer plate (33) disposed on the top of the upper pressure plate (4). The top of the buffer plate (33) is fixedly connected to the output end of the hydraulic cylinder (5). Four guide rods (34) are fixedly connected to the top of the upper pressure plate (4). The top of the buffer plate (33) is provided with guide holes (35) that cooperate with the guide rods (34). A buffer spring (36) is sleeved on the surface of the guide rod (34). The top of the buffer spring (36) is fixedly connected to the bottom of the buffer plate (33), and the bottom of the buffer spring (36) is fixedly connected to the top of the upper pressure plate (4).

6. The multilayer circuit board auxiliary production device according to claim 5, characterized in that: The top of the buffer plate (33) is fixedly connected to a slide rod (37), and the top of the support beam (2) is fixedly installed with a sliding sleeve (38) that works in conjunction with the slide rod (37).

7. The multilayer circuit board auxiliary production device according to claim 4, characterized in that: A pressure relief pipe (39) is fixedly connected to one side of the lower pressure plate (7), and a solenoid valve (40) is fixedly installed on the surface of the pressure relief pipe (39).

8. The multilayer circuit board auxiliary production device according to claim 7, characterized in that: A return spring (41) is fitted on the surface of the lifting column (13). The bottom of the return spring (41) is fixedly connected to the top of the sealing ring (14), and the top of the return spring (41) is fixedly connected to the inner wall of the connecting hole (10).

9. The multilayer circuit board auxiliary production device according to claim 2, characterized in that: The number of jet pipes (31) is several, and one end is designed to be inclined upward at 35°.

10. The multilayer circuit board auxiliary production device according to claim 1, characterized in that: The surface of the rotating rod (19) is fitted with a bearing (42), and one side of the rotating block (20) is rotatably connected to the connecting plate (15) through the bearing (42).

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