A co-packaged optics (CPO) module structure

Abstract

The application belongs to the technical field of optical modules, and particularly relates to a photoelectric co-packaging CPO module structure, which comprises a mounting shell, a switching chip, an optical engine, a light source system and an auxiliary monitoring system. The switching chip and the optical engine are installed on a support substrate in the mounting shell. An optical fiber coupling interface is arranged on the outer side of the mounting shell to connect the optical fiber link between the optical engine and an external computer device. The CPO module structure of the application is monitored in real time by the auxiliary monitoring module in terms of power management, temperature management and link connection signal stability and other related data during use. The above data is collected by optical power, temperature and current sensors. When abnormal data occurs during the monitoring process, fault locating and positioning and automatic maintenance can be performed to eliminate the fault, the frequency of disassembly, maintenance and repair is reduced, and the use experience is improved.

Description

Technical Field

[0001] This invention belongs to the field of optical module technology, specifically a photoelectric co-packaged CPO module structure. Background Technology

[0002] With the acceleration of digital transformation across society, cloud computing penetration will increase significantly. Data centers, as indispensable infrastructure, are driving continuous investment and expansion by data center network operators. The continued increase in traffic, major cloud vendors' increased capital expenditure, and the sustained growth in the number of data centers are all driving further growth in the optical module market and will also increase demand for high-speed optical modules.

[0003] CPO modules are not directly plugged into ordinary computers. They are core interconnect devices for professional networks or computing scenarios with high speed, high density, and high computing power, rather than consumer-grade plug-and-play peripherals. Their usage, deployment scenarios, and compatible devices have clear professional attributes. However, because they are installed on core boards, CPO modules are usually located at the core of computer equipment during operation. When malfunctions occur, users find it difficult to disassemble and maintain them, and heat dissipation problems can easily lead to excessively high local temperatures, resulting in decreased stability and a poor user experience. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies and solve the aforementioned technical problems, this invention proposes a photoelectric co-packaged CPO module structure.

[0005] The technical solution adopted by the present invention to solve its technical problem is as follows: The present invention proposes an optoelectronic co-packaged CPO module structure, including a mounting shell, a switching chip, an optical engine, a light source system and an auxiliary monitoring system. The switching chip and the optical engine are mounted on a support substrate inside the mounting shell. An optical fiber coupling interface is provided on the outside of the mounting shell to connect the optical fiber link between the optical engine and an external computer device.

[0006] The auxiliary monitoring system includes a power monitoring module, a temperature monitoring module, and a link status stability monitoring module. The support base plate has a cooling channel inside, and the outer surface of the mounting housing has a mounting groove. The openings on both sides of the mounting groove are respectively provided with an air inlet and an air outlet. The air inlet and air outlet are connected to the air cooling system of the computer equipment through independent air ducts.

[0007] Cooling plates are evenly arranged on the inner wall of the mounting slot. The cooling plates are connected to the supporting base plate through connecting rods. The hollow part inside the cooling plate forms a cooling cavity. Both the cooling cavity and the cooling channel are filled with coolant, and the cooling cavity and the cooling channel are connected by the hollow connecting rods inside.

[0008] Preferably, the laser in the light source system is located on the outside of the mounting housing, with the installation position coinciding with the path of the independent air duct, and is connected to the optical engine inside the mounting housing via optical fiber to provide light.

[0009] Preferably, an air-cooling pipe is provided in the middle part of the cooling chamber, and the two ends of the air-cooling pipe penetrate through the side wall of the cooling plate and are respectively connected to the area inside the mounting groove near the air inlet and air outlet.

[0010] Preferably, a guide pipe is provided in the middle part of the cooling channel, and the end of the connecting pipe provided in the hollow part of the connecting rod extends into the cooling cavity, and the connecting pipe connects the guide pipe and the air-cooling pipe.

[0011] Preferably, the flow guide tube includes a heat-absorbing part and a deformable part. The heat-absorbing part is made of a rigid thermally conductive material, and the deformable part is made of an elastic material. The heat-absorbing part and the deformable part are distributed alternately to form the flow guide tube.

[0012] Preferably, a guide cap is slidably disposed on the inner wall of the heat absorption section near the deformation section. The guide cap has a conical tubular structure, and the large end of the guide cap slides in contact with the inner wall of the deformation section.

[0013] Preferably, a guide rod is provided at the center of the guide tube, and the guide rod passes through the openings at both ends of each guide cap in sequence. Limiting plates are uniformly provided on the outer surface of the heat absorption part, and the ends of the limiting plates slide in contact with the inner surface of the cooling channel.

[0014] An extrusion strip is provided on the large end of the guide cap. The extrusion strip is distributed in a ring around the central axis of the guide cap and slides in contact with the inner wall of the heat absorption part. A support strip is provided on the inner side of the extrusion strip, and the end of the support strip slides in contact with the surface of the guide rod.

[0015] Preferably, the diameter of the part on the guide rod corresponding to the deformed part is larger than the diameter of other parts, but smaller than the inner diameter of the small end opening of the guide cap.

[0016] The beneficial effects of this invention are as follows:

[0017] The optoelectronic co-packaged CPO module structure of this invention is equipped with an auxiliary monitoring module, a power monitoring module, a temperature monitoring module, and a link status stability monitoring module, which respectively monitor the power management, temperature management, and link connection signal stability of the CPO module structure during use. The above data is collected through optical power, temperature, current sensors, etc. When abnormal data occurs during the monitoring process, fault diagnosis and location can be quickly performed and automatic maintenance can be performed to eliminate the fault.

[0018] Furthermore, to address the overheating issue caused by the onboard integrated mounting method, when excessively high temperatures are detected, the air-cooling system configured in the computer equipment can be activated to guide cooling airflow into the mounting slot. When the cooling airflow passes through the cooling plate, the temperature of the coolant in the cooling chamber decreases due to the air-cooling effect, while the temperature of the coolant in the cooling channel of the support substrate increases due to heat absorption. The temperature difference in local areas causes the coolant in the cooling channel and the coolant in the cooling chamber to flow and exchange with each other, thereby improving the heat dissipation efficiency of the support substrate and the various components it supports, and ensuring the normal operation of the CPO module of this application. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a perspective view of the present invention;

[0021] Figure 2 This is a perspective view of the invention from another angle;

[0022] Figure 3 This is a partial cross-sectional view of the present invention;

[0023] Figure 4 yes Figure 3 A magnified view of a section at point A in the middle;

[0024] Figure 5 yes Figure 4 A magnified view of a section at point B in the middle;

[0025] Figure 6 This is a perspective view of the guide cap in this invention.

[0026] In the figure: mounting housing 1, supporting base plate 2, cooling channel 21, mounting groove 22, air inlet 221, air outlet 222, cooling plate 23, connecting rod 231, cooling chamber 232, air cooling pipe 24, guide pipe 25, connecting pipe 251, heat absorption part 252, deformation part 253, limiting plate 254, guide cap 26, extrusion strip 261, support strip 262, guide rod 27. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1:

[0029] As shown in the attached diagram of the instruction manual. Figures 1-6As shown, this application proposes an optoelectronic co-packaged CPO module structure, including a mounting housing 1, a switching chip, an optical engine, a light source system and an auxiliary monitoring system. The switching chip and the optical engine are mounted on a support substrate 2 inside the mounting housing 1. An optical fiber coupling interface is provided on the outside of the mounting housing 1 to connect the optical engine and the optical fiber link of an external computer device.

[0030] The auxiliary monitoring system includes a power monitoring module, a temperature monitoring module, and a link status stability monitoring module. The support base plate 2 has a cooling channel 21 inside, and the outer surface of the mounting housing 1 has a mounting groove 22. The outer opening of the mounting groove 22 is semi-closed, with only two openings remaining, which are the air inlet 221 and the air outlet 222, respectively. The air inlet 221 and the air outlet 222 are connected to the air cooling system of the computer equipment through independent air ducts. The independent air ducts can be duct-like structures or groove structures that guide the cooling airflow. They are designed according to the usage requirements and can guide the cooling airflow generated by the cooling system through the inside of the mounting groove 22 to the outside, thereby removing heat.

[0031] Multiple cooling plates 23 are evenly arranged on the inner wall of the mounting slot 22. The cooling plates 23 are connected to the support base plate 2 through the connecting rod 231 that penetrates the mounting housing 1. The cooling plates 23 and the connecting rods 231 correspond one-to-one. The hollow part inside the cooling plate 23 forms a cooling cavity 232. The cooling cavity 232 and the cooling channel 21 are both filled with coolant. The cooling cavity 232 and the cooling channel 21 are connected through the hollow connecting rod 231.

[0032] Specific workflow: As a core interconnect device for high-speed, high-density, and high-computing-power professional networks and computing scenarios, this application encapsulates the switching chip (i.e., ASIC) and the optical engine together on the same supporting substrate 2 inside the mounting housing 1. This allows for low latency, low power consumption, and high-density interconnection through short optoelectronic interconnection distances. Furthermore, because the installation method of this application involves integrated deployment onto the core board, which is a core location of the computer equipment, user disassembly and maintenance are difficult. Moreover, due to heat dissipation difficulties, local overheating can easily occur, leading to decreased stability during operation and a poor user experience.

[0033] Therefore, this application is also equipped with an auxiliary monitoring module, which monitors the power management, temperature management and link connection signal stability of the CPO module structure during use through a power monitoring module, a temperature monitoring module and a link status stability monitoring module, respectively. The specific structure and composition of the auxiliary monitoring module can adopt the specific technical solutions in the prior art that can meet the above requirements. For example, the acquisition of the above data can be achieved by corresponding optical power, temperature and current sensors. When abnormal data occurs during the monitoring process, fault diagnosis and location can be quickly performed and faults can be automatically maintained and eliminated.

[0034] Furthermore, to address the overheating issue caused by the onboard integrated mounting method, on the one hand, the support substrate 2 used to mount the switching chip and optical engine is made of a material with good thermal conductivity, and a cooling channel 21 is provided inside the support substrate 2, which is filled with coolant. The coolant type can be water-based coolant or fluorinated coolant. During the operation of the computer equipment, the heat generated by the switching chip and optical engine under high-intensity operation is transferred from the mounting position to the coolant in the cooling channel 21 inside the support substrate 2, causing the coolant to absorb heat and its temperature to rise, thereby achieving cooling of components such as the switching chip and optical engine.

[0035] On the other hand, when the temperature is detected to be too high, the air cooling system configured in the computer equipment can be activated to send the cooling airflow into the independent air duct. The independent air duct can guide the cooling airflow into the mounting slot 22. In the semi-enclosed area inside the mounting slot 22, the cooling airflow passes through the gap of the cooling plate 23 and makes full contact with the surface of the cooling plate 23, so that the temperature of the cooling plate 23 is reduced. The cooling plate 23 is connected to the support substrate 2, which can promote the transfer of heat on the support substrate 2 to the cooling plate 23, and accelerate the cooling and cooling process of the support substrate 2 and the components on the support substrate 2.

[0036] Furthermore, since the cooling cavity 232 inside the cooling plate 23 is connected to the cooling channel 21 inside the supporting substrate 2, the coolant inside the cooling channel 21 and the cooling cavity 232 forms a whole. When the cooling airflow passes through the cooling plate 23, the temperature of the coolant in the cooling cavity 232 drops due to the air cooling effect, while the temperature of the coolant in the cooling channel 21 in the supporting substrate 2 rises due to heat absorption. The temperature difference in the local area causes the coolant in the cooling channel 21 and the coolant in the cooling cavity 232 to flow and exchange with each other, thereby improving the heat dissipation efficiency of the supporting substrate 2 and the various components it supports, and ensuring the normal operation of the CPO module of this application.

[0037] Example 2:

[0038] Based on Embodiment 1, the laser in the light source system is located on the outside of the mounting housing 1, with the installation position coinciding with the path of the independent air duct. It is connected to the optical engine inside the mounting housing 1 via optical fiber and supplies light.

[0039] Specific workflow: Based on the specific workflow in Embodiment 1, in order to further reduce the heat generated by the CPO module of this application during operation, the laser that supplies light to the optical engine can be placed on the outside of the mounting housing 1. By independently installing and isolating the heat generated by the laser during operation, the heat source inside the mounting housing 1 can be reduced, and the temperature of the working environment inside the mounting housing 1 can be controlled more effectively.

[0040] Regarding the specific installation location of the laser, it can be placed in a low-temperature area inside the computer equipment enclosure, or directly on an independent air duct, so that the cooling airflow can come into contact with the laser and carry away the heat generated during the operation of the laser, thereby achieving effective cooling of the laser.

[0041] Example 3:

[0042] Based on Embodiment 2, an air-cooled pipe 24 is provided in the middle part of the cooling chamber 232. The two ends of the air-cooled pipe 24 penetrate the side wall of the cooling plate 23 and are respectively connected to the area inside the mounting groove 22 near the air inlet 221 and the air outlet 222.

[0043] A guide pipe 25 is provided in the middle part of the cooling channel 21. The end of the connecting pipe 251 provided in the hollow part of the connecting rod 231 extends into the cooling cavity 232, and the connecting pipe 251 connects the guide pipe 25 and the air cooling pipe 24.

[0044] Specific workflow: Based on the specific workflow in Example 2, after the cooling airflow enters the mounting groove 22 by setting the air-cooling pipe 24, part of the cooling airflow is guided into the air-cooling pipe 24. Since the air-cooling pipe 24 and the connecting pipe 251 can be made of aluminum-copper alloy with good thermal conductivity, or for insulation considerations, they can be made of materials with good insulation and thermal conductivity, depending on the usage requirements; therefore, during the process of the cooling airflow passing through the air-cooling pipe 24, it can absorb the heat of the coolant inside the cooling chamber 232 and cool down. In this way, by increasing the contact surface, the heat dissipation efficiency of the coolant inside the cooling chamber 232 is improved.

[0045] Furthermore, since the air-cooling pipe 24 and the guide pipe 25 are connected by the connecting pipe 251 to form a complete flow channel, the cooling airflow flows from the air-cooling pipe 24 into the connecting pipe 251 and then into the guide pipe 25, further expanding the contact area between the coolant and the cooling airflow inside the cooling channel 21, thereby improving the cooling efficiency of the coolant and better controlling the temperature of the components on the support substrate 2.

[0046] Example 4:

[0047] Based on Embodiment 3, the guide tube 25 includes a heat-absorbing part 252 and a deformable part 253. The heat-absorbing part 252 is made of a rigid heat-conducting material, and the deformable part 253 is made of an elastic material, such as a high-temperature resistant insulating rubber material. The heat-absorbing part 252 and the deformable part 253 are arranged alternately to form the guide tube 25. During installation, both ends of the guide tube 25 are heat-absorbing parts 252, which are fixed to the inner walls of both ends of the cooling channel 21. The middle part is composed of heat-absorbing parts 252 and deformable parts 253 arranged alternately. The length of the heat-absorbing part 252 is greater than the length of the deformable part 253, at least three times the length of the deformable part 253, which effectively ensures the heat exchange efficiency.

[0048] Specific workflow: Based on the specific workflow in Embodiment 3, for the coolant inside the cooling channel 21, due to the high-intensity operation of components such as the switching chip and optical engine on the support substrate 2, a large amount of heat is generated. During the heat absorption and cooling process, the volume of the coolant increases, resulting in a large pressure of the coolant inside the cooling channel 21. This causes the deformable part 253 to be pressed and indented towards the inside of the guide tube 25. In order to increase the deformation range of the deformable part 253, the sidewall of the deformable part 253 can be set as a pleated telescopic structure to facilitate a larger range of elastic deformation. When the cooling airflow enters the inside of the guide tube 25 and flows along the inside of the guide tube 25, the cooling airflow passes through each heat absorption part 252 and the deformable part 253 in sequence. Because the heat absorption part 252 is made of a hard material with good thermal conductivity, the heat of the coolant on the outside can be transferred to the cooling airflow through the heat absorption part 252.

[0049] When the cooling airflow passes through the deformable part 253, the airflow impacts the inner wall of the recessed deformable part 253, causing the deformable part 253 to tend to deform outward. As the cooling airflow continues to flow in, the air pressure inside the guide pipe 25 increases, pushing the deformable part 253 to bulge outward and squeezing the area where the coolant is located inside the cooling channel 21, causing the coolant to be pressurized and flow into the cooling chamber 232. At the same time, due to the deformation and recovery of the deformable part 253, the heat-absorbing part 252 located in the middle of the guide pipe 25 slides laterally back and forth along the cooling channel 21, further promoting the flow of the coolant inside the cooling channel 21. This improves the flow exchange efficiency of the coolant between the cooling channel 21 and the cooling chamber 232, and also improves the heat transfer efficiency of the support substrate 2, ensuring effective control of the operating temperature of the components on the support substrate 2.

[0050] Example 5:

[0051] Based on Embodiment 4, a guide cap 26 is slidably provided on the inner wall of the heat-absorbing part 252 near the deformable part 253. The guide cap 26 has a conical tubular structure, and the large end of the guide cap 26 slides in contact with the inner wall of the deformable part 253.

[0052] Specific workflow: Based on the specific workflow in Example 4, when the cooling airflow enters the interior of the guide pipe 25 and flows and impacts along the interior of the guide pipe 25, the guide caps 26 inside each heat absorption part 252 are impacted by the flowing airflow. The conical tubular structure causes the cooling airflow to flow in from the large end of the guide cap 26 and out from the small end. During this process, the guide cap 26 is blown and slides along the inner wall of the heat absorption part 252 and approaches the deformable part 253. On the one hand, the sliding guide cap 26, in conjunction with the blowing action of the airflow, causes the corresponding heat absorption part 252 to move slightly in the horizontal direction, thereby promoting the flow of coolant inside the cooling channel 21 and strengthening the coolant exchange between the cooling chamber 232 and the cooling channel 21.

[0053] On the other hand, when the sliding guide cap 26 approaches and contacts the deformable part 253, it will cause the inwardly recessed deformable part 253 to be squeezed and impacted by the large end of the guide cap 26, thereby causing the deformable part 253 to accelerate outward concavity, squeezing the gap area between the inner wall of the cooling channel 21 and the guide tube 25, accelerating the pressure change inside the cooling channel 21, thereby further promoting the exchange flow of coolant between the cooling channel 21 and the cooling chamber 232, and improving the heat transfer efficiency of the support substrate 2.

[0054] Example 6:

[0055] Based on Embodiment 5, a guide rod 27 is provided at the center of the guide tube 25. The guide rod 27 passes through the openings at both ends of each guide cap 26 in sequence. Limiting plates 254 are uniformly provided on the outer surface of the heat absorption part 252. The end of the limiting plate 254 slides in contact with the inner surface of the cooling channel 21. The diameter of the part of the guide rod 27 corresponding to the deformable part 253 is larger than the diameter of other parts and smaller than the inner diameter of the small end opening of the guide cap 26. Furthermore, in order to ensure the movement and reset of the guide cap 26, the guide cap 26 can be connected to the inner wall of the guide rod 27 through an elastic element. The elastic element can be an elastic rope. After the guide cap 26 moves due to the airflow, the elastic element deforms. After the impact airflow disappears, the elastic element recovers its deformation and pulls the guide cap 26 back to its reset position.

[0056] An extrusion strip 261 is provided on the large end of the guide cap 26. The extrusion strip 261 is arranged in a ring around the central axis of the guide cap 26 and slides in contact with the inner wall of the heat absorption part 252. A support strip 262 is provided on the inner side of the extrusion strip 261. The end of the support strip 262 slides in contact with the surface of the guide rod 27. The connection between the extrusion strip 261 and the large end of the guide cap 26 can be made of elastic material, while the contact part between the extrusion strip 261 and the inner wall of the heat absorption part 252 can be made of smooth and hard material. The support strip 262 can be made of a high-hardness elastic material, which can lift the extrusion strip 261 under the action of external force to make it bend and deform, and the deformation can be restored after the external force is removed.

[0057] Specific workflow: Based on the specific workflow in Embodiment 5, when the limiting plate 254 uniformly arranged on the outer surface of the heat absorption part 252 slides into contact with the inner wall of the cooling channel 21, causing the heat absorption part 252 to slide slightly laterally due to the impact of the cooling airflow, the limiting plate 254 restricts the movement of the heat absorption part 252, prompting it to move along a fixed trajectory along the central axis of the cooling channel 21, thus preventing the heat absorption part 252 from deviating during the movement.

[0058] The limiting plate 254 can be made of a material with good thermal conductivity. In this way, the setting of the limiting plate 254 increases the contact area between the heat absorption part 252 and the coolant inside the cooling channel 21, thereby improving the heat exchange efficiency between the heat absorption part 252 and the coolant, and thus improving the cooling effect on the coolant inside the cooling channel 21.

[0059] Furthermore, when the heat-absorbing part 252 in the middle section slides back and forth slightly due to the pulling of the deformable parts 253 on both sides, the limiting plate 254 can drive the flow of coolant in the gap area between the inner wall of the cooling channel 21 and the guide pipe 25 to a greater extent, thereby accelerating the coolant exchange between the cooling channel 21 and the cooling chamber 232; if necessary, the limiting plate 254 can also be set to have a spiral blade-like structure around the central axis of the heat-absorbing part 252, which can drive the coolant to rotate around the heat-absorbing part 252 during the back and forth sliding process, further improving the flow efficiency of the coolant;

[0060] Furthermore, when the guide cap 26 moves to the deformable part 253, the large end of the guide cap 26 contacts the inner wall of the deformable part 253, especially the extrusion strips 261 distributed in a ring on the large end, which abut against the inner wall of the deformable part 253. As the support strip 262 connected to the extrusion strip 261 slides along the guide rod 27 to the position corresponding to the deformable part 253, because the diameter of the guide rod 27 is larger at this point, it pushes the support strip 262 to drive the extrusion strip 261 to open outward, further pushing the deformable part 253 to expand outward. And because the diameter of the guide rod 27 is larger at this point, it causes the gap between the small end opening of the guide cap 26 and the outer surface of the guide rod 27 to decrease, increasing the resistance to the flow of cooling air. Similarly, a larger reaction force pushes the guide cap 26 to impact and extrude the deformable part 253, causing it to deform and expand outward, thereby extruding the interior of the cooling channel 21, accelerating the exchange of coolant, and improving the cooling temperature control efficiency of the support substrate 2.

[0061] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A photoelectric co-packaged CPO module structure, comprising a mounting housing (1), a switching chip, an optical engine and a light source system, wherein the switching chip and the optical engine are mounted on a support substrate (2) inside the mounting housing (1), and an optical fiber coupling interface is provided on the outside of the mounting housing (1) for connecting the optical fiber link between the optical engine and an external computer device; Its features are: The support substrate (2) has a cooling channel (21) inside, and the mounting housing (1) has a mounting groove (22) on its outer surface. The mounting groove (22) has an air inlet (221) and an air outlet (222) on both sides. The air inlet (221) and the air outlet (222) are connected to the air cooling system of the computer equipment through independent air ducts. Cooling plates (23) are evenly arranged on the inner wall of the mounting groove (22). The hollow part inside the cooling plate (23) forms a cooling cavity (232). The cooling cavity (232) and the cooling channel (21) are both filled with coolant. The cooling cavity (232) and the cooling channel (21) are connected by a hollow connecting rod (231), so that the cooling plate (23) is connected to the support base plate (2) through the connecting rod (231).

2. The optoelectronic co-packaged CPO module structure according to claim 1, characterized in that: The laser in the light source system is located outside the mounting housing (1), and its installation position coincides with the path of the independent air duct. It is connected to the optical engine inside the mounting housing (1) through an optical fiber to provide light.

3. The optoelectronic co-packaged CPO module structure according to claim 1, characterized in that: A cooling pipe (24) is provided in the middle part of the cooling chamber (232). The two ends of the cooling pipe (24) penetrate the side wall of the cooling plate (23) and are respectively connected to the area inside the mounting groove (22) near the air inlet (221) and the air outlet (222).

4. The optoelectronic co-packaged CPO module structure according to claim 3, characterized in that: A guide pipe (25) is provided in the middle part of the cooling channel (21). The end of the connecting pipe (251) provided in the hollow part of the connecting rod (231) extends into the cooling cavity (232), and the connecting pipe (251) connects the guide pipe (25) and the air cooling pipe (24).

5. The optoelectronic co-packaged CPO module structure according to claim 4, characterized in that: The flow guide tube (25) includes a heat-absorbing part (252) and a deformable part (253). The heat-absorbing part (252) is made of a rigid heat-conducting material, and the deformable part (253) is made of an elastic material. The heat-absorbing part (252) and the deformable part (253) are arranged alternately to form the flow guide tube (25).

6. The optoelectronic co-packaged CPO module structure according to claim 5, characterized in that: A guide cap (26) is slidably provided on the inner wall of the heat-absorbing part (252) near the deformable part (253). The guide cap (26) is a conical tubular structure, and the large end of the guide cap (26) slides in contact with the inner wall of the deformable part (253).

7. The optoelectronic co-packaged CPO module structure according to claim 6, characterized in that: A guide rod (27) is provided at the center of the guide tube (25). The guide rod (27) passes through the openings at both ends of each guide cap (26) in sequence. Limiting plates (254) are uniformly provided on the outer surface of the heat absorption part (252). The end of the limiting plate (254) slides in contact with the inner surface of the cooling channel (21). An extrusion strip (261) is provided on the large end of the guide cap (26). The extrusion strip (261) is arranged in a ring around the central axis of the guide cap (26) and slides in contact with the inner wall of the heat absorption part (252). A support strip (262) is provided on the inner side of the extrusion strip (261). The end of the support strip (262) slides in contact with the surface of the guide rod (27).

8. The optoelectronic co-packaged CPO module structure according to claim 7, characterized in that: The diameter of the part of the guide rod (27) corresponding to the deformable part (253) is larger than the diameter of other parts, but smaller than the inner diameter of the small end opening of the guide cap (26).

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