一种盲插弹性电气连接模组、芯片时序检测装置及系统
By using blind-fit flexible electrical connection modules and environmental parameter monitoring, the problem of environmental damage to the control board during chip testing was solved, achieving high-precision test results and extending equipment life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING GUANGQI INTELLIGENT TESTING TECHNOLOGY CO LTD
- Filing Date
- 2026-02-25
- Publication Date
- 2026-07-17
AI Technical Summary
In current chip testing technologies, harsh environments such as high temperature and high humidity severely affect the performance of control boards and high-speed probes, leading to distorted test data and shortened equipment lifespan, thus failing to meet the testing requirements of complex environments.
By adopting a blind-plug flexible electrical connection module, the test environment is separated from the control board and timing acquisition unit. Through the design of the probe guide slot base and probe base, combined with temperature and humidity sensors, environmental parameters are monitored in real time and test data is corrected to avoid environmental damage to the control board.
It improves the accuracy of chip testing, extends the lifespan of equipment, reduces testing costs, and ensures the integrity and accuracy of signal transmission.
Smart Images
Figure CN121831473B_ABST