Systems and methods for isolating failure in die-to-die interconnects

Abstract

Systems and methods for isolating faults in a die-to-die interconnect are provided. The method includes providing a first transmission path along a die-to-die interconnect from a transmitter associated with a first die to an asynchronous buffer associated with a second die. The method also includes providing a second transmission path from a voltage reference circuit arrangement associated with the second die to an asynchronous buffer associated with the second die. The method further includes simultaneously enabling both the first transmission path and the second transmission path to allow the asynchronous buffer to receive inputs from both a transmitter associated with the first die and a voltage reference circuit arrangement associated with the second die such that the inputs received by the asynchronous buffer indicate: (1) no failure in the die-to-die interconnect; (2) an open circuit fault in the die-to-die interconnect, or (3) a short circuit fault in the die-to-die interconnect.

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