Nanometer heat insulation plate packaging structure and curing packaging method for preparing nanometer heat insulation plate packaging structure

Abstract

The invention relates to the technical field of nanometer heat insulation material packaging. Specifically, the invention relates to a nanometer heat insulation plate packaging structure and a double-gradient second-level curing packaging method for preparing the nanometer heat insulation plate packaging structure, and further relates to a nanometer heat insulation plate product with the nanometer heat insulation plate packaging structure. According to the nanometer heat insulation plate packaging structure, the double-gradient structural design is adopted, damage to the internal pore structure of the nanometer heat insulation plate is avoided, second-level efficient production is achieved through the double-gradient second-level curing packaging method, and the nanometer heat insulation plate packaging structure has remarkable industrial application value. Besides, according to the packaging method, by accurately controlling the penetration depth of the coating and the surface film forming thickness, collaborative optimization of strength improvement, powder falling inhibition and heat insulation performance keeping of the product is achieved, and the packaging method is suitable for the scenes of building energy saving, household appliance heat preservation, industrial equipment heat insulation and the like.

Description

Technical Field

[0001] This invention relates to the field of nanomaterial encapsulation technology. Specifically, this invention relates to a nanomaterial encapsulation structure and a curing encapsulation method for preparing the nanomaterial encapsulation structure. This invention also relates to nanomaterial encapsulation products having the nanomaterial encapsulation structure. Background Technology

[0002] Nanomaterial insulation panels, especially dry-pressed nanomaterial insulation panels (made by dry pressing a mixture of nanoparticles, reinforcing fibers, and inorganic fillers), can achieve ultra-low thermal conductivity (approximately 0.015 to approximately 0.020 W / (m•K)) due to their internal nanoporous structure (pore size of approximately <100 nm and porosity of approximately >90%). However, existing nanomaterial insulation panels typically suffer from the following key drawbacks, thus failing to meet the requirements of engineering applications: (1) Easy to shed powder: The dry pressing process results in weak bonding force between surface particles of the dry-pressed nano-insulation board, which easily causes dust to fall off under mechanical stress (the amount of powder shedding usually exceeds about 1.0 g / m²); and (2) Difference in strength: The compressive strength is usually no more than about 0.5 MPa, and the flexural strength is usually no more than about 0.3 MPa.

[0003] Encapsulation technology is generally used in this field to overcome the above-mentioned defects of nano-insulation panels. However, existing nano-insulation panel encapsulation processes usually have the following significant shortcomings, which cannot meet the needs of industrial production: (1) Coating too thick: The coating thickness of traditional processes usually needs to be greater than about 50 μm. Even if the thickness is reduced, the material cost is significantly higher (usually not less than about 3 yuan / m²), and it causes the thermal conductivity of the finished nano heat insulation board to increase by at least about 20%. (2) Excessive penetration: The coating liquid penetrates into the interior of the nano heat insulation board to a depth of more than 150 μm, filling the nanopores in the nano heat insulation board body and causing the skeleton to collapse, resulting in a significant decrease in the heat insulation performance of the finished nano heat insulation board. (3) Low curing and encapsulation efficiency: The coating usually requires about 30 to 60 minutes to heat cure.

[0004] Therefore, there is an urgent need in the existing technology for a low-cost, high-efficiency, and low-performance-loss nano-insulation plate encapsulation solution. Summary of the Invention

[0005] Purpose of the invention In view of the problems existing in the prior art described in the background section above, the object of the present invention is to provide a nano heat insulation plate encapsulation structure and a curing and encapsulation method for preparing the nano heat insulation plate encapsulation structure. The object of the present invention is also to provide a nano heat insulation plate product containing the nano heat insulation plate encapsulation structure.

[0006] Technical solution To achieve the above objectives, the present invention adopts the following technical solution: Option 1: A nano-insulation plate encapsulation structure, wherein the encapsulation structure includes: — The core insulation layer, including the nanoporous structure of the nano-insulation panel itself; — A surface protective layer, located outside the core insulation layer, with a thickness ranging from about 5 to about 20 μm, is formed by curing an aqueous polyacrylate emulsion coated on the outside of the nano-insulation plate.

[0007] Option 2: According to the nano-insulation plate encapsulation structure described in Option 1 above, the thickness of the surface protective layer is in the range of about 10 to about 15 μm.

[0008] Option 3: According to the nano-insulation plate encapsulation structure described in Option 1 or 2 above, the surface protective layer is formed by UV curing or thermal curing of an aqueous polyacrylate emulsion coated on the outside of the nano-insulation plate.

[0009] Option 4: The nano-insulation plate encapsulation structure according to any one of Options 1 to 3 above, wherein the nano-insulation plate encapsulation structure further includes a gradient reinforcement layer between the core insulation layer and the surface protective layer, the thickness of which is in the range of about 50 to about 80 μm, and is formed by the in-situ reaction of an aqueous aminosilane solution with a concentration in the range of about 0.09 to about 0.11 wt% and an aqueous polyacrylate emulsion with a concentration in the range of about 0.05 to about 0.2 wt% penetrating into the interior of the surface of the nano-insulation plate to a depth of about 50 to about 80 μm.

[0010] Option 5: According to the nano-insulation plate encapsulation structure described in Option 4 above, the porosity of the gradient reinforcement layer is about 70% to about 80% of the porosity of the core insulation layer.

[0011] Option 6: The nano-insulation plate encapsulation structure according to any one of Options 1 to 5 above, wherein the nano-insulation plate is a dry-pressed nano-insulation plate, preferably a dry-pressed nano-silica insulation plate.

[0012] Option 7: The nano-insulation plate encapsulation structure according to any one of Options 1 to 6 above, wherein the concentration of the aqueous polyacrylate emulsion used to form the surface protective layer is in the range of about 25% to about 35% by weight.

[0013] Option 8: A curing and encapsulation method for preparing a nano-thermal insulation plate encapsulation structure according to any one of Options 1 to 7 above, wherein the curing and encapsulation method includes the following step 1: Step 1: The aqueous polyacrylate emulsion is coated on the surface of the nano heat insulation board to form a wet film. After leveling, the dry film thickness is ensured to be in the range of about 5 to about 20 μm. Then, it is cured by ultraviolet light irradiation or heating to form the surface protective layer.

[0014] Option 9: The curing and encapsulation method according to Option 8 above, wherein the concentration of the aqueous polyacrylate emulsion used in step 1 is in the range of about 25% to about 35% by weight.

[0015] Option 10: The curing and encapsulation method according to Option 8 or 9 above, wherein the polyacrylate contained in the aqueous polyacrylate emulsion used in step 1 contains a photocurable double bond structure and has a weight-average molecular weight in the range of about 5,000 to about 50,000 g / mol.

[0016] Option 11: The curing and encapsulation method according to any one of Options 8 to 10 above, wherein the aqueous polyacrylate emulsion used in step 1 further comprises a nano silica dispersant with a concentration in the range of about 0.01 to about 0.05% by weight, wherein the particle size of the nano silica dispersant is in the range of about 10 to about 20 nm.

[0017] Option 12: The curing and encapsulation method according to any one of Options 8 to 11 above, wherein in step 1, the aqueous polyacrylate emulsion is sprayed onto the surface of the nano-insulation plate by electrostatic spraying.

[0018] Option 13: The curing and encapsulation method according to Option 12 above, wherein the electrostatic spraying includes performing the electrostatic spraying at a voltage of about 15 to about 25 kV.

[0019] Option 14: The curing and encapsulation method according to Option 12 or 13 above, wherein during the electrostatic spraying process, the atomized particle size of the aqueous polyacrylate emulsion is controlled within the range of about 30 to about 50 μm.

[0020] Option 15: The curing and encapsulation method according to any one of Options 8 to 14 above, wherein the curing is completed by ultraviolet light irradiation, and the curing time of the ultraviolet light irradiation is less than about 30 seconds, more preferably less than about 20 seconds, and most preferably in the range of about 5 to about 15 seconds.

[0021] Scheme 16: The curing and encapsulation method according to any one of Schemes 8 to 15 above, wherein the curing and encapsulation method further includes step 2 after step 1: ultrasonic cleaning of the surface protective layer obtained from step 1.

[0022] Option 17: A curing and encapsulation method according to any one of Options 8 to 16 above, wherein the curing and encapsulation method further includes step 0, performed before step 1, for forming a gradient reinforcement layer: performing a plasma-chemical composite activation treatment on at least one surface of the nano-insulation plate, including: Step 0-1: Perform plasma surface treatment on the surface of the nano-insulation plate; Step 0-2: The surface of the plasma-treated nano-insulation plate from step 0-1 is brought into contact with an aqueous aminosilane solution with a concentration in the range of about 0.09 to about 0.11% by weight for a sufficient time to allow the aqueous aminosilane solution to penetrate to a depth of about 50 to about 80 μm below the surface of the nano-insulation plate. Step 0-3: Apply an aqueous polyacrylate emulsion with a concentration in the range of about 0.05 to about 0.2% by weight to the surface of the nano-insulation plate obtained from Step 0-2, which has been permeated with the aqueous aminosilane solution, so that the aqueous polyacrylate emulsion penetrates to a depth of about 50 to about 80 μm below the surface of the nano-insulation plate, wherein the penetration depth of the aqueous polyacrylate emulsion is controlled not to exceed the penetration depth of the aqueous aminosilane solution; Step 0-4: The nano-insulation plate, which has been permeated with the aqueous aminosilane solution and the aqueous polyacrylate emulsion since step 0-3, is kept at a temperature of room temperature to about 45°C for about 5 to about 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulation plate reacts with the aqueous aminosilane solution to form the gradient reinforcement layer.

[0023] Option 18: According to the curing and encapsulation method described in Option 17 above, in step 0-4, the nano-insulation plate permeated with the aqueous aminosilane solution and the aqueous polyacrylate emulsion from step 0-3 is kept under vacuum at a temperature of room temperature to about 45°C for about 5 to about 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulation plate reacts with the aqueous aminosilane solution to form the gradient reinforcement layer.

[0024] Option 19: The curing and encapsulation method according to Option 17 or 18 above, wherein the plasma surface treatment in step 0-1 includes using oxygen, air, or a mixture thereof as the working gas under vacuum conditions with an absolute pressure of about 10 to about 500 Pa, at a concentration of about 0.05 to about 0.1 W / cm². 2 The surface of the nano-insulation plate is subjected to plasma surface treatment at a power density of approximately 25 to 35 seconds.

[0025] Option 20: The curing and encapsulation method according to any one of Options 17 to 19 above, wherein step 0-2 includes immersing the plasma-treated nano-insulation plate in an aqueous aminosilane solution with a concentration of about 0.09 to about 0.11% by weight for about 10 to about 20 seconds, so that the aqueous aminosilane solution penetrates to a depth of about 50 to about 80 μm below the surface of the nano-insulation plate.

[0026] Scheme 21: The curing and encapsulation method according to any one of Schemes 17 to 20 above, wherein the aminosilane used in steps 0-2 includes (3-aminopropyl)triethoxysilane or N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or a mixture thereof.

[0027] Option 22: The curing and encapsulation method according to any one of Options 17 to 21 above, wherein the polyacrylate contained in the aqueous polyacrylate emulsion used in steps 0-3 contains a photocurable double bond structure and has a weight-average molecular weight in the range of about 5,000 to about 50,000 g / mol.

[0028] Option 23: The curing and encapsulation method according to any one of Options 17 to 22 above, wherein in steps 0-3, the aqueous polyacrylate emulsion with a concentration of about 0.05 to about 0.2% by weight is applied to the surface of the nano-insulation plate by ultrasonic atomization spraying.

[0029] Option 24: The curing and encapsulation method according to any one of Options 17 to 23 above, wherein the aqueous polyacrylate emulsion used in steps 0-3 further comprises a nano silica dispersant with a concentration in the range of about 0.01 to about 0.05% by weight, wherein the particle size of the nano silica dispersant is in the range of about 10 to about 20 nm.

[0030] Option 25: The curing and encapsulation method according to any one of Options 17 to 24 above, wherein step 0-4 includes holding the nano-insulating plate permeated with an aqueous aminosilane solution and an aqueous polyacrylate emulsion under a vacuum condition of an absolute pressure of about 10 to about 500 Pa at a temperature of about 35 to about 45°C for about 10 to about 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulating plate reacts rapidly with the aqueous aminosilane solution to form the gradient reinforcement layer.

[0031] Option 26: The curing and encapsulation method according to any one of Options 8 to 25 above, wherein the curing and encapsulation method further includes repeating step 1 to achieve curing and encapsulation of multiple surfaces of the nano-insulation plate.

[0032] Option 27: A nano-insulation plate product having a nano-insulation plate encapsulation structure according to any one of Options 1 to 7 above, or a nano-insulation plate encapsulation structure formed by a curing encapsulation method according to any one of Options 8 to 26 above, wherein the nano-insulation plate product has a powder shedding amount reduced by more than about 98% compared to a nano-insulation plate without the nano-insulation plate encapsulation structure, or the powder shedding amount of the nano-insulation plate product is less than about 0.2 g / m³. 2 Preferably less than about 0.15 g / m 2 More preferably less than about 0.05 g / m 2 .

[0033] Option 28: The nano-insulation panel product according to Option 27 above, wherein the compressive strength of the nano-insulation panel product is increased by more than 36% compared with a nano-insulation panel without the nano-insulation panel encapsulation structure, or the compressive strength of the nano-insulation panel product is at least about 0.68 MPa.

[0034] Option 29: The nano-insulation panel product according to Option 27 or 28 above, wherein the nano-insulation panel product has a bending strength that is at least about 50% higher than that of a nano-insulation panel without the nano-insulation panel encapsulation structure, or the bending strength of the nano-insulation panel product is at least about 0.45 MPa.

[0035] Option 30: A nano-insulation panel product according to any one of Options 27 to 29 above, wherein the thermal conductivity of the nano-insulation panel product is increased by no more than about 3.5% compared with a nano-insulation panel without the nano-insulation panel encapsulation structure, or the thermal conductivity of the nano-insulation panel product is less than about 0.0186 W / (m•K).

[0036] Option 31: A nano-insulation panel product according to any one of Options 27 to 30 above, wherein the nano-insulation panel product preferably has one or more of the following properties: The interfacial bonding strength between the core insulation layer and the surface protective layer, or the interfacial bonding strength between the core insulation layer and the gradient reinforcement layer, is at least about 0.5 MPa; and / or The surface protective layer has a hardness rating of at least 1H; and / or The thermal insulation performance retention rate of the nano-insulation panel product after 1000 thermal shock cycles is greater than approximately 98.5%.

[0037] Technical effect The nano-insulation panel curing and encapsulation method of this invention is a dual-gradient, second-level curing and encapsulation method. In particular, plasma-chemical composite activation treatment enhances the surface adhesion of the nano-insulation panel. Ultra-low concentration aqueous aminosilane solution and aqueous polyacrylate emulsion are used to achieve gradient penetration of the nano-insulation panel to a depth of approximately 50 to 80 μm. After the reaction, electrostatic spraying followed by ultraviolet curing (approximately 10 seconds) forms an ultra-thin surface protective layer of approximately 5 to 20 μm. The preferred nano-insulation panel curing and encapsulation method of this invention achieves a reduction of powder shedding of the nano-insulation panel by more than 98% (even reaching approximately 98.4%), an increase in strength of more than 36% (even reaching approximately 42%), and ensures that the increase in thermal conductivity of the nano-insulation panel product compared to the untreated nano-insulation panel is no more than approximately 3.5% (even no more than approximately 2.8%). Furthermore, the cost of preparing the nano-insulation panel encapsulation structure is reduced to 0.4 yuan / m². 2 Below (even as low as approximately 0.38 yuan / m) 2 The curing time is reduced to less than 30 seconds (or even less than about 15 seconds). In the encapsulation structure of this invention, the dual-gradient structure design avoids damage to the internal pore structure, and ultraviolet curing enables efficient production in the range of about 10 seconds, which has significant industrial application value.

[0038] The encapsulation method of this invention achieves synergistic optimization of strength enhancement, powder shedding suppression, and heat insulation performance by precisely controlling the coating penetration depth and surface film thickness, and is applicable to scenarios such as building energy conservation, home appliance insulation, and industrial equipment insulation.

[0039] Furthermore, in some simplified embodiments, the encapsulation structure of the present invention may not include the aforementioned gradient reinforcement layer. In such embodiments, an aqueous polyacrylate emulsion can be directly coated onto the surface of the core insulation layer and cured by ultraviolet light irradiation or heating in an oven to form an effective anti-powder protective layer. This approach is simpler in process, lower in cost, and suitable for applications where mechanical strength requirements are not stringent.

[0040] In addition, the curing and encapsulation method of the present invention uses an all-aqueous system with no volatile organic compound (VOC) emissions; it is applicable to various types of nano-insulation boards such as dry-pressed boards and wet-pressed boards. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the specific embodiments of the present invention, the drawings used in the specific embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0042] Figure 1This is a schematic diagram of a cross-section of a preferred nano-insulation plate encapsulation structure of the present invention.

[0043] Figure Labels 1: Core insulation layer; 2: Gradient reinforcement layer; 3: Surface protective layer. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with the embodiments of this invention. Those skilled in the art should understand that the embodiments described are merely for the purpose of aiding understanding of this invention and should not be considered as specific limitations on this invention. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention. Process parameters in the following embodiments that are not specifically specified are generally performed under conventional conditions.

[0045] In the description of this invention, the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and are not intended to require the invention to be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the invention.

[0046] The endpoints and any values ​​of the ranges disclosed in this invention are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. The term "about" as used in this invention means that the number it modifies may fluctuate within ±20%, ±15%, ±10%, ±5%, or ±2% of that number. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and the individual point values ​​contained within them, and the individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this invention.

[0047] According to a first aspect of the present invention, the present invention provides a nano-insulation plate encapsulation structure. The following description refers to the appended specification. Figure 1 The nano-insulation plate encapsulation structure of the first aspect of the present invention will be described in detail.

[0048] According to the first aspect of the invention, the nano-insulation plate encapsulation structure (in an inside-out order or as follows) Figure 1 As shown, in a bottom-up order, it comprises: a core thermal insulation layer 1, an optional gradient reinforcement layer 2, and a surface protective layer 3. The various components constituting the nano-thermal insulation panel encapsulation structure of the present invention will be described in detail below.

[0049] Core insulation layer 1: The core insulation layer 1 includes the nanoporous structure of the nano-insulation plate itself, which forms the basis of the optional gradient reinforcement layer 2 and surface protective layer 3 included in the nano-insulation plate encapsulation structure of the present invention, providing a nanoporous thermal insulation structure for the nano-insulation plate product of the present invention. For example, in the case of the silica nano-insulation plate preferred in the present invention, the surface silanol groups of the nano-insulation plate constituting the core insulation layer 1 can serve as chemical reaction sites to form covalent bonds with the polymer forming the gradient reinforcement layer 2. Furthermore, the high porosity and nanoscale pore size of the nano-insulation plate together determine the controllable penetration depth of the encapsulation liquid, which is the material basis for achieving synergistic optimization of 'strength-insulation'.

[0050] In a preferred embodiment of the present invention, the nano-insulation board constituting the core insulation layer 1 can be a dry-pressed nano-insulation board, preferably a dry-pressed nano-silica insulation board.

[0051] Optional gradient enhancement layer 2: In the nano-insulation panel encapsulation structure of the first aspect of the present invention, a gradient reinforcement layer 2 is preferably included, which is located between the core insulation layer 1 and the surface protective layer 3, thereby enabling the nano-insulation panel encapsulation structure of the present invention to have sufficiently high strength. The main function of the gradient reinforcement layer 2 includes: in the gradient reinforcement layer 2, (1) By crosslinking waterborne aminosilane and waterborne polyacrylate in situ within the nanopores, the strength of the surface skeleton is enhanced, and the compressive / bending properties of the product are significantly improved. (2) Forming a chemically bonded transition zone, improving the interfacial bonding force with the surface protective layer 3, and preventing thermal cycling delamination; (3) Suppress dust shedding and solve the industry problem of easy dust shedding in dry pressing plates.

[0052] On the one hand, the thickness of the gradient reinforcement layer 2 should be controlled within the range of approximately 50 to approximately 80 μm, for example, approximately 55 μm, approximately 60 μm, approximately 65 μm, approximately 70 μm, or approximately 75 μm. Here, the thickness of the gradient reinforcement layer 2 should not be too large, for example, it should not exceed approximately 80 μm; otherwise, excessive filling of the nanopores of the nano-insulation board by the cross-linked polymer may lead to a significant decrease in local porosity, thereby increasing the thermal conductivity (deteriorating the insulation performance). On the other hand, the thickness of the gradient reinforcement layer 2 should also not be too small, for example, it should not be less than approximately 50 μm; otherwise, the reinforcement area will be insufficient to cover the mechanical stress concentration layer (usually within approximately 50 μm of the surface layer), resulting in limited strength improvement and potential ineffective anchoring of the surface protective layer 3, easily leading to interface peeling.

[0053] Experiments show that when the thickness of the gradient reinforcement layer is about 50 to about 80 μm, the compressive strength can be increased by at least about 36% while the increase in thermal conductivity can be controlled within about 3.5%, thus achieving synergistic optimization of mechanical and thermal insulation properties.

[0054] On the other hand, the present invention also preferably requires that the porosity of the gradient reinforcement layer 2 be controlled to be about 70% to about 80% of the porosity of the core insulation layer 1, for example, about 72%, about 75%, or about 78%. Here, if the porosity of the gradient reinforcement layer 2 exceeds about 80% of the porosity of the core insulation layer 1 (i.e., insufficient filling), the polymer network density is too low, which cannot effectively bridge the nanoparticles of the nano-insulation board, resulting in limited improvement in mechanical strength and weak interfacial bonding. In addition, if the porosity of the gradient reinforcement layer 2 is lower than about 70% of the porosity of the core insulation layer 1 (i.e., overfilling), a large number of nanopores are blocked by polymer, the mean free path limitation effect of gas molecules is weakened, which may lead to a significant increase in thermal conductivity and deterioration of thermal insulation performance.

[0055] Experiments show that when the porosity of the gradient reinforcement layer 2 is maintained at about 70% to about 80% of the porosity of the core insulation layer 1, the compressive strength of the obtained nano-insulation board product can be increased by at least about 36%, while the increase in its thermal conductivity can be controlled within about 3.5%, thereby achieving the best balance between structural reinforcement and thermal insulation performance.

[0056] In some preferred embodiments of the present invention, the gradient reinforcement layer 2 may be formed by an in-situ reaction (condensation reaction of polyacrylate and aminosilane) of an aqueous aminosilane solution and an aqueous polyacrylate emulsion that penetrate into the interior of the nano-insulation plate surface constituting the core insulation layer 1 to a depth of about 50 to about 80 μm.

[0057] In some further preferred embodiments, the concentration of the aqueous aminosilane solution permeating into the interior of the surface of the nano-insulation plate can be in the range of about 0.09 to about 0.11% by weight, for example, about 0.10% by weight. Here, the concentration of the aqueous aminosilane solution should not be too high, for example, it should not exceed about 0.11% by weight, otherwise the aminosilane molecules may excessively aggregate on the pore walls, easily undergoing a self-condensation reaction (forming siloxane oligomers instead of bonding with the substrate), resulting in: (i) a reduction in effective anchoring points and a decrease in interfacial bonding strength; and (ii) unreacted aminosilane residues clogging the nanopores of the nano-insulation plate, resulting in an increase in thermal conductivity; in addition, the concentration of the aqueous aminosilane solution should not be too low, for example, it should not be less than about 0.09% by weight, otherwise the coverage of the silanol groups on the pore walls may be insufficient, failing to provide sufficient amino reaction sites for subsequent polyacrylate, resulting in a low crosslinking density of the gradient reinforcement layer and limited improvement in mechanical strength.

[0058] In some further preferred embodiments, the concentration of the aqueous polyacrylate emulsion penetrating into the interior of the surface of the nano-insulation board can range from about 0.05 to about 0.2 wt%, such as about 0.10 wt% or about 0.15 wt%. Here, the concentration of the aqueous polyacrylate emulsion should not be too high, for example, it should not exceed about 0.2 wt%, otherwise the emulsion particles may rapidly form a film on the surface layer, hindering the deep penetration into the nano-insulation board, resulting in: (i) insufficient thickness of the gradient enhancement layer (e.g., less than about 50 μm), and (ii) polymer accumulation on the surface layer, sudden drop in porosity, and significant increase in thermal conductivity; in addition, the concentration of the aqueous polyacrylate emulsion should not be too low, for example, it should not be lower than about 0.05 wt%, otherwise the crosslinking network density is too low to effectively bridge the nano-silica framework, resulting in insufficient improvement in compressive / flexural strength (e.g., less than about 30%), and the powder loss may still be higher than about 0.15 or even about 0.2 g / m².

[0059] Surface protection layer 3: The surface protection layer 3 is located outside the core insulation layer 1 or the optionally present gradient enhancement layer 2. Its main functions include: (1) forming a dense and continuous film to effectively prevent the shedding of nano-dust; (2) providing surface hardness and wear resistance (preferably reaching 1H in pencil hardness) to resist mechanical damage during construction and transportation; and (3) isolating water vapor and pollutants to improve the long-term service stability of the nano-insulation board products.

[0060] The thickness of the surface protection layer 3 should be controlled within the range of about 5 to about 20 μm, preferably within the range of about 10 to about 15 μm, such as about 11 μm, about 12 μm, about 13 μm or about 14 μm. Here, the thickness of the surface protection layer 3 should not be too large, for example, it should not exceed about 20 μm, otherwise the polymer film is too thick, the increase in thermal resistance is limited but the solid-phase conduction path is extended, resulting in an increase in the overall thermal conductivity (slight deterioration of the insulation performance); at the same time, it will also cause an unnecessary increase in material cost; in addition, the thickness of the surface protection layer 3 should not be too small, for example, it should not be lower than about 5 μm, otherwise the film layer may be discontinuous or have pinholes, unable to effectively cover the surface micro-defects, resulting in: (i) the powder loss increases again (may exceed about 0.2 g / m²); (ii) insufficient surface hardness (<HB), easy to be scratched; and (iii) environmental media (such as moisture) is easy to penetrate into the core insulation layer 1 or the gradient enhancement layer 2, accelerating the aging of the nano-insulation board products.

[0061] Experiments show that in combination with the gradient enhancement layer 2 detailed above, the surface protection layer 3 with a thickness in the range of about 10 to about 15 μm can preferably control the increase in thermal conductivity within a range not exceeding about 0.5% while ensuring that the powder loss is less than about 0.05 g / m² and the pencil hardness is at least 1H.

[0062] In some preferred embodiments, the surface protective layer 3 is formed by curing an aqueous polyacrylate emulsion coated on the outside of the gradient enhancement layer 2 by ultraviolet light curing or heat curing, and more preferably by ultraviolet light curing.

[0063] In some further preferred embodiments, the concentration of the aqueous polyacrylate emulsion forming the surface protective layer 3 generally needs to be controlled within the range of about 25 to about 35% by weight, such as about 28% by weight, about 30% by weight or about 32% by weight. Here, the concentration of the aqueous polyacrylate emulsion forming the surface protective layer 3 should not be too high. For example, it should not exceed about 35% by weight, otherwise the viscosity of the emulsion is too high, which may result in: (i) difficult atomization during spraying, rough film surface, obvious orange peel; (ii) poor leveling property, easy to form shrinkage holes or cracks; and (iii) increased internal stress during the drying process, easy to generate microcracks after curing, reducing the surface density and protective performance. In addition, the concentration of the aqueous polyacrylate emulsion forming the surface protective layer 3 should not be too low. For example, it should not be lower than about 25% by weight, otherwise the solid content may be insufficient, resulting in: (i) it is difficult to form a continuous dry film in a single spraying (i.e., the thickness may be less than about 5 μm); (ii) multiple coatings are required to reach the target thickness, reducing the production efficiency; and (iii) low crosslinking density of the film layer, insufficient surface hardness (<HB), and significant decline in wear resistance and anti-powdering ability.

[0064] According to the second aspect of the present invention, the present invention provides a curing encapsulation method for preparing the nano-insulating board encapsulation structure according to the first aspect of the present invention. The curing encapsulation method according to the second aspect of the present invention includes the following optional steps 0, step 1 and optional step 2.

[0065] Step 1: Preparation of the surface protective layer 3 Step 1 includes coating an aqueous polyacrylate emulsion on the surface of the nano-insulating board, or in the presence of the gradient enhancement layer 2, coating on the surface of the gradient enhancement layer 2 to form a wet film, and after leveling, ensuring that the dry film thickness is within the range of about 5 to about 20 μm, preferably within the range of about 10 to about 15 μm; subsequently, curing is completed by ultraviolet light irradiation to form the dense and continuous surface protective layer 3.

[0066] In some preferred embodiments, in step 1, the aqueous polyacrylate emulsion can be evenly sprayed onto the surface of the nano-insulating board by electrostatic spraying.

[0067] In some further preferred embodiments, the electrostatic spraying process includes performing the electrostatic spraying at a voltage of about 15 to about 25 kV. Here, the voltage of the electrostatic spraying should not be too high, for example, not exceeding about 25 kV, otherwise it may lead to an excessively strong electric field, causing emulsion splashing or edge effects, resulting in uneven film thickness; nor should it be too low, for example, not below about 15 kV, otherwise insufficient atomization will affect the uniformity of film formation.

[0068] Furthermore, during the electrostatic spraying process, the atomized particle size of the aqueous polyacrylate emulsion is preferably controlled within the range of approximately 30 to approximately 50 μm, for example, approximately 40 μm. Here, the atomized particle size should not be too large, for example, not exceeding approximately 50 μm, otherwise the droplets will be difficult to level, and orange peel or pinholes will easily appear on the surface; nor should it be too small, for example, not less than approximately 30 μm, otherwise the droplets will easily disperse, reducing material utilization and polluting the environment.

[0069] In step 1, in order to make the thickness of the formed surface protective layer in the range of about 5 to about 20 μm, preferably in the range of about 10 to about 15 μm, the thickness of the dry film formed by the aqueous polyacrylate emulsion coated on the surface of the gradient reinforcement layer should also be in the range of about 5 to about 20 μm, preferably in the range of about 10 to about 15 μm, for example, about 11 μm, about 12 μm, about 13 μm or about 14 μm.

[0070] In some preferred embodiments, the polyacrylate in the aqueous polyacrylate emulsion used in step 1 should contain a photocurable double bond structure (e.g., acryloyl, methacryloyl, etc.) and have a certain molecular weight range to ensure good film-forming properties and rapid UV curing capability. The weight-average molecular weight of the polyacrylate is preferably in the range of about 5,000 to about 50,000 g / mol, for example, about 10,000 g / mol, about 20,000 g / mol, about 30,000 g / mol, or about 40,000 g / mol. Here, the weight-average molecular weight of the polyacrylate should not be too high, for example, not exceeding about 50,000 g / mol, otherwise it may lead to insufficient UV light penetration depth, surface curing without internal cross-linking; in addition, the weight-average molecular weight of the polyacrylate should not be too low, for example, not lower than about 5,000 g / mol, otherwise the film strength will be insufficient and the surface hardness will be low (e.g., ...). <HB)。

[0071] In a further preferred embodiment, the aqueous polyacrylate emulsion used in step 1 may further contain a nano-silica dispersant. The purpose of adding the nano-silica dispersant is to improve the hardness, abrasion resistance and scratch resistance of the surface protection layer. The concentration of the added nano-silica dispersant may be in the range of about 0.01 to about 0.05 wt%, for example, about 0.02 wt%, about 0.03 wt% or about 0.04 wt%. Here, the concentration of the nano-silica dispersant should not be too high, for example, it should not exceed about 0.05 wt%, otherwise it may lead to an increase in film brittleness, a decrease in adhesion, and an exacerbation of UV light scattering, affecting the curing uniformity; nor should it be too low, for example, it should not be lower than about 0.01 wt%, otherwise the enhancement effect is not obvious.

[0072] In addition, the particle size of the added nano-silica dispersant is preferably in the range of about 10 to about 20 nm, for example, about 12 nm, about 15 nm or about 18 nm. Here, the particle size should not be too large, for example, it should not exceed about 20 nm, otherwise the silica dispersant is likely to settle or cause the formation of a rough surface; nor should it be too small, for example, it should not be lower than about 10 nm, otherwise the specific surface area of the silica dispersant is too large and additional surface modification is required to ensure compatibility with the polymer matrix.

[0073] In some other preferred embodiments, the curing time of the ultraviolet light irradiation is less than about 30 seconds, preferably less than about 20 seconds, and more preferably in the range of about 5 to about 15 seconds. Here, the ultraviolet light curing time should not exceed about 30 seconds, otherwise it may lead to an unnecessary increase in energy consumption, and long-term irradiation may also cause polymer yellowing or aging, affecting the appearance and durability of the product.

[0074] In some further preferred embodiments, the concentration of the aqueous polyacrylate emulsion forming the surface protection layer 3 can generally be controlled in the range of about 25 to about 35 wt%, for example, about 28 wt%, about 30 wt% or about 32 wt%. Here, the concentration of the aqueous polyacrylate emulsion forming the surface protection layer 3 should not be too high, for example, it should not exceed about 35 wt%, otherwise the emulsion viscosity is too high, which may lead to: (i) difficult atomization during spraying, rough film surface, obvious orange peel, (ii) poor leveling property, easy formation of shrinkage holes or cracks, and (iii) increased internal stress during the drying process, easy generation of microcracks after curing, reducing the surface density and protection performance; in addition, the concentration of the aqueous polyacrylate emulsion forming the surface protection layer 3 should not be too low, for example, it should not be lower than about 25 wt%, otherwise the solid content may be insufficient, resulting in: (i) it is difficult to form a continuous dry film by single spraying (i.e., the thickness may be less than about 10 μm), (ii) multiple coatings are required to reach the target thickness, reducing the production efficiency, and (iii) low crosslinking density of the film layer, insufficient surface hardness (<HB), and significant decrease in abrasion resistance and powder resistance.

[0075] Optional Step 2: Cleaning In the curing and encapsulation method of the second aspect of the present invention, a cleaning step 2 is preferably performed after step 1: the surface protective layer obtained from step 2 is ultrasonically cleaned to remove unreacted monomers, dust, or spray residues adhering to the surface protective layer, thereby improving surface cleanliness and ensuring the reliability of subsequent applications (such as bonding, lamination, or bonding). The ultrasonic cleaning preferably uses deionized water or an aqueous ethanol solution with a volume fraction of about 10 to about 30% as the cleaning medium, and is performed at a frequency of about 20 to about 40 kHz for about 5 to about 10 seconds to avoid over-cleaning and damage to the protective layer.

[0076] Optional Step 0: Plasma-Chemical Composite Activation Treatment of the Nano-Insulation Panel Surface In the curing and encapsulation method of the second aspect of the present invention, it is particularly preferred that the curing and encapsulation method further includes step 0 for forming the gradient reinforcement layer 2 before step 1. Step 0 includes providing a nano-insulation plate and performing a plasma-chemical composite activation treatment on the surface of the nano-insulation plate to form the gradient reinforcement layer 2. Here, the interior of the nano-insulation plate without the composite activation treatment constitutes the core insulation layer 1. Specifically, the plasma-chemical composite activation treatment includes steps 0-1 to 0-4: Step 0-1: Plasma surface treatment of the nano-insulation panel surface Step 0-1 includes first performing plasma surface treatment on the surface of the nano-insulation panel, the main function of which is, for example, in the case of a nano-silica insulation panel: (1) Remove surface organic contaminants and weak boundary layers to expose a clean nano-silica framework; (2) Activate surface silanol groups (-Si-OH) by bombarding the inert surface with high-energy particles to generate a large number of active -OH groups, increasing the density by about 2 to about 5 times; (3) Improve surface energy and wettability so that the subsequent aminosilane solution can quickly and uniformly penetrate to a depth of about 50 to 80 μm below the surface, thereby avoiding uneven impregnation or "island adsorption" caused by hydrophobicity.

[0077] The aforementioned plasma surface treatment enables aminosilane molecules to be firmly bonded to the pore walls through hydrolysis and condensation reactions (forming -Si-O-Si- covalent bonds), providing chemical anchoring points for the gradient reinforcement layer, thereby significantly improving the interfacial bonding strength.

[0078] The plasma surface treatment includes using oxygen, air, or a mixture thereof as the working gas under vacuum conditions with an absolute pressure of about 10 to about 500 Pa, at a concentration of about 0.05 to about 0.1 W / cm³. 2 The surface of the nano-insulation plate is subjected to plasma surface treatment at a power density of approximately 25 to 35 seconds.

[0079] On the one hand, during the plasma surface treatment process, the absolute pressure of the vacuum condition should be in the range of about 10 to about 500 Pa, for example, about 50 Pa, about 100 Pa, about 200 Pa, about 300 Pa, or about 400 Pa. Here, the absolute pressure of the vacuum condition should not be too high, for example, it should not exceed about 500 Pa (i.e., the gas pressure is too high), otherwise the mean free path of the gas molecules will be too short, which may lead to: (i) unstable plasma discharge, which is prone to arcing rather than uniform glow discharge, and (ii) frequent collisions between high-energy particles and gas molecules, resulting in large energy loss and a significant reduction in surface activation efficiency; on the other hand, the absolute pressure of the vacuum condition should not be too low, for example, it should not be lower than about 10 Pa (i.e., the vacuum is too high), otherwise the density of the working gas (such as O2) will be too low, which may lead to: (i) difficulty in maintaining the plasma and insufficient discharge power density, and (ii) low generation of active oxygen species (such as ·O, O3, etc.), low efficiency of introducing surface -OH groups, and inability to achieve effective activation.

[0080] On the other hand, during the plasma surface treatment process, the power density used should be in the range of about 0.05 to about 0.1 W / cm², for example, about 0.06 W / cm², about 0.07 W / cm², about 0.08 W / cm², or about 0.09 W / cm². Here, the power density of the plasma surface treatment should not be too high, for example, it should not exceed about 0.1 W / cm². 2 Otherwise, excessively high plasma energy may lead to: (i) local overheating of the nano-silica framework, causing pore structure collapse or sintering and a decrease in porosity; (ii) excessive surface etching, forming microcracks, which reduces the adhesion of subsequent coatings; and (iii) premature hydrolysis and condensation of aminosilanes at high temperatures, preventing effective penetration to a sufficient depth. Furthermore, the power density of the plasma surface treatment should not be too low, for example, not lower than approximately 0.05 W / cm². 2 Otherwise, insufficient plasma activity may lead to: (i) a low amount of surface -OH groups generated, resulting in limited improvement in wettability (the contact angle may still be greater than about 60°); (ii) the aminosilane solution is difficult to penetrate uniformly, remaining only on the surface layer of about 20 to about 30 μm, and thus failing to form an effective gradient reinforcement structure.

[0081] On the other hand, during the plasma surface treatment process, the plasma surface treatment time should be in the range of approximately 25 to approximately 35 seconds, for example, approximately 26 seconds, approximately 28 seconds, approximately 30 seconds, or approximately 32 seconds. Here, the plasma surface treatment time should not be too long, for example, it should not exceed approximately 35 seconds, otherwise the continuous bombardment of high-energy particles on the nano-silica framework will lead to: (i) excessive etching or local collapse of the surface pore structure, resulting in a decrease in porosity; (ii) a significant increase in surface roughness, forming microcrack sources, which weakens the adhesion of subsequent coatings; and (iii) the accumulation of material temperature rise, which may cause premature reaction of aminosilane or substrate shrinkage. In addition, the plasma surface treatment time should not be too short, for example, it should not be less than approximately 25 seconds, otherwise the surface activation will be insufficient, which may lead to: (i) insufficient density of silanol groups (-Si-OH), resulting in limited improvement in wettability (the water contact angle may still be greater than approximately 50°); and (ii) the aminosilane solution cannot penetrate uniformly to the target depth (approximately 50 to approximately 80 μm), forming only shallow adsorption, and the bonding strength of the gradient enhancement layer is significantly reduced.

[0082] Step 0-2: Contact with aqueous aminosilane solution Step 0-2 includes bringing the surface of the plasma-treated nano-insulation plate into contact with an aqueous aminosilane solution, for example, immersing the plasma-treated nano-insulation plate in the aqueous aminosilane solution so that the aqueous aminosilane solution penetrates to a depth of about 50 to about 80 μm below the surface of the nano-insulation plate.

[0083] In some exemplary preferred embodiments, the concentration of the aqueous aminosilane solution used in steps 0-2 can be in the range of about 0.09 to about 0.11% by weight, for example, about 0.10% by weight. Here, the concentration of the aqueous aminosilane solution should not be too high, for example, it should not exceed about 0.11% by weight, otherwise the concentration of silane molecules in the nanopores will be too high, which will easily lead to self-condensation reaction (forming cyclic or linear oligomeric siloxanes), resulting in (in the case of, for example, nano-silica heat insulation plates): (i) a reduction in the effective anchoring -Si-O-SiO2- bonding sites on the pore walls, and (ii) unreacted oligomers clogging the nanopores (less than about 50%). (nm), increasing the solid-phase heat transfer path and increasing the thermal conductivity; and (iii) residual aminosilane interferes with the subsequent penetration and crosslinking of polyacrylate, reducing the overall uniformity of the gradient reinforcement layer; in addition, the concentration of the aqueous aminosilane solution should not be too low, for example, it should not be lower than about 0.09% by weight, otherwise the silanol coverage of the pore wall is insufficient, and it cannot provide enough -NH2 reaction sites, resulting in: (i) low chemical bonding density between the aqueous polyacrylate emulsion and the skeleton, (ii) discontinuous crosslinking network of the gradient reinforcement layer, limited improvement in mechanical strength (compressive strength increase is less than about 30%), and (iii) decreased interfacial bonding strength, which is prone to delamination after thermal shock cycling.

[0084] In some other exemplary preferred embodiments, in steps 0-2, the immersion time of the nano-insulation plate in the aqueous aminosilane solution needs to be controlled within the range of about 10 to about 20 seconds, for example, about 12 seconds, about 15 seconds or about 18 seconds. Here, the immersion time should not be too long, for example, not exceeding about 20 seconds. Otherwise, the aqueous aminosilane solution may diffuse excessively into the deeper layers of the nano-insulation board, resulting in: (i) a penetration depth exceeding about 80 μm, entering the low-stress zone inside the core insulation layer, causing unnecessary pore filling; (ii) deep pores being blocked by polymer precursors, increasing the thermal conductivity (deteriorating insulation performance); and (iii) an increase in surface residual liquid, increasing the difficulty of subsequent cleaning or causing uneven film formation on the surface. In addition, the immersion time should not be too short, for example, not less than about 10 seconds. Otherwise, the solution may not have been sufficiently wetted and diffused to the target depth, resulting in: (i) aminosilane only adsorbing in the surface area less than about 50 μm, failing to form a complete gradient reinforcement structure; (ii) discontinuous distribution of -NH2 groups on the pore walls, resulting in a weak subsequent polyacrylate crosslinking network; and (iii) insufficient interfacial bonding strength, limited improvement in flexural strength, and the amount of powder shedding may still be higher than about 0.1 or about 0.2 g / m².

[0085] In addition, the aminosilanes used in steps 0-2 include, but are not limited to, (3-aminopropyl)triethoxysilane or N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or mixtures thereof.

[0086] Steps 0-3: Apply aqueous polyacrylate emulsion Steps 0-3 involve applying an aqueous polyacrylate emulsion to the surface of a nano-insulator plate that has already been permeated with the aqueous aminosilane solution. The aqueous polyacrylate emulsion permeates under capillary action to a depth of approximately 50 to 80 μm below the surface of the nano-insulator plate, wherein the penetration depth of the aqueous polyacrylate emulsion does not exceed the penetration depth of the aminosilane solution described in steps 0-2 above. The permeation of the aqueous polyacrylate emulsion allows for chemical cross-linking with the aminosilane on the pore walls, laying the foundation for the formation of the gradient reinforcement layer.

[0087] In some exemplary preferred embodiments, the aqueous polyacrylate emulsion can be uniformly applied to the surface of the nano-insulation plate by ultrasonic atomization spraying to avoid mechanical impact damaging the high-porosity substrate.

[0088] In some other exemplary preferred embodiments, the concentration of the aqueous polyacrylate emulsion used in steps 0-3 can be in the range of about 0.05 to about 0.2% by weight, for example, about 0.10% by weight or about 0.15% by weight. Here, the concentration of the aqueous polyacrylate emulsion should not be too high, for example, it should not exceed about 0.2% by weight, otherwise the emulsion viscosity will be too high, which may cause rapid film formation on the surface and hinder penetration into the deeper layers, resulting in insufficient gradient reinforcement layer thickness (e.g., less than about 50 μm). At the same time, local polymer accumulation will block the nanopores, resulting in an increase in thermal conductivity. In addition, the concentration of the aqueous polyacrylate emulsion should not be too low, for example, it should not be less than about 0.05% by weight, otherwise the crosslinking network density may be too low, which will not be able to effectively bridge the nano silica skeleton, resulting in insufficient improvement in compressive / flexural strength (e.g., less than about 30%), and the powder loss may still be higher than about 0.1 or about 0.2 g / m².

[0089] In some other preferred embodiments, the polyacrylate in the aqueous polyacrylate emulsion used in steps 0-3 preferably contains a photocurable double bond structure (e.g., acryloyl group, methacryloyl group, etc.) to facilitate rapid curing by ultraviolet light in subsequent steps.

[0090] In some preferred embodiments, the polyacrylate in the aqueous polyacrylate emulsion used in steps 0-3 should have a certain molecular weight range to ensure a balance between its diffusion capacity and reactivity within the nanopores. The weight-average molecular weight of the polyacrylate in the aqueous polyacrylate emulsion is preferably in the range of about 5,000 to about 50,000 g / mol, for example, about 10,000 g / mol, about 20,000 g / mol, about 30,000 g / mol, or about 40,000 g / mol. Here, the weight-average molecular weight of the polyacrylate should not be too high, for example, not exceeding about 50,000 g / mol, otherwise it may lead to excessive molecular chain diffusion resistance, making it difficult to penetrate deep into the nanopores, with crosslinking limited to the surface layer and an incomplete gradient structure. In addition, the weight-average molecular weight of the polyacrylate should not be too low, for example, not lower than about 5,000 g / mol, otherwise it may lead to too few crosslinking points, insufficient network strength, and easy loss of low molecular weight components in subsequent processing, affecting long-term stability.

[0091] In some further preferred embodiments, the aqueous polyacrylate emulsion may also contain a nano-silica dispersant. The purpose of adding the nano-silica dispersant is to: (i) enhance the rigidity and creep resistance of the gradient reinforcement layer 2; (ii) match the chemical composition of the core insulation layer and reduce interfacial thermal resistance; and (iii) suppress the propagation of microcracks caused by thermal expansion mismatch during thermal cycling. The concentration of the nano-silica dispersant added to the aqueous polyacrylate emulsion can be in the range of about 0.01 to about 0.05% by weight, for example, about 0.02% by weight, about 0.03% by weight, or about 0.04% by weight. Here, the concentration of the nano-silica dispersant should not be too high, for example, not exceeding about 0.05% by weight, otherwise it may cause nanoparticles to agglomerate and block pores, thus increasing the thermal conductivity; nor should it be too low, for example, not below about 0.01% by weight, otherwise the reinforcing effect will not be significant.

[0092] Furthermore, the particle size of the added nano-silica dispersant is preferably in the range of about 10 to about 20 nm, for example, about 12 nm, about 15 nm, or about 18 nm. Here, the particle size of the nano-silica dispersant should not be too large, for example, not exceeding about 20 nm, otherwise it may not be able to enter the nanopores smaller than 50 nm and will only accumulate on the surface; nor should it be too small, for example, not lower than about 10 nm, otherwise the specific surface area will be too large, resulting in excessive adsorption of polymer chains and reduced crosslinking efficiency.

[0093] Steps 0-4: Reaction of polyacrylate emulsion with aqueous aminosilane solution Steps 0-4 include holding the nano-insulating plate permeated with the aqueous polyacrylate emulsion and the aqueous aminosilane solution at room temperature (about 20 to about 25°C) to about 45°C for about 5 to about 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulating plate reacts with the aqueous aminosilane solution to form the gradient reinforcement layer 2. For example, the nano-insulating plate can be held at a temperature of about 35 to about 45°C and under vacuum conditions (e.g., under a vacuum with an absolute pressure of about 10 to about 500 Pa) for about 10 to about 20 minutes to promote the in-situ condensation reaction between the carboxyl groups (-COOH) in the polyacrylate and the amino groups (-NH2) in the aminosilane, dehydrating to form amide bonds, thereby constructing a three-dimensional cross-linked network within the nanopores to form the gradient reinforcement layer 2.

[0094] On the one hand, the temperature of the in-situ condensation reaction should preferably be controlled within the range of about 20 to about 45°C, for example, about 25°C, about 30°C, about 35°C, or about 40°C. Here, the temperature of the in-situ condensation reaction should not be too high, for example, it should not exceed about 45°C, otherwise it may cause water to evaporate too quickly, the condensation reaction to be incomplete, and at the same time, it may cause local thermal shrinkage of the nanoframework, resulting in microcracks. On the other hand, the temperature of the in-situ condensation reaction should not be too low, for example, it should not be lower than about 20°C, otherwise the reaction kinetics will be slow, the conversion rate will be insufficient within a certain time (for example, about 20 minutes), the crosslinking density will be low, and the mechanical properties will be affected.

[0095] On the other hand, a vacuum is preferably applied during the in-situ condensation reaction to accelerate moisture removal and shorten the reaction time. The absolute pressure of the vacuum condition is preferably in the range of about 10 to about 500 Pa, for example, about 50 Pa, about 100 Pa, about 200 Pa, about 300 Pa, or about 400 Pa. Here, the absolute pressure of the vacuum condition should not be too high, for example, it should not exceed about 500 Pa, otherwise the water vapor partial pressure in the system will be high, which is not conducive to the forward condensation dehydration reaction; in addition, the absolute pressure of the vacuum condition should not be too low, for example, it should not be lower than about 10 Pa, otherwise the pumping rate will be too fast, which may carry out unreacted monomers and reduce the crosslinking efficiency.

[0096] On the other hand, during the in-situ condensation reaction, the reaction time needs to be controlled within the range of approximately 5 to approximately 20 minutes, for example, 10 minutes or approximately 15 minutes. Here, the in-situ condensation reaction time should not be too long, for example, it should not exceed approximately 20 minutes, otherwise there will be no significant performance gain, and production efficiency will be reduced instead. Furthermore, the in-situ condensation reaction time should not be too short, for example, it should not be less than approximately 5 minutes, otherwise the reaction will be incomplete, the residual functional groups will easily absorb moisture, leading to a decrease in the long-term stability of the product.

[0097] Finally, in order to achieve curing and encapsulation of multiple surfaces (e.g., all surfaces) of the nano-insulation plate, the curing and encapsulation method according to the second aspect of the invention preferably further includes repeating the optional steps 0, 1 and 3 multiple times.

[0098] Alternatively, in the case of step 0, step 0 may include providing a nano-insulation plate, simultaneously performing plasma-chemical composite activation treatment on multiple surfaces (preferably all surfaces) of the nano-insulation plate, and repeating step 1 and optional step 3 to form the surface protective layer on multiple surfaces (e.g., all surfaces) of the nano-insulation plate.

[0099] According to a third aspect of the present invention, the present invention provides a nano-insulation plate article having a nano-insulation plate encapsulation structure according to the first aspect of the present invention or a nano-insulation plate encapsulation structure formed by a curing and encapsulation method according to the second aspect of the present invention.

[0100] According to a third aspect of the present invention, the nano-insulation panel product has the following properties: the amount of powder shedding is reduced by more than about 98%, or the amount of powder shedding of the nano-insulation panel product is less than about 0.2 g / m³. 2 Preferably less than about 0.15 g / m 2 More preferably less than about 0.05 g / m 2 .

[0101] In a further preferred embodiment, the nano-insulation panel article according to the third aspect of the present invention, compared with a nano-insulation panel without the nano-insulation panel encapsulation structure, The compressive strength is increased by approximately 36% or more, or the compressive strength of the nano-insulation panel product is at least approximately 0.68 MPa; and / or The flexural strength is increased by at least approximately 50%, or the flexural strength of the nano-insulation panel product is at least approximately 0.45 MPa; and / or The increase in thermal conductivity is no more than about 3.5%, or the thermal conductivity of the nano-insulation panel product is less than about 0.0186 W / (m•K).

[0102] In some further preferred embodiments, the nano-insulating panel article according to the third aspect of the present invention also has one or more of the following properties: The interfacial bonding strength between the core thermal insulation layer 1 and the surface protective layer 3, or the interfacial bonding strength between the core thermal insulation layer 1 and the gradient reinforcement layer 2, is at least about 0.5 MPa; and / or The surface protective layer has a hardness rating of at least 1H; and / or The thermal insulation performance retention rate of the nano-insulation panel product after 1000 thermal shock cycles is greater than approximately 98.5%.

[0103] The present invention will now be described in further detail with reference to specific embodiments and comparative examples.

[0104] Unless otherwise stated, the chemicals used in the following examples and comparative examples are all commercially available analytical grade chemicals.

[0105] The aqueous polyacrylate emulsions used in the examples and comparative examples were commercially available Joncryl® 538 from BASF, which contains polyacrylates with photocurable double bonds and a weight-average molecular weight of approximately 25,000 g / mol.

[0106] The aqueous aminosilane solution used in the examples and comparative examples was the A1100 aqueous aminosilane solution product commercially available from Momentive Advanced Materials, which contains (3-aminopropyl)triethoxysilane.

[0107] The dry-pressed nano-silica heat insulation board used in the examples and comparative examples is a product made by the inventors of this invention. The dry-pressed nano-silica heat insulation board without any encapsulation serves as a control sample. Its initial powder shedding amount is at least about 2.5 g / m², its compressive strength is about 0.50 MPa, its flexural strength is about 0.30 MPa, its porosity is about 90%, and its thermal conductivity is about 0.018 W / (m•K).

[0108] Example 1: Preparation of a nano-insulation plate encapsulation structure Step 0, Plasma-Chemical Composite Activation Treatment: The inventor of this invention provides a self-made dry-pressed nano-silica heat insulation board with dimensions of approximately 300 mm × 300 mm × 20 mm.

[0109] The entire surface of the dry-pressed nano-silica heat insulation board was subjected to plasma surface activation, including plasma (using oxygen as the working gas) at a rate of approximately 0.075 W / cm² under a vacuum of approximately 250 Pa. 2 The power density of the dry-pressed nano-silica heat insulation board is applied to the surface for approximately 30 seconds.

[0110] After plasma treatment, the plasma-treated nano-silica heat insulation plate is impregnated with an aqueous aminosilane solution at a concentration of about 0.10% by weight for about 15 seconds, such that the aqueous aminosilane solution is impregnated into the surface to a depth of about 80 μm.

[0111] An aqueous polyacrylate emulsion (penetrating liquid, which also contains a nano-SiO2 dispersant with a particle size of about 15 nm) with a concentration of about 0.15 wt% was applied to the surface of a nano-insulation plate that had been impregnated with an aqueous aminosilane solution by ultrasonic atomization spraying. The spraying time was controlled so that the aqueous polyacrylate emulsion penetrated into the surface to a depth of about 65 μm.

[0112] The nano-insulating plate impregnated with the aqueous polyacrylate emulsion and the aqueous aminosilane solution is left to stand under a vacuum of about 250 Pa and at a temperature of about 40°C for about 10 minutes to form the gradient reinforcement layer. The porosity of the gradient reinforcement layer is about 75% of the porosity of the dry-pressed nano-silica insulating plate.

[0113] Step 1, Preparation of the surface protective layer: An aqueous polyacrylate emulsion with a concentration of about 30% by weight (which also contains a nano-SiO2 dispersant with a concentration of about 0.03% by weight and a particle size of about 15 nm) is applied to the surface of the gradient reinforcement layer of the nano-insulation plate by electrostatic spraying. The atomized particle size of the aqueous polyacrylate emulsion is controlled within the range of about 30 to about 50 μm, and the electrostatic spraying voltage is controlled at 20 kV. The spraying time is controlled so that the aqueous polyacrylate emulsion formed on the surface has a dry film thickness of about 12 μm after leveling. Subsequently, the aqueous polyacrylate emulsion is cured by ultraviolet light irradiation for about 10 seconds, thereby forming the surface protective layer.

[0114] Step 2: Cleaning The cured surface protective layer obtained from step 1 above was cleaned with deionized water and ultrasonically treated at a frequency of about 30 kHz for about 5 seconds.

[0115] Example 2: Preparation of a nano-insulation plate encapsulation structure The nano-insulation plate encapsulation structure was prepared using a process similar to that in Example 1, except that the following process parameters were used: The concentration of the aqueous polyacrylate emulsion used as the permeation fluid in step 0 is approximately 0.08% by weight. In step 1, the dry film thickness of the aqueous polyacrylate emulsion formed on the surface is approximately 10 μm; and The UV curing time in step 1 is approximately 8 seconds; and The porosity of the gradient reinforcement layer is approximately 76% of the porosity of the dry-pressed nano-silica heat insulation board.

[0116] Example 3: Preparation of a nano-insulation plate encapsulation structure An aqueous polyacrylate emulsion with a concentration of about 30% by weight and a thickness of about 12 μm (which also contains about 0.03% by weight of nano-SiO2 dispersant with a particle size of about 15 nm) was directly electrostatically sprayed onto the surface of the same nano-insulation plate used in Example 1. The aqueous polyacrylate emulsion was then cured by irradiation with ultraviolet light for about 10 seconds to obtain a nano-insulation plate encapsulation structure without a gradient transition layer.

[0117] Example 4: Preparation of a nano-insulation plate encapsulation structure Using the same aqueous polyacrylate emulsion as in Example 3, it was sprayed onto the surface of the untreated nano-insulation plate to form a wet film approximately 12 μm thick. Subsequently, the sample was placed in an oven at 80°C for 10 minutes to complete curing, resulting in a nano-insulation plate encapsulation structure without a gradient transition layer.

[0118] Comparative Example 1: Preparation of nano-insulation plate encapsulation structure in the prior art A silicone coating with a thickness of about 12 μm (using an ethanol solution of methyltrimethoxysilane with a concentration of about 20% by weight) was directly sprayed onto the surface of the same nano-insulation plate as used in Example 1, and then thermally cured at a temperature of about 150°C for about 30 minutes to obtain a nano-insulation plate encapsulation structure without a gradient transition layer.

[0119] Comparative Example 2: Preparation of Nanoscale Thermal Insulation Panel Encapsulation Structure The nano-insulation plate encapsulation structure was prepared using a process similar to that in Example 1, except that the following process parameters were used: In step 1, the aqueous aminosilane solution is immersed to a depth of about 100 μm into the surface, and the aqueous polyacrylate emulsion penetrates to a depth of about 90 μm into the surface.

[0120] Comparative Example 3: Preparation of Nanoscale Thermal Insulation Panel Encapsulation Structure The nano-insulation plate encapsulation structure was prepared using a process similar to that in Example 1, except that the following process parameters were used: In step 1, the aqueous aminosilane solution is immersed to a depth of about 55 μm into the surface, and the aqueous polyacrylate emulsion penetrates to a depth of about 40 μm into the surface.

[0121] Comparative Example 4: Preparation of Nanoscale Thermal Insulation Panel Encapsulation Structure The nano-insulation plate encapsulation structure was prepared using a process similar to that in Example 1, except that the following process parameters were used: The porosity of the gradient reinforcement layer was controlled to be approximately 60% of the porosity of the nano-insulation plate by adjusting the concentrations of the aqueous aminosilane solution and the aqueous polyacrylate emulsion.

[0122] Comparative Example 5: Preparation of Nanoscale Thermal Insulation Panel Encapsulation Structure The nano-insulation plate encapsulation structure was prepared using a process similar to that in Example 1, except that the following process parameters were used: By shortening the plasma treatment time, the porosity of the gradient reinforcement layer is controlled to approximately 89% of the porosity of the nano-insulation plate.

[0123] In the above-described embodiments 1 to 4 and comparative examples 1 to 5 of the present invention, the following standards or methods were used to determine and obtain various performance parameters: Porosity: Refer to Chinese National Standard GB / T 6343-2009 "Determination of Apparent Density of Foamed Plastics and Rubber" and Chinese National Standard GB / T 24586-2009 "Determination of Apparent Density, True Density and Porosity of Iron Ore".

[0124] Powder loss (g / m) 2Referring to the general principles of pulverization testing, the compressed air purging method is used for determination. Specifically, the sample (approximately 300 mm × 300 mm) is fixed horizontally, and air is blown vertically at a pressure of approximately 0.2 MPa for about 10 seconds at a distance of approximately 10 cm from the surface. The detached dust is collected below using a clean filter membrane, weighed, and converted into the amount of dust shed per unit area (g / m²). 2 ).

[0125] Compressive strength (MPa) and flexural strength (MPa): were determined in accordance with the Chinese national standard GB / T 5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products". The loading rate for compressive strength testing was approximately 10 mm / min, and the sample size was approximately 100 mm × 100 mm × original thickness. The flexural strength was tested using the three-point bending method with a span of approximately 150 mm and a loading rate of approximately 5 mm / min.

[0126] Thermal conductivity [W / (m·K)]: The test was conducted in accordance with the Chinese national standard GB / T 10295-2008 "Determination of steady-state thermal resistance and related properties of thermal insulation materials by heat flow meter method", with an average test temperature of approximately 25℃ and a temperature difference of approximately 20℃.

[0127] Surface protective layer hardness: The hardness of the coating is determined according to the Chinese national standard GB / T 6739-2006 "Determination of hardness of paint film by pencil method". The hardness is expressed by the hardest pencil mark that does not produce permanent scratches (e.g., 1H).

[0128] Thermal insulation performance retention rate (%) after thermal shock cycling: The sample was placed in a high and low temperature alternating test chamber and subjected to -40℃. The material was subjected to a 100℃ thermal cycle, with each cycle lasting 1 hour (approximately 15 minutes for heating / cooling and approximately 15 minutes for holding), for a total of 1000 cycles. After the cycle, the thermal conductivity λ1 and the initial thermal conductivity λ0 were measured according to the Chinese National Standard GB / T 10295-2008 "Determination of Steady-State Thermal Resistance and Related Properties of Thermal Insulation Materials - Heat Flow Meter Method". The formula for calculating the thermal insulation performance retention rate is: Retention rate = λ1 / λ0 × 100%.

[0129] The interfacial bonding strength (MPa) between the functional layer and the core insulation layer was determined by adapting the Chinese national standard GB / T 2790-1995 "Test Method for 180° Peel Strength of Adhesives - Flexible Materials vs. Rigid Materials". A double-sided tape-assisted method was used, and a universal testing machine was employed to determine the interfacial peel strength at a tensile rate of approximately 50 mm / min. The average value of three parallel tests was taken. Here, "functional layer" is defined as follows: when a gradient reinforcement layer is included, it refers to the "gradient reinforcement layer"; when no gradient reinforcement layer is included (e.g., in Examples 3, 4, and Comparative Example 1), it refers to the "surface protective layer".

[0130] The test results are shown in Table 1 below. As a control, the performance test results of the unencapsulated nano-insulation panel are also listed in Table 1. Table 1 also lists the preparation costs of the products for each embodiment and comparative example.

[0131] Table 1:

[0132] The results in Table 1 clearly demonstrate that this invention has successfully constructed a complete technical solution system covering both high performance and low cost requirements, exhibiting significant and multi-layered technical advantages: First, Examples 1 and 2 of this invention represent the high-performance solutions of this invention. Through an innovative "plasma-chemical composite activation" and "dual-gradient penetration curing" structural design, this solution achieves a perfect synergy between mechanical enhancement and thermal preservation at the nanoscale. Its overall performance is extremely outstanding: powder loss is reduced to below 0.04 g / m² (more than 98% lower than the unencapsulated board), compressive and flexural strengths are increased by more than 36% and 50% respectively, while thermal conductivity only increases slightly by about 2.2%, fully meeting the stringent requirements of high-end applications for material performance. Simultaneously, thanks to the second-level (<30 seconds) UV curing process, its preparation cost is as low as below 0.38 yuan / m², giving it extremely strong industrial competitiveness.

[0133] Secondly, Examples 3 and 4 of this invention represent low-cost simplified solutions. These solutions demonstrate that even omitting the complex step of the gradient reinforcement layer, significant technical effects can be achieved by directly forming a protective film on the substrate surface using only the aqueous polyacrylate emulsion of this invention. Whether through efficient UV curing (Example 3) or conventional oven thermosetting (Example 4), the powder shedding amount can be significantly reduced from the original 2.5 g / m² to below 0.15 g / m², effectively solving the fundamental problem of easy powder shedding in dry-pressed nano-insulation panels. In particular, the thermosetting solution (Example 4) further reduces the cost to 0.28 yuan / m², providing a highly attractive solution for cost-sensitive markets.

[0134] In summary, Examples 3 and 4 together demonstrate the effectiveness of the basic encapsulation structure of the present invention, which, by comprising only a core heat insulation layer and a UV- or thermosetting waterborne polyacrylate surface protective layer formed thereon, achieves a significant anti-powdering effect.

[0135] Furthermore, compared with the embodiments of the present invention, the prior art and solutions that deviate from the technical points of the present invention all have obvious defects: Comparative Example 1 (Prior Art) represents the traditional thermosetting route for silicone coatings. This method not only causes damage to the nanoporous structure due to prolonged high-temperature curing, resulting in a sharp increase in thermal conductivity to 0.022 W / (m·K) (a degradation of approximately 22%), but also incurs high raw material and energy costs (approximately 3.00 RMB / m²), low efficiency, and overall performance far inferior to any solution presented in this invention.

[0136] Comparative Examples 2 to 5 systematically verify the necessity of the preferred core process parameter window of the present invention. Comparative Example 2 (gradient reinforcement layer too thick) and Comparative Example 4 (porosity too small) suffer from deteriorated thermal conductivity due to excessive filling and clogging of pores; Comparative Example 3 (gradient reinforcement layer too thin) and Comparative Example 5 (porosity too large) suffer from low mechanical strength and interfacial bonding force, as well as poor thermal shock stability, due to insufficient cross-linking network. These comparative examples collectively demonstrate that only by controlling the penetration depth of the gradient reinforcement layer to about 50 to about 80 μm and the porosity to about 70% to about 80% of that of the core insulation layer can the optimal balance of performance be achieved.

[0137] In summary, this invention not only provides a top-performance nano-insulation panel encapsulation technology, but also derives a series of efficient and low-cost simplified application solutions, forming a complete patent protection matrix from core technology to peripheral applications. Regardless of the market demand, this invention can provide solutions superior to existing technologies, and its comprehensive advantages are all-encompassing and irreplaceable.

[0138] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions claimed by the present invention.

Claims

1. A nano-insulation plate encapsulation structure, characterized in that, The packaging structure includes: — Core insulation layer (1), including the nanoporous structure of the nano insulation board itself; — A surface protective layer (3) is located outside the core heat insulation layer (1) and has a thickness in the range of 5 to 20 μm, preferably in the range of 10 to 15 μm. The surface protective layer (3) is formed by curing an aqueous polyacrylate emulsion coated on the outside of the nano heat insulation plate, preferably by UV curing or thermal curing.

2. The nano-insulation plate encapsulation structure according to claim 1, characterized in that, The nano-insulation panel encapsulation structure also includes a gradient reinforcement layer (2) between the core insulation layer (1) and the surface protective layer (3). The thickness of the gradient reinforcement layer (2) is in the range of 50 to 80 μm. It is formed by the in-situ reaction of an aqueous aminosilane solution with a concentration in the range of 0.09 to 0.11 wt% and an aqueous polyacrylate emulsion with a concentration in the range of 0.05 to 0.2 wt% that penetrate into the interior of the surface of the nano-insulation panel to a depth of 50 to 80 μm. The porosity of the gradient reinforcement layer (2) is preferably 70% to 80% of the porosity of the core insulation layer (1).

3. The nano-insulation plate encapsulation structure according to claim 1 or 2, characterized in that, The nano-insulation board is a dry-pressed nano-insulation board, preferably a dry-pressed nano-silica insulation board; and / or The concentration of the aqueous polyacrylate emulsion used to form the surface protective layer (3) is in the range of 25 to 35% by weight.

4. A curing and encapsulation method for preparing a nano-thermal insulation plate encapsulation structure according to any one of claims 1 to 3, characterized in that, The curing and encapsulation method includes the following step 1: Step 1: The aqueous polyacrylate emulsion is coated on the surface of the nano heat insulation board to form a wet film. After leveling, the dry film thickness is ensured to be in the range of 5 to 20 μm. Then, it is cured by ultraviolet light irradiation or heating to form the surface protective layer (3).

5. The curing and encapsulation method according to claim 4, characterized in that, In step 1, The concentration of the aqueous polyacrylate emulsion used is in the range of 25 to 35% by weight; and / or The aqueous polyacrylate emulsion used contains polyacrylates with photocurable double bonds and a weight-average molecular weight in the range of 5,000 to 50,000 g / mol; and / or The aqueous polyacrylate emulsion further comprises a nano-silica dispersant with a concentration ranging from 0.01 to 0.05% by weight, wherein the particle size of the nano-silica dispersant is in the range of 10 to 20 nm; and / or The aqueous polyacrylate emulsion is sprayed onto the surface of the nano-insulation plate by electrostatic spraying. Preferably, the electrostatic spraying is performed at a voltage of 15 to 25 kV, and / or the atomized particle size of the aqueous polyacrylate emulsion is controlled within the range of 30 to 50 μm during the electrostatic spraying process; and / or The curing time under ultraviolet light is less than 30 seconds, preferably within the range of 5 to 15 seconds.

6. The curing and encapsulation method according to claim 4, characterized in that, The curing and encapsulation method further includes step 2 after step 1: ultrasonic cleaning of the surface protective layer obtained from step 1.

7. The curing and encapsulation method according to any one of claims 4 to 6, characterized in that, The curing and encapsulation method further includes step 0, performed prior to step 1, for forming a gradient reinforcement layer (2): performing a plasma-chemical composite activation treatment on at least one surface of the nano-insulation plate, including: Step 0-1: Perform plasma surface treatment on the surface of the nano-insulation plate; Step 0-2: The surface of the plasma-treated nano-insulation plate from step 0-1 is brought into contact with an aqueous aminosilane solution with a concentration in the range of 0.09 to 0.11% by weight for a sufficient time to allow the aqueous aminosilane solution to penetrate to a depth of 50 to 80 μm below the surface of the nano-insulation plate. Step 0-3: Apply an aqueous polyacrylate emulsion with a concentration in the range of 0.05 to 0.2% by weight to the surface of the nano-insulation plate obtained from Step 0-2, which has been permeated with the aqueous aminosilane solution, so that the aqueous polyacrylate emulsion penetrates to a depth of 50 to 80 μm below the surface of the nano-insulation plate, wherein the penetration depth of the aqueous polyacrylate emulsion is controlled not to exceed the penetration depth of the aqueous aminosilane solution; Step 0-4: The nano-insulation plate permeated with the aqueous aminosilane solution and the aqueous polyacrylate emulsion from step 0-3 is kept at a temperature of room temperature to 45°C for 5 to 20 minutes. Preferably, the nano-insulation plate permeated with the aqueous aminosilane solution and the aqueous polyacrylate emulsion from step 0-3 is kept under vacuum conditions at a temperature of room temperature to 45°C for 5 to 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulation plate reacts with the aqueous aminosilane solution to form the gradient reinforcement layer (2).

8. The curing and encapsulation method according to claim 7, characterized in that, The plasma surface treatment in step 0-1 includes using oxygen, air, or a mixture thereof as the working gas under vacuum conditions with an absolute pressure of 10 to 500 Pa, at a concentration of 0.05 to 0.1 W / cm³. 2 The surface of the nano-insulation plate is subjected to plasma surface treatment for 25 to 35 seconds at a power density of [specific value missing]; and / or Steps 0-2 include immersing the plasma-treated nano-insulation plate in an aqueous aminosilane solution with a concentration of 0.09 to 0.11% by weight for 10 to 20 seconds, so that the aqueous aminosilane solution penetrates to a depth of 50 to 80 μm below the surface of the nano-insulation plate; and / or The aminosilanes used in steps 0-2 include (3-aminopropyl)triethoxysilane or N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or mixtures thereof; and / or The aqueous polyacrylate emulsions used in steps 0-3 contain polyacrylates with photocurable double bonds and a weight-average molecular weight in the range of 5,000 to 50,000 g / mol; and / or In steps 0-3, an aqueous polyacrylate emulsion with a concentration of 0.05 to 0.2% by weight is applied to the surface of the nano-insulation plate by ultrasonic atomization spraying; and / or The aqueous polyacrylate emulsion used in steps 0-3 further comprises a nano-silica dispersant with a concentration ranging from 0.01 to 0.05% by weight, wherein the nano-silica dispersant has a particle size ranging from 10 to 20 nm; and / or Steps 0-4 include holding the nano-insulation plate permeated with aqueous aminosilane solution and aqueous polyacrylate emulsion under a vacuum of 10 to 500 Pa and a temperature of 35 to 45°C for 10 to 20 minutes, so that the aqueous polyacrylate emulsion permeated into the nano-insulation plate reacts rapidly with the aqueous aminosilane solution to form the gradient reinforcement layer (2).

9. The curing and encapsulation method according to any one of claims 4 to 8, characterized in that, The curing and encapsulation method further includes repeating step 1 to achieve curing and encapsulation of multiple surfaces of the nano-insulation plate.

10. A nano-insulating plate article having a nano-insulating plate encapsulation structure according to any one of claims 1 to 3 or a nano-insulating plate encapsulation structure formed by a curing encapsulation method according to any one of claims 4 to 9, characterized in that, Compared to nano-insulation panels without the nano-insulation panel encapsulation structure, the nano-insulation panel product exhibits a powder shedding rate reduced by more than 98%, or the powder shedding rate of the nano-insulation panel product is less than 0.2 g / m³. 2 Preferably less than 0.15 g / m 2 More preferably less than 0.05 g / m 2 ; Preferably, compared with a nano-insulation panel that does not have the nano-insulation panel encapsulation structure, the nano-insulation panel product is... The compressive strength is increased by more than 36%, or the compressive strength of the nano-insulation panel product is at least 0.68 MPa; and / or The flexural strength is increased by at least 50%, or the flexural strength of the nano-insulation panel product is at least 0.45 MPa; and / or The increase in thermal conductivity does not exceed 3.5%, or the thermal conductivity of the nano-insulation panel product is less than 0.0186 W / (m•K); More preferably, the nano-insulation panel product has one or more of the following properties: The interfacial bonding strength between the core insulation layer (1) and the surface protective layer (3) or the interfacial bonding strength between the core insulation layer (1) and the gradient reinforcement layer (2) is at least 0.5 MPa; and / or The surface protective layer has a hardness rating of at least 1H; and / or The heat insulation performance retention rate of the nano-insulation panel product after 1000 thermal shock cycles is greater than 98.5%.

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