Detection device and detection system

Abstract

The application provides a detection device and a detection system, and belongs to the technical field of laser chips. The detection device comprises a cooling assembly, a mounting assembly and a light receiving assembly. The cooling assembly comprises a first main body part, a first cooling part and a fastening area. The mounting assembly is provided with a mounting groove for mounting a chip. The light receiving assembly comprises a second main body part, a second cooling part and a light receiving cavity. The second cooling part is located on the side of the light receiving cavity away from the mounting assembly. The second main body part comprises a first sub-part and a second sub-part which are opposite to the first main body part and the mounting assembly respectively. The light receiving cavity comprises a first area and a second area which are located in the first sub-part and the second sub-part respectively. The side of the first main body part facing the first sub-part protrudes from the mounting assembly, the side of the second sub-part facing the mounting assembly protrudes from the first sub-part, and at least part of the protrusion is located above the fastening area. The groove bottom of the mounting groove is at least partially opposite to the first cooling part. The application can improve the optical path efficiency and the cooling efficiency.

Description

Technical Field

[0001] This invention relates to the field of laser chip technology, and more specifically, to a detection device and a detection system. Background Technology

[0002] Laser chips are core components in fields such as fiber optic communication, industrial processing, medical equipment, and defense technology. Their reliability and stability during long-term operation directly determine the performance and lifespan of the entire system. Therefore, conducting effective aging tests, photoelectric performance tests, and reliability tests on laser chips throughout their lifecycle, and eliminating defective products, is a crucial step in ensuring batch quality and long-term reliability of the devices.

[0003] Existing testing devices, such as aging testing devices, are illustrated below. These devices include a mounting assembly, a cooling assembly, and a light-receiving assembly disposed on one side of the mounting assembly. The chip under test (DUT) is mounted on the mounting assembly, the cooling assembly cools the DUT, and the light-receiving assembly receives light from the DUT.

[0004] Because the cooling component has a fastening area on the side near the light receiving component, the fastening area protrudes from the mounting component in the transverse direction (the direction from the cooling component to the light receiving component), occupying a certain amount of space. This forces the mounting component to maintain a large distance from the light receiving component, resulting in low optical path efficiency between the chip and the light receiving component. Furthermore, the area directly opposite the cooling section in the mounting component and the cooling component is small, resulting in low cooling efficiency of the cooling section for the chip mounted on the mounting component. Summary of the Invention

[0005] This application addresses the shortcomings of existing methods by proposing a detection device and system to solve technical problems such as low optical path efficiency between the chip and the light-receiving component or low cooling efficiency of the laser chip.

[0006] In a first aspect, embodiments of this application provide a detection device, comprising:

[0007] The cooling assembly includes: a first main body and a first cooling section disposed within the first main body;

[0008] Mounting components are disposed on the first main body, including a mounting section for mounting chips;

[0009] A light-collecting component is disposed on the same side of the first main body and the mounting component; the light-collecting component includes: a second main body having a light-collecting cavity;

[0010] The first main body portion has a fastening area near the edge of the second main body portion;

[0011] The second main body includes: a first sub-part and a second sub-part that are respectively opposite to the first main body and the mounting components;

[0012] The first main body protrudes from the mounting assembly on the side facing the first sub-part, and the second sub-part protrudes from the first sub-part on the side facing the mounting assembly, with at least a portion of the protrusions located above the fastening area, such that the mounting part and the first cooling part are at least partially opposite each other in the vertical direction.

[0013] In some embodiments, the light receiving cavity includes: a first region and a second region located within the first sub-part and the second sub-part, respectively;

[0014] The light-receiving assembly also includes a second cooling section located on the side of the light-receiving cavity away from the first main body; the cooling assembly also includes a third cooling section located within the first main body.

[0015] The third cooling section is separated from the first cooling section;

[0016] The third cooling section is at least partially located between the first cooling section and the first region, and is located in the direction from the first main body to the first sub-section, with the third cooling section at least partially facing the first region.

[0017] In some embodiments, the side of the first sub-part facing the first main body is a notch in the first region;

[0018] The gap on the side of the first main body facing the first sub-body is sealed.

[0019] In some embodiments, the first main body includes: a first base and a first cover;

[0020] The cooling assembly also includes fasteners located in the fastening area;

[0021] The first base and the first cover are fitted together and connected by fasteners;

[0022] The third cooling section is located above the fastener.

[0023] In some embodiments, the cooling assembly further includes a heat insulation element; the heat insulation element is located between the first cooling section and the third cooling section;

[0024] In the vertical direction, the bottom of the heat insulation component is not higher than the first cooling part and the third cooling part, and the top of the heat insulation component is not lower than the first cooling part and the third cooling part.

[0025] In some embodiments, both the first cooling section and the third cooling section include flow channels;

[0026] The cooling assembly also includes: an inlet pipe and an outlet pipe; the inlet pipe, the flow channel of the first cooling section, the flow channel of the third cooling section, and the outlet pipe are connected in sequence;

[0027] Alternatively, the water inlet pipe, the flow channel of the first cooling section, and the water outlet pipe are connected in sequence, and the water inlet pipe, the flow channel of the third cooling section, and the water outlet pipe are connected in sequence.

[0028] In some embodiments, the sidewall of the first sub-part has a gap with the first main body, and the gap is filled with a thermally conductive material; or, the sidewalls of the first sub-part are attached to the opposite sidewalls of the first main body.

[0029] In some embodiments, along the direction from the first main body portion toward the second main body portion, the size of the first region is smaller than the size of the second region, and the mounting portion is directly opposite the middle region of the second region in the vertical direction.

[0030] In some embodiments, the mounting portion includes at least one mounting slot; the mounting slot is used to mount the chip;

[0031] The light receiving cavity has at least one light inlet;

[0032] The light inlet and the mounting slot are set up in a one-to-one correspondence;

[0033] In the vertical direction, the mounting slot is at least partially aligned with the first cooling section.

[0034] Secondly, embodiments of this application provide a detection system, including: a chip and any of the detection devices provided in the first aspect above;

[0035] The mounting section of the detection device is equipped with a chip;

[0036] The light emitted by the chip enters the light-receiving cavity of the detection device.

[0037] The beneficial effects of the technical solutions provided in this application include:

[0038] In this embodiment, by designing the side of the light-receiving component as a "stepped" structure to accommodate the mounting component and the cooling component that protrudes relative to the mounting component, an extremely compact layout is achieved, breaking through space limitations and improving optical path efficiency and cooling efficiency.

[0039] Specifically, the first main body of the cooling component protrudes towards the light-receiving component, the first part of the light-receiving component facing the cooling component is recessed, and the second part of the light-receiving component facing the mounting component protrudes, so that the light-receiving component forms a "stepped" structure on the side to accommodate the protruding first main body of the cooling component. This allows the fastening area of ​​the first main body to be located below the light-receiving component, so that the light-receiving component is as close as possible to the chip on the mounting component in the lateral direction. Without changing the original design of the mounting component, the path from the mounting component to the light-receiving component is shortened, thereby shortening the optical path of the laser beam emitted by the chip on the mounting component to the light-receiving cavity. This solves the problem of excessively long optical path caused by the fastening area of ​​the cooling component occupying lateral space.

[0040] Generally, in a detection device, optical power is detected by photoelectric voltage. In this embodiment, by shortening the optical path of the laser beam emitted by the chip on the mounting assembly to the receiving cavity, the photoelectric voltage can be increased, thereby improving the detected optical power and optimizing the optical path efficiency.

[0041] Moreover, compared to existing technologies, the first main body of the cooling component protrudes towards the light-receiving component, so that the first cooling part inside the cooling component is located directly below the mounting part of the mounting component, thereby increasing the facing area between the first cooling part and the chip mounted in the mounting slot and improving cooling efficiency.

[0042] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is one of the structural schematic diagrams of a detection device provided in an embodiment of this application;

[0045] Figure 2 This is a second schematic diagram of the structure of a detection device provided in an embodiment of this application;

[0046] Figure 3 This is the third schematic diagram of a detection device provided in the embodiments of this application;

[0047] Figure 4 This is the fourth schematic diagram of a detection device provided in the embodiments of this application;

[0048] Figure 5 This is the fifth schematic diagram of a detection device provided in the embodiments of this application.

[0049] Figure label:

[0050] 100 - Cooling components;

[0051] 110 - First main body; 111 - First base; 112 - First cover; 120 - First cooling section; 130 - Fastening area; 131 - Fastener; 140 - Third cooling section; 150 - Heat insulation component;

[0052] 200-Light receiving module;

[0053] 210 - Second main body; 211 - First sub-section; 2110 - Notch; 212 - Second sub-section; 220 - Second cooling section; 230 - Light receiving cavity; 231 - First region; 232 - Second region; 233 - Light inlet;

[0054] 300 - Mounting components; 310 - Mounting slot; 400 - Thermal conductive material. Detailed Implementation

[0055] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions of the embodiments of this application.

[0056] Those skilled in the art will understand that, unless specifically stated otherwise, the terms "described" and "the" as used herein may also include plural forms. It should be further understood that the term "comprising" as used in this application's specification means the presence of the stated features, integers, elements, and / or components, but does not exclude implementations of other features, information, data, elements, components, and / or combinations thereof supported by this art. It should be understood that when we say an element is "connected" to another element, the element may be directly connected to the other element, or it may mean that the element and the other element are connected through an intermediate element. The term "and / or" as used herein refers to at least one of the items defined by the term; for example, "A and / or B" can be implemented as "A," or as "B," or as "A and B."

[0057] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0058] This application provides a detection device. A schematic diagram of the detection device is shown below. Figure 1 and Figure 2 As shown, the detection device includes: a cooling assembly 100, a mounting assembly 300, and a light-collecting assembly 200.

[0059] The cooling assembly 100 includes: a first main body 110 and a first cooling section 120 disposed within the first main body 110.

[0060] Mounting component 300 is disposed on the first main body 110, including a mounting section for mounting a chip. The chip is the object to be detected by the detection device.

[0061] The light-receiving assembly 200 is disposed on the same side of the first main body portion 110 and the mounting assembly 300; the light-receiving assembly 200 includes a second main body portion 210 having a light-receiving cavity 230. The first main body portion 110 has a fastening region 130 near the edge of the second main body portion 210.

[0062] The second main body 210 includes a first sub-part 211 and a second sub-part 212 that are respectively opposite to the first main body 110 and the mounting assembly 300. The first main body 110 protrudes from the mounting assembly 300 on the side facing the first sub-part 211, and the second sub-part 212 protrudes from the first sub-part 211 on the side facing the mounting assembly 300, and at least a portion of the protrusion is located above the fastening region 130, such that the mounting portion is at least partially opposite to the first cooling portion 120 in the vertical direction.

[0063] In this embodiment, the mounting component 300 and the cooling component 100 are stacked vertically, and the light receiving component 200 is arranged laterally on one side of the stacked mounting component 300 and cooling component 100. This allows the light emitted by the chip mounted on the mounting component 300 to be emitted toward the light receiving cavity 230 of the light receiving component 200. The light is refracted and reflected within the light receiving cavity 230, and the photodetector receives the light signal and converts it into an electrical signal. By analyzing the electrical signal, comprehensive and high-precision detection of the laser chip can be achieved.

[0064] In this embodiment, by designing the side of the light receiving component 200 as a "stepped" structure to fit the mounting component 300 and the cooling component 100 protruding relative to the mounting component 300, an extremely compact layout is achieved, breaking through space limitations and improving optical path efficiency and cooling efficiency.

[0065] Specifically, the first main body 110 of the cooling component 100 protrudes towards the light receiving component 200, the first part of the light receiving component 200 facing the cooling component 100 is recessed, and the second part of the light receiving component 200 facing the mounting component 300 protrudes, so that the light receiving component 200 forms a "stepped" structure on the side to accommodate the protruding first main body 110 of the cooling component 100. This makes the fastening area 130 of the first main body 110 located below the light receiving component 200, so that the light receiving component 200 is as close as possible to the chip on the mounting component 300 in the lateral direction. Without changing the original design of the mounting component 300, the path from the mounting component 300 to the light receiving component 200 is shortened, thereby shortening the optical path of the laser beam emitted by the chip on the mounting component 300 to the light receiving cavity 230. This solves the problem of excessively long optical path caused by the fastening area 130 of the cooling component 100 occupying lateral space.

[0066] Generally, in a detection device, the light beam emitted by the chip reaches the receiving cavity 230, and the performance is judged by measuring the optical power within the receiving cavity 230. The optical power is detected by a photoelectric voltage detector. In this embodiment, by shortening the optical path of the laser beam emitted by the chip on the mounting assembly 300 to the receiving cavity 230, the photoelectric voltage can be increased, thereby improving the detected optical power and optimizing the optical path efficiency.

[0067] Moreover, compared to the prior art, the first main body 110 of the cooling assembly 100 protrudes toward the light receiving assembly 200, so that the first cooling part 120 in the cooling assembly 100 is located directly below the mounting part (such as the mounting groove 310) of the mounting assembly 300, thereby increasing the face-to-face area between the first cooling part 120 and the chip mounted in the mounting groove 310 and improving the cooling efficiency.

[0068] It should be noted that, Figure 1 This is a three-dimensional structural diagram of the detection device. Figures 2-5 These are all schematic diagrams of cross-sections along the transverse direction in the detection device.

[0069] It should be noted that, in this embodiment, the vertical direction refers to the direction parallel to the direction of gravity when the detection device is upright, i.e., the direction from which the mounting component 300 points to the cooling component 100, or the direction from which the cooling component 100 points to the mounting component 300. In this embodiment, the horizontal direction refers to the direction parallel to the line connecting the light-receiving component 200 and the cooling component 100 when the detection device is upright, i.e., the direction from the light-receiving component 200 to the cooling component 100, or the direction from the cooling component 100 to the light-receiving component 200.

[0070] Optionally, the chip is a laser chip capable of emitting a laser beam.

[0071] The research and development concept of this application also includes: In the original design of the light-receiving component 200, the second cooling section 220 is located on the side of the light-receiving cavity 230 away from the mounting component 300, and the second cooling section 220 is also closer to the second region 232, so that the second cooling section 220 mainly cools the second region 232. However, the first region 231 can concentrate the light, resulting in a stronger light intensity, and the first region 231 also needs to be cooled. However, the light-receiving cavity 230 needs to be close to the mounting component 300, which means that the side of the light-receiving cavity 230 closest to the mounting component 300 cannot be equipped with a cooling section. Therefore, as Figure 3 As shown, in some embodiments, the light receiving cavity 230 includes a first region 231 and a second region 232 located in the first sub-section 211 and the second sub-section 212, respectively.

[0072] The light receiving assembly 200 also includes a second cooling section 220 located on the side of the light receiving cavity 230 away from the first main body 110; the cooling assembly 100 also includes a third cooling section 140 located within the first main body 110.

[0073] The third cooling section 140 is spaced apart from the first cooling section 120.

[0074] The third cooling section 140 is at least partially located between the first cooling section 120 and the first region 231, and is at least partially facing the first region 231 along the direction from the first main body 110 to the first sub-section 211.

[0075] In this embodiment, since the first main body 110 protrudes, there is sufficient space to provide a third cooling section 140 on the side of the first main body 110 near the second main body 210. Since the first main body 110 is directly opposite the first region 231, the third cooling section 140 provided within the first main body 110 is at least partially directly opposite the first region 231, allowing the third cooling section 140 to cool the first region 231, especially the portion of the first region 231 near the first main body 110 and away from the second cooling section 220. This embodiment cleverly utilizes the space protruding from the first main body 110 to provide the third cooling section 140, improving the cooling capacity of the first region 231 within the light-receiving cavity 230 without changing its position, thus ensuring temperature stability within the light-receiving cavity 230.

[0076] This application also provides two different implementations of the positional relationship between the light-receiving component 200 and the cooling component 100.

[0077] In the first implementation, such as Figure 5 As shown, the side of the first sub-part 211 facing the first main body 110 is the notch 2110 of the first region 231.

[0078] The gap 2110 is sealed on the side of the first main body 110 facing the first sub-body 211.

[0079] In this embodiment, the sidewall of the first region 231 in the first sub-part 211 is removed, so that the first region 231 has a notch 2110 on the side facing the first main body 110 to increase the lateral space, so that the first main body 110 protrudes further toward the first region 231, thereby increasing the size of the protrusion of the first main body 110, so that the first main body 110 has a larger lateral space to set the third cooling part 140.

[0080] In some embodiments, such as Figure 3 As shown, the first main body 110 includes a first base 111 and a first cover 112.

[0081] The cooling assembly 100 also includes a fastener 131 disposed in the fastening area 130.

[0082] The first base 111 and the first cover 112 are fitted together and connected by fasteners 131.

[0083] The third cooling section 140 is located above the fastener 131.

[0084] In this embodiment, the first main body 110 is formed by the mating of a first base 111 and a first cover 112. The first cover 112 has an inner cavity, and structures such as a first cooling section 120 and a third cooling section 140 are disposed inside the first cover 112. The mating point between the first cover 112 and the first base 111 is connected by a fastener 131 disposed in the fastening area 130. The fastener 131 needs to occupy a certain space in the vertical direction. Therefore, the third cooling section 140 can be disposed above the fastener 131 to avoid the fastener 131 and further achieve a compact layout.

[0085] Considering that the first cooling section 120 mainly cools the chip, which is a high-cost, precision structural component, it needs to be protected as much as possible during the testing process. Therefore, in some embodiments, such as Figure 4 As shown, the cooling assembly 100 also includes a heat insulation member 150; the heat insulation member 150 is located between the first cooling section 120 and the third cooling section 140.

[0086] In the vertical direction, the bottom of the heat insulation member 150 is not higher than the first cooling part 120 and the third cooling part 140, and the top of the heat insulation member 150 is not lower than the first cooling part 120 and the third cooling part 140.

[0087] In this embodiment, the first cooling section 120 mainly cools the chip and is isolated from the third cooling section 140 by a heat insulation component 150, so that the third cooling section 140 and the first cooling section 120 dissipate heat independently, preventing heat crosstalk between the third cooling section 140 and the first cooling section 120 and thus reducing the cooling efficiency of the first cooling section 120, ensuring the cooling efficiency of the first cooling section 120 on the chip, and thus ensuring the stability of the chip during the detection process.

[0088] In some embodiments, both the first cooling section 120 and the third cooling section 140 include flow channels.

[0089] The cooling assembly 100 also includes an inlet pipe and an outlet pipe; the inlet pipe, the flow channel of the first cooling section 120, the flow channel of the third cooling section 140, and the outlet pipe are connected in sequence.

[0090] In this embodiment, both the first cooling section 120 and the third cooling section 140 are water-cooled. The flow channels of the first cooling section 120 and the third cooling section 140 are connected and share the same water-cooling circulation system. The flow channel of the first cooling section 120 is closer to the water inlet pipe, so that the coolant or other coolant with a lower temperature enters the flow channel of the first cooling section 120 first and cools the chip, and then flows to the flow channel of the third cooling section 140 to dissipate heat from the first region 231. Since the cooling requirements of the third cooling section 140 are not as high as those of the first cooling section 120, the third cooling section 140 receives the coolant flowing out of the first cooling section 120, which can save cooling resources.

[0091] Unlike the previous embodiment, in some embodiments, the water inlet pipe, the flow channel of the first cooling section 120, and the water outlet pipe are connected in sequence, and the water inlet pipe, the flow channel of the third cooling section 140, and the water outlet pipe are connected in sequence.

[0092] In this embodiment, the first cooling unit 120 and the third cooling unit 140 operate independently and can be controlled separately without interfering with each other.

[0093] In the second implementation, such as Figure 3 or Figure 4 As shown, the sidewall of the first sub-part 211 is spaced from the first main body 110, and the space is filled with a thermally conductive material 400.

[0094] In this embodiment, the sidewall of the first sub-part 211 is spaced from the first main body 110. The thermally conductive material 400 filling the space ensures that there is no gap between the first sub-part 211 and the first main body 110, thereby improving the thermal conductivity and ensuring that the third cooling part 140 has a good cooling effect on the first region 231 in the first sub-part 211.

[0095] Unlike the previous embodiment, in some embodiments, the first sub-part 211 is attached to the sidewall opposite to the first main body 110, which can shorten the heat conduction path, reduce thermal resistance, and thus improve the cooling effect.

[0096] In some embodiments, along the direction from the first main body portion 110 toward the second main body portion 210, the size of the first region 231 is smaller than the size of the second region 232, and the mounting portion is directly opposite the middle region of the second region 232 in the vertical direction.

[0097] In this embodiment, by designing the side of the light-receiving component 200 as a "stepped" structure, the shape of the light-receiving cavity 230 within the light-receiving component 200 is adaptively changed, forming a structure where the second region 232 has a larger cross-sectional area and the first region 231 has a smaller cross-sectional area in the transverse direction. This "larger at the top and smaller at the bottom" structure of the light-receiving cavity 230 better concentrates the light within, increasing the reflective surface and the number of reflections, effectively lengthening the average propagation path of the light within the cavity, improving the sensitivity of related detections such as spectral analysis, and preventing light leakage from the light inlet 233. Furthermore, since the light beam has a certain divergence angle, in this embodiment, the mounting part is directly aligned with the middle region of the second region 232 in the vertical direction, so that the center of the diverging beam corresponds to the middle region of the second region 232. This allows the diverging beam to be incident into the light-receiving cavity 230 as evenly as possible, thereby maximizing the beam incident rate.

[0098] In some embodiments, the mounting portion includes at least one mounting slot 310 for mounting a chip.

[0099] The light receiving cavity 230 has at least one light inlet 233.

[0100] The light inlet 233 and the mounting slot 310 are set in a one-to-one correspondence.

[0101] In the vertical direction, the mounting groove 310 is at least partially aligned with the first cooling section 120.

[0102] In this embodiment, the mounting assembly 300 has at least one mounting slot 310. When there are multiple mounting slots 310, they are arranged longitudinally at intervals along the first main body 110, and the multiple light-receiving ports of the second sub-part 212 are also corresponding to the mounting slots 310 one-to-one, enabling simultaneous detection of multiple chips and improving detection efficiency. The light beam emitted by the chip enters the light-receiving cavity 230 through the light-inlet port 233.

[0103] It should be noted that in this embodiment, the longitudinal direction is the length direction along the first main body 110, the transverse direction is the width direction of the first main body 110, and the vertical direction is the height direction of the first main body 110.

[0104] The detection device provided in this application embodiment can detect the aging state, photoelectric performance, structural reliability, etc. of the chip.

[0105] Based on the same inventive concept, embodiments of this application also provide a detection system, including: a chip and a detection device as provided in any of the foregoing embodiments.

[0106] The mounting section of the detection device is equipped with a chip; the light emitted by the chip enters the light receiving cavity 230.

[0107] In this embodiment, the detection device provided in any of the foregoing embodiments is used, and its technology and principle are similar, so they will not be described again here. In the detection system, by designing the side of the light receiving component 200 as a "stepped" structure to fit the mounting component 300 and the cooling component 100 protruding relative to the mounting component 300, an extremely compact layout is achieved, breaking through space limitations and improving optical path efficiency and cooling efficiency.

[0108] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0109] 1. In the detection device, the light beam emitted by the chip reaches the receiving cavity 230, and the performance is judged by measuring the optical power in the receiving cavity 230. The optical power is detected by a photoelectric voltage detector. In this embodiment, by shortening the optical path of the laser beam emitted by the chip on the mounting assembly 300 to the receiving cavity 230, the photoelectric voltage can be increased, thereby improving the detected optical power and optimizing the optical path efficiency.

[0110] 2. Compared with the prior art, the first main body 110 of the cooling component 100 protrudes toward the light receiving component 200, so that the first cooling part 120 in the cooling component 100 is located below the mounting groove 310 of the mounting component 300 in the lateral direction, thereby increasing the facing area between the first cooling part 120 and the chip mounted in the mounting groove 310 and improving the cooling efficiency.

[0111] 3. Because the first main body 110 protrudes, there is sufficient space to provide a third cooling section 140 on the side of the first main body 110 near the second main body 210. Since the first main body 110 is directly opposite the first region 231, the third cooling section 140 provided in the first main body 110 is at least partially directly opposite the first region 231, allowing the third cooling section 140 to cool the first region 231, especially the portion of the first region 231 near the first main body 110 and away from the second cooling section 220. This embodiment cleverly utilizes the space protruding from the first main body 110 to provide the third cooling section 140, improving the cooling capacity of the first region 231 within the light receiving cavity 230 without changing the position of the light receiving cavity 230, thus ensuring temperature stability within the light receiving cavity 230.

[0112] 4. Remove the sidewall of the first region 231 in the first sub-part 211 so that the first region 231 has a notch 2110 on the side facing the first main body 110, so that the first main body 110 protrudes further towards the first region 231, thereby increasing the size of the protrusion of the first main body 110, so that the first main body 110 has a larger lateral space to accommodate the third cooling part 140.

[0113] 5. The first cooling section 120 mainly cools the chip and is isolated from the third cooling section 140 by a heat insulation component 150, so that the third cooling section 140 and the first cooling section 120 dissipate heat independently, preventing heat crosstalk between the third cooling section 140 and the first cooling section 120 from reducing the cooling efficiency of the first cooling section 120, ensuring the cooling efficiency of the first cooling section 120 on the chip, and thus ensuring the stability of the chip during the detection process.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A detection device, characterized in that, include: The cooling assembly (100) includes: a first main body (110) and a first cooling section (120) disposed within the first main body (110). Mounting component (300) is disposed on the first main body (110) and includes a mounting part for mounting a chip; A light-receiving assembly (200) is disposed on the same side of the first main body (110) and the mounting assembly (300); the light-receiving assembly (200) includes: a second main body (210) having a light-receiving cavity (230); wherein, The first main body (110) has a fastening area (130) near the edge of the second main body (210). The second main body (210) includes a first sub-part (211) and a second sub-part (212) that are respectively opposite to the first main body (110) and the mounting assembly (300). The first main body (110) protrudes from the mounting assembly (300) on the side facing the first sub-part (211), and the second sub-part (212) protrudes from the first sub-part (211) on the side facing the mounting assembly (300), and at least a portion of the protrusion is located above the fastening area (130), such that the first cooling part (120) is located directly below the mounting part in the vertical direction.

2. The detection device according to claim 1, characterized in that, The light receiving cavity (230) includes a first region (231) and a second region (232) located in the first sub-part (211) and the second sub-part (212), respectively. The light receiving assembly (200) further includes a second cooling section (220) located on the side of the light receiving cavity (230) away from the first main body (110); the cooling assembly (100) further includes a third cooling section (140) located within the first main body (110). The third cooling section (140) is spaced apart from the first cooling section (120); The third cooling section (140) is at least partially located between the first cooling section (120) and the first region (231), and is located in the direction from the first main body (110) to the first sub-section (211), with the third cooling section (140) at least partially facing the first region (231).

3. The detection device according to claim 2, characterized in that, The side of the first sub-part (211) facing the first main body (110) is the notch (2110) of the first region (231). The first main body (110) blocks the gap (2110) on the side facing the first sub-part (211).

4. The detection device according to claim 2, characterized in that, The first main body (110) includes: a first seat (111) and a first cover (112); The cooling assembly (100) also includes a fastener (131) disposed in the fastening area (130). The first seat (111) and the first cover (112) are mated together and connected by the fastener (131); The third cooling section (140) is disposed above the fastener (131).

5. The detection device according to claim 2, characterized in that, The cooling assembly (100) further includes a heat insulation element (150); the heat insulation element (150) is located between the first cooling section (120) and the third cooling section (140); In the vertical direction, the bottom of each heat insulation member (150) is not higher than the first cooling part (120) and the third cooling part (140), and the top of each heat insulation member (150) is not lower than the first cooling part (120) and the third cooling part (140).

6. The detection device according to claim 2, characterized in that, Both the first cooling section (120) and the third cooling section (140) include flow channels; The cooling assembly (100) further includes: an inlet pipe and an outlet pipe; the inlet pipe, the flow channel of the first cooling section (120), the flow channel of the third cooling section (140), and the outlet pipe are connected in sequence; Alternatively, the water inlet pipe, the flow channel of the first cooling section (120), and the water outlet pipe are connected in sequence, and the water inlet pipe, the flow channel of the third cooling section (140), and the water outlet pipe are connected in sequence.

7. The detection device according to claim 2, characterized in that, The sidewall of the first sub-part (211) is spaced from the first main body (110), and the space is filled with thermally conductive material (400); or, the sidewall of the first sub-part (211) is attached to the opposite sidewall of the first main body (110).

8. The detection device according to claim 2, characterized in that, Along the direction from the first main body (110) toward the second main body (210), the size of the first region (231) is smaller than the size of the second region (232), and the mounting part is directly opposite the middle region of the second region (232) in the vertical direction.

9. The detection device according to claim 1, characterized in that, The mounting section includes at least one mounting slot (310); the mounting slot (310) is used to mount the chip; The light receiving cavity (230) has at least one light inlet (233); The light inlet (233) and the mounting slot (310) are respectively provided in a one-to-one correspondence; In the vertical direction, the mounting groove (310) is at least partially opposite to the first cooling section (120).

10. A detection system, characterized in that, include: The chip and the detection device as described in any one of claims 1-9 above; The chip is mounted on the mounting section of the detection device; The light emitted by the chip enters the light receiving cavity (230) of the detection device.

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