基于金属基PCB局部接地结构优化方法及系统

By identifying abnormal areas through operating condition simulation and multi-dimensional data acquisition, and reconstructing the structure, the problems of low efficiency, electromagnetic interference and overheating in the optimization of the grounding structure of metal-based circuit boards were solved, and the electrical performance was improved.

CN121859800BActive Publication Date: 2026-07-17DONGGUAN SHOUFU ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
DONGGUAN SHOUFU ELECTRONICS CO LTD
Filing Date
2025-12-31
Publication Date
2026-07-17

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Abstract

本发明涉及印刷电路板制造技术领域，一种基于金属基PCB局部接地结构优化方法及系统，包括：基于自动优化指令确认出多个金属基电路板，对金属基电路板进行工况仿真，得到工作中电路板，对工作中电路板进行多维数据采集，得到多维数据集，基于多维数据集确认出异常区域集，基于异常区域集对工作中电路板进行结构重构，得到重构电路板，将重构电路板作为金属基电路板，返回上述对金属基电路板进行工况仿真的步骤，直至异常区域集为预设的空集，得到优化电路板，汇总所述优化电路板，得到多个优化电路板，实现局部接地结构优化。本发明可解决金属基电路板中由不当的局部接地结构导致的电磁干扰及局部过热的问题。
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